CN104698746B - 抗蚀剂图案的形成方法 - Google Patents

抗蚀剂图案的形成方法 Download PDF

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Publication number
CN104698746B
CN104698746B CN201510138362.1A CN201510138362A CN104698746B CN 104698746 B CN104698746 B CN 104698746B CN 201510138362 A CN201510138362 A CN 201510138362A CN 104698746 B CN104698746 B CN 104698746B
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China
Prior art keywords
resist
resist pattern
alkaline
ozone
film
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Active
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CN201510138362.1A
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English (en)
Chinese (zh)
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CN104698746A (zh
Inventor
寺井护
萩原琢也
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Renesas Electronics Corp
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Renesas Electronics Corp
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Publication of CN104698746A publication Critical patent/CN104698746A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
CN201510138362.1A 2009-03-12 2010-03-11 抗蚀剂图案的形成方法 Active CN104698746B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-059981 2009-03-12
JP2009059981A JP5516931B2 (ja) 2009-03-12 2009-03-12 レジストパターン形成方法
CN201010136569A CN101840152A (zh) 2009-03-12 2010-03-11 抗蚀剂图案的形成方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201010136569A Division CN101840152A (zh) 2009-03-12 2010-03-11 抗蚀剂图案的形成方法

Publications (2)

Publication Number Publication Date
CN104698746A CN104698746A (zh) 2015-06-10
CN104698746B true CN104698746B (zh) 2019-05-17

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CN201510138362.1A Active CN104698746B (zh) 2009-03-12 2010-03-11 抗蚀剂图案的形成方法
CN201010136569A Pending CN101840152A (zh) 2009-03-12 2010-03-11 抗蚀剂图案的形成方法

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CN201010136569A Pending CN101840152A (zh) 2009-03-12 2010-03-11 抗蚀剂图案的形成方法

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US (1) US8323879B2 (enExample)
JP (1) JP5516931B2 (enExample)
CN (2) CN104698746B (enExample)
TW (1) TWI490668B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518634B2 (en) * 2011-02-08 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning process for semiconductor device fabrication
JP5618098B2 (ja) * 2012-04-23 2014-11-05 信越半導体株式会社 Ｃ−ｖ特性測定方法
JP5728517B2 (ja) * 2013-04-02 2015-06-03 富士フイルム株式会社 化学増幅型レジスト膜のパターニング用有機系処理液の製造方法、パターン形成方法、及び、電子デバイスの製造方法
JP7009122B2 (ja) * 2017-09-05 2022-01-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI788434B (zh) 2017-10-27 2023-01-01 日商東京威力科創股份有限公司 光罩圖案形成方法、記憶媒體及基板處理裝置
CN109839801A (zh) * 2017-11-24 2019-06-04 山东华光光电子股份有限公司 一种改善光刻缺陷以及延长光刻版使用期限的方法
CN110459691B (zh) * 2019-08-30 2022-04-08 京东方科技集团股份有限公司 显示基板及其制作方法、和显示装置
TWI794774B (zh) 2020-03-24 2023-03-01 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
JP7440316B2 (ja) * 2020-03-24 2024-02-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7718916B2 (ja) * 2021-08-31 2025-08-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200616101A (en) * 2004-07-07 2006-05-16 Toshiba Kk Method for manufacturing semiconductor device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217258A (ja) 1990-12-18 1992-08-07 Sharp Corp レジストパターンの作製方法及びその装置
JPH09160259A (ja) * 1995-12-06 1997-06-20 Fujitsu Ltd レジストパターンの形成方法
JP2000089475A (ja) 1998-09-11 2000-03-31 Sony Corp 露光塗布現像装置およびレジストパターン形成方法
US6946410B2 (en) * 2002-04-05 2005-09-20 E. I. Du Pont De Nemours And Company Method for providing nano-structures of uniform length
JP4093462B2 (ja) * 2002-10-09 2008-06-04 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US6954585B2 (en) * 2002-12-03 2005-10-11 Tokyo Electron Limited Substrate processing method and apparatus
JP3993549B2 (ja) * 2003-09-30 2007-10-17 株式会社東芝 レジストパターン形成方法
JP3857692B2 (ja) * 2004-01-15 2006-12-13 株式会社東芝 パターン形成方法
JP2005353763A (ja) * 2004-06-09 2005-12-22 Matsushita Electric Ind Co Ltd 露光装置及びパターン形成方法
JP3964913B2 (ja) * 2004-07-07 2007-08-22 株式会社東芝 パターン形成方法及び半導体装置の製造方法
JP4167642B2 (ja) * 2004-10-20 2008-10-15 株式会社東芝 レジストパターン形成方法
JP2006108564A (ja) * 2004-10-08 2006-04-20 Renesas Technology Corp 電子デバイスの製造方法および露光システム
JP4488890B2 (ja) * 2004-12-27 2010-06-23 株式会社東芝 レジストパターン形成方法及び半導体装置の製造方法
JP4611137B2 (ja) * 2005-07-12 2011-01-12 東京応化工業株式会社 保護膜形成用材料、およびこれを用いたホトレジストパターン形成方法
JP2007180253A (ja) 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd フォトレジストパターン形成方法
JP4368365B2 (ja) * 2006-08-02 2009-11-18 Ｔｄｋ株式会社 液浸露光用基板およびその製造方法、ならびに液浸露光方法

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
TW200616101A (en) * 2004-07-07 2006-05-16 Toshiba Kk Method for manufacturing semiconductor device

Also Published As

Publication number Publication date
US20100233449A1 (en) 2010-09-16
JP2010211153A (ja) 2010-09-24
CN101840152A (zh) 2010-09-22
TW201033757A (en) 2010-09-16
JP5516931B2 (ja) 2014-06-11
US8323879B2 (en) 2012-12-04
TWI490668B (zh) 2015-07-01
CN104698746A (zh) 2015-06-10

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