CN104639848B - 固态摄像器件、固态摄像器件的驱动方法和电子装置 - Google Patents
固态摄像器件、固态摄像器件的驱动方法和电子装置 Download PDFInfo
- Publication number
- CN104639848B CN104639848B CN201410588692.6A CN201410588692A CN104639848B CN 104639848 B CN104639848 B CN 104639848B CN 201410588692 A CN201410588692 A CN 201410588692A CN 104639848 B CN104639848 B CN 104639848B
- Authority
- CN
- China
- Prior art keywords
- pixel
- phase difference
- difference detection
- photoelectric conversion
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
- H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Aviation & Aerospace Engineering (AREA)
- Focusing (AREA)
- Mechanical Engineering (AREA)
- Studio Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-230219 | 2013-11-06 | ||
| JP2013230219A JP6176062B2 (ja) | 2013-11-06 | 2013-11-06 | 固体撮像装置およびその駆動方法、並びに電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104639848A CN104639848A (zh) | 2015-05-20 |
| CN104639848B true CN104639848B (zh) | 2019-02-15 |
Family
ID=53006780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410588692.6A Expired - Fee Related CN104639848B (zh) | 2013-11-06 | 2014-10-28 | 固态摄像器件、固态摄像器件的驱动方法和电子装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (5) | US9641780B2 (enExample) |
| JP (1) | JP6176062B2 (enExample) |
| CN (1) | CN104639848B (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5319347B2 (ja) * | 2009-03-17 | 2013-10-16 | キヤノン株式会社 | 撮像装置及びその制御方法 |
| JP6176062B2 (ja) * | 2013-11-06 | 2017-08-09 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
| JP6341675B2 (ja) * | 2014-01-29 | 2018-06-13 | キヤノン株式会社 | 固体撮像装置及びその駆動方法並びにそれを用いた撮像システム |
| KR102275711B1 (ko) * | 2014-11-17 | 2021-07-09 | 삼성전자주식회사 | 이미지 센서 및 이미지 센서의 데이터 출력 방법 |
| TWI696278B (zh) * | 2015-03-31 | 2020-06-11 | 日商新力股份有限公司 | 影像感測器、攝像裝置及電子機器 |
| JP5897752B1 (ja) * | 2015-05-14 | 2016-03-30 | ブリルニクスジャパン株式会社 | 固体撮像装置およびその駆動方法、電子機器 |
| JP2016225774A (ja) * | 2015-05-29 | 2016-12-28 | キヤノン株式会社 | 撮像素子および撮像装置 |
| JP6566734B2 (ja) * | 2015-06-11 | 2019-08-28 | キヤノン株式会社 | 固体撮像素子 |
| KR102407036B1 (ko) * | 2015-11-03 | 2022-06-10 | 삼성전자주식회사 | 이미지 센서 및 이미지 센서의 동작 방법 |
| KR102414030B1 (ko) * | 2015-11-18 | 2022-06-29 | 에스케이하이닉스 주식회사 | 이미지 센서 |
| JP6727797B2 (ja) * | 2015-12-04 | 2020-07-22 | キヤノン株式会社 | 撮像装置の駆動方法 |
| WO2017101864A1 (zh) | 2015-12-18 | 2017-06-22 | 广东欧珀移动通信有限公司 | 图像传感器、控制方法和电子装置 |
| JP6643101B2 (ja) * | 2016-01-21 | 2020-02-12 | キヤノン株式会社 | 撮像装置 |
| JP2017168566A (ja) * | 2016-03-15 | 2017-09-21 | ソニー株式会社 | 固体撮像素子、および電子機器 |
| KR102524400B1 (ko) * | 2016-07-04 | 2023-04-24 | 에스케이하이닉스 주식회사 | 하나의 컬러 필터 및 하나의 마이크로렌즈를 공유하는 다수 개의 포토다이오드들을 갖는 이미지 센서 |
| CN109792497B (zh) * | 2016-09-27 | 2021-04-20 | 富士胶片株式会社 | 成像元件及摄像装置 |
| JP2018078405A (ja) | 2016-11-08 | 2018-05-17 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、固体撮像素子の駆動方法、及び、電子機器 |
