CN104541347B - 端子接合装置 - Google Patents
端子接合装置 Download PDFInfo
- Publication number
- CN104541347B CN104541347B CN201480001838.0A CN201480001838A CN104541347B CN 104541347 B CN104541347 B CN 104541347B CN 201480001838 A CN201480001838 A CN 201480001838A CN 104541347 B CN104541347 B CN 104541347B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- terminal
- dividing head
- pair
- grafting material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 98
- 239000000463 material Substances 0.000 claims abstract description 60
- 239000011248 coating agent Substances 0.000 claims abstract description 23
- 238000000576 coating method Methods 0.000 claims abstract description 23
- 230000032258 transport Effects 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 11
- 230000003028 elevating effect Effects 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 239000002699 waste material Substances 0.000 description 9
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Specific Conveyance Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013170015A JP6126942B2 (ja) | 2013-08-20 | 2013-08-20 | 端子接合装置 |
JP2013-170015 | 2013-08-20 | ||
PCT/JP2014/069050 WO2015025647A1 (ja) | 2013-08-20 | 2014-07-17 | 端子接合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104541347A CN104541347A (zh) | 2015-04-22 |
CN104541347B true CN104541347B (zh) | 2017-06-23 |
Family
ID=52483429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480001838.0A Active CN104541347B (zh) | 2013-08-20 | 2014-07-17 | 端子接合装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6126942B2 (ja) |
KR (1) | KR101682318B1 (ja) |
CN (1) | CN104541347B (ja) |
TW (1) | TWI521555B (ja) |
WO (1) | WO2015025647A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017092313A (ja) * | 2015-11-12 | 2017-05-25 | 株式会社東芝 | 半導体製造装置。 |
JP7025687B2 (ja) * | 2017-09-11 | 2022-02-25 | Tdk株式会社 | 電子部品の製造方法および電子部品 |
JP7040410B2 (ja) | 2018-03-07 | 2022-03-23 | 株式会社村田製作所 | コイル部品の製造方法 |
CN110246681B (zh) * | 2018-03-07 | 2022-07-08 | 株式会社村田制作所 | 线圈部件的制造方法和线圈部件的制造装置 |
JP6903740B2 (ja) * | 2018-08-24 | 2021-07-14 | 深▲せん▼市誠捷智能装備股▲ふん▼有限公司 | 搬送装置及びコンデンサ組立機 |
CN109755012B (zh) * | 2019-01-25 | 2020-09-25 | 东莞市力能电子科技有限公司 | 一种变压器连接端子全自动裁切组装设备及其组装方法 |
JP7405019B2 (ja) * | 2020-06-26 | 2023-12-26 | Tdk株式会社 | 金属端子付き電子部品の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6547879B1 (en) * | 1999-12-08 | 2003-04-15 | Tokyo Weld Co., Ltd. | Electrode forming apparatus for electric parts |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0550696U (ja) * | 1991-12-05 | 1993-07-02 | 日本電子機器株式会社 | 電子部品の半田付け装置 |
JP3175409B2 (ja) * | 1993-07-12 | 2001-06-11 | 松下電器産業株式会社 | 積層セラミック電子部品の製造方法及びその装置 |
JPH0864467A (ja) * | 1994-08-25 | 1996-03-08 | Kyocera Corp | 複合セラミックコンデンサ |
JP4117102B2 (ja) * | 2000-10-02 | 2008-07-16 | 太陽誘電株式会社 | 電子部品の外部電極形成方法及び装置 |
JP4241439B2 (ja) * | 2003-06-18 | 2009-03-18 | 株式会社村田製作所 | チップ型電子部品の取扱い装置 |
JP4925342B2 (ja) * | 2007-12-28 | 2012-04-25 | 信越ポリマー株式会社 | 被粘着物離脱用ローラ及び被粘着物離脱装置 |
JP5176775B2 (ja) * | 2008-06-02 | 2013-04-03 | 株式会社村田製作所 | セラミック電子部品及びその製造方法 |
JP2012094671A (ja) * | 2010-10-27 | 2012-05-17 | Tdk Corp | 電子部品 |
-
2013
- 2013-08-20 JP JP2013170015A patent/JP6126942B2/ja active Active
-
2014
- 2014-07-17 WO PCT/JP2014/069050 patent/WO2015025647A1/ja active Application Filing
- 2014-07-17 CN CN201480001838.0A patent/CN104541347B/zh active Active
- 2014-07-17 KR KR1020157005679A patent/KR101682318B1/ko active IP Right Grant
- 2014-08-06 TW TW103126864A patent/TWI521555B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6547879B1 (en) * | 1999-12-08 | 2003-04-15 | Tokyo Weld Co., Ltd. | Electrode forming apparatus for electric parts |
Also Published As
Publication number | Publication date |
---|---|
TW201517087A (zh) | 2015-05-01 |
CN104541347A (zh) | 2015-04-22 |
WO2015025647A1 (ja) | 2015-02-26 |
TWI521555B (zh) | 2016-02-11 |
KR101682318B1 (ko) | 2016-12-05 |
JP6126942B2 (ja) | 2017-05-10 |
JP2015038947A (ja) | 2015-02-26 |
KR20150041039A (ko) | 2015-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104541347B (zh) | 端子接合装置 | |
US8052036B2 (en) | Tab lead soldering apparatus and tab lead soldering method | |
JP4489025B2 (ja) | 圧着装置 | |
KR102117726B1 (ko) | 압착 장치 및 압착 방법 | |
KR20100130987A (ko) | 기판홀더, 기판홀더 유니트, 기판반송장치 및 기판접합장치 | |
US10412868B2 (en) | System and method for separating workpieces | |
US11664344B2 (en) | Mounting apparatus | |
CN107295758B (zh) | 电子部件安装装置和电子部件制造方法 | |
CN105188333A (zh) | 装配装置以及装配方法 | |
CN105208846A (zh) | 元件压接装置 | |
CN103000550B (zh) | 芯片接合机以及接合方法 | |
CN106455473B (zh) | 托盘搬送装置以及安装装置 | |
JP5410388B2 (ja) | チップ保持装置,チップ供給装置およびチップ搭載機 | |
JP6245685B2 (ja) | 製造装置 | |
KR20200021138A (ko) | 웨이퍼의 접합을 위한 웨이퍼 지그 및 이를 포함하는 웨이퍼 접합 장치 | |
JP5493713B2 (ja) | 基板ホルダ、基板貼り合わせ装置、基板ホルダ対および搬送装置 | |
JP2015122363A (ja) | 部品実装装置 | |
JP4659440B2 (ja) | 基板搬送装置およびチップ搭載機 | |
KR20130004012A (ko) | 평판 디스플레이의 모듈 접합 방법 및 장치 | |
KR101579094B1 (ko) | 본딩 스테이지 및 그 제조 방법 | |
JP4093854B2 (ja) | 電子部品実装装置 | |
JP2007137426A (ja) | テーピング装置及びその制御方法 | |
JP5874428B2 (ja) | キャリブレート用ターゲット治具および半導体製造装置 | |
US20230290666A1 (en) | Semiconductor manufacturing apparatus, carrier jig, and manufacturing method of semiconductor device | |
JP2012123134A (ja) | Fpdモジュールの組立装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |