TW200730602A - Anisotropic conductive adhesive - Google Patents

Anisotropic conductive adhesive

Info

Publication number
TW200730602A
TW200730602A TW095142078A TW95142078A TW200730602A TW 200730602 A TW200730602 A TW 200730602A TW 095142078 A TW095142078 A TW 095142078A TW 95142078 A TW95142078 A TW 95142078A TW 200730602 A TW200730602 A TW 200730602A
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
conductive adhesive
adhesive
film
conductive film
Prior art date
Application number
TW095142078A
Other languages
Chinese (zh)
Inventor
Tooru Fujinawa
Takeshi Horiuchi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200730602A publication Critical patent/TW200730602A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

As disclosed is an anisotropic conductive adhesive (10) comprising base film (12) and, superimposed thereon, anisotropic conductive film (14) having conductive particles dispersed in an insulating adhesive, wherein the anisotropic conductive film (14) has a pattern involving spaces (16) disposed with interspaces therebetween at multiple positions.
TW095142078A 2005-11-21 2006-11-14 Anisotropic conductive adhesive TW200730602A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005335371 2005-11-21

Publications (1)

Publication Number Publication Date
TW200730602A true TW200730602A (en) 2007-08-16

Family

ID=38048495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142078A TW200730602A (en) 2005-11-21 2006-11-14 Anisotropic conductive adhesive

Country Status (5)

Country Link
JP (1) JPWO2007058108A1 (en)
KR (1) KR101053767B1 (en)
CN (1) CN101309988A (en)
TW (1) TW200730602A (en)
WO (1) WO2007058108A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8739402B2 (en) 2008-12-17 2014-06-03 Microconnections Sas Method of manufacture of IC contactless communication devices
EP2855614B1 (en) * 2012-05-29 2021-10-13 Conpart AS Isotropic conductive adhesive
JP2020198422A (en) * 2019-03-08 2020-12-10 デクセリアルズ株式会社 Method for producing connecting structure, connecting structure, film structure, and method for producing film structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4627125B2 (en) * 2001-07-27 2011-02-09 三井化学株式会社 Anisotropic conductive paste
JP3864078B2 (en) * 2001-11-30 2006-12-27 三井化学株式会社 Anisotropic conductive paste and method of using the same
JP3995942B2 (en) * 2002-01-29 2007-10-24 旭化成株式会社 Method for producing conductive adhesive sheet having anisotropy
JP3982444B2 (en) * 2003-04-07 2007-09-26 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive adhesive
JP2005136144A (en) * 2003-10-30 2005-05-26 Kyocera Corp Solid-state imaging apparatus

Also Published As

Publication number Publication date
CN101309988A (en) 2008-11-19
KR20080066735A (en) 2008-07-16
KR101053767B1 (en) 2011-08-02
WO2007058108A1 (en) 2007-05-24
JPWO2007058108A1 (en) 2009-04-30

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