CN104203490A - 焊料预成型件与焊料合金装配方法 - Google Patents

焊料预成型件与焊料合金装配方法 Download PDF

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CN104203490A
CN104203490A CN201380015592.8A CN201380015592A CN104203490A CN 104203490 A CN104203490 A CN 104203490A CN 201380015592 A CN201380015592 A CN 201380015592A CN 104203490 A CN104203490 A CN 104203490A
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solder
temperature
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CN104203490B (zh
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P·J·凯普
E·S·托米
G·森多内
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A Erfa Metal Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264Bi as the principal constituent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

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  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种将组件装配到基体上的方法,例如将电子组件装配到电子基体上的方法,包括将焊膏应用到电子基体从而形成焊膏沉积,将低温预成型件放置到所述的焊膏沉积处,以焊膏的回流温度加工该电子基体从而产生一个低温焊点,以及以比焊膏的回流温度低的回流温度加工所述的低温焊点。装配组件和焊点组合物的其他方法将进一步公开。

Description

焊料预成型件与焊料合金装配方法
背景技术
本申请涉及的是将组件连接到基体上的方法,更为详细的说,本申请涉及的是将电子组件和相关设备连接到印刷电路板上的方法。
无铅焊料合金在电路板组装领域来说是众所周知的。这种无铅焊料合金的实施例包括锡-银-铜或SAC合金以及锡铋合金。SAC合金具有加工温度相对较高的缺点。锡-铋合金在高应变率下表现出延性损失。
发明内容
本发明的一个方面涉及的是将组件装配到基体上的方法,例如将电子组件装配到电子基体上。在一个实施方案中,所述的方法包括:将焊膏应用到电子基体上,从而形成焊膏沉积;将低温预成型件放置到所述焊膏沉积处;以焊膏的回流温度加工该电子基体从而产生一个低温焊点;以及以比焊膏的回流温度低的回流温度加工所述的低温焊点。
该方法的实施方案进一步包括以较低回流温度和回流温度之间的温度进行的第二焊接工艺。在某些实施方案中,所述的低温预成型件可以是包括锡和铋的组合物。所述的组合物可包含42%重量的锡和58%重量的铋。所述的组合物还可以包括银。在另一些实施方案中,所述的焊点包括锡、银、铜和铋。所述的焊点可以包括49-53%重量的锡、0-1.0%重量的银、0-0.1%重量的铜和46-50%重量的铋。所述的焊点的回流温度可以在138-170℃之间。在另一些实施方案中,所述的组合物可以包括55%重量的锡和45%重量的铋。
本发明的另一方面涉及的是一种方法,其包括:将低温焊膏应用到电子基体上,从而形成焊膏沉积;将高温预成型件放置到所述的焊膏沉积处;以及以回流温度加工所述的电子基体,其适用于低温焊膏用于产生低温焊点,导致高温焊接预成型件分解进入所述的低温焊膏沉积。
所述方法的实施方案进一步包括由锡和铋组成的低温焊膏组合物。在一些实施方案中,所述的组合物可以包括42%重量的锡和58%重量的铋。所述的组合物还可以包括银。所述的焊点的回流温度可在190-200℃之间。
本发明的另一方面涉及的是一种焊点,其包括49-53%重量的锡、0-1.0%重量的银、0-0.1%重量的铜和平衡的铋。在一个实施方案中,焊点的回流温度在190-200℃之间。
具体实施方式
