CN104684994B - 拒墨性组合物、负型感光性树脂组合物、固化膜、分隔壁以及光学元件 - Google Patents

拒墨性组合物、负型感光性树脂组合物、固化膜、分隔壁以及光学元件 Download PDF

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CN104684994B
CN104684994B CN201380049711.1A CN201380049711A CN104684994B CN 104684994 B CN104684994 B CN 104684994B CN 201380049711 A CN201380049711 A CN 201380049711A CN 104684994 B CN104684994 B CN 104684994B
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compound
group
sensitive resin
resin combination
negative light
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CN104684994A (zh
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高桥秀幸
松浦启吾
川岛正行
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AGC Inc
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Asahi Glass Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/50Sympathetic, colour changing or similar inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/236Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers using printing techniques, e.g. applying the etch liquid using an ink jet printer

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
CN201380049711.1A 2012-09-24 2013-09-19 拒墨性组合物、负型感光性树脂组合物、固化膜、分隔壁以及光学元件 Active CN104684994B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012209084 2012-09-24
JP2012-209084 2012-09-24
PCT/JP2013/075365 WO2014046209A1 (ja) 2012-09-24 2013-09-19 撥インク性組成物、ネガ型感光性樹脂組成物、硬化膜、隔壁、及び光学素子

Publications (2)

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CN104684994A CN104684994A (zh) 2015-06-03
CN104684994B true CN104684994B (zh) 2016-08-24

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Country Status (5)

Country Link
JP (1) JP6065915B2 (ko)
KR (1) KR102156003B1 (ko)
CN (1) CN104684994B (ko)
TW (1) TWI649621B (ko)
WO (1) WO2014046209A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102372956B1 (ko) * 2013-12-17 2022-03-10 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 수지 경화막, 격벽 및 광학 소자
CN106462069B (zh) * 2014-04-25 2019-10-18 Agc株式会社 负型感光性树脂组合物、分隔壁及光学元件
JP6317624B2 (ja) * 2014-05-22 2018-04-25 双葉電子工業株式会社 乾燥剤、封止構造及び有機el素子
CN106465508B (zh) 2014-06-09 2018-05-25 旭硝子株式会社 拒墨剂、负型感光性树脂组合物、分隔壁和光学元件
JP7234946B2 (ja) * 2018-01-26 2023-03-08 三菱ケミカル株式会社 感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明
WO2022168829A1 (ja) * 2021-02-08 2022-08-11 セントラル硝子株式会社 撥液剤、硬化性組成物、硬化物、隔壁、有機電界発光素子、含フッ素塗膜の製造方法及び含フッ素塗膜
WO2023171487A1 (ja) * 2022-03-07 2023-09-14 東レ株式会社 感光性樹脂組成物、硬化物、表示装置および表示装置の製造方法
JP2024103000A (ja) * 2023-01-20 2024-08-01 デクセリアルズ株式会社 共重合体、親水撥油組成物、親水撥油膜、親水撥油積層体、及び物品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1711503A (zh) * 2002-11-06 2005-12-21 旭硝子株式会社 负型感光性树脂组合物
CN1756995A (zh) * 2003-03-07 2006-04-05 旭硝子株式会社 感光性树脂组合物及其涂膜固化物
CN102053492A (zh) * 2008-12-31 2011-05-11 罗门哈斯电子材料有限公司 用于光刻法的组合物和方法
CN102112923A (zh) * 2008-08-01 2011-06-29 旭硝子株式会社 负型感光性组合物、使用该组合物的光学元件用间隔壁及具有该间隔壁的光学元件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03190951A (ja) * 1989-12-19 1991-08-20 Asahi Glass Co Ltd フルオロシリコーン重合体とフルオロアクリレート重合体からなる組成物
KR20000053358A (ko) * 1996-11-18 2000-08-25 이노우에 노리유끼 내구성 발수제 및 도장 물품
WO2007069703A1 (ja) 2005-12-15 2007-06-21 Asahi Glass Company, Limited 含フッ素重合体、ネガ型感光性組成物及び隔壁
JP2008203786A (ja) * 2007-02-22 2008-09-04 Fujifilm Corp カラーフィルタ用感光性組成物、並びに感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、表示装置
JP2008249867A (ja) * 2007-03-29 2008-10-16 Fujifilm Corp 感光性樹脂組成物、感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、並びに表示装置
EP2309330A4 (en) * 2008-07-03 2012-01-18 Asahi Glass Co Ltd PHOTOSENSITIVE COMPOSITION, SEPARATION WALL, COLOR FILTER, AND ORGANIC ELECTROLUMINESCENCE DEVICE
JP5682573B2 (ja) 2009-12-28 2015-03-11 旭硝子株式会社 感光性組成物、隔壁、カラーフィルタおよび有機el素子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1711503A (zh) * 2002-11-06 2005-12-21 旭硝子株式会社 负型感光性树脂组合物
CN1756995A (zh) * 2003-03-07 2006-04-05 旭硝子株式会社 感光性树脂组合物及其涂膜固化物
CN102112923A (zh) * 2008-08-01 2011-06-29 旭硝子株式会社 负型感光性组合物、使用该组合物的光学元件用间隔壁及具有该间隔壁的光学元件
CN102053492A (zh) * 2008-12-31 2011-05-11 罗门哈斯电子材料有限公司 用于光刻法的组合物和方法

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Publication number Publication date
WO2014046209A1 (ja) 2014-03-27
CN104684994A (zh) 2015-06-03
TW201423277A (zh) 2014-06-16
KR102156003B1 (ko) 2020-09-15
TWI649621B (zh) 2019-02-01
JP6065915B2 (ja) 2017-01-25
KR20150060689A (ko) 2015-06-03
JPWO2014046209A1 (ja) 2016-08-18

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Patentee before: Asahi Glass Co., Ltd.

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