CN104241212A - 柔性层叠封装体、包括其的电子系统及包括其的存储卡 - Google Patents

柔性层叠封装体、包括其的电子系统及包括其的存储卡 Download PDF

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Publication number
CN104241212A
CN104241212A CN201310741641.8A CN201310741641A CN104241212A CN 104241212 A CN104241212 A CN 104241212A CN 201310741641 A CN201310741641 A CN 201310741641A CN 104241212 A CN104241212 A CN 104241212A
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packaging body
unit
flexible layer
stacked
contact projection
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CN201310741641.8A
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CN104241212B (zh
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金锺薰
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SK Hynix Inc
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Hynix Semiconductor Inc
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Abstract

本发明提供柔性层叠封装体。柔性层叠封装体包括顺序层叠的第一单元封装体和第二单元封装体。第一单元封装体和第二单元封装体中的每个具有固定区和浮动区。第一单元封装体的固定区通过固定部而连接且固定至第二单元封装体的固定区。

Description

柔性层叠封装体、包括其的电子系统及包括其的存储卡
相关申请的交叉引用
本申请要求2013年6月5日向韩国知识产权局提交的韩国专利申请第10-2013-0065006号的优先权，该申请的内容以全文引用方式并入本文。
技术领域
本公开的实施例总体而言涉及电子装置封装体，更具体而言涉及柔性层叠封装体、包括所述柔性层叠封装体的电子系统、以及包括所述柔性层叠封装体的存储卡。
背景技术
在电子系统中使用的电子装置可包括各种电路元件，所述电路元件可被集成在半导体衬底中和/或半导体衬底上以组成所述电子装置（也称作半导体芯片或半导体裸片）。半导体芯片或半导体裸片可被封装以形成半导体芯片封装体。半导体芯片封装体广泛地使用在诸如计算机、移动系统或数据储存媒介的电子系统中。近来，随着移动系统的发展，能够弯曲或翘曲的柔性层叠封装体的需求逐渐地增加。
穿戴式电子产品的需求也随着移动系统的发展而增加。因此，穿戴式电子产品也需要柔性层叠封装体。因为半导体衬底或半导体芯片能被薄型化地制造而足以弯曲或翘曲，所以嵌有单个半导体芯片的半导体封装体可容易地制造成具有柔性特性。然而，对于减少包括多个层叠半导体芯片的层叠封装体的总厚度而言有些限制。即，制造具有柔性特性的层叠封装体是有难度的。当层叠封装体被翘曲时，拉伸应力或压缩应力可局部地施加在层叠封装体的某些部分，而且应力可能造成层叠封装体的损坏。因此，仍然需要包括多个层叠半导体芯片的柔性层叠封装体。
发明内容
实施例的实例针对柔性层叠封装体、包括所述柔性层叠封装体的电子系统和包括所述柔性层叠封装体的存储卡。
根据一个实施例，一种柔性层叠封装体包括顺序向下层叠的第一单元封装体和第二单元封装体。第一单元封装体和第二单元封装体中的每个具有固定区和浮动区。第一单元封装体的固定区通过固定部而连接且固定至第二单元封装体的固定区。第一和第二单元封装体中的每个包括下柔性层、下柔性层上的上柔性层、以及下柔性层和上柔性层之间的芯片。
根据一个实施例，一种柔性层叠封装体包括顺序向下层叠的第一芯片和第二芯片。第一芯片和第二芯片中的每个具有固定区和浮动区。第一芯片的固定区利用固定部而连接且固定至第二芯片的固定区。
根据一个实施例，一种柔性层叠封装体包括顺序层叠的第一单元封装体和第二单元封装体。第一单元封装体和第二单元封装体中的每个具有固定区和浮动区。第一单元封装体的固定区通过固定部而连接且固定至第二单元封装体的固定区。第一和第二单元封装体中的每个包括将芯片封装在其中的柔性层。
根据一个实施例，一种电子系统包括存储器和通过总线与存储器耦接的控制器。存储器或控制器包括顺序向下层叠的第一单元封装体和第二单元封装体。第一单元封装体和第二单元封装体中的每个具有固定区和浮动区。第一单元封装体的固定区通过固定部而连接且固定至第二单元封装体的固定区。第一和第二单元封装体中的每个包括下柔性层、下柔性层上的上柔性层、以及下柔性层和上柔性层之间的芯片。
根据一个实施例，一种电子系统包括存储器和通过总线与存储器耦接的控制器。存储器或控制器包括顺序向下层叠的第一芯片和第二芯片。第一芯片和第二芯片中的每个具有固定区和浮动区。第一芯片的固定区利用固定部而连接且固定至第二芯片的固定区。
根据一个实施例，一种存储卡包括存储器和存储器控制器，存储器包括贯穿电极，存储器控制器控制存储器的操作。存储器包括顺序向下层叠的第一单元封装体和第二单元封装体。第一单元封装体和第二单元封装体中的每个具有固定区和浮动区。第一单元封装体的固定区通过固定部而连接且固定至第二单元封装体的固定区。第一和第二单元封装体中的每个包括下柔性层、下柔性层上的上柔性层、以及下柔性层和上柔性层之间的芯片。
根据一个实施例，一种存储卡包括存储器和存储器控制器，存储器包括贯穿电极，存储器控制器控制存储器的操作。存储器包括顺序向下层叠的第一芯片和第二芯片。第一芯片和第二芯片中的每个具有固定区和浮动区。第一芯片的固定区利用固定部而连接且固定至第二芯片的固定区。
附图说明
参考附图及随附的详细说明，本发明构思的实施例将变得更加明显易懂，其中：
图1至图6是图示根据一个实施例的柔性层叠封装体的截面图；
图7是图示根据一个实施例的柔性层叠封装体的截面图；
图8是图示根据一个实施例的柔性层叠封装体的截面图；
图9是图示根据一个实施例的柔性层叠封装体的截面图；
图10是图示根据一个实施例的包括柔性层叠封装体的电子系统的一个实例的方框图；以及
图11是图示根据一个实施例的包括柔性层叠封装体的电子系统的另一个实例的方框图。
具体实施方式
将理解的是虽然第一、第二、第三等用词在本文中可用来描述各种不同的元件，但这些元件不应受限于这些用词。这些用词仅用来区分一个元件与另一元件。因此，在不脱离本发明的教导的情况下，不同实施例中的第一元件在其它实施例中可以被称为第二元件。
也将理解的是当一个元件被称为位于另一元件“上”、“上方”、“下方”或“之下”时，所述元件可以是分别直接位于另一元件“上”、“上方”、“下方”或“之下”，或者也可存在中间元件。因此，在本文中使用的诸如“上”、“上方”、“下方”或“之下”等用词仅用于描述特定的实施例而并非要限制本发明的概念。
还将理解的是当一个元件被称为“连接”或“耦接”至另一元件时，所述元件可以是直接连接或耦接至另一元件或者也可存在中间元件。相反地，当一个元件被称为“直接连接”或“直接耦接”至另一元件时，则不存在中间元件。用来描述元件之间或层之间的关系的其它词语应以相似的方式加以解释（例如，“在...之间”相对于“直接在...之间”、“相邻”相对于“直接相邻”、“在…上”相对于“直接在…上”）。
参考图1，柔性层叠封装体可构造成包括层叠结构20，所述层叠结构20具有层叠的多个单元封装体10。每个单元封装体10或层叠结构20可包括固定区21和浮动区23。固定区21表示在层叠结构20中层叠的单元封装体10中的芯片100电气地和机械地连接的局部部分，浮动区23表示单元封装体10中的芯片100未电气地和机械地连接以自由弯曲或翘曲的柔性部分。浮动区23可允许柔性层叠封装体具有柔性能力。芯片100或单元封装体10的在浮动区23中的部分可物理地或机械地断开连接以彼此互相间隔开。即，芯片100或单元封装体10的在浮动区23中的部分可彼此松开而好似浮动部分。
层叠的单元封装体10或芯片100可通过设置在固定区21中的固定连接器200而彼此互相结合。固定连接器200不设置在浮动区23中。因此，芯片100或单元封装体10的位于浮动区23中的部分可物理地或机械地彼此断开连接以独立地移动或具有柔性。因此，芯片100或单元封装体10的位于浮动区23中的部分可自由地翘曲或弯曲。固定连接器200可垂直地层叠以构成固定部，所述固定部与层叠的单元封装体10中包括的芯片100彼此电连接。例如，固定连接器200可使用多个导体来实现，诸如多个贯穿电极、多个凸块或多个焊球。
如图1和图2所示，每个单元封装体10可包括芯片100和柔性层300，芯片100具有集成在衬底中和/或衬底上的集成电路，柔性层300包围芯片100。柔性层300可包括层压的下柔性层310和上柔性层330，芯片100可设置在下柔性层310和上柔性层330之间。也就是，芯片100可以被下柔性层310和上柔性层330封装。芯片100可对应于包括集成电路的半导体芯片。例如，芯片100可以是半导体存储芯片，诸如动态随机存取存储器（DRAM）芯片、静态随机存取存储器（SRAM）芯片、快闪存储器芯片、磁性随机存取存储器（MRAM）芯片、电阻式随机存取存储器（ReRAM）芯片、铁电随机存取存储器（FeRAM）芯片、或相变随机存取存储器（PcRAM）芯片。可替选地，芯片100可以是半导体非存储芯片，诸如包括逻辑集成电路而没有存储器单元的逻辑芯片。芯片100可以被解释成其中和/或其上形成有集成电路的裸片或衬底。
固定连接器200可被引入作为连接至外部装置的电路径或信号路径。每个固定连接器200可使用形成再分布层的方法来制造，或者可被制造成包括诸如贯穿硅通孔（TSV）的贯穿电极。每个固定连接器200可包括：贯穿电极本体210，其穿通芯片100；第一接触部230，其从贯穿电极本体210延伸且穿通上柔性层330以电连接至外部装置；以及第二接触部250，其从贯穿电极本体210延伸且穿通下柔性层310以电连接至外部装置。贯穿电极本体210可由贯穿硅通孔（TSV）形成。第一接触部230和第二接触部250可以由凸块或再分布层形成。每个固定连接器200可由诸如金属层（例如，铜层）的导电层来形成以提供电连接结构。
下柔性层310和上柔性层330中的每个可包括提供应力的材料层。例如，下柔性层310和上柔性层330中的每个可包括聚合物层、橡胶层或弹性层。在不同的实施例中，柔性层300可由聚酰亚胺层形成。当柔性层300中的芯片100翘曲或弯曲时，柔性层300可在芯片100所在的区域产生机械中性面。如图3所示，当单元封装体10受外力F而翘曲以具有哭泣式形状时，单元封装体10中的芯片100也可翘曲，使得上柔性层330向其两个边缘延伸以提供第一应力S1（例如，拉伸应力），下柔性层310向其中心部分压缩以提供第二应力S2（例如，压缩应力）。因此，第一应力S1和第二应力S2可互相抵消或补偿以在设有芯片100的区域产生机械中性面。即，没有应力实质地施加于设置在下柔性层310和上柔性层330之间的芯片100。结果，因为施加于芯片的总应力实质地为零，所以芯片100可成功地翘曲而不会有任何破坏。类似地，即使单元封装体10翘曲以形成微笑式形状，也可在设有芯片100的区域产生机械中性面。因此，芯片100可成功地翘曲而不会有任何破坏。
再次参考图1，构成层叠结构20的第一单元封装体11和第二单元封装体12可通过固定区21中的固定连接器200而彼此结合。第一单元封装体11中的第一固定连接器201可与第二单元封装体12中的第二固定连接器202连接并结合，以在固定区21中将第一单元封装体11与第二单元封装体12结合。粘合层500可局部地引入在第一固定连接器201和第二固定连接器202的接合部附近，以将第一单元封装体11与第二单元封装体12物理地接触。粘合层500可局部地仅仅被引入固定区21而不延伸到浮动区23中。因此，第一单元封装体11和第二单元封装体12可在浮动区23中间隔开。粘合层500可包括介电材料以保护第一固定连接器201和第二固定连接器202的接合部且将第一固定连接器201和第二固定连接器202的接合部与其它元件互相绝缘。粘合层500可将第一单元封装体11附接至第二单元封装体12，使得第一单元封装体11和第二单元封装体12可靠地彼此互相固定。
在浮动区23中可在单元封装体10上设置多个接触凸起400，如图1和图2所示。例如，第一接触凸起410可在浮动区23中设置在单元封装体10的下柔性层310的底表面上，第二接触凸起430可在浮动区23中设置在单元封装体10的上柔性层330的顶表面上。如图1所示，当第一单元封装体11层叠在第二单元封装体12上时，第一单元封装体11的底表面上的第一接触凸起411（或410）可在浮动区23中朝第二单元封装体12的顶表面垂直地延伸，第二单元封装体12的顶表面上的第二接触凸起432（或430）可在浮动区23中朝第一单元封装体11的底表面垂直地延伸。
第二接触凸起432（或430）可在浮动区23中设置在第一接触凸起411（或410）之间，如图4所示，图4对应于沿图1的竖直线A-A’截取的截面图。即，第二接触凸起432（或430）可与第一接触凸起411（或410）垂直地错位。参考图2和图4，第一接触凸起411（或410）可在浮动区23中与第一单元封装体11的下柔性层310（或柔性层300）的底表面相结合，第一接触凸起411（或410）的尖端部可在浮动区23中与第二单元封装体12的上柔性层330（或柔性层300）的顶表面相接触。因此，第一单元封装体11的浮动区23可通过第一接触凸起411（或410）与第二单元封装体12的浮动区23间隔开。即，接触凸起400可在浮动区23中设置在单元封装体10的柔性层300之间，以支撑彼此互相分隔开的单元封装体10。此外，接触凸起400可将施加于一个单元封装体10的力传导至与其相邻的另一个单元封装体10。
如图5所示，当力F施加于包括具有层叠的单元封装体10的层叠结构20的层叠封装体以将层叠封装体翘曲而形成哭泣式形状时，第一单元封装体11也被力F翘曲以形成哭泣式形状，第一单元封装体11的第一接触凸起411（或410）可将由第一单元封装体11翘曲所产生的力T传导至与第一接触凸起411（或410）接触的第二单元封装体12。结果，第二单元封装体12也可经由第一接触凸起411（或410）所传导的力T而翘曲以具有哭泣式形状。第二接触凸起430也可对力F的传导有贡献。例如，如果当力F施加于包括层叠结构20的层叠封装体而形成哭泣式形状时第一接触凸起411（或410）支配地作为力F的传送器，则当力施加于层叠封装体以具有与哭泣式形状相反构造的微笑形状时，第二接触凸起430可支配地作为力的传送器。
接触凸起400（410和430）不作为将单元封装体10彼此互相固定的接合构件或固定构件。即，接触凸起400（410和430）可以是尖端部能够在柔性层300的表面上滑动和移动的构件，而不同于固定连接器200。例如，接触凸起400（410和430）可以是可移动接触部。因此，如果第一单元封装体11翘曲，则第二单元封装体12也可翘曲，第一单元封装体11的第一接触凸起411（410）的尖端部可以在第二单元封装体12的柔性层300的顶表面上滑动。结果，第一接触凸起411（410）的尖端部的接触位置可以在第二单元封装体12的柔性层300的顶表面上改变。如此，当第一单元封装体11和第二单元封装体12翘曲以具有相同形状时，第一接触凸起411（410）固定至第一单元封装体11，而第一接触凸起411（410）的尖端部可仅仅是接触第二单元封装体12且可在第二单元封装体12上滑动。因此，第一接触凸起411（410）可允许第一单元封装体11和第二单元封装体12自由地翘曲。
如图2所示（也参看图5），接触凸起400（410和430）可附接到上、下柔性层330和310的表面，或者可使用挤压技术、雕刻技术或模造技术来形成接触凸起400（410和430）。接触凸起400可被附接成具有凸块形状且可被形成为包括介电材料或导电材料。例如，接触凸起400可被形成为包括聚合物材料、橡胶材料、弹性材料等。在柔性层300由聚酰亚胺薄膜形成的情况下，可通过将模造工艺、按压工艺或凹凸工艺（dimpleprocess）应用于柔性层300（即，聚酰亚胺薄膜）来形成接触凸起400。在这种情况下，柔性层300和接触凸起400可构成单一的统一体而在其间没有异质结。
包括图1和图5所示的层叠的单元封装体10的层叠结构20可以嵌入封装衬底600，如图6所示。封装衬底600可以是柔性印刷电路板或包括柔性薄膜材料的柔性内嵌衬底。封装衬底600可包括覆盖层叠结构20的底表面的下衬底610、覆盖层叠结构20的顶表面的上衬底630、以及设置在下衬底610和上衬底630的边缘之间以提供层叠结构20所在的空腔651的中间衬底650。下衬底610、中间衬底650和上衬底630中的每个可包括柔性材料，举例而言，诸如聚酰亚胺材料的聚合物材料。
下衬底610可具有包括第一外连接器611、第一内连接器613和设置在其中的第一连接通孔615的互连结构，且层叠结构20可经由第一外连接器611、第一内连接器613和第一连接通孔615而电连接至外部装置。第一外连接器611可设置在下衬底610的底表面以作为电接触焊盘；第一内连接器613可设置在下衬底610的顶表面以电连接至层叠结构20中的固定连接器200；第一连接通孔615可设置在第一外连接器611和第一内连接器613之间以将第一外连接器611电连接至第一内连接器613。类似地，上衬底630可具有包括第二外连接器631、第二内连接器633和设置在其中的第二连接通孔635的互连结构。即，第二外连接器631可设置在上衬底630的顶表面以作为电接触焊盘；第二内连接器633可设置在上衬底630的底表面以电连接至层叠结构20中的固定连接器200；第二连接通孔635可设置在第二外连接器631和第二内连接器633之间以将第二外连接器631电连接至第二内连接器633。在不同的实施例中，在固定连接器200和第一内连接器613之间可额外地设置导电衬底连接器620；在固定连接器200和第二内连接器633之间可额外地设置另一导电衬底连接器620。每个导电衬底连接器620可以是诸如焊球或凸块的导电连接器。
附接至构成层叠结构20的单元封装体10的柔性层300的接触凸起400中的至少一个可具有接触下衬底610的尖端部，以将层叠结构20翘曲时所产生的力传导至下衬底610。在不同的实施例中，第三接触凸起640可额外地附接至上衬底630的底表面，第三接触凸起640的尖端部可接触层叠结构20的最顶层单元封装体10的顶表面。在这种情况下，第三接触凸起640可将上衬底630翘曲时所产生的力传导至单元封装体10。
参考图7，根据不同实施例的柔性层叠封装体可具有层叠结构720，所述层叠结构720包括层叠的多个单元封装体710，且每个单元封装体710可包括芯片7100和封装芯片7100的柔性层7300。此外，固定连接器7200可设置在层叠结构720的固定区21中，以提供电气和机械结合结构。然而，图7所示的柔性层叠封装体甚至可构造成不具有任何接触凸起（图1中的400）。单元封装体710可通过包括固定连接器7200的结合结构以及通过包围固定区21中的固定连接器7200之间的接合部的粘合层7500而彼此互相连接和固定。相比之下，由于固定连接器7200和粘合层7500的存在，即使没有任何接触凸起（图1中的400），浮动区23中的单元封装体710也可以垂直地彼此互相间隔开。
参考图8，根据不同实施例的柔性层叠封装体可具有层叠结构820，所述层叠结构820包括层叠的多个单元封装体810，且每个单元封装体810可包括芯片8100和封装芯片8100的柔性层8300。将单元封装体810固定的固定区821可位于层叠结构820的边缘，且单元封装体810的彼此互相间隔开的浮动区823可位于层叠结构820的相对于固定区821的另一边缘。即，图1和图7中所示的柔性层叠封装体的固定区21和浮动区23分别位于层叠结构20的中心部分和边缘，而图8中所示的柔性层叠封装体的固定区821和浮动区823分别位于层叠结构820的二个边缘。结果，就固定区821和浮动区823的位置而言，图8中所示的本实施例具有从图1和图7所示的实施例修改的构造。如图8所示，固定区821可包括将单元封装体810彼此互相机械地固定并电连接的固定连接器8200和强化固定连接器8200的结合力的粘合层8500。浮动区823可包括设置在柔性层8300上的多个接触凸起8400。当层叠结构820受到施加于层叠结构820的力而翘曲时，接触凸起8400可作为单元封装体810之间的力的传送器。
参考图9，根据不同实施例的柔性层叠封装体可具有层叠结构920，所述层叠结构920包括层叠的多个芯片9100，且芯片9100不被任何柔性层封装。即，没有柔性层被引入图9所示的柔性层叠封装体中。图9的柔性层叠封装体可包括位于层叠结构920的中心部分的固定区921和位于层叠结构920的边缘的浮动区923，与图1的实施例相似。固定区921中的固定连接器9200可由穿通芯片9100的贯穿电极、诸如贯穿硅通孔（TSV）来形成。可替选地，固定连接器9200可形成为包括电连接到芯片9100的集成电路的凸块。固定连接器9200可在固定区921中将层叠芯片9100彼此互相连接和固定。粘合层9500可局部地引入固定连接器9200的接合部附近以强化固定连接器9200在固定区921中的结合力。可将接触凸起9400形成为包括附接至芯片9100在浮动区923中的表面的凸块。芯片9100可通过插入在其中的接触凸起9400而彼此互相间隔开。当力施加于层叠结构920以翘曲层叠结构920时，接触凸起9400可作为芯片9100之间的力的传送器。接触凸起9400可由绝缘材料形成以将芯片9100彼此电绝缘。
参考图10，根据实施例的柔性层叠封装体可以以存储卡1800的形式提供。例如，存储卡1800可包括诸如非易失性存储装置的存储器1810和存储器控制器1820。存储器1810和存储器控制器1820可储存数据或读取储存的数据。
存储器1810可包括应用本发明实施例的封装技术的非易失性存储装置中的至少任何一种。存储器控制器1820可控制存储器1810，使得响应于来自主机1830的读取/写入请求来读取已储存的数据或储存数据。
参考图11，根据实施例的柔性层叠封装体可应用于电子系统2710。电子系统2710可包括控制器2711、输入/输出单元2712和存储器2713。控制器2711、输入/输出单元2712和存储器2713可经由总线2715而彼此互相耦接，总线2715提供数据移动的路径。
例如，控制器2711可包括至少一个微处理器、至少一个数字信号处理器、至少一个微控制器以及能够执行与这些元件相同功能的逻辑装置中的至少任何一种。控制器2711和存储器2713可包括根据本发明实施例的柔性层叠封装体中的至少任何一种。输入/输出单元2712可包括选自小型键盘（keypad）、键盘、显示装置、触控屏幕等之中的至少一种。存储器2713是用于储存数据的装置。存储器2713可储存数据和/或要由控制器2711等执行的命令。
存储器2713可包括诸如DRAM的易失性存储装置和/或诸如快闪存储器的非易失性存储装置。例如，快闪存储器可被安装至诸如移动终端或桌上型计算机的信息处理系统。快闪存储器可构成固态盘（SSD）。在此情况下，电子系统2710可稳定地将大量数据储存在快闪存储系统中。
电子系统2710还可包括接口2714，所述接口2714构造成将数据传送到通信网或从通信网接收数据。接口2714可以是有线或无线的形式。例如，接口2714可包括天线或有线或无线收发器。
电子系统2710可实现成移动系统、个人计算机、工业计算机或执行不同功能的逻辑系统。例如，移动系统可以是个人数字助理（PDA）、便携式计算机、平板计算机、移动电话、智能电话、无线电话、膝上型计算机、存储卡、数字音乐系统和信息传送/接收统中的任何一种。
在电子系统2710是能够执行无线通信的设备的情况下，电子系统2710可以使用在诸如CDMA（码分多址）、GSM（全球移动通信系统）、NADC（北美数字蜂窝）、E-TDMA（增强时分多址）、WCDMA（宽带码分多址）、CDMA2000、LTE（长期演进）和Wibro（无线宽带互联网）等的通信系统中。
如上文所述，根据实施例的柔性层叠封装体可提供能够翘曲或弯曲的层叠封装体。在柔性层叠封装体被使用在穿戴式电子系统的情况下，穿戴式电子系统能被改善以具有大储存容量和多功能特性。
以上出于说明的目的公开了本发明构思的实施例。在不脱离如所附权利要求所公开的范围和精神的情况下，可以进行各种修改、增加和替换。
通过以上实施例可以看出，本申请提供了以下的技术方案。
1.一种柔性层叠封装体，包括：
顺序地层叠的第一单元封装体和第二单元封装体，所述第一单元封装体和所述第二单元封装体中的每个具有固定区和浮动区；以及
固定部，所述固定部连接且固定所述第一单元封装体和所述第二单元封装体的固定区，
其中，所述第一单元封装体和所述第二单元封装体中的每个包括下柔性层、所述下柔性层上的上柔性层、以及所述下柔性层和所述上柔性层之间的芯片。
2.如技术方案1所述的柔性层叠封装体，还包括多个第一接触凸起，所述多个第一接触凸起从所述第一单元封装体的浮动区的底表面朝向所述第二单元封装体的浮动区的顶表面凸出，
其中，所述多个第一接触凸起被配置成将施加于所述第一单元封装体的浮动区的力传导到所述第二单元封装体的浮动区。
3.如技术方案2所述的柔性层叠封装体，还包括一个或更多个第二接触凸起，所述一个或更多个第二接触凸起从所述第二单元封装体的浮动区的顶表面朝向所述第一单元封装体的浮动区的底表面凸出，
其中，所述第二接触凸起中的至少一个设置在所述多个第一接触凸起之间。
4.如技术方案2所述的柔性层叠封装体，
其中，所述第一接触凸起在所述浮动区中与所述第一单元封装体的下柔性层相结合；
其中，所述第一接触凸起的尖端部在所述浮动区中与所述第二单元封装体的上柔性层相接触；以及
其中，所述第一单元封装体通过所述第一接触凸起与所述第二单元封装体分隔开。
5.如技术方案2所述的柔性层叠封装体，其中，所述第一接触凸起中的每个包括聚合物材料、橡胶材料或弹性材料。
6.如技术方案1所述的柔性层叠封装体，
其中，每个单元封装体的下柔性层和上柔性层构成柔性层；以及
其中，所述柔性层包括聚合物材料、橡胶材料或弹性材料。
7.如技术方案1所述的柔性层叠封装体，
其中，每个单元封装体的下柔性层和上柔性层构成柔性层；以及
其中，所述柔性层包括聚酰亚胺材料。
8.如技术方案1所述的柔性层叠封装体，其中，每个单元封装体的位于每个下柔性层和每个上柔性层之间的芯片被每个相应单元封装体的下柔性层和上柔性层封装。
9.如技术方案1所述的柔性层叠封装体，
其中，所述第一单元封装体和所述第二单元封装体的固定区位于所述第一单元封装体和所述第二单元封装体的中心部分；以及
其中，所述第一单元封装体和所述第二单元封装体的浮动区位于所述第一单元封装体和所述第二单元封装体的两个边缘。
10.如技术方案1所述的柔性层叠封装体，
其中，所述第一单元封装体和所述第二单元封装体的固定区位于所述第一单元封装体和所述第二单元封装体的第一边缘；以及
其中，所述第一单元封装体和所述第二单元封装体的浮动区位于所述第一单元封装体和所述第二单元封装体的与所述第一边缘相对的第二边缘。
11.如技术方案1所述的柔性层叠封装体，其中，所述固定部将所述第一单元封装体电连接至所述第二单元封装体。
12.如技术方案11所述的柔性层叠封装体，其中，所述固定部包括：
穿通所述第一单元封装体的第一贯穿电极；以及
穿通所述第二单元封装体的第二贯穿电极。
13.如技术方案11所述的柔性层叠封装体，还包括粘合层，所述粘合层将所述第一单元封装体的固定区附接至所述第二单元封装体的固定区，
其中，所述粘合层设置在所述第一单元封装体和所述第二单元封装体之间以包围所述固定部。
14.如技术方案1所述的柔性层叠封装体，还包括具有空腔的封装衬底，其中，包括所述第一单元封装体和所述第二单元封装体的层叠结构位于所述空腔中。
15.如技术方案14所述的柔性层叠封装体，其中，所述封装衬底包括：
覆盖所述层叠结构的底表面的下衬底；
覆盖所述层叠结构的顶表面的上衬底；
中间衬底，设置在所述下衬底和所述上衬底的边缘之间以提供所述空腔；以及
多个第三接触凸起，所述多个第三接触凸起从所述上衬底朝向所述层叠结构的顶表面凸出，以作为力的传送器，
其中，所述下衬底和所述上衬底中的每个包括互连结构，所述互连结构将所述固定部与所述下衬底或所述上衬底相结合。
16.如技术方案15所述的柔性层叠封装体，其中，所述上衬底和所述下衬底包括柔性材料。
17.一种柔性层叠封装体，包括：
顺序地层叠的第一芯片和第二芯片，所述第一芯片和所述第二芯片中的每个具有固定区和浮动区；以及
固定部，所述固定部将所述第一芯片的固定区连接且固定至所述第二芯片的固定区。
18.如技术方案17所述的柔性层叠封装体，还包括多个第一接触凸起，所述多个第一接触凸起从所述第一芯片的浮动区的底表面朝向所述第二芯片的浮动区的顶表面凸出，
其中，所述多个第一接触凸起被配置成将施加于所述第一芯片的浮动区的力传导到所述第二芯片的浮动区。
19.如技术方案18所述的柔性层叠封装体，
其中，所述第一接触凸起和第二接触凸起将所述第一芯片与所述第二芯片绝缘；以及
其中，所述固定部将所述第一芯片电连接至所述第二芯片。
20.一种柔性层叠封装体，包括：
顺序层叠的第一单元封装体和第二单元封装体，所述第一单元封装体和所述第二单元封装体中的每个具有固定区和浮动区；以及
固定部，所述固定部连接且固定所述第一单元封装体和所述第二单元封装体的固定区，
其中，所述第一单元封装体和所述第二单元封装体中的每个包括将芯片封装在其中的柔性层。

Claims (10)

1.一种柔性层叠封装体，包括：
顺序地层叠的第一单元封装体和第二单元封装体，所述第一单元封装体和所述第二单元封装体中的每个具有固定区和浮动区；以及
固定部，所述固定部连接且固定所述第一单元封装体和所述第二单元封装体的固定区，
其中，所述第一单元封装体和所述第二单元封装体中的每个包括下柔性层、所述下柔性层上的上柔性层、以及所述下柔性层和所述上柔性层之间的芯片。
2.如权利要求1所述的柔性层叠封装体，还包括多个第一接触凸起，所述多个第一接触凸起从所述第一单元封装体的浮动区的底表面朝向所述第二单元封装体的浮动区的顶表面凸出，
其中，所述多个第一接触凸起被配置成将施加于所述第一单元封装体的浮动区的力传导到所述第二单元封装体的浮动区。
3.如权利要求2所述的柔性层叠封装体，还包括一个或更多个第二接触凸起，所述一个或更多个第二接触凸起从所述第二单元封装体的浮动区的顶表面朝向所述第一单元封装体的浮动区的底表面凸出，
其中，所述第二接触凸起中的至少一个设置在所述多个第一接触凸起之间。
4.如权利要求2所述的柔性层叠封装体，
其中，所述第一接触凸起在所述浮动区中与所述第一单元封装体的下柔性层相结合；
其中，所述第一接触凸起的尖端部在所述浮动区中与所述第二单元封装体的上柔性层相接触；以及
其中，所述第一单元封装体通过所述第一接触凸起与所述第二单元封装体分隔开。
5.如权利要求2所述的柔性层叠封装体，其中，所述第一接触凸起中的每个包括聚合物材料、橡胶材料或弹性材料。
6.如权利要求1所述的柔性层叠封装体，
其中，每个单元封装体的下柔性层和上柔性层构成柔性层；以及
其中，所述柔性层包括聚合物材料、橡胶材料或弹性材料。
7.如权利要求1所述的柔性层叠封装体，
其中，每个单元封装体的下柔性层和上柔性层构成柔性层；以及
其中，所述柔性层包括聚酰亚胺材料。
8.如权利要求1所述的柔性层叠封装体，其中，每个单元封装体的位于每个下柔性层和每个上柔性层之间的芯片被每个相应单元封装体的下柔性层和上柔性层封装。
9.如权利要求1所述的柔性层叠封装体，
其中，所述第一单元封装体和所述第二单元封装体的固定区位于所述第一单元封装体和所述第二单元封装体的中心部分；以及
其中，所述第一单元封装体和所述第二单元封装体的浮动区位于所述第一单元封装体和所述第二单元封装体的两个边缘。
10.如权利要求1所述的柔性层叠封装体，
其中，所述第一单元封装体和所述第二单元封装体的固定区位于所述第一单元封装体和所述第二单元封装体的第一边缘；以及
其中，所述第一单元封装体和所述第二单元封装体的浮动区位于所述第一单元封装体和所述第二单元封装体的与所述第一边缘相对的第二边缘。
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