JP2015514316A - はんだ予成形品およびはんだ合金組付方法 - Google Patents
はんだ予成形品およびはんだ合金組付方法 Download PDFInfo
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- JP2015514316A JP2015514316A JP2015501809A JP2015501809A JP2015514316A JP 2015514316 A JP2015514316 A JP 2015514316A JP 2015501809 A JP2015501809 A JP 2015501809A JP 2015501809 A JP2015501809 A JP 2015501809A JP 2015514316 A JP2015514316 A JP 2015514316A
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- solder
- temperature
- solder paste
- low temperature
- preform
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 140
- 238000000034 method Methods 0.000 title claims abstract description 50
- 229910045601 alloy Inorganic materials 0.000 title description 25
- 239000000956 alloy Substances 0.000 title description 25
- 239000000203 mixture Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052718 tin Inorganic materials 0.000 claims description 19
- 229910052797 bismuth Inorganic materials 0.000 claims description 16
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000004090 dissolution Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 26
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 5
- 229910001152 Bi alloy Inorganic materials 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- HSGAUFABPUECSS-UHFFFAOYSA-N [Ag][Cu][Sn][Bi] Chemical compound [Ag][Cu][Sn][Bi] HSGAUFABPUECSS-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
この開示は、構成要素を基板上に取付ける方法、ならびに特に電子部品および関連付けられる装置をプリント回路基板上に取付ける方法に向けられる。
この開示の1つの局面は、電子部品のような構成要素を電子基板のような基板上に組付ける方法に向けられる。1つの実施の形態では、この方法は、はんだペーストを電子基板に適用してはんだペーストデポジットを形成するステップと、はんだペーストデポジットに低温予成形品を配置するステップと、電子基板をはんだペーストのリフロー温度で処理して、低温はんだ接合を形成するステップと、低温はんだ接合を、はんだペーストのリフロー温度より低いリフロー温度で処理するステップとを含む。
1つ以上の実施の形態によれば、異なる温度でリフローする2つ以上の種類のはんだ接合が、プリント回路基板(PCB)の同じ側に、単一のはんだペースト印刷プロセスを用いて、低温予成形品をはんだペーストデポジットに選択的に配置することによって、形成されてもよい。はんだペースト合金の温度でのリフローの後、接合は、第2のはんだプロセスにおけるリフロー、またはより低い温度での再加工が、大多数の他のはんだ接合接続を乱すことなく可能である。
Claims (16)
- 組付の方法であって、
はんだペーストを電子基板に適用してはんだペーストデポジットを形成するステップと、
前記はんだペーストデポジットに低温予成形品を配置するステップと、
前記電子基板を前記はんだペーストのリフロー温度で処理して、低温はんだ接合を形成するステップと、
前記低温はんだ接合を、前記はんだペーストのリフロー温度より低いリフロー温度で処理するステップとを含む、方法。 - 前記低温予成形品は錫およびビスマスからなる組成物である、請求項1に記載の方法。
- 前記組成物は、42重量%の錫および58重量%のビスマスからなる、請求項2に記載の方法。
- 前記組成物は、さらに、銀からなる、請求項2に記載の方法。
- 前記はんだ接合は、錫、銀、銅およびビスマスからなる、請求項1に記載の方法。
- 前記はんだ接合は、49〜53重量%の錫、0〜1.0重量%の銀、0〜0.1重量%の銅、および46〜50重量%のビスマスからなる、請求項5に記載の方法。
- 前記はんだ接合のリフロー温度は138〜170℃の間にある、請求項1に記載の方法。
- 前記より低いリフロー温度と前記リフロー温度との間の温度での第2のはんだプロセスをさらに含む請求項1に記載の方法。
- 前記組成物は、55重量%の錫および45重量%のビスマスからなる、請求項1に記載の方法。
- 組付の方法であって、
低温はんだペーストを電子基板に適用してはんだペーストデポジットを形成するステップと、
前記はんだペーストデポジットに高温予成形品を配置するステップと、
前記電子基板を前記低温はんだペーストに対して適切なリフロー温度で処理して、前記高温はんだ予成形品の前記低温はんだペーストデポジットへの溶解から結果として生じる低温はんだ接合を形成するステップとを含む方法。 - 前記低温はんだペーストは錫およびビスマスからなる組成物である、請求項10に記載の方法。
- 前記組成物は、42重量%の錫および58重量%のビスマスからなる、請求項11に記載の方法。
- 前記組成物は、さらに、銀からなる、請求項11に記載の方法。
- 前記はんだ接合のリフロー温度は190〜200℃の間にある、請求項10に記載の方法。
- はんだ接合であって、
49〜53重量%の錫、
0〜1.0重量%の銀、
0〜0.1重量%の銅、および
残部ビスマスからなる、はんだ接合。 - 前記はんだ接合のリフロー温度は190〜200℃の間にある、請求項15に記載のはんだ接合。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261613233P | 2012-03-20 | 2012-03-20 | |
US61/613,233 | 2012-03-20 | ||
PCT/US2013/032137 WO2013142335A1 (en) | 2012-03-20 | 2013-03-15 | Solder preforms and solder alloy assembly methods |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015514316A true JP2015514316A (ja) | 2015-05-18 |
JP6251235B2 JP6251235B2 (ja) | 2017-12-20 |
Family