| KR102672594B1 (ko) * | 2017-01-23 | 2024-06-07 | 삼성전자주식회사 | 이미지 센서 및 이를 포함한 전자 장치 |
| US10362255B2 (en) * | 2017-02-09 | 2019-07-23 | Semiconductor Components Industries, Llc | Multi-conversion gain pixel configurations |
| WO2018186302A1 (ja) | 2017-04-05 | 2018-10-11 | 株式会社ニコン | 撮像素子および撮像装置 |
| WO2019009213A1 (ja) * | 2017-07-07 | 2019-01-10 | ブリルニクスジャパン株式会社 | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
| KR102358317B1 (ko) * | 2017-07-20 | 2022-02-08 | 에스케이하이닉스 주식회사 | 이미지 센서 |
| WO2019035374A1 (ja) * | 2017-08-18 | 2019-02-21 | ソニー株式会社 | 撮像素子および撮像装置 |
| US11658193B2 (en) * | 2018-01-23 | 2023-05-23 | Samsung Electronics Co., Ltd. | Image sensor |
| JP2019169668A (ja) * | 2018-03-26 | 2019-10-03 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
| WO2019229835A1 (ja) * | 2018-05-29 | 2019-12-05 | オリンパス株式会社 | 固体撮像装置および撮像システム |
| JP7280691B2 (ja) * | 2018-11-27 | 2023-05-24 | キヤノン株式会社 | 撮像素子およびその制御方法、及び撮像装置 |
| JP7458746B2 (ja) * | 2019-11-01 | 2024-04-01 | キヤノン株式会社 | 光電変換装置、撮像システム及び移動体 |
| US12155950B2 (en) * | 2019-12-10 | 2024-11-26 | Sony Semiconductor Solutions Corporation | Imaging device that allows miniaturization and electronic apparatus |
| KR20220019895A (ko) * | 2020-08-10 | 2022-02-18 | 삼성전자주식회사 | 이미지 센서 |
| KR20220051052A (ko) * | 2020-10-16 | 2022-04-26 | 삼성전자주식회사 | 이미지 센서 |
| JP2022176568A (ja) * | 2021-05-17 | 2022-11-30 | 株式会社ニコン | 撮像素子、及び、撮像装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001083407A (ja) * | 1999-09-13 | 2001-03-30 | Canon Inc | 撮像装置 |
| CN101258738A (zh) * | 2005-07-12 | 2008-09-03 | 美光科技公司 | 双重转换增益栅极及电容器与hdr组合 |
| CN102105830A (zh) * | 2008-07-25 | 2011-06-22 | 佳能株式会社 | 焦点检测设备 |
| CN102196198A (zh) * | 2010-01-29 | 2011-09-21 | 索尼公司 | 固体摄像器件、其制造方法和驱动方法、以及电子装置 |
| WO2013077154A1 (en) * | 2011-11-21 | 2013-05-30 | Canon Kabushiki Kaisha | Image sensing device and image capturing apparatus |
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| US6759641B1 (en) * | 2000-09-27 | 2004-07-06 | Rockwell Scientific Licensing, Llc | Imager with adjustable resolution |
| JP4532800B2 (ja) * | 2001-11-08 | 2010-08-25 | キヤノン株式会社 | 撮像装置及びシステム |
| KR100426309B1 (ko) | 2001-12-27 | 2004-04-08 | 한국전자통신연구원 | 근전도 발생 부위 탐색 및 표시 장치 |
| US20060103749A1 (en) * | 2004-11-12 | 2006-05-18 | Xinping He | Image sensor and pixel that has switchable capacitance at the floating node |
| DE102005007146A1 (de) | 2005-02-11 | 2006-08-24 | Siemens Ag | Verfahren zur Ummantelung eines Varistorblockes mit einer elektrisch isolierenden Umhüllung sowie Varistorblock für einen Überspannungsableiter |
| US7432540B2 (en) * | 2005-08-01 | 2008-10-07 | Micron Technology, Inc. | Dual conversion gain gate and capacitor combination |
