MY178666A - Dicing tape - Google Patents

Dicing tape

Info

Publication number
MY178666A
MY178666A MYPI2015000860A MYPI2015000860A MY178666A MY 178666 A MY178666 A MY 178666A MY PI2015000860 A MYPI2015000860 A MY PI2015000860A MY PI2015000860 A MYPI2015000860 A MY PI2015000860A MY 178666 A MY178666 A MY 178666A
Authority
MY
Malaysia
Prior art keywords
release force
adhesive layer
cured
radiation
dicing tape
Prior art date
Application number
MYPI2015000860A
Inventor
Satoshi Ota
Akira Yabuki
Yuri Tamagawa
Akira Akutsu
Toru Sano
Yukihiro Matsubara
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY178666A publication Critical patent/MY178666A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

Provided is a dicing tape which enables picking up of thin semiconductor chips efficiently in a short time, without causing chip cracking, in a pick-up step after a dicing step. A dicing tape (1) of the invention includes an adhesive layer (3) containing 100 parts by mass of one kind or two or more kinds of polymers selected from the group consisting of an acrylic polymer, a vinyl acetate polymer, and an acrylic-based polymer having a carbon-carbon double bond; and 0.5 to 30 parts by mass of a phthalic acid ester, in which the release force is 0. 5 N/25 mm or more before the adhesive layer (3) is radiation-cured, and the release force is 0.05 to 0. 4 N/25 mm after the adhesive layer (3) is radiation-cured, and for the release force after the adhesive layer (3) is radiation-cured, when the release force at a release rate of 50 mm/min is designated as (i), and the release force at a release rate of 1, 000 mm/min is designated as (ii), the ratio (ii)/(i) is 1 or less.
MYPI2015000860A 2012-10-18 2013-10-15 Dicing tape MY178666A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012230779A JP5294366B1 (en) 2012-10-18 2012-10-18 Dicing tape

Publications (1)

Publication Number Publication Date
MY178666A true MY178666A (en) 2020-10-20

Family

ID=49396755

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000860A MY178666A (en) 2012-10-18 2013-10-15 Dicing tape

Country Status (7)

Country Link
JP (1) JP5294366B1 (en)
KR (1) KR101470802B1 (en)
CN (1) CN104756235B (en)
MY (1) MY178666A (en)
SG (1) SG11201502324TA (en)
TW (1) TWI506118B (en)
WO (1) WO2014061629A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6673734B2 (en) * 2016-03-29 2020-03-25 リンテック株式会社 Pressure-sensitive adhesive sheet for glass dicing and method for producing the same
JP6623098B2 (en) * 2016-03-29 2019-12-18 リンテック株式会社 Adhesive sheet for glass dicing and method for producing the same
JP6661438B2 (en) * 2016-03-29 2020-03-11 リンテック株式会社 Pressure-sensitive adhesive sheet for glass dicing and method for producing the same
JP6745136B2 (en) * 2016-05-16 2020-08-26 株式会社アルバック Electronic component manufacturing method and processing system
KR101877897B1 (en) * 2017-03-06 2018-07-12 엘비세미콘 주식회사 Methods of fabricating bump structure
JP7041476B2 (en) * 2017-07-04 2022-03-24 日東電工株式会社 Dicing tape and dicing die bond film
JP6566324B2 (en) 2017-09-29 2019-08-28 サイデン化学株式会社 Adhesive sheet
JP7224231B2 (en) * 2019-04-17 2023-02-17 日東電工株式会社 Dicing die bond film
JPWO2022255322A1 (en) * 2021-06-02 2022-12-08

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726350B2 (en) * 1992-02-24 1998-03-11 リンテック株式会社 Adhesive sheet for attaching wafer
JP2002373871A (en) * 2001-06-15 2002-12-26 Sekisui Chem Co Ltd Method of manufacturing ic chip
JP4913584B2 (en) * 2006-03-27 2012-04-11 古河電気工業株式会社 Wafer processing method and wafer processing tape used therefor
JP4970863B2 (en) * 2006-07-13 2012-07-11 日東電工株式会社 Workpiece processing method
JP4931519B2 (en) * 2006-09-01 2012-05-16 日東電工株式会社 Active surface-attached dicing adhesive tape or sheet and method of picking up a workpiece cut piece
JP2010260893A (en) * 2009-04-30 2010-11-18 Nitto Denko Corp Laminated film and method for producing semiconductor device
JP2011089009A (en) * 2009-10-22 2011-05-06 Hitachi Maxell Ltd Radiation-curable adhesive composition, adhesive film for dicing using the same and method for producing cut piece
JP5406110B2 (en) * 2010-04-20 2014-02-05 日東電工株式会社 Adhesive sheet for semiconductor wafer processing
CN101906278A (en) * 2010-08-12 2010-12-08 华南理工大学 Single-component polyvinylacetate binding agent and preparation method thereof
JP5899622B2 (en) * 2011-02-08 2016-04-06 日立化成株式会社 Adhesive sheet for semiconductor, method for producing adhesive sheet for semiconductor, semiconductor wafer, semiconductor device, and method for producing semiconductor device
JP5803123B2 (en) * 2011-02-08 2015-11-04 日立化成株式会社 Adhesive sheet for semiconductor, semiconductor wafer using the same, semiconductor device, and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
CN104756235B (en) 2017-05-24
TW201430092A (en) 2014-08-01
KR20140097591A (en) 2014-08-06
WO2014061629A1 (en) 2014-04-24
TWI506118B (en) 2015-11-01
KR101470802B1 (en) 2014-12-08
SG11201502324TA (en) 2015-05-28
JP2014082414A (en) 2014-05-08
JP5294366B1 (en) 2013-09-18
CN104756235A (en) 2015-07-01

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