CN104347439A - 打线结构的制法 - Google Patents

打线结构的制法 Download PDF

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CN104347439A
CN104347439A CN201310325428.9A CN201310325428A CN104347439A CN 104347439 A CN104347439 A CN 104347439A CN 201310325428 A CN201310325428 A CN 201310325428A CN 104347439 A CN104347439 A CN 104347439A
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weld pad
pommel
making
bond structure
path
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CN104347439B (zh
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林伟胜
洪隆棠
叶孟宏
谢智伦
朱育德
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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  • Engineering & Computer Science (AREA)
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Abstract

一种打线结构的制法，先提供具有焊垫的基板，再于该焊垫的表面上以磨擦方式形成焊线的球端，且磨擦方式的进行依环绕该焊垫表面周缘的路径为之。本发明的制法以绕圈方式形成该球端，所以能避免较小尺寸的球端由该焊垫上脱落的问题发生。

Description

打线结构的制法
技术领域
本发明涉及一种半导体制程，特别是关于一种打线结构的制法。
背景技术
于现有的半导体封装技术中，藉由打线技术（即透过金线或铜线等）将焊线由芯片电性连接至如导线架或封装基板的承载件，该承载件再藉由如焊球的导电组件电性连接至如电路板的外部装置。
现有打线技术(wire bonding)可藉由超音速振动状态，由钢嘴形成最初球体在半导体装置或承载件上，以进行球端加压(1st ball bond)作业，使焊垫表面与球端相互固接，再由该球体延伸线体至另一半导体装置或承载件的焊垫表面上，以进行另一加压(2nd bond)作业，最后再以钢嘴将多余的焊线剪断。
如图1A所示，其为打线结构1的剖面示意图，于进行打线制程的球端加压作业时，先利用超音速振动装置（图略）并配合磨擦(scrubbing)作业形成一焊线12的球端12a于一基板10的焊垫11上，待加压该球端12a以使该球端12a固接于该焊垫11上后，再拉伸该焊线12。
于进行磨擦作业时，于形成线料（即该球端12a）时能同时去除生产该基板10过程中所产生的微粒及有机薄膜，而现有技术所采用的磨擦方式利用该超音速振动装置以纵向（即Y方向）与横向（即X方向）的移动路径将线料形成在该焊垫11的表面上，以形成该球端12a，如图1B所示。
现有磨擦方式虽可去除生产过程中所产生的微粒及有机薄膜，但由于现有的焊垫11的面积较大（如焊垫11的宽度d为40微米(um)以上），所以采用上述的方式磨擦形成该球端12a并不会有太大问题。
然而，现今的半导体装置的制程不断的朝向体积化更高的制程演进，因此，线路亦朝细线路、细间距的方向做设计，致使该焊垫11的宽度d随之缩小。当该焊垫11的宽度d缩小至40微米(um)以下时，该焊线12的球端12a的体积亦需缩小，使得该球端12a接合于焊垫11的面积因而减小，而在此情况下，若采用现有磨擦方式形成该球端12a，将容易造成该球端12a由该焊垫11上脱落的掉球问题。
此外，形成该焊线12的线材（如铜、金）较硬，若打线至极薄的基板（如芯片）上，由于极薄的基板是非常脆弱，所以以现有磨擦方式形成该球端12a，容易造成该焊垫11碎裂。
因此，如何克服上述现有技术的种种问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述现有技术的缺失，本发明的主要目的在于提供一种打线结构的制法，能避免较小尺寸的球端由该焊垫上脱落的问题发生。
本发明的打线结构的制法，包括：提供一具有多个焊垫的基板；以及于至少一该焊垫的表面上以磨擦方式形成焊线的球端，且磨擦方式的进行依环绕该焊垫的表面周缘的路径为之
前述的制法中，该焊垫的宽度小于40微米。
前述的制法中，该磨擦方式的路径为顺时钟方向或逆时钟方向。
前述的制法中，该磨擦方式的路径先由该焊垫的表面中心向该焊垫的表面周缘移动，再环绕该焊垫的表面周缘。
前述的制法中，形成该焊线的材质为铜、银或金。
前述的制法中，还包括于形成该球端后，压固该球端于该焊垫上。
另外，前述的制法中，还包括于形成该球端后，由该球端延伸形成焊线的线体。
由上可知，本发明的打线结构的制法中，通过于该焊垫的表面上环绕该焊垫表面周缘磨擦形成该球端，不仅可有效去除生产过程中所产生的微粒及有机薄膜，且能增加焊接强度以避免该球端由该焊垫上脱落的问题。