ID=49223257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015501809A Active JP6251235B2 (ja) | 2012-03-20 | 2013-03-15 | はんだ予成形品およびはんだ合金組付方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9801285B2 (ja) |
EP (1) | EP2834037A4 (ja) |
JP (1) | JP6251235B2 (ja) |
KR (1) | KR102087004B1 (ja) |
CN (1) | CN104203490B (ja) |
IN (1) | IN2014DN07833A (ja) |
WO (1) | WO2013142335A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10431564B2 (en) * | 2014-01-27 | 2019-10-01 | Mediatek Inc. | Structure and formation method of chip package structure |
CN104625463A (zh) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | 一种抗氧化锡棒的生产方法 |
CN104889594B (zh) * | 2015-06-08 | 2017-07-11 | 哈尔滨工业大学 | 低温超声SnBi基钎料及其制备方法,及其超声钎焊陶瓷和/或陶瓷基复合材料的方法 |
EP3414039B1 (en) * | 2016-02-11 | 2023-06-14 | Celestica International LP | Thermal treatment for preconditioning or restoration of a solder joint |
GB2569466B (en) | 2016-10-24 | 2021-06-30 | Jaguar Land Rover Ltd | Apparatus and method relating to electrochemical migration |
DE102018116410A1 (de) * | 2018-07-06 | 2020-01-09 | Endress+Hauser SE+Co. KG | Verfahren zur Herstellung einer hochtemperaturfesten bleifreien Lotverbindung und hochtemperaturfeste bleifreie Lotverbindung |
WO2020233839A1 (en) * | 2019-05-23 | 2020-11-26 | Alpha Assembly Solutions Inc. | Solder paste for module fabrication of solar cells |
US11278977B2 (en) | 2019-10-22 | 2022-03-22 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
US11310950B2 (en) | 2019-10-22 | 2022-04-19 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
DE102019129971A1 (de) * | 2019-11-06 | 2021-05-06 | Endress+Hauser SE+Co. KG | Verfahren zum Auflöten eines Bauelements auf eine Leiterplatte, Elektronikeinheit und Feldgerät der Automatisierungstechnik |
DE102020129831A1 (de) | 2020-11-12 | 2022-05-12 | Endress+Hauser SE+Co. KG | Verfahren zum Auflöten eines Bauelements auf eine Oberfläche einer ersten Leiterplatte |
JPWO2022153631A1 (ja) * | 2021-01-14 | 2022-07-21 | ||
DE102021103360A1 (de) | 2021-02-05 | 2022-08-11 | Few Fahrzeugelektrik Werk Gmbh & Co. Kg | Verfahren zur Herstellung einer Vorverzinnungsanordnung und derartige Vorverzinnungsanordnung |
CN117712035B (zh) * | 2024-02-06 | 2024-04-30 | 苏州锐杰微科技集团有限公司 | 一种用于解决基板翘曲问题的复合焊点低温互连方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1154656A (ja) * | 1997-07-31 | 1999-02-26 | Nec Corp | 半田バンプ電極の製造方法及び半田バンプ電極 |
JP2002043466A (ja) * | 2000-07-26 | 2002-02-08 | Denso Corp | ボールグリッドアレイパッケージ |
JP2007088293A (ja) * | 2005-09-22 | 2007-04-05 | Fujitsu Ltd | 基板の反り低減構造および基板の反り低減方法 |
JP2009277777A (ja) * | 2008-05-13 | 2009-11-26 | Tamura Seisakusho Co Ltd | はんだボール搭載方法及び電子部品実装用部材 |
WO2010061428A1 (ja) * | 2008-11-28 | 2010-06-03 | 富士通株式会社 | 電子装置の製造方法、電子部品搭載用基板及びその製造方法 |
JP2012023667A (ja) * | 2010-07-16 | 2012-02-02 | Panasonic Corp | 固体撮像装置 |
Family Cites Families (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US711629A (en) * | 1902-03-06 | 1902-10-21 | Storm Miller W | Insulator. |
US4878611A (en) * | 1986-05-30 | 1989-11-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate |
US5060844A (en) * | 1990-07-18 | 1991-10-29 | International Business Machines Corporation | Interconnection structure and test method |
US5147084A (en) * | 1990-07-18 | 1992-09-15 | International Business Machines Corporation | Interconnection structure and test method |
US5118027A (en) * | 1991-04-24 | 1992-06-02 | International Business Machines Corporation | Method of aligning and mounting solder balls to a substrate |