| JP4710660B2 (ja) | 2006-03-10 | 2011-06-29 | 株式会社ニコン | 固体撮像素子及びこれを用いた電子カメラ |
| US7602430B1 (en) * | 2007-04-18 | 2009-10-13 | Foveon, Inc. | High-gain multicolor pixel sensor with reset noise cancellation |
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| JP5644177B2 (ja) * | 2010-05-07 | 2014-12-24 | ソニー株式会社 | 固体撮像装置、および、その製造方法、電子機器 |
| JP5750918B2 (ja) | 2011-02-03 | 2015-07-22 | 株式会社ニコン | 固体撮像素子及びこれを用いた撮像装置 |
| KR20130011692A (ko) * | 2011-07-22 | 2013-01-30 | 삼성전자주식회사 | 깊이 영상과 컬러 영상을 획득하는 픽셀 구조를 가진 이미지 센서 |
| JP2013034045A (ja) * | 2011-08-01 | 2013-02-14 | Sony Corp | 固体撮像装置、撮像装置 |
| JP5436634B2 (ja) * | 2012-08-02 | 2014-03-05 | 株式会社藤商事 | 遊技機 |
| JP5971078B2 (ja) * | 2012-10-19 | 2016-08-17 | 株式会社ニコン | 固体撮像素子および撮像装置 |
| KR101414202B1 (ko) * | 2012-10-31 | 2014-07-01 | 주식회사 동부하이텍 | 이미지 센서 |
| EP2738812B8 (en) * | 2012-11-29 | 2018-07-18 | ams Sensors Belgium BVBA | A pixel array |
| JP6176062B2 (ja) * | 2013-11-06 | 2017-08-09 | ソニー株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
| JP6239975B2 (ja) * | 2013-12-27 | 2017-11-29 | キヤノン株式会社 | 固体撮像装置及びそれを用いた撮像システム |
-
2013
- 2013-11-06 JP JP2013230219A patent/JP6176062B2/ja not_active Expired - Fee Related
-
2014
- 2014-10-28 CN CN201410588692.6A patent/CN104639848B/zh not_active Expired - Fee Related
- 2014-10-30 US US14/528,753 patent/US9641780B2/en not_active Expired - Fee Related
-
2017
- 2017-04-28 US US15/582,218 patent/US9924119B2/en active Active
-
2018
- 2018-01-24 US US15/878,652 patent/US10659708B2/en not_active Expired - Fee Related
-
2020
- 2020-04-15 US US16/849,843 patent/US11343451B2/en active Active
- 2020-07-10 US US16/926,278 patent/US11343452B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001083407A (ja) * | 1999-09-13 | 2001-03-30 | Canon Inc | 撮像装置 |
| CN101258738A (zh) * | 2005-07-12 | 2008-09-03 | 美光科技公司 | 双重转换增益栅极及电容器与hdr组合 |
| CN102105830A (zh) * | 2008-07-25 | 2011-06-22 | 佳能株式会社 | 焦点检测设备 |
| CN102196198A (zh) * | 2010-01-29 | 2011-09-21 | 索尼公司 | 固体摄像器件、其制造方法和驱动方法、以及电子装置 |
| WO2013077154A1 (en) * | 2011-11-21 | 2013-05-30 | Canon Kabushiki Kaisha | Image sensing device and image capturing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180152655A1 (en) | 2018-05-31 |
| US20150124139A1 (en) | 2015-05-07 |
| CN104639848A (zh) | 2015-05-20 |
| US11343451B2 (en) | 2022-05-24 |
| US9641780B2 (en) | 2017-05-02 |
| JP2015091025A (ja) | 2015-05-11 |
| US20170237920A1 (en) | 2017-08-17 |
| US20200369371A1 (en) | 2020-11-26 |
| US20200339245A1 (en) | 2020-10-29 |
| US10659708B2 (en) | 2020-05-19 |
| US11343452B2 (en) | 2022-05-24 |
| US9924119B2 (en) | 2018-03-20 |
| JP6176062B2 (ja) | 2017-08-09 |
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Granted publication date: 20190215 |