CN104241305B - 光电转换设备以及光电转换设备的制造方法 - Google Patents

光电转换设备以及光电转换设备的制造方法 Download PDF

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Publication number
CN104241305B
CN104241305B CN201410263602.6A CN201410263602A CN104241305B CN 104241305 B CN104241305 B CN 104241305B CN 201410263602 A CN201410263602 A CN 201410263602A CN 104241305 B CN104241305 B CN 104241305B
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semiconductor regions
photoelectric conversion
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rectangular projection
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Chinese (zh)
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CN104241305A (zh
Inventor
渡边高典
三木崇史
饭田聪子
小林昌弘
岩田旬史
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Canon Inc
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Canon Inc
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/14Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
    • H10F77/148Shapes of potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/21Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/014Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8027Geometry of the photosensitive area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033Photosensitive area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
CN201410263602.6A 2013-06-13 2014-06-13 光电转换设备以及光电转换设备的制造方法 Active CN104241305B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013124592A JP5932720B2 (ja) 2013-06-13 2013-06-13 光電変換装置、および、光電変換装置の製造方法。
JP2013-124592 2013-06-13

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CN104241305A CN104241305A (zh) 2014-12-24
CN104241305B true CN104241305B (zh) 2017-04-12

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US (1) US9437764B2 (enExample)
JP (1) JP5932720B2 (enExample)
CN (1) CN104241305B (enExample)
DE (1) DE102014211226B4 (enExample)
GB (1) GB2518261B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6706481B2 (ja) 2015-11-05 2020-06-10 ソニーセミコンダクタソリューションズ株式会社 撮像素子
JP6946379B2 (ja) * 2016-12-28 2021-10-06 キヤノン株式会社 固体撮像装置及び撮像システム
JP6840555B2 (ja) * 2017-01-30 2021-03-10 キヤノン株式会社 固体撮像装置及び撮像システム
CN108198829A (zh) * 2018-01-29 2018-06-22 德淮半导体有限公司 Cmos图像传感器及其形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101621067A (zh) * 2008-07-02 2010-01-06 索尼株式会社 固体摄像器件及其制造方法和电子装置
CN101853867A (zh) * 2009-03-31 2010-10-06 索尼公司 固态成像装置及其制造方法和电子设备

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Publication number Priority date Publication date Assignee Title
JP2000012828A (ja) 1998-06-24 2000-01-14 Sony Corp Ccd固体撮像素子の製造方法
JP2000031451A (ja) * 1998-07-13 2000-01-28 Toshiba Corp 固体撮像装置およびその製造方法
JP3621273B2 (ja) * 1998-09-09 2005-02-16 松下電器産業株式会社 固体撮像装置およびその製造方法
JP2000150857A (ja) 1998-11-18 2000-05-30 Nec Corp 固体撮像装置及びその製造方法
JP2002164529A (ja) 2000-11-28 2002-06-07 Sony Corp 固体撮像素子およびその製造方法
JP2005167187A (ja) 2003-11-13 2005-06-23 Seiko Epson Corp 固体撮像装置及びその製造方法
KR20080016259A (ko) * 2006-08-18 2008-02-21 동부일렉트로닉스 주식회사 씨모스 이미지 센서 및 그 제조방법
JP2011108824A (ja) 2009-11-17 2011-06-02 Panasonic Corp 固体撮像素子
JP2011146747A (ja) 2011-04-28 2011-07-28 Sony Corp 固体撮像装置の製造方法および半導体装置の製造方法
US9570489B2 (en) * 2011-07-12 2017-02-14 Sony Corporation Solid state imaging device having impurity concentration on light receiving surface being greater or equal to that on opposing surface
JP2013051327A (ja) * 2011-08-31 2013-03-14 Sony Corp 固体撮像素子および電子機器
JP2014165286A (ja) * 2013-02-23 2014-09-08 Nikon Corp フォトダイオード、固体撮像素子及び撮像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101621067A (zh) * 2008-07-02 2010-01-06 索尼株式会社 固体摄像器件及其制造方法和电子装置
CN101853867A (zh) * 2009-03-31 2010-10-06 索尼公司 固态成像装置及其制造方法和电子设备

Also Published As

Publication number Publication date
DE102014211226A1 (de) 2014-12-18
GB2518261B (en) 2016-06-29
US9437764B2 (en) 2016-09-06
JP2015002192A (ja) 2015-01-05
CN104241305A (zh) 2014-12-24
US20140367747A1 (en) 2014-12-18
GB2518261A (en) 2015-03-18
GB201410584D0 (en) 2014-07-30
JP5932720B2 (ja) 2016-06-08
DE102014211226B4 (de) 2017-11-30

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