根据本发明的一个或多个实施方案,在不同的温度下回流,在印刷电路板(PCB)的相同侧,通过选择性地将低温预成型件放置在焊膏沉积处,使用单一焊膏印刷工艺,可能产生两种或更多种类型的焊点。在焊膏合金的温度回流之后,焊点可在不干扰其他多数焊点连接的情况下,在第二焊接工艺回流或者以较低温度返工。
根据本发明的一个或多个非限定性实施方案,锡-铋预成型件具有的熔融温度为大约138℃,其被放置在SAC(锡-银-铜)焊膏的沉积处,SAC(锡-银-铜)焊膏具有的熔融温度约为217℃,从而产生具有熔融温度约为165-180℃的低温焊点。所得到的焊点适用于在约为200℃的温度下进行低温第二焊接工艺,从而能够使所述的第二焊接工艺不干扰SAC焊点。所述的第二焊接工艺可能包括,举例来说,RF屏蔽或温度敏感元件的连接和发生在比低温焊接(约200℃为例)高但比SAC焊料的熔融温度217℃低的温度。不同的预成型件可以选择地用于发生在不同的温度下回流的区域。
根据一个或多个实施方案,PCB的一侧的部分可以在低温焊料和标准无铅SAC焊料共存的情况下可选择的发生。然后在电气验证测试之后,在不干扰SAC焊点的情况下,第二焊接操作可以在该PCB上执行(例如,焊接无线电频率或RF屏蔽)。根据一个或多个实施方案的方法和途径,有益的是,其无需任何复杂的装配操作,例如低效地分配低温焊膏从而在PCB上产生第二低温区域。相反,仅由一种焊膏(例如SAC305)印制的低温焊点产生,然后通过选择性的挑选和将低温预成型件(例如Sn42Bi58)放置到SAC焊膏中,并将PCB板以SAC温度(例如,约为240℃)回流。因此,电路板的区域包含低温焊料(例如,Sn55Bi45或Sn60Bi40),其可用于以不干扰SAC焊点的回流温度(例如,在200℃回流)用于第二焊接工艺。
根据一个或多个实施方案,方法可用于各种应用。在一些非限定性的实施方案中,移动手持设备的工人可以对PCB之上的电子进行100%测试,然后附加RF屏蔽。在所述组件已经附着之后应用低温焊膏来屏蔽可能需要分配,这是繁琐且缓慢的。如果所述的RF屏蔽仅由SAC焊膏附加,第二焊接工艺将会干扰已经测试后的电子组件。一个更为有效的方法是从SAC焊膏和锡-铋预成型件建立所述的低温焊点,并在初始回流期间与回流相结合。一旦电气测试完成,屏蔽可以通过将其浸入助焊剂中附加,将其放置在现有的低温焊点上,并在足够的温度下回流从而回流所述的低温焊料,但低于SAC的温度。
在其他非限定性的实施方案中,RF屏蔽可以在与其他SAC组件相同的时间焊接到电路板上,但由于所述焊点保护使用SAC焊膏和锡-铋预成型件的结合的焊接屏蔽,所述屏蔽可以被移除而无需干扰其他的焊点,因为屏蔽焊点的回流温度比电路板上的其他组件低。如果所述的屏蔽使用SAC焊料附加,屏蔽的移除工艺(进入或在所述屏蔽下的带有集成电路的电气问题的返工)可能干扰周围区域的焊点,当试图修补RF屏蔽下的特定问题的时候,可能引入更多的问题
在进一步的非限定性的实施方案中,将温敏元件附着到PCB上可以通过SAC焊膏和锡-铋预成型件产生的焊点完成。然后,所述的温敏元件仅借助于焊膏助焊剂被连接,并以较低温度焊接操作。所述的焊膏助焊剂用于将部分锚定在其位置,就像标准PCB装配过程中焊膏锚定电器组件那样。
在另外的实施方案中,热循环耐力和抗跌落冲击,两种产品功能对于电子组件来说是非常重要的,是需要被优化的。焊料合金在同时使用这两个度量的组件的性能方面起着很重要的作用。为了优化具体的热循环耐力,所述的焊料合金通常会包含小百分比的银。然而,为了优化跌落冲击,较少的银是最好的。对于在单一PCB上的混合合金的能力,所有的单一焊膏应用方法,通过在相同电路板上用于特定设备的焊料合金的选择性工程同时满足跌落冲击和热循环耐力的微调是可能的。
根据一个或多个实施方案,所述方法可能产生RoHS(限制有害物质)兼容的同时在PCB上选择地低温合金与SAC305焊料一致。这样的方法可能涉及使用标准设备的单一焊膏印刷工艺。在一些非限定性的实施方案中,RF屏蔽可被移除用于不干扰周围组件的返工。在其他实施方案中,低温焊点可以在SAC305回流期间形成,其用于支持在低温状态下的第二回流工艺。所述的第二工艺可以,例如,将温敏元件连接或将RF屏蔽连接。
根据一个或多个实施方案,用于产生低温焊料合金用于屏蔽连接的方法可能涉及单一焊膏印刷工艺。在一些实施方案中,SAC305焊膏可印刷。一种锡-铋合金预成型件可以放置在焊膏垫块上以此连接RF屏蔽。然后,所述的组件可使用标准SAC305回流曲线回流。所述的RF屏蔽可以在低温状态下移除,不会干扰SAC305焊点。SAC305焊膏和锡-铋预成型件可以以不同比例的组合来实现所需的非共晶(non-eutectic)锡-铋-银-铜合金。所述的预成型合金可被调整以实现更多的合金柔性。在氮气中的回流可以提供用于预成型件-焊膏比例的增加的柔性。
