CN104508067B - 各向同性导电粘接剂 - Google Patents

各向同性导电粘接剂 Download PDF

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Publication number
CN104508067B
CN104508067B CN201380040083.0A CN201380040083A CN104508067B CN 104508067 B CN104508067 B CN 104508067B CN 201380040083 A CN201380040083 A CN 201380040083A CN 104508067 B CN104508067 B CN 104508067B
Authority
CN
China
Prior art keywords
silver
beads
bead
conductive adhesive
isotropic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380040083.0A
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English (en)
Chinese (zh)
Other versions
CN104508067A (zh
Inventor
赫尔吉·克里斯蒂安森
基思·雷德福德
托雷·赫尔兰德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conpart AS
Original Assignee
Conpart AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB1209486.8A external-priority patent/GB201209486D0/en
Priority claimed from GB201304532A external-priority patent/GB201304532D0/en
Application filed by Conpart AS filed Critical Conpart AS
Publication of CN104508067A publication Critical patent/CN104508067A/zh
Application granted granted Critical
Publication of CN104508067B publication Critical patent/CN104508067B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
CN201380040083.0A 2012-05-29 2013-05-29 各向同性导电粘接剂 Active CN104508067B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261652524P 2012-05-29 2012-05-29
GB1209486.8 2012-05-29
US61/652,524 2012-05-29
GBGB1209486.8A GB201209486D0 (en) 2012-05-29 2012-05-29 Isotropic conductive adhesive
GB1304532.3 2013-03-13
GB201304532A GB201304532D0 (en) 2013-03-13 2013-03-13 Isotropic conductive adhesive
PCT/EP2013/061091 WO2013178692A1 (en) 2012-05-29 2013-05-29 Isotropic conductive adhesive

Publications (2)

Publication Number Publication Date
CN104508067A CN104508067A (zh) 2015-04-08
CN104508067B true CN104508067B (zh) 2018-12-25

Family

ID=48784834

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380040083.0A Active CN104508067B (zh) 2012-05-29 2013-05-29 各向同性导电粘接剂

Country Status (6)

Country Link
US (1) US9758702B2 (enExample)
EP (1) EP2855614B1 (enExample)
CN (1) CN104508067B (enExample)
GB (1) GB2505035B (enExample)
IN (1) IN2014MN02449A (enExample)
WO (1) WO2013178692A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104194262B (zh) * 2014-08-18 2017-12-12 苏州生益科技有限公司 一种热固性树脂组合物及使用其制作的半固化片和层压板
JP6626494B2 (ja) * 2015-03-04 2019-12-25 積水化学工業株式会社 電気モジュール及び電気モジュールの製造方法
FR3038446B1 (fr) * 2015-07-01 2017-07-21 Hydromecanique & Frottement Materiau composite conducteur elabore a partir de poudres revetues
JP6186019B2 (ja) * 2016-01-13 2017-08-23 株式会社山王 導電性微粒子及び導電性微粒子の製造方法
US11168235B2 (en) * 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6942824B1 (en) * 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
CN101309988A (zh) * 2005-11-21 2008-11-19 日立化成工业株式会社 各向异性导电粘接剂
WO2012056244A1 (en) * 2010-10-29 2012-05-03 Conpart As Process for the surface modification of a polymer particle

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731282A (en) 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US5001542A (en) 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
GB9822822D0 (en) 1998-10-19 1998-12-16 Dyno Particles As Particles
CN1989573A (zh) 2004-08-05 2007-06-27 积水化学工业株式会社 导电性微粒、导电性微粒的制造方法、以及无电解镀银液
TWI339358B (en) 2005-07-04 2011-03-21 Hitachi Ltd Rfid tag and manufacturing method thereof
CN102714071A (zh) 2009-11-20 2012-10-03 3M创新有限公司 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法
GB201116240D0 (en) 2011-09-20 2011-11-02 Henkel Ag & Co Kgaa Electrically conductive adhesives comprising silver-coated particles
US20130248777A1 (en) 2012-03-26 2013-09-26 Heraeus Precious Metals North America Conshohocken Llc Low silver content paste composition and method of making a conductive film therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6942824B1 (en) * 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
CN101309988A (zh) * 2005-11-21 2008-11-19 日立化成工业株式会社 各向异性导电粘接剂
WO2012056244A1 (en) * 2010-10-29 2012-05-03 Conpart As Process for the surface modification of a polymer particle

Also Published As

Publication number Publication date
GB2505035A (en) 2014-02-19
US20130323501A1 (en) 2013-12-05
IN2014MN02449A (enExample) 2015-07-10
EP2855614B1 (en) 2021-10-13
CN104508067A (zh) 2015-04-08
US9758702B2 (en) 2017-09-12
EP2855614A1 (en) 2015-04-08
WO2013178692A1 (en) 2013-12-05
GB2505035B (en) 2014-10-29
GB201309566D0 (en) 2013-07-10

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