CN104362243A - 基板的封装方法及封装结构 - Google Patents
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Abstract
本发明提供一种基板的封装方法及封装结构,该方法包括:步骤1、提供基板、及封装盖板;步骤2、在所述封装盖板上涂覆一圈第一框胶;步骤3、在所述封装盖板上第一框胶外围涂覆一圈第二框胶;步骤4、将所述封装盖板与基板相对贴合;步骤5、使用UV光源对所述第一框胶及第二框胶进行照射使其固化;步骤6、对基板及封装盖板进行切割作业,将与所述第二框胶相接触部分的基板及封装盖板切除,从而实现封装盖板对基板的封装。
Description
技术领域
本发明涉及显示技术领域,尤其涉及一种基板的封装方法及封装结构。
背景技术
在显示技术领域,平板显示技术(LCD、OLED)已经逐步取代CRT显示器。平面光源技术是新型的光源,其技术研发已经接近市场化量产水平。在平板显示与平面光源技术当中,对于两片平板玻璃的粘结是一项很重要的技术,其封装效果将直接影响器件的性能。
紫外光(UV)固化技术是LCD/OLED封装最早也是最常用的技术,其具有如下特点:不用溶剂或少量溶剂,减少了溶剂对环境的污染;耗能少,可低温固化,适用于对热敏感的材料;固化速度快,效率高,可在高速生产线上使用,固化设备占地面积小等。
如图1-2所示,有时为了防止框胶内的间隔颗粒压伤TFT基板200上的TFT及电极引线,需要使用不含间隔颗粒的框胶300进行封装。目前,使用不含间隔颗粒的框胶300进行封装的方法为,在封装盖板100上对应基板200上显示器件400的外围涂覆不含间隔颗粒的框胶300,将封装盖板100与基板200相对贴合,之后对框胶300进行固化,从而实现封装盖板100对基板200的封装。然而,由于没有间隔颗粒的限制,不含间隔颗粒的框胶300的胶高胶宽很难控制,这一组玻璃与上一组玻璃、或者同一组玻璃内部都有可能存在胶高胶宽的差异。
发明内容
本发明的目的在于提供一种基板的封装方法及封装结构,该方法通过采用不含间隔颗粒的框胶及涂覆于其外侧的含有指定间隔颗粒高度的框胶共同进行封装,并在封装完成后对含有间隔颗粒的框胶的部分进行切割,从而得到使用不含间隔颗粒的框胶封装的基板,并保证框胶具有一致的高度及宽度,制程简便,封装效果好;且有效防止框胶内的间隔颗粒压伤基板上的薄膜晶体管及电极引线。
为实现上述目的,本发明提供一种基板的封装方法,包括如下步骤:
步骤1、提供基板、及封装盖板;
步骤2、在所述封装盖板上涂覆一圈第一框胶;
步骤3、在所述封装盖板上第一框胶外围涂覆一圈第二框胶;
步骤4、将所述封装盖板与基板相对贴合;
步骤5、使用UV光源对所述第一框胶及第二框胶进行照射使其固化;
步骤6、对基板及封装盖板进行切割作业,将与所述第二框胶相接触部分的基板及封装盖板切除,从而实现封装盖板对基板的封装。
所述封装盖板为玻璃板,所述基板为TFT基板。
所述步骤2中基板上设有显示器件,所述封装盖板上对应所述显示器件的外围设有第一涂胶位置,所述第一涂胶位置外围设有第一切割线,所述第一切割线外围设有第二涂胶位置,所述第一框胶涂覆于所述第一涂胶位置上。
所述步骤3中第二框胶涂覆于所述第二涂胶位置上。
所述步骤5中第二框胶的宽度小于第一框胶的宽度,所述第二框胶的宽度为0.2mm~3mm,所述第二框胶的内边缘位于第一切割线外侧。
所述第一框胶中不含有间隔颗粒,所述第二框胶中含有间隔颗粒。
所述第一框胶与第二框胶的固化条件相同。
所述基板上设有第二切割线,所述第二切割线位于对应的封装盖板上的第二涂胶位置与第一切割线之间,所述第二框胶的内边缘位于第二切割线外侧。
所述步骤6中沿第一切割线对封装盖板进行切割作业,沿第二切割线对基板进行切割作业。