US5389160A (en) | 1993-06-01 | 1995-02-14 | Motorola, Inc. | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
US5591941A (en) * | 1993-10-28 | 1997-01-07 | International Business Machines Corporation | Solder ball interconnected assembly |
US5427865A (en) | 1994-05-02 | 1995-06-27 | Motorola, Inc. | Multiple alloy solder preform |
US5551627A (en) * | 1994-09-29 | 1996-09-03 | Motorola, Inc. | Alloy solder connect assembly and method of connection |
US5569433A (en) | 1994-11-08 | 1996-10-29 | Lucent Technologies Inc. | Lead-free low melting solder with improved mechanical properties |
US5655703A (en) * | 1995-05-25 | 1997-08-12 | International Business Machines Corporation | Solder hierarchy for chip attachment to substrates |
US5803340A (en) * | 1995-09-29 | 1998-09-08 | Delco Electronics Corporation | Composite solder paste for flip chip bumping |
AU6279296A (en) * | 1996-06-12 | 1998-01-07 | International Business Machines Corporation | Lead-free, high tin ternary solder alloy of tin, silver, and indium |
US20010002982A1 (en) * | 1996-06-12 | 2001-06-07 | Sarkhel Amit Kumar | Lead-free, high tin ternary solder alloy of tin, silver, and bismuth |
US6117759A (en) * | 1997-01-03 | 2000-09-12 | Motorola Inc. | Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package |
US5931371A (en) * | 1997-01-16 | 1999-08-03 | Ford Motor Company | Standoff controlled interconnection |
US6002172A (en) * | 1997-03-12 | 1999-12-14 | International Business Machines Corporation | Substrate structure and method for improving attachment reliability of semiconductor chips and modules |
US6330967B1 (en) * | 1997-03-13 | 2001-12-18 | International Business Machines Corporation | Process to produce a high temperature interconnection |
US5953623A (en) * | 1997-04-10 | 1999-09-14 | International Business Machines Corporation | Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection |
US5872400A (en) * | 1997-06-25 | 1999-02-16 | International Business Machines Corporation | High melting point solder ball coated with a low melting point solder |
US6059172A (en) * | 1997-06-25 | 2000-05-09 | International Business Machines Corporation | Method for establishing electrical communication between a first object having a solder ball and a second object |
US6050481A (en) * | 1997-06-25 | 2000-04-18 | International Business Machines Corporation | Method of making a high melting point solder ball coated with a low melting point solder |
US6025649A (en) * | 1997-07-22 | 2000-02-15 | International Business Machines Corporation | Pb-In-Sn tall C-4 for fatigue enhancement |
US6235996B1 (en) | 1998-01-28 | 2001-05-22 | International Business Machines Corporation | Interconnection structure and process module assembly and rework |
GB9903552D0 (en) * | 1999-02-16 | 1999-04-07 | Multicore Solders Ltd | Reflow peak temperature reduction of solder alloys |
US6583354B2 (en) * | 1999-04-27 | 2003-06-24 | International Business Machines Corporation | Method of reforming reformable members of an electronic package and the resultant electronic package |
JP3514670B2 (ja) * | 1999-07-29 | 2004-03-31 | 松下電器産業株式会社 | 半田付け方法 |
KR100398716B1 (ko) * | 2000-06-12 | 2003-09-19 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 모듈 및 반도체 장치를 접속한 회로 기판 |
US6276596B1 (en) * | 2000-08-28 | 2001-08-21 | International Business Machines Corporation | Low temperature solder column attach by injection molded solder and structure formed |
