GB2505035B - Isotropic conductive adhesive - Google Patents
Isotropic conductive adhesiveInfo
- Publication number
- GB2505035B GB2505035B GB201309566A GB201309566A GB2505035B GB 2505035 B GB2505035 B GB 2505035B GB 201309566 A GB201309566 A GB 201309566A GB 201309566 A GB201309566 A GB 201309566A GB 2505035 B GB2505035 B GB 2505035B
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductive adhesive
- isotropic conductive
- isotropic
- adhesive
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261652524P | 2012-05-29 | 2012-05-29 | |
| GBGB1209486.8A GB201209486D0 (en) | 2012-05-29 | 2012-05-29 | Isotropic conductive adhesive |
| GB201304532A GB201304532D0 (en) | 2013-03-13 | 2013-03-13 | Isotropic conductive adhesive |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB201309566D0 GB201309566D0 (en) | 2013-07-10 |
| GB2505035A GB2505035A (en) | 2014-02-19 |
| GB2505035B true GB2505035B (en) | 2014-10-29 |
Family
ID=48784834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB201309566A Active GB2505035B (en) | 2012-05-29 | 2013-05-29 | Isotropic conductive adhesive |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9758702B2 (enExample) |
| EP (1) | EP2855614B1 (enExample) |
| CN (1) | CN104508067B (enExample) |
| GB (1) | GB2505035B (enExample) |
| IN (1) | IN2014MN02449A (enExample) |
| WO (1) | WO2013178692A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104194262B (zh) * | 2014-08-18 | 2017-12-12 | 苏州生益科技有限公司 | 一种热固性树脂组合物及使用其制作的半固化片和层压板 |
| JP6626494B2 (ja) * | 2015-03-04 | 2019-12-25 | 積水化学工業株式会社 | 電気モジュール及び電気モジュールの製造方法 |
| FR3038446B1 (fr) * | 2015-07-01 | 2017-07-21 | Hydromecanique & Frottement | Materiau composite conducteur elabore a partir de poudres revetues |
| JP6186019B2 (ja) * | 2016-01-13 | 2017-08-23 | 株式会社山王 | 導電性微粒子及び導電性微粒子の製造方法 |
| US11168235B2 (en) * | 2017-05-09 | 2021-11-09 | 3M Innovative Properties Company | Electrically conductive adhesive |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0242025A1 (en) * | 1986-02-14 | 1987-10-21 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
| WO2000024005A1 (en) * | 1998-10-19 | 2000-04-27 | Dynal Particles As | Particles |
| US6942824B1 (en) * | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
| EP1783783A1 (en) * | 2004-08-05 | 2007-05-09 | Sekisui Chemical Co., Ltd. | Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid |
| WO2012056244A1 (en) * | 2010-10-29 | 2012-05-03 | Conpart As | Process for the surface modification of a polymer particle |
| WO2013041568A1 (en) * | 2011-09-20 | 2013-03-28 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives comprising silver-coated particles |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4731282A (en) | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
| US5001542A (en) | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
| US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
| TWI339358B (en) | 2005-07-04 | 2011-03-21 | Hitachi Ltd | Rfid tag and manufacturing method thereof |
| KR101053767B1 (ko) * | 2005-11-21 | 2011-08-02 | 히다치 가세고교 가부시끼가이샤 | 이방 도전 접착제 |
| CN102714071A (zh) | 2009-11-20 | 2012-10-03 | 3M创新有限公司 | 包含其上共价连接有表面改性的纳米粒子的导电粒子的组合物、以及制备方法 |
| US20130248777A1 (en) | 2012-03-26 | 2013-09-26 | Heraeus Precious Metals North America Conshohocken Llc | Low silver content paste composition and method of making a conductive film therefrom |
-
2013
- 2013-05-29 GB GB201309566A patent/GB2505035B/en active Active
- 2013-05-29 US US13/904,244 patent/US9758702B2/en active Active
- 2013-05-29 CN CN201380040083.0A patent/CN104508067B/zh active Active
- 2013-05-29 IN IN2449MUN2014 patent/IN2014MN02449A/en unknown
- 2013-05-29 EP EP13725696.2A patent/EP2855614B1/en active Active
- 2013-05-29 WO PCT/EP2013/061091 patent/WO2013178692A1/en not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0242025A1 (en) * | 1986-02-14 | 1987-10-21 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
| WO2000024005A1 (en) * | 1998-10-19 | 2000-04-27 | Dynal Particles As | Particles |
| US6942824B1 (en) * | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
| EP1783783A1 (en) * | 2004-08-05 | 2007-05-09 | Sekisui Chemical Co., Ltd. | Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid |
| WO2012056244A1 (en) * | 2010-10-29 | 2012-05-03 | Conpart As | Process for the surface modification of a polymer particle |
| EP2632975A1 (en) * | 2010-10-29 | 2013-09-04 | Conpart AS | Process for the surface modification of a polymer particle |
| WO2013041568A1 (en) * | 2011-09-20 | 2013-03-28 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives comprising silver-coated particles |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2505035A (en) | 2014-02-19 |
| CN104508067B (zh) | 2018-12-25 |
| US20130323501A1 (en) | 2013-12-05 |
| IN2014MN02449A (enExample) | 2015-07-10 |
| EP2855614B1 (en) | 2021-10-13 |
| CN104508067A (zh) | 2015-04-08 |
| US9758702B2 (en) | 2017-09-12 |
| EP2855614A1 (en) | 2015-04-08 |
| WO2013178692A1 (en) | 2013-12-05 |
| GB201309566D0 (en) | 2013-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2519420B (en) | Electrofracturing formations | |
| EP2899245A4 (en) | ANISOTROPIC AND CONDUCTIVE ADHESIVE | |
| PL2878299T3 (pl) | Plaster adhezyjny | |
| EP2812944A4 (en) | SUPRALUMINIC ANTENNA | |
| PL2844690T3 (pl) | Folia samoprzylepna przewodząca trójwymiarowo prąd elektryczny | |
| EP2874517A4 (en) | SEAT LIFTING ARRANGEMENT | |
| PT2805380T (pt) | Elemento de ligação | |
| GB201421101D0 (en) | Electronic communicating | |
| PL2738401T3 (pl) | Element do szybkiego montażu | |
| PT2844548T (pt) | Elemento de volume | |
| GB2498820B (en) | Condensers | |
| HU4206U (en) | Multi purposal sportsdevice | |
| EP2905847A4 (en) | TOGETHER | |
| GB201212489D0 (en) | Improvements in conductive adhesives | |
| GB2509235B (en) | Driver circuit | |
| EP2914323A4 (en) | INTUMASK ARRANGEMENT | |
| GB2498536B (en) | Electrical assembly | |
| GB2505035B (en) | Isotropic conductive adhesive | |
| ZA201209337B (en) | Conductive adhesive | |
| EP2739690A4 (en) | STRUCTURAL ADHESIVE ELECTROCONDUCTIVE | |
| GB2507515B (en) | An assembly | |
| EP2870696A4 (en) | PILOTAGE CIRCUIT | |
| GB2510023B (en) | Retaining assembly | |
| EP2941512A4 (en) | RIGID INSULATING PANEL | |
| EP2815428A4 (en) | CIRCUIT ASSEMBLY |