本发明还提供一种基板的封装结构,包括基板、位于所述基板上的显示器件、与所述基板相对设置的封装盖板、及位于基板与封装盖板之间粘结所述基板与封装盖板的第一框胶,所述第一框胶中不含有间隔颗粒。
本发明的有益效果:本发明提供的基板的封装方法及封装结构,通过采用不含间隔颗粒的框胶及涂覆于其外侧的含有指定间隔颗粒高度的框胶共同进行封装,并在封装完成后对含有间隔颗粒的框胶的部分进行切割,从而得到使用不含间隔颗粒的框胶封装的基板,并保证框胶具有一致的高度及宽度,制程简便,封装效果好。该种封装结构采用不含间隔颗粒的框胶进行封装,且框胶的高度及宽度保持一致,结构简单,并有效防止框胶内的间隔颗粒压伤基板上的薄膜晶体管及电极引线。
为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。
附图说明
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其它有益效果显而易见。
附图中,
图1为一种现有的封装结构的俯视示意图;
图2为图1所示封装结构的剖面示意图;
图3为本发明基板的封装方法的流程图;
图4为本发明基板的封装方法步骤3的俯视示意图;
图5为本发明基板的封装方法步骤3的剖面示意图;
图6为本发明基板的封装方法步骤4的剖面示意图;
图7为本发明基板的封装方法步骤6的剖面示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3,本发明提供一种基板的封装方法,包括如下步骤:
步骤1、提供基板20、及封装盖板10。
所述封装盖板10为玻璃板,所述基板20为TFT基板。
步骤2、如图4所示,在所述封装盖板10上涂覆一圈第一框胶31。
请同时参阅图4与图6,基板20上设有显示器件40,所述封装盖板10上对应所述显示器件40外围设有第一涂胶位置11,所述第一涂胶位置11外围设有第一切割线13,所述第一切割线13外围设有第二涂胶位置12。所述基板20上设有第二切割线23,所述第二切割线23位于对应的封装盖板10上的第二涂胶位置12与第一切割线13之间,
所述第一框胶31涂覆于所述第一涂胶位置11上,所述第一框胶31为不含有间隔颗粒的框胶。
步骤3、如图4所示,在所述封装盖板10上第一框胶31外围涂覆一圈第二框胶32。
请同时参阅图4与图5,所述第二框胶32涂覆于所述第二涂胶位置12上,所述第二框胶32为含有指定间隔颗粒33高度的框胶。为了不影响后续切割制程作业,所述第二框胶32的内边缘应位于第二切割线23外侧。
步骤4、如图6所示,将所述封装盖板10与基板20相对贴合。
请参阅图6,第二框胶32的宽度小于第一框胶31的宽度,由于第二框胶32仅是为了控制基板20与封装盖板10对组后的间隙,所以涂胶的量不必过多,对组后第二框胶32的胶宽控制在0.2mm~3mm即可。
步骤5、使用UV光源对所述第一框胶31及第二框胶32进行照射使其固化。
所述第一框胶31与第二框胶32的固化条件相同。
步骤6、对基板20及封装盖板10进行切割作业,将与所述第二框胶32相接触部分的基板20及封装盖板10切除,从而实现封装盖板10对基板20的封装。
具体地,请参阅图6,沿第一切割线13对封装盖板10进行切割作业,沿第二切割线23对基板20进行切割作业。最终得到图7所示的使用不含间隔颗粒的第一框胶31封装的基板20。
由于基板20与封装盖板10对组时,第二框胶32内的间隔颗粒33限定了基板20与封装盖板10间的间隙,所以第一框胶31的高度得到了保证,在涂胶量一定的情况下,第一框胶31的胶宽也同时得到保证。
