IN2014MN02449A - - Google Patents

Info

Publication number
IN2014MN02449A
IN2014MN02449A IN2449MUN2014A IN2014MN02449A IN 2014MN02449 A IN2014MN02449 A IN 2014MN02449A IN 2449MUN2014 A IN2449MUN2014 A IN 2449MUN2014A IN 2014MN02449 A IN2014MN02449 A IN 2014MN02449A
Authority
IN
India
Prior art keywords
beads
silver
polymer
average diameter
less
Prior art date
Application number
Inventor
Helge Kristiansen
Keith Redford
Tore Helland
Original Assignee
Conpart As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB1209486.8A external-priority patent/GB201209486D0/en
Priority claimed from GB201304532A external-priority patent/GB201304532D0/en
Application filed by Conpart As filed Critical Conpart As
Publication of IN2014MN02449A publication Critical patent/IN2014MN02449A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

Abstract

An isotropic conductive adhesive comprises silver coated polymer beads 12 within an adhesive matrix 8 wherein the mean average diameter of the polymer cores of the beads 12 is 5 µm or greater and less than 30 µm and wherein the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.
IN2449MUN2014 2012-05-29 2013-05-29 IN2014MN02449A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261652524P 2012-05-29 2012-05-29
GBGB1209486.8A GB201209486D0 (en) 2012-05-29 2012-05-29 Isotropic conductive adhesive
GB201304532A GB201304532D0 (en) 2013-03-13 2013-03-13 Isotropic conductive adhesive
PCT/EP2013/061091 WO2013178692A1 (en) 2012-05-29 2013-05-29 Isotropic conductive adhesive

Publications (1)

Publication Number Publication Date
IN2014MN02449A true IN2014MN02449A (en) 2015-07-10

Family

ID=48784834

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2449MUN2014 IN2014MN02449A (en) 2012-05-29 2013-05-29

Country Status (6)

Country Link
US (1) US9758702B2 (en)
EP (1) EP2855614B1 (en)
CN (1) CN104508067B (en)
GB (1) GB2505035B (en)
IN (1) IN2014MN02449A (en)
WO (1) WO2013178692A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104194262B (en) * 2014-08-18 2017-12-12 苏州生益科技有限公司 A kind of compositions of thermosetting resin and the prepreg and laminate using its making
WO2016140196A1 (en) * 2015-03-04 2016-09-09 積水化学工業株式会社 Conducting paste, electric module and electric module production method
FR3038446B1 (en) * 2015-07-01 2017-07-21 Hydromecanique & Frottement CONDUCTIVE COMPOSITE MATERIAL PRODUCED FROM COATED POWDERS
JP6186019B2 (en) * 2016-01-13 2017-08-23 株式会社山王 Conductive fine particles and method for producing conductive fine particles
US11168235B2 (en) * 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731282A (en) 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US5001542A (en) 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
GB9822822D0 (en) 1998-10-19 1998-12-16 Dyno Particles As Particles
US6942824B1 (en) * 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
CN1989573A (en) 2004-08-05 2007-06-27 积水化学工业株式会社 Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid
TWI339358B (en) 2005-07-04 2011-03-21 Hitachi Ltd Rfid tag and manufacturing method thereof
JPWO2007058108A1 (en) * 2005-11-21 2009-04-30 日立化成工業株式会社 Anisotropic conductive adhesive
JP5690352B2 (en) 2009-11-20 2015-03-25 スリーエム イノベイティブ プロパティズ カンパニー Composition comprising conductive particles covalently bonded with surface-modified nanoparticles and method for producing the same
GB201018380D0 (en) * 2010-10-29 2010-12-15 Conpart As Process
GB201116240D0 (en) 2011-09-20 2011-11-02 Henkel Ag & Co Kgaa Electrically conductive adhesives comprising silver-coated particles
US20130248777A1 (en) 2012-03-26 2013-09-26 Heraeus Precious Metals North America Conshohocken Llc Low silver content paste composition and method of making a conductive film therefrom

Also Published As

Publication number Publication date
EP2855614A1 (en) 2015-04-08
US9758702B2 (en) 2017-09-12
EP2855614B1 (en) 2021-10-13
CN104508067B (en) 2018-12-25
WO2013178692A1 (en) 2013-12-05
GB2505035A (en) 2014-02-19
CN104508067A (en) 2015-04-08
GB2505035B (en) 2014-10-29
US20130323501A1 (en) 2013-12-05
GB201309566D0 (en) 2013-07-10

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