JPWO2007058108A1 - Anisotropic conductive adhesive - Google Patents

Anisotropic conductive adhesive Download PDF

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Publication number
JPWO2007058108A1
JPWO2007058108A1 JP2007545210A JP2007545210A JPWO2007058108A1 JP WO2007058108 A1 JPWO2007058108 A1 JP WO2007058108A1 JP 2007545210 A JP2007545210 A JP 2007545210A JP 2007545210 A JP2007545210 A JP 2007545210A JP WO2007058108 A1 JPWO2007058108 A1 JP WO2007058108A1
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Prior art keywords
anisotropic conductive
conductive adhesive
film
space
adhesive
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JP2007545210A
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Japanese (ja)
Inventor
藤縄　貢
貢 藤縄
堀内　猛
猛 堀内
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2007058108A1 publication Critical patent/JPWO2007058108A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

ベースフィルム（１２）と、ベースフィルム（１２）上にある、絶縁性接着剤中に導電性粒子が分散してなる異方導電膜（１４）からなり、異方導電膜（１４）のパターンが、複数箇所に互いに離隔的に設けられているスペース（１６）を含む異方導電接着剤（１０）。A base film (12) and an anisotropic conductive film (14) formed by dispersing conductive particles in an insulating adhesive on the base film (12). The pattern of the anisotropic conductive film (14) is An anisotropic conductive adhesive (10) that includes spaces (16) that are spaced apart from each other at a plurality of locations.

Description

本発明は、異方導電接着剤、特に外周電極の接続に適した異方導電接着剤に関する。   The present invention relates to an anisotropic conductive adhesive, and more particularly to an anisotropic conductive adhesive suitable for connection of outer peripheral electrodes.

近年、情報端末機器を中心として、高機能化、軽量化、薄型化、小型化の市場ニーズが高まっているのに伴い、ベアチップを直接的にプリント配線板その他の基板に実装する方法が種々検討されている。   In recent years, with the increasing market demand for higher functionality, lighter weight, thinner and smaller size, mainly for information terminal equipment, various methods for mounting bare chips directly on printed wiring boards and other substrates have been studied. Has been.

その一つとして、熱硬化型接着剤中に導電性粒子を分散した異方導電接着剤をフィルム状に成形した異方導電フィルム（ＡＣＦ）や、異方導電接着剤を液状に調製した異方導電ペースト（ＡＣＰ）を用いる方法がある。このうちフィルム状の異方導電接着剤の製品形態は、通常、図７に示した異方導電接着剤１のように、ベースフィルム２上に異方導電膜４をベタで積層し、それをリールに巻いたものとなっている。   One of them is the anisotropic conductive film (ACF) in which an anisotropic conductive adhesive in which conductive particles are dispersed in a thermosetting adhesive is formed into a film, or an anisotropic conductive film prepared in a liquid form. There is a method using a conductive paste (ACP). Of these, the product form of the film-like anisotropic conductive adhesive is usually formed by laminating the anisotropic conductive film 4 on the base film 2 in a solid manner like the anisotropic conductive adhesive 1 shown in FIG. It has been wound on a reel.

しかしながら、従来の異方導電接着剤１を用いて、例えばＣＭＯＳセンサーを囲む電極のようなスペースを囲む電極（以下、外周電極という場合がある）のみを選択的に接続する場合、異方導電膜４を、外周電極の各辺の電極ごとに貼付する必要があるが、この場合実装のタクトタイムが長くなる。   However, when the conventional anisotropic conductive adhesive 1 is used to selectively connect only an electrode surrounding a space such as an electrode surrounding a CMOS sensor (hereinafter also referred to as an outer peripheral electrode), for example, 4 needs to be affixed for each electrode on each side of the outer peripheral electrode, but in this case, the mounting tact time becomes long.

本発明は、外周電極に簡便に実装できる異方導電接着剤を提供することを目的とする。   An object of this invention is to provide the anisotropic conductive adhesive which can be easily mounted in an outer peripheral electrode.