本发明还提供一种由上述基板的封装方法所得到的基板的封装结构,如图7所示,包括基板20、位于所述基板20上的显示器件40、与所述基板20相对设置的封装盖板10、及位于基板20与封装盖板10之间粘结所述基板20与封装盖板10的第一框胶31,所述第一框胶31中不含有间隔颗粒。
值得一提的是,上述基板的封装方法及其封装结构可适用于LCD、OLED、及WOLED等器件的封装。
综上所述,本发明提供的基板的封装方法及封装结构,通过采用不含间隔颗粒的框胶及涂覆于其外侧的含有指定间隔颗粒高度的框胶共同进行封装,并在封装完成后对含有间隔颗粒的框胶的部分进行切割,从而得到使用不含间隔颗粒的框胶封装的基板,并保证框胶具有一致的高度及宽度,制程简便,封装效果好。该种封装结构采用不含间隔颗粒的框胶进行封装,且框胶的高度及宽度保持一致,结构简单,并有效防止框胶内的间隔颗粒压伤基板上的薄膜晶体管及电极引线。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的保护范围。
Claims (10)
1.一种基板的封装方法,其特征在于,包括如下步骤:
步骤1、提供基板(20)、及封装盖板(10);
步骤2、在所述封装盖板(10)上涂覆一圈第一框胶(31);
步骤3、在所述封装盖板(10)上第一框胶(31)外围涂覆一圈第二框胶(32);
步骤4、将所述封装盖板(10)与基板(20)相对贴合;
步骤5、使用UV光源对所述第一框胶(31)及第二框胶(32)进行照射使其固化;
步骤6、对基板(20)及封装盖板(10)进行切割作业,将与所述第二框胶(32)相接触部分的基板(20)及封装盖板(10)切除,从而实现封装盖板(10)对基板(20)的封装。
2.如权利要求1所述的基板的封装方法,其特征在于,所述封装盖板(10)为玻璃板,所述基板(20)为TFT基板。
3.如权利要求1所述的基板的封装方法,其特征在于,所述步骤2中基板(20)上设有显示器件(40),所述封装盖板(10)上对应所述显示器件(40)外围设有第一涂胶位置(11),所述第一涂胶位置(11)外围设有第一切割线(13),所述第一切割线(13)外围设有第二涂胶位置(12),所述第一框胶(31)涂覆于所述第一涂胶位置(11)上。
4.如权利要求3所述的基板的封装方法,其特征在于,所述步骤3中第二框胶(32)涂覆于所述第二涂胶位置(12)上。
5.如权利要求3所述的基板的封装方法,其特征在于,所述步骤5中第二框胶(32)的宽度小于第一框胶(31)的宽度,所述第二框胶(32)的宽度为0.2mm~3mm,所述第二框胶(32)的内边缘位于第一切割线(13)外侧。
6.如权利要求1所述的基板的封装方法,,其特征在于,所述第一框胶(31)中不含有间隔颗粒,所述第二框胶(32)中含有间隔颗粒(33)。
7.如权利要求6所述的基板的封装方法,其特征在于,所述第一框胶(31)与第二框胶(32)的固化条件相同。
8.如权利要求3所述的基板的封装方法,其特征在于,所述基板(20)上设有第二切割线(23),所述第二切割线(23)位于对应的封装盖板(10)上的第二涂胶位置(12)与第一切割线(13)之间,所述第二框胶(32)的内边缘位于第二切割线(23)外侧。
9.如权利要求8所述的基板的封装方法,其特征在于,所述步骤6中沿第一切割线(13)对封装盖板(10)进行切割作业,沿第二切割线(23)对基板(20)进行切割作业。
10.一种基板的封装结构,包括基板(20)、位于所述基板(20)上的显示器件(40)、与所述基板(20)相对设置的封装盖板(10)、及位于基板(20)与封装盖板(10)之间粘结所述基板(20)与封装盖板(10)的第一框胶(31),其特征在于,所述第一框胶(31)中不含有间隔颗粒。
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