US6350669B1 (en) * | 2000-10-30 | 2002-02-26 | Siliconware Precision Industries Co., Ltd. | Method of bonding ball grid array package to circuit board without causing package collapse |
JP4051893B2 (ja) * | 2001-04-18 | 2008-02-27 | 株式会社日立製作所 | 電子機器 |
JP3556922B2 (ja) * | 2001-05-07 | 2004-08-25 | 富士通株式会社 | バンプ形成方法 |
US6974659B2 (en) * | 2002-01-16 | 2005-12-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming a solder ball using a thermally stable resinous protective layer |
US6805974B2 (en) * | 2002-02-15 | 2004-10-19 | International Business Machines Corporation | Lead-free tin-silver-copper alloy solder composition |
US6782897B2 (en) * | 2002-05-23 | 2004-08-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of protecting a passivation layer during solder bump formation |
US6897761B2 (en) * | 2002-12-04 | 2005-05-24 | Cts Corporation | Ball grid array resistor network |
TW200414858A (en) * | 2003-01-15 | 2004-08-01 | Senju Metal Industry Co | Apparatus and method for aligning and attaching solder columns to a substrate |
US6842341B1 (en) * | 2003-10-02 | 2005-01-11 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
US8574959B2 (en) * | 2003-11-10 | 2013-11-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming bump-on-lead interconnection |
JP4502690B2 (ja) * | 2004-04-13 | 2010-07-14 | 富士通株式会社 | 実装基板 |
JP2006032619A (ja) * | 2004-07-15 | 2006-02-02 | Hitachi Ltd | 低耐熱性表面実装部品及びこれをバンプ接続した実装基板 |
JP2006041401A (ja) * | 2004-07-29 | 2006-02-09 | Sharp Corp | 半導体装置及びその製造方法 |
US20060054657A1 (en) * | 2004-09-16 | 2006-03-16 | Francis Thamarayoor R | Method and apparatus for de-soldering integrated circuit devices |
US7331503B2 (en) | 2004-10-29 | 2008-02-19 | Intel Corporation | Solder printing process to reduce void formation in a microvia |
US7413110B2 (en) * | 2005-02-16 | 2008-08-19 | Motorola, Inc. | Method for reducing stress between substrates of differing materials |
US7195145B2 (en) * | 2005-07-13 | 2007-03-27 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
JP2007103462A (ja) * | 2005-09-30 | 2007-04-19 | Oki Electric Ind Co Ltd | 端子パッドと半田の接合構造、当該接合構造を有する半導体装置、およびその半導体装置の製造方法 |
KR100790978B1 (ko) * | 2006-01-24 | 2008-01-02 | 삼성전자주식회사 | 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법 |
CN101500744B (zh) * | 2006-07-05 | 2011-11-30 | 富士电机株式会社 | 膏状钎焊料和电子部件的软钎焊方法 |
US20100059244A1 (en) * | 2007-03-05 | 2010-03-11 | Kyocera Corporation | Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus |
US20080308612A1 (en) | 2007-06-15 | 2008-12-18 | Best Inc. | Manual method for reballing using a solder preform |
CA2645532A1 (en) * | 2007-11-26 | 2009-05-26 | Daido Tokushuko Kabushiki Kaisha | Metallic bipolar plate for fuel cells and method for manufacturing the same |
US7560373B1 (en) * | 2008-03-31 | 2009-07-14 | Fay Hua | Low temperature solder metallurgy and process for packaging applications and structures formed thereby |
JP2011198777A (ja) * | 2008-06-12 | 2011-10-06 | Nihon Superior Co Ltd | はんだ接合方法及びはんだ継手 |
JP2010109032A (ja) * | 2008-10-29 | 2010-05-13 | Fujitsu Microelectronics Ltd | 半導体装置の製造方法 |
US8339161B2 (en) * | 2009-07-07 | 2012-12-25 | Analog Devices, Inc. | High performance voltage buffers with distortion cancellation |
KR101660787B1 (ko) * | 2009-09-23 | 2016-10-11 | 삼성전자주식회사 | 솔더 볼 접합 방법 및 메모리 모듈 리페어 방법 |
US10625378B2 (en) * | 2010-04-23 | 2020-04-21 | Iowa State University Research