CN104451585B - 沉积源运送装置 - Google Patents

沉积源运送装置 Download PDF

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Publication number
CN104451585B
CN104451585B CN201310608571.9A CN201310608571A CN104451585B CN 104451585 B CN104451585 B CN 104451585B CN 201310608571 A CN201310608571 A CN 201310608571A CN 104451585 B CN104451585 B CN 104451585B
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sedimentary origin
buoyant element
support
conveyer according
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Chinese (zh)
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CN104451585A (zh
Inventor
高晟洙
朴旻亨
金在福
宋原准
李宽熙
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48—Ion implantation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811—Controlling the atmosphere during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Non-Mechanical Conveyors (AREA)
CN201310608571.9A 2013-09-12 2013-11-26 沉积源运送装置 Active CN104451585B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0109960 2013-09-12
KR1020130109960A KR102175820B1 (ko) 2013-09-12 2013-09-12 증착원 반송 장치

Publications (2)

Publication Number Publication Date
CN104451585A CN104451585A (zh) 2015-03-25
CN104451585B true CN104451585B (zh) 2018-08-10

Family

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Family Applications (1)

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CN201310608571.9A Active CN104451585B (zh) 2013-09-12 2013-11-26 沉积源运送装置

Country Status (3)

Country Link
KR (1) KR102175820B1 (ko)
CN (1) CN104451585B (ko)
TW (1) TWI615344B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102365900B1 (ko) 2015-07-17 2022-02-22 삼성디스플레이 주식회사 증착 장치
WO2017198297A1 (en) * 2016-05-18 2017-11-23 Applied Materials, Inc. Apparatus and method for transportation of a deposition source
CN109715846A (zh) * 2016-12-14 2019-05-03 应用材料公司 沉积系统
CN106816351B (zh) * 2017-01-20 2018-08-17 信利（惠州）智能显示有限公司 一种离子注入装置
CN107488834B (zh) * 2017-08-15 2019-08-02 武汉华星光电半导体显示技术有限公司 一种传送装置及真空溅射设备
WO2019182260A1 (ko) * 2018-03-23 2019-09-26 홍잉 인라인 박막 프로세싱 장치
CN110670028A (zh) * 2019-11-12 2020-01-10 谢曲坚 磁性材料表面蒸发镝的设备

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* Cited by examiner, † Cited by third party
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US3347655A (en) * 1964-07-10 1967-10-17 Libbey Owens Ford Glass Co Glass sheet support frame
JPS53113782A (en) * 1977-03-16 1978-10-04 Ulvac Corp Forming apparatus for film deposited evaporation having no pin hole
JPH0273959A (ja) * 1988-09-09 1990-03-13 Hitachi Ltd 移動型ルツボ
TW313144U (en) * 1996-10-09 1997-08-11 Wang Shing Wang Improved rail conveying apparatus of roller conveying machine
TW477349U (en) * 2000-07-20 2002-02-21 Helix Technology Inc Circulating conveying mechanism for continuous vacuum device
CN2452844Y (zh) * 2000-12-15 2001-10-10 郑州大方桥梁机械有限公司 磁悬浮列车轨道梁架设精确导向定位架
KR100748159B1 (ko) * 2001-01-17 2007-08-09 미쓰보시 다이야몬도 고교 가부시키가이샤 절단장치, 절단시스템 및 절단방법
JP2003063643A (ja) * 2001-08-30 2003-03-05 Nippon Sekkei Kogyo:Kk 薄板の搬送方法及び装置
JP4464961B2 (ja) * 2004-03-15 2010-05-19 三星ダイヤモンド工業株式会社 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
DE102004042776A1 (de) * 2004-09-03 2006-03-23 Applied Films Gmbh & Co. Kg Vorrichtung zum Austausch und Transport von Komponenten von Beschichtungsanlagen
EP1840242B1 (de) * 2006-03-29 2011-06-29 Applied Materials GmbH & Co. KG Vakuumtransportvorrichtung mit beweglicher Führungsschiene
KR100978192B1 (ko) * 2008-05-23 2010-08-25 주식회사 에스케이디 하이테크 용융아연도금의 싱크롤과 스테빌라이징롤용 스크래핑시스템
KR20100013808A (ko) * 2008-08-01 2010-02-10 삼성모바일디스플레이주식회사 유기물 증착 장치
KR101182354B1 (ko) * 2010-07-07 2012-09-20 한국기계연구원 스프링을 갖는 자기부상 이송 시스템
KR20130004830A (ko) * 2011-07-04 2013-01-14 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
KR101906358B1 (ko) * 2012-02-21 2018-10-11 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법
CN102586751A (zh) * 2012-03-14 2012-07-18 无锡康力电子有限公司 基片架磁定位系统
CN202730224U (zh) * 2012-07-23 2013-02-13 陈晓东 一种柔性薄膜太阳能电池导电膜沉积设备

Also Published As

Publication number Publication date
KR20150030547A (ko) 2015-03-20
CN104451585A (zh) 2015-03-25
KR102175820B1 (ko) 2020-11-09
TW201509779A (zh) 2015-03-16
TWI615344B (zh) 2018-02-21

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