在合金的第一实施例中:
合金成分 混合物 贡献 复合合金
焊膏 1.0
Sn 96.5 19.3 52.9Sn
Ag 3.0 0.6 0.9Ag
Cu 0.5 0.1 0.1Cu
预成型件 4.0
Sn 42.0 33.6
Bi 57.6 46.1 46.1Bi
Ag 0.4 0.32
总量 100.0 100.0
所述的成分包括一部分SAC305焊膏和四部分SnBi47.6Ag0.04预成型件=~Sn53 Bi Ag1 Cu 0.1。(熔融范围约为138-165℃)
在合金的第二实施例中:
合金成分 混合物 贡献 复合合金
焊膏 1.0
Sn 96.5 13.8 49.8Sn
Ag 3.0 0.4 0.4Ag
Cu 0.5 0.1 0.07Cu
预成型件 6.0
Sn 42.0 36.0
Bi 58.0 49.7 49.7Bi
Ag 0.0 0.0
总量 100.0 100.0
所述的成分包括一部分SAC305焊膏和六部分Sn42Bi58预成型件=~Sn50 Bi50 Ag0.4 Cu。(熔融范围约为138-170℃)
因此,上述存在的合金的这两个实施例可以以显著低于200℃的温度下返工。
根据一个或多个实施方案,预成型件可以以各种各样的合金制造,其能够以复合合金进行微调。举例来说,在非限定性实施方案中,Sn55Bi45+Cu和Co可以提高跌落冲击。在非晶合金中高银灵敏度不重要。通过使用预成型件从而选择性地调整焊点合金用于在PCB上的特定位置,可能满足用于单一组件的目标混合物。在一些实施方案中,特定组件的跌落冲击或热循环灵敏度可以通过改变特定成分的合金克服。
在本发明的另外一个实施方案中,一种生产焊点的方法可以使用将低温焊膏,例如,锡-铋合金(例如,Sn42Bi58),应用到印刷电路板(PCB)从而形成焊料沉积,并选择性地将较高温度预成型件,例如SAC305预成型件,放置到所述的焊膏沉积处。由此产生的组合物在回流温度下加工,其适用于低温焊膏从而产生低温焊点。基本上,所述的高温焊料预成型件分解或混合进入所述低温焊膏中。产生的焊点的回流温度在190-200℃之间。在某些实施方案中,预成型件具有较高的加工温度,当仍然保持较低的总加工温度时,其可以使用。在本实施方案中,所述较高温度预处理件分解于所述较低温度焊膏沉积处。因此,所述的加工温度无需达到预成型件的熔融温度实现产生的焊点。上述方法可能在需要低温回流加工或当得到的焊点具有特有特征(例如较高的锡含量以提升焊点的延性)时适用。
在一个实施例中,方法包括将SN42BI58焊膏沉积到印刷电路板上。焊料预成型件,例如SAC305焊料预成型件,被选择性地放置到焊膏沉积处。由此产生的系统在190-200℃的温度之间处理,这适用于回流SN42BI58焊膏沉积。由此产生的焊点具有高锡含量,因此,不同的、独有的合金具有特有属性。
本文所述的回流焊接是指一个过程,其中焊膏被印刷或分配,或者焊料预成型件被放置,或者二者皆有,在印刷电路板的一个表面上,组件被放置在或接近所述的沉积焊料处,且组件被加热到足够使所述焊料回流的温度。
在某个实施方案中,所述的焊膏和所述的预成型件共享至少一个共同的元素,从而便于以接近或低于所述合金之一的熔点的温度快速分解进入另一种。在一个实施方案中,这种共同的元素是锡。
在某些实施方案中,所述的焊膏包括本文描述的成分,其与助焊剂结合。合适的助焊剂是本领域公知的。
本文所述的方法和成分可以用于的应用包括,但不限定为,印刷电路板的制造、LED组件、光伏电池的制造、半导体制造和模具连接。
本领域技术人员应该可以知道,本文所述的方法的实施方案并非局限于应用中的细节安排。所述的方法能够以其他实施方案和以各种方式实施或实践。本文所提供的具体的实施例仅是用于说明的目的,而非限制。特别是,本文所讨论的与一个或多个实施方案结合的行为、元件、特征等不能试图排除在其他任何相似的实施方案。
同时,人们应该理解在此使用的措辞和术语是为了描述的目的,不应视为限制。在此使用的术语“包括(including)”、“包括(comprising)”、“具有(having)”、“包含(containing)”、“涉及(involving)”以及上述术语的结合使用是指包括其后所列出的项目和等同物以及额外的项目。
人们应该理解的是,本发明具有至少一个实施方案的上述几个方面,各种变体、修改以及改进对于本领域技术人员来说将可能发生。这种变体、修改和改进应视为本发明的部分且落入本发明的保护范围中。因此,上述的说明书和附图仅是列举的方式展示。

Claims (16)

1.一种装配的方法,其包括:
将焊膏应用到电子基体上,从而形成焊膏沉积;
将低温预成型件放置到所述的焊膏沉积处;
以所述焊膏的回流温度加工所述电子基体,从而产生低温焊点;以及
以回流温度加工所述的低温焊点,其中所述的回流温度比所述的焊膏的回流温度低。
2.根据权利要求1所述的方法,其中所述的低温预成型件是包括锡和铋的组合物。
3.根据权利要求2所述的方法,其中所述的组合物包括42%重量的锡和58%重量的铋。
4.根据权利要求2所述的方法,其中所述的组合物进一步包括银。
5.根据权利要求1所述的方法,其中所述的焊点包括锡、银、铜和铋。
6.根据权利要求5所述的方法,其中所述的焊点包括49-53%重量的锡、0-1.0%重量的银、0-0.1%重量的铜和46-50%重量的铋。
7.根据权利要求1所述的方法,其中所述的焊点的回流温度在138-170℃之间。
8.根据权利要求1所述的方法,进一步包括在较低回流温度和回流温度之间的温度下进行的第二焊接工艺。
9.根据权利要求1所述的方法,其中所述的组合物包括55%重量的锡和45%重量的铋。
10.一种装配的方法,其包括:
将低温焊膏应用到电子基体上从而形成焊膏沉积;
将高温预成型件放置在所述的焊膏沉积处;以及
以回流温度加工所述的电子基体,其适用于低温焊膏从而产生低温焊点,导致高温焊接预成型件分解进入所述的低温焊膏沉积。
11.根据权利要求10所述的方法,其中所述的低温焊膏是一种组合物,该组合物包括锡和铋。
12.根据权利要求11所述的方法,其中所述的组合物包括42%重量的锡和58%重量的铋。
13.根据权利要求11所述的方法,其中所述的组合物进一步包括银。
14.根据权利要求10所述的方法,其中所述焊点的回流温度在190-200℃之间。
15.一种焊点,其包括:
49-53%重量的锡;
0-1.0%重量的银;
0-0.1%重量的铜;以及
平衡的铋。
16.根据权利要求15所述的焊点,其中所述焊点的回流温度在190-200℃之间。
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CN117712035A (zh) * 2024-02-06 2024-03-15 苏州锐杰微科技集团有限公司 一种用于解决基板翘曲问题的复合焊点低温互连方法
CN117712035B (zh) * 2024-02-06 2024-04-30 苏州锐杰微科技集团有限公司 一种用于解决基板翘曲问题的复合焊点低温互连方法

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US20180020554A1 (en) 2018-01-18
CN104203490B (zh) 2018-04-24
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