此外，藉由本发明的磨擦方式的路径，若将较硬的线材打线至极薄的基板上，可避免该球端造成该焊垫碎裂的问题。
附图说明
图1A为打线结构的剖面示意图；
图1B为现有磨擦作业的磨擦路径的平面上视示意图；
图2A至图2B为本发明打线结构的制法的剖面示意图；以及
图3A、图3A’、图3B及图3B’为本发明磨擦方式的磨擦路径的平面上视示意图。
符号说明
1,2                          打线结构
10,20                        基板
11,21                        焊垫
12,22                        焊线
12a,22a                      球端
22b                          线体
d,w                          宽度
L1,L2,L3,L4,S1,S1’,S2,S2’  路径
X,Y                          方向。
具体实施方式
以下藉由特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其它优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供本领域技术人员的了解与阅读，并非用以限定本发明可实施的限定条件，所以不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”及“一”等的用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2B为打线结构2的制法的剖面示意图。
如图2A及图3A所示，提供一具有至少一焊垫21的基板20，再于该焊垫21的表面上利用超音速振动装置（图略）以磨擦方式形成一球端22a，且磨擦路径为绕着对应该焊垫21表面周缘（如图3A所示的绕圈路径S1）。
如图2B所示，压固该球端22a于该焊垫21上，再由该球端22a延伸形成一线体22b，以形成由该球端22a与线体22b所构成的焊线22。
于本实施例中，该基板20可为封装基板或导电架，且该焊垫21可为电性接触垫或导脚，而形成该焊线22的材质为铜、银或金。
此外，该焊垫21的宽度w小于40微米（um）。
又，如图3A所示，该磨擦路径先由该焊垫21的表面中心向右朝该焊垫21的边缘移动，且略呈上弧线路线（如弧线路径L1），以当该超音速振动装置移动至该球端22a的预定周缘时，顺势以顺时钟方向移动（如绕圈路径S1）或转成逆时钟方向移动（如图3A’所示绕圈路径S1’），以形成该球端22a。于其它实施例中，该磨擦路径也可向左呈下弧线路线朝该焊垫21的边缘移动（如弧线路径L2）。
另外，有关该超音速振动装置的定位设定，由于该超音速振动装置的初始输出方向为Y方向，所以于磨擦过程中，可将该超音速振动装置的输出方向以偏横向方向（即X方向）作补偿，以使磨擦后的球端22a的底面（即接触该焊垫21的接合面）趋近正圆形。
于另一实施例中，如图3B所示，该磨擦路径也可先由该焊垫21的表面中心向左朝该焊垫21的边缘移动，且略呈上弧线路线（如弧线路径L3），以当该超音速振动装置移动至该球端22a的预定周缘时，顺势以逆时钟方向移动（如绕圈路径S2）或转成顺时钟方向移动（如图3B’所示绕圈路径S2’），以形成该球端22a。或者，向右呈下弧线路线朝该焊垫21的边缘移动（如弧线路径L4），再顺势以逆时钟方向移动（如绕圈路径S2）或转成顺时钟方向移动（如绕圈路径S2’）。
因此，该弧线路径L1,L2,L3,L4与该绕圈路径S1,S2可任意搭配，并无特别限制。
综上所述，本发明的打线结构的制法，主要藉由绕着对应该焊垫21表面周缘磨擦形成焊线22的球端22a，所以当该该焊垫21的尺寸较小时（即宽度小于40微米），能有效形成该焊线22的球端22a，以避免该球端22a由该焊垫21上脱落。
此外，藉由绕圈方式的磨擦路径，能分散线材形成于焊垫21上的应力，所以即使将较硬的线材打线至极薄的基板20上，该球端22a也不会造成该焊垫21碎裂。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (8)

1.一种打线结构的制法，包括：
提供一具有多个焊垫的基板；以及
于至少一该焊垫的表面上以磨擦方式形成焊线的球端，且磨擦方式的进行依环绕该焊垫的表面周缘的路径为之。
2.根据权利要求1所述的打线结构的制法，其特征在于，该焊垫的宽度小于40微米。
3.根据权利要求1所述的打线结构的制法，其特征在于，该磨擦方式的路径先由该焊垫的表面中心向该焊垫的表面周缘移动，再环绕该焊垫的表面周缘。
4.根据权利要求1所述的打线结构的制法，其特征在于，该环绕以顺时钟方向为之。
5.根据权利要求1所述的打线结构的制法，其特征在于，该环绕以逆时钟方向为之。
6.根据权利要求1所述的打线结构的制法，其特征在于，形成该焊线的材质为铜、银或金。
7.根据权利要求1所述的打线结构的制法，其特征在于，该制法还包括于形成该球端后，压固该球端于该焊垫上。
8.根据权利要求1所述的打线结构的制法，其特征在于，该制法还包括于形成该球端后，由该球端延伸形成焊线的线体。
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