JP7405019B2 - 金属端子付き電子部品の製造方法 - Google Patents
金属端子付き電子部品の製造方法 Download PDFInfo
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- JP7405019B2 JP7405019B2 JP2020110523A JP2020110523A JP7405019B2 JP 7405019 B2 JP7405019 B2 JP 7405019B2 JP 2020110523 A JP2020110523 A JP 2020110523A JP 2020110523 A JP2020110523 A JP 2020110523A JP 7405019 B2 JP7405019 B2 JP 7405019B2
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- Prior art keywords
- electronic component
- heating
- metal terminal
- terminal
- metal
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- 229910052751 metal Inorganic materials 0.000 title claims description 128
- 239000002184 metal Substances 0.000 title claims description 128
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 165
- 238000000034 method Methods 0.000 claims description 33
- 238000005304 joining Methods 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 description 25
- 230000035939 shock Effects 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- -1 and for example Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
Claims (6)
- 金属端子付き電子部品を製造する金属端子付き電子部品の製造方法であって、
端子電極を有する電子部品を準備する工程と、
金属端子を準備する工程と、
前記端子電極及び前記金属端子の少なくとも一方に接合部材を塗布する工程と、
前記電子部品を第1の加熱手段で予備加熱する工程と、
前記予備加熱する工程の後に、前記金属端子に第2の加熱手段を接触させて本加熱することで、前記電子部品の前記端子電極と前記金属端子とを接合する工程と、を備え、
少なくとも前記接合する工程において、保持部で前記電子部品を保持し、
前記保持部は前記第1の加熱手段として構成され、
前記予備加熱する工程において、前記保持部で前記電子部品を保持した状態で前記予備加熱を行う、金属端子付き電子部品の製造方法。 - 前記接合する工程において、前記第2の加熱手段とは前記電子部品を挟んで反対側にて、支持部で前記電子部品を支持する、請求項1に記載の金属端子付き電子部品の製造方法。
- 前記支持部は、第3の加熱手段として構成され、
前記接合する工程において、前記第2の加熱手段の反対側の前記金属端子に前記第3の加熱手段を接触させて本加熱することで、前記第2の加熱手段の反対側にて、前記端子電極と前記金属端子とを接合する、請求項2に記載の金属端子付き電子部品の製造方法。 - 前記第1の加熱手段による前記予備加熱の温度は、前記第2の加熱手段による前記本加熱の温度より低い、請求項1~3の何れか一項に記載の金属端子付き電子部品の製造方法。
- 前記第1の加熱手段による前記予備加熱の温度は、はんだの融点よりも低く、
前記第2の加熱手段による前記本加熱の温度は、はんだの融点よりも高い、請求項1~4の何れか一項に記載の金属端子付き電子部品の製造方法。 - 前記第1の加熱手段は、前記電子部品の素地と接触する、請求項1~5の何れか一項に記載の金属端子付き電子部品の製造方法。
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JP2020110523A JP7405019B2 (ja) | 2020-06-26 | 2020-06-26 | 金属端子付き電子部品の製造方法 |
CN202110697712.3A CN114121483A (zh) | 2020-06-26 | 2021-06-23 | 带金属端子的电子部件的制造方法 |
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JP2020110523A JP7405019B2 (ja) | 2020-06-26 | 2020-06-26 | 金属端子付き電子部品の製造方法 |
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JP2022007505A JP2022007505A (ja) | 2022-01-13 |
JP7405019B2 true JP7405019B2 (ja) | 2023-12-26 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091588A (ja) | 2006-09-30 | 2008-04-17 | Nippon Chemicon Corp | 端子付きコンデンサの製造方法 |
JP2008192994A (ja) | 2007-02-07 | 2008-08-21 | Tdk Corp | 電子部品の製造方法 |
JP2011165984A (ja) | 2010-02-10 | 2011-08-25 | Mitsubishi Materials Corp | 電子部品製造装置 |
JP2015038947A (ja) | 2013-08-20 | 2015-02-26 | 株式会社村田製作所 | 端子接合装置 |
JP2015062214A (ja) | 2013-08-20 | 2015-04-02 | 株式会社村田製作所 | 端子板付き電子部品の製造方法及び端子板付き電子部品 |
JP5977219B2 (ja) | 2013-11-07 | 2016-08-24 | 住友ゴム工業株式会社 | 空気入りタイヤの試験方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007109859A (ja) * | 2005-10-13 | 2007-04-26 | Nec Electronics Corp | 電子部品の製造方法 |
JP5126266B2 (ja) * | 2010-03-24 | 2013-01-23 | Tdk株式会社 | 金属端子付き電子部品及びその実装方法、並びにその製造方法 |
CN104160463B (zh) * | 2012-03-05 | 2017-09-29 | 株式会社村田制作所 | 电子部件及电子部件与接合对象物的接合结构体的形成方法 |
JP2018018938A (ja) * | 2016-07-27 | 2018-02-01 | 株式会社村田製作所 | 積層セラミック電子部品 |
-
2020
- 2020-06-26 JP JP2020110523A patent/JP7405019B2/ja active Active
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2021
- 2021-06-23 CN CN202110697712.3A patent/CN114121483A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091588A (ja) | 2006-09-30 | 2008-04-17 | Nippon Chemicon Corp | 端子付きコンデンサの製造方法 |
JP2008192994A (ja) | 2007-02-07 | 2008-08-21 | Tdk Corp | 電子部品の製造方法 |
JP2011165984A (ja) | 2010-02-10 | 2011-08-25 | Mitsubishi Materials Corp | 電子部品製造装置 |
JP2015038947A (ja) | 2013-08-20 | 2015-02-26 | 株式会社村田製作所 | 端子接合装置 |
JP2015062214A (ja) | 2013-08-20 | 2015-04-02 | 株式会社村田製作所 | 端子板付き電子部品の製造方法及び端子板付き電子部品 |
JP5977219B2 (ja) | 2013-11-07 | 2016-08-24 | 住友ゴム工業株式会社 | 空気入りタイヤの試験方法 |
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JP2022007505A (ja) | 2022-01-13 |
CN114121483A (zh) | 2022-03-01 |
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