本発明によれば以下の異方導電接着剤が提供される。
１．ベースフィルムと、
前記ベースフィルム上にある、絶縁性接着剤中に導電性粒子が分散してなる異方導電膜からなり、
前記異方導電膜のパターンが、複数箇所に互いに離隔的に設けられているスペースを含む異方導電接着剤。
２．中央長手方向に同一サイズの複数のスペースが一列に設けられている１記載の異方導電接着剤。
３．前記スペースが、異方導電膜だけに空いていて、ベースフィルムには空いていない１又は２記載の異方導電接着剤。
４．前記スペースが、異方導電膜だけでなくベースフィルムにも空いている１又は２記載の異方導電接着剤。
５．イメージセンサー用である１〜４のいずれかに記載の異方導電接着剤。According to the present invention, the following anisotropic conductive adhesive is provided.
1. A base film,
The anisotropic conductive film formed by dispersing conductive particles in an insulating adhesive on the base film,
An anisotropic conductive adhesive comprising a space in which the anisotropic conductive film pattern is spaced apart from each other at a plurality of locations.
2. 2. The anisotropic conductive adhesive according to 1, wherein a plurality of spaces of the same size are provided in a row in the central longitudinal direction.
3. The anisotropic conductive adhesive according to 1 or 2, wherein the space is vacant only in the anisotropic conductive film and not vacant in the base film.
4). 3. The anisotropic conductive adhesive according to 1 or 2, wherein the space is vacant not only in the anisotropic conductive film but also in the base film.
5. The anisotropic conductive adhesive according to any one of 1 to 4, which is used for an image sensor.

本発明によれば、外周電極に簡便に実装できる異方導電接着剤を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, the anisotropic conductive adhesive which can be easily mounted in an outer periphery electrode can be provided.

（ａ）は実施形態１の異方導電接着剤の平面図であり、（ｂ）は線Ａ−Ａに沿った断面図である。(A) is a top view of the anisotropic conductive adhesive of Embodiment 1, (b) is sectional drawing along line AA. 実施形態１の異方導電接着剤の斜視図である。1 is a perspective view of an anisotropic conductive adhesive according to Embodiment 1. FIG. 実施形態１の変形例を示す平面図である。FIG. 10 is a plan view showing a modification of the first embodiment. （ａ）は実施形態２の異方導電接着剤の平面図であり、（ｂ）は線Ｂ−Ｂに沿った断面図である。(A) is a top view of the anisotropic conductive adhesive of Embodiment 2, (b) is sectional drawing along line BB. 実施形態２の異方導電接着剤の斜視図である。6 is a perspective view of an anisotropic conductive adhesive according to Embodiment 2. FIG. （ａ）は本発明の異方導電接着剤を用いた、携帯電話用イメージセンサ（カメラ）における実装の一例を表す断面図であり、（ｂ）はその模式的平面図である。(A) is sectional drawing showing an example of the mounting in the image sensor (camera) for mobile phones using the anisotropic conductive adhesive of this invention, (b) is the typical top view. 従来の異方導電接着剤の断面図である。It is sectional drawing of the conventional anisotropic conductive adhesive.

以下、本発明の異方導電接着剤を、図面を参照しつつ詳細に説明する。なお、各図中、同一符号は同一又は同等の構成要素を表している。   Hereinafter, the anisotropic conductive adhesive of the present invention will be described in detail with reference to the drawings. In each figure, the same numerals indicate the same or equivalent components.

実施形態１
図１（ａ）は本発明の異方導電接着剤の実施形態１の平面図、図１（ｂ）は図１（ａ）の線Ａ−Ａに沿った断面図である。また、図２は、この異方導電接着剤の斜視図である。Embodiment 1
FIG. 1A is a plan view of Embodiment 1 of the anisotropic conductive adhesive of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG. FIG. 2 is a perspective view of the anisotropic conductive adhesive.

異方導電接着剤１０は、ベースフィルム１２に異方導電膜１４が積層されている。
異方導電膜１４のパターンは、図１（ａ）に示すように、異方導電接着剤１０の中央長手方向、矩形のスペース１６を離隔的に多数含んでいる。本実施形態では、スペース１６は異方導電膜１４だけに形成され、ベースフィルム１２には形成されていない。In the anisotropic conductive adhesive 10, an anisotropic conductive film 14 is laminated on a base film 12.
As shown in FIG. 1A, the pattern of the anisotropic conductive film 14 includes a large number of spaced apart rectangular spaces 16 in the central longitudinal direction of the anisotropic conductive adhesive 10. In the present embodiment, the space 16 is formed only in the anisotropic conductive film 14 and is not formed in the base film 12.

接続対象となる外周電極のスペースの形とサイズに合わせて、スペース１６を離隔的に設け、さらに、外周電極の幅に合わせてスペース１６を囲む異方導電膜１４の幅、大きさ、場所を調整すれば、効率よく、一度に短時間に、必要な異方導電膜１４を外周電極に貼付できる。従来のように、外周電極の各辺にあわせて異方導電膜を切断して貼付することが不要となる。   Spaces 16 are provided separately according to the shape and size of the space of the outer peripheral electrode to be connected, and the width, size, and location of the anisotropic conductive film 14 surrounding the space 16 are adjusted according to the width of the outer peripheral electrode. If adjusted, the necessary anisotropic conductive film 14 can be attached to the outer peripheral electrode efficiently and in a short time. As in the prior art, it is not necessary to cut and attach the anisotropic conductive film to each side of the outer peripheral electrode.

ここで、ベースフィルム１２としては、異方導電膜１４のキャリアテープとして機能し、異方導電膜１４の基板への転着を阻害しない限り、その形成材料や厚み等に特に制限はない。例えば、ポリテトラフルオロエチレン、剥離処理が施されたポリエチレンテレフタレート（ＰＥＴ）フィルム等を使用することができる。   Here, as long as the base film 12 functions as a carrier tape for the anisotropic conductive film 14 and does not inhibit transfer of the anisotropic conductive film 14 to the substrate, there is no particular limitation on the forming material, thickness, and the like. For example, polytetrafluoroethylene, a polyethylene terephthalate (PET) film subjected to a peeling treatment, or the like can be used.

異方導電膜１４は、絶縁性接着剤中に導電性粒子を分散させたものであるが、絶縁性接着剤や導電性粒子それ自体は、公知の異方導電膜と同様とすることができる。
例えば、絶縁性接着剤としては、種々の熱硬化性接着剤や熱可塑性接着剤を使用することができる。ＩＣチップ実装後の信頼性の点からは、エポキシ系樹脂、ウレタン系樹脂、アクリレート系樹脂、ＢＴレジン樹脂等の熱硬化性接着剤を使用することが好ましい。なお、これら樹脂成分から絶縁性接着剤を調製する場合に、単一種の樹脂成分を使用してもよく、複数種を混合して使用してもよい。The anisotropic conductive film 14 is obtained by dispersing conductive particles in an insulating adhesive, but the insulating adhesive and the conductive particles themselves can be the same as known anisotropic conductive films. .
For example, various thermosetting adhesives and thermoplastic adhesives can be used as the insulating adhesive. From the viewpoint of reliability after mounting the IC chip, it is preferable to use a thermosetting adhesive such as an epoxy resin, a urethane resin, an acrylate resin, or a BT resin resin. In addition, when preparing an insulating adhesive from these resin components, a single type of resin component may be used or a plurality of types may be mixed and used.

一方、導電性粒子としては、例えば、Ｎｉ、Ａｇ、Ｃｕ又はこれらの合金等からなる金属粉、球状樹脂粒子の表面に金属メッキを施したもの等、電気的良導体からなる粒子を種々使用することができる。このような電気的良導体からなる粒子上に絶縁被膜を形成した粒子も使用することができる。また、導電性粒子の粒径は、０．２〜２０μｍとすることが好ましい。   On the other hand, as the conductive particles, for example, various kinds of particles made of a good electrical conductor such as metal powder made of Ni, Ag, Cu, or an alloy thereof, or the like, and the surface of the spherical resin particles plated with metal are used. Can do. It is also possible to use particles in which an insulating film is formed on such particles made of a good electrical conductor. Moreover, it is preferable that the particle size of electroconductive particle shall be 0.2-20 micrometers.

以上の絶縁性接着剤と導電性粒子とを常法にしたがって混合することにより異方導電膜用組成物を調製でき、得られた組成物をスクリーン印刷等でベースフィルム１２上に所定のパターンに印刷することにより、図１（ａ）のように中央部のスペース１６が離隔的に形成されている本実施形態の異方導電接着剤１０を得ることができる。
この他に、一面塗工したフィルムの異方導電接着剤層部分をハーフカットによって抜き出すことによって異方導電接着剤１０を製造できる。An anisotropic conductive film composition can be prepared by mixing the above insulating adhesive and conductive particles according to a conventional method, and the resulting composition is formed into a predetermined pattern on the base film 12 by screen printing or the like. By printing, it is possible to obtain the anisotropic conductive adhesive 10 of the present embodiment in which the central space 16 is formed separately as shown in FIG.
In addition, the anisotropic conductive adhesive 10 can be manufactured by extracting the anisotropic conductive adhesive layer part of the film coated on one side by half-cutting.

尚、本実施形態では、スペース１６は長手方向中央一列に設けられているが、複数列設けてもよい。また、本実施形態では、スペース１６は四角形であるが、長方形でも、また他の形でもよい。さらに、スペース１６の周囲四辺に異方導電膜１４があるが、図３に示すように三辺のみとしてもよい。   In the present embodiment, the spaces 16 are provided in a central row in the longitudinal direction, but a plurality of rows may be provided. In the present embodiment, the space 16 is a quadrangle, but may be a rectangle or another shape. Furthermore, although the anisotropic conductive film 14 is present on the four sides around the space 16, only three sides may be provided as shown in FIG.

実施形態２
図４（ａ）は、本発明の異方導電接着剤の実施形態２の平面図、図４（ｂ）は図４（ａ）の線Ｂ−Ｂに沿った断面図である。また、図５は、この異方導電接着剤の斜視図である。
この実施形態の異方導電接着剤２０は、スペース２６が異方導電膜１４だけでなくベースフィルム２２にも形成されている点が実施形態１の異方導電接着剤１０と異なる。即ち、異方導電接着剤２０のベースフィルム２２には、異方導電膜１４と同じスペース２６が空いている。スペース２６は異方導電膜１４とベースフィルム２２を貫いて形成されている。
この異方導電接着剤２０も、接続しようとする外周電極のスペースの形とサイズに合わせて、スペース２６を離隔的に設けることにより、効率よく、異方導電膜１４を外周電極に貼付できる。Embodiment 2
4A is a plan view of Embodiment 2 of the anisotropic conductive adhesive of the present invention, and FIG. 4B is a cross-sectional view taken along line BB in FIG. 4A. FIG. 5 is a perspective view of the anisotropic conductive adhesive.
The anisotropic conductive adhesive 20 of this embodiment is different from the anisotropic conductive adhesive 10 of Embodiment 1 in that the space 26 is formed not only in the anisotropic conductive film 14 but also in the base film 22. That is, the same space 26 as the anisotropic conductive film 14 is vacant in the base film 22 of the anisotropic conductive adhesive 20. The space 26 is formed through the anisotropic conductive film 14 and the base film 22.
This anisotropic conductive adhesive 20 can also be efficiently attached to the outer peripheral electrode by providing the space 26 in a spaced manner in accordance with the shape and size of the space of the outer peripheral electrode to be connected.

異方導電接着剤２０は、接着剤層を塗工した原反もしくはリールにした接着剤を抜き打ち機によってスペース部を抜くことによって製造できる。   The anisotropic conductive adhesive 20 can be manufactured by removing the space portion with a punching machine from an original fabric coated with an adhesive layer or an adhesive made into a reel.

実施形態３
図６（ａ），（ｂ）は、本発明の異方導電接着剤の携帯電話用イメージセンサ（カメラ）における実装の一例を示し、図６（ａ）はその断面図、図６（ｂ）はその模式的平面図である。
図６（ａ）において、基板上３２に、ＣＣＤ（Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄｅｖｉｃｅｓ）センサー又はＣＭＯＳ（Ｃｏｍｐｌｅｍｅｎｔａｒｙ Ｍｅｔａｌ Ｏｘｉｄｅ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ）センサー３０が備わり、センサー３０の上方にリッドガラス４２及びレンズ４４がある。センサー３０が搭載されている基板３２とフレキシブルプリント配線板（ＦＰＣ）３４を接続する場合、まず、本発明の異方導電接着剤を基板側の電極３６の実装面と合わせる。本発明の異方導電膜５０はセンサー３０に合わせてスペースが空いているので、そのままセンサー３０の外周に貼付できる。ベースフィルム（図示せず）を剥離する。これにより、極めて簡便に異方導電膜５０を基板側の電極３６に転着することができる。Embodiment 3
6 (a) and 6 (b) show an example of mounting the anisotropic conductive adhesive of the present invention in an image sensor (camera) for a mobile phone, FIG. 6 (a) is a sectional view thereof, and FIG. 6 (b). Is a schematic plan view thereof.
6A, a CCD (Charge Coupled Devices) sensor or a CMOS (Complementary Metal Oxide Semiconductor) sensor 30 is provided on a substrate 32, and a lid glass 42 and a lens 44 are provided above the sensor 30. When the substrate 32 on which the sensor 30 is mounted and the flexible printed wiring board (FPC) 34 are connected, first, the anisotropic conductive adhesive of the present invention is matched with the mounting surface of the electrode 36 on the substrate side. Since the anisotropic conductive film 50 of the present invention has a space corresponding to the sensor 30, it can be directly applied to the outer periphery of the sensor 30. A base film (not shown) is peeled off. Thereby, the anisotropic conductive film 50 can be transferred to the electrode 36 on the substrate side very easily.

その後、異方導電膜の転着部位にＦＰＣ３４を載せ、さらに加熱加圧することによりＦＰＣ３４を基板３２に実装する。なお、この場合の加熱圧着条件は、従来の異方導電膜を使用してＩＣチップを実装する場合と同様とすることができる。
図６（ｂ）は、異方導電膜５０がセンサー３０を囲む外周電極を被膜するように貼付されていることを模式的に示す。図６（ｂ）に示すように、異方導電膜５０に空いたスペースと、センサー３０が対応している。Thereafter, the FPC 34 is mounted on the transfer site of the anisotropic conductive film, and the FPC 34 is mounted on the substrate 32 by further applying heat and pressure. In this case, the thermocompression bonding conditions can be the same as those in the case of mounting an IC chip using a conventional anisotropic conductive film.
FIG. 6B schematically shows that the anisotropic conductive film 50 is attached so as to coat the outer peripheral electrode surrounding the sensor 30. As shown in FIG. 6B, the sensor 30 corresponds to a space that is vacant in the anisotropic conductive film 50.

本発明の回路接続材料は、電気・電子用の異方導電接着剤として幅広く使用できる。   The circuit connection material of the present invention can be widely used as an anisotropic conductive adhesive for electric and electronic use.

Claims (5)

ベースフィルムと、
前記ベースフィルム上にある、絶縁性接着剤中に導電性粒子が分散してなる異方導電膜からなり、
前記異方導電膜のパターンが、複数箇所に互いに離隔的に設けられているスペースを含む異方導電接着剤。A base film,
The anisotropic conductive film formed by dispersing conductive particles in an insulating adhesive on the base film,
An anisotropic conductive adhesive comprising a space in which the anisotropic conductive film pattern is spaced apart from each other at a plurality of locations. 中央長手方向に同一サイズの複数のスペースが一列に設けられている請求項１記載の異方導電接着剤。   The anisotropic conductive adhesive according to claim 1, wherein a plurality of spaces of the same size are provided in a row in the central longitudinal direction. 前記スペースが、異方導電膜だけに空いていて、ベースフィルムには空いていない請求項１又は２記載の異方導電接着剤。   The anisotropic conductive adhesive according to claim 1, wherein the space is vacant only in the anisotropic conductive film and not vacant in the base film. 前記スペースが、異方導電膜だけでなくベースフィルムにも空いている請求項１又は２記載の異方導電接着剤。   The anisotropic conductive adhesive according to claim 1 or 2, wherein the space is vacant not only in the anisotropic conductive film but also in the base film. イメージセンサー用である請求項１〜４のいずれかに記載の異方導電接着剤。   The anisotropic conductive adhesive according to any one of claims 1 to 4, which is used for an image sensor.
JP2007545210A 2005-11-21 2006-11-09 Anisotropic conductive adhesive Pending JPWO2007058108A1 (en)

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JP2003168323A (en) * 2001-11-30 2003-06-13 Mitsui Chemicals Inc Anisotropic conductive paste and its using method
JP2004006793A (en) * 2003-04-07 2004-01-08 Sony Chem Corp Anisotropic conductive adhesive
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JP2003168323A (en) * 2001-11-30 2003-06-13 Mitsui Chemicals Inc Anisotropic conductive paste and its using method
JP2004006793A (en) * 2003-04-07 2004-01-08 Sony Chem Corp Anisotropic conductive adhesive
JP2005136144A (en) * 2003-10-30 2005-05-26 Kyocera Corp Solid-state imaging apparatus

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