JP6065915B2 - ネガ型感光性樹脂組成物、硬化膜、隔壁、及び光学素子 - Google Patents

ネガ型感光性樹脂組成物、硬化膜、隔壁、及び光学素子 Download PDF

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JP6065915B2
JP6065915B2 JP2014536919A JP2014536919A JP6065915B2 JP 6065915 B2 JP6065915 B2 JP 6065915B2 JP 2014536919 A JP2014536919 A JP 2014536919A JP 2014536919 A JP2014536919 A JP 2014536919A JP 6065915 B2 JP6065915 B2 JP 6065915B2
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group
compound
photosensitive resin
resin composition
negative photosensitive
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JPWO2014046209A1 (ja
Inventor
高橋　秀幸
秀幸 高橋
啓吾 松浦
啓吾 松浦
川島　正行
正行 川島
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AGC Inc
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Asahi Glass Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/50—Sympathetic, colour changing or similar inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/236—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers using printing techniques, e.g. applying the etch liquid using an ink jet printer

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2014536919A 2012-09-24 2013-09-19 ネガ型感光性樹脂組成物、硬化膜、隔壁、及び光学素子 Active JP6065915B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012209084 2012-09-24
JP2012209084 2012-09-24
PCT/JP2013/075365 WO2014046209A1 (ja) 2012-09-24 2013-09-19 撥インク性組成物、ネガ型感光性樹脂組成物、硬化膜、隔壁、及び光学素子

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JPWO2014046209A1 JPWO2014046209A1 (ja) 2016-08-18
JP6065915B2 true JP6065915B2 (ja) 2017-01-25

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JP2014536919A Active JP6065915B2 (ja) 2012-09-24 2013-09-19 ネガ型感光性樹脂組成物、硬化膜、隔壁、及び光学素子

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Country Link
JP (1) JP6065915B2 (ko)
KR (1) KR102156003B1 (ko)
CN (1) CN104684994B (ko)
TW (1) TWI649621B (ko)
WO (1) WO2014046209A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023171487A1 (ja) * 2022-03-07 2023-09-14 東レ株式会社 感光性樹脂組成物、硬化物、表示装置および表示装置の製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102372956B1 (ko) * 2013-12-17 2022-03-10 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 수지 경화막, 격벽 및 광학 소자
KR102378162B1 (ko) * 2014-04-25 2022-03-23 에이지씨 가부시키가이샤 네거티브형 감광성 수지 조성물, 격벽 및 광학 소자
JP6317624B2 (ja) * 2014-05-22 2018-04-25 双葉電子工業株式会社 乾燥剤、封止構造及び有機ｅｌ素子
JP6593331B2 (ja) 2014-06-09 2019-10-23 Ａｇｃ株式会社 撥インク剤、ネガ型感光性樹脂組成物、隔壁および光学素子
CN111566560A (zh) * 2018-01-26 2020-08-21 三菱化学株式会社 感光性树脂组合物、间隔壁、有机场致发光元件、图像显示装置及照明
WO2022168829A1 (ja) * 2021-02-08 2022-08-11 セントラル硝子株式会社 撥液剤、硬化性組成物、硬化物、隔壁、有機電界発光素子、含フッ素塗膜の製造方法及び含フッ素塗膜

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPH03190951A (ja) * 1989-12-19 1991-08-20 Asahi Glass Co Ltd フルオロシリコーン重合体とフルオロアクリレート重合体からなる組成物
JP3512200B2 (ja) * 1996-11-18 2004-03-29 ダイキン工業株式会社 耐久性撥水剤及び塗装物品
EP1560068B1 (en) * 2002-11-06 2008-01-23 Asahi Glass Company Ltd. Barrier rib and its method of preparation
CN100524021C (zh) * 2003-03-07 2009-08-05 旭硝子株式会社 感光性树脂组合物及其涂膜固化物
KR20080078645A (ko) * 2005-12-15 2008-08-27 아사히 가라스 가부시키가이샤 함불소 중합체, 네거티브형 감광성 조성물 및 격벽
JP2008203786A (ja) * 2007-02-22 2008-09-04 Fujifilm Corp カラーフィルタ用感光性組成物、並びに感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、表示装置
JP2008249867A (ja) * 2007-03-29 2008-10-16 Fujifilm Corp 感光性樹脂組成物、感光性転写材料、離画壁及びその形成方法、カラーフィルタ及びその製造方法、並びに表示装置
TWI459132B (zh) * 2008-07-03 2014-11-01 Asahi Glass Co Ltd A photosensitive composition, a partition wall, a color filter, and an organic EL element
JP5093352B2 (ja) * 2008-08-01 2012-12-12 旭硝子株式会社 ネガ型感光性組成物、それを用いた光学素子用隔壁および該隔壁を有する光学素子
EP2204392A1 (en) * 2008-12-31 2010-07-07 Rohm and Haas Electronic Materials LLC Compositions and processes for photolithography
WO2011081151A1 (ja) 2009-12-28 2011-07-07 旭硝子株式会社 感光性組成物、隔壁、カラーフィルタおよび有機ｅｌ素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023171487A1 (ja) * 2022-03-07 2023-09-14 東レ株式会社 感光性樹脂組成物、硬化物、表示装置および表示装置の製造方法

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TWI649621B (zh) 2019-02-01
KR20150060689A (ko) 2015-06-03
JPWO2014046209A1 (ja) 2016-08-18
WO2014046209A1 (ja) 2014-03-27
CN104684994B (zh) 2016-08-24
TW201423277A (zh) 2014-06-16
KR102156003B1 (ko) 2020-09-15
CN104684994A (zh) 2015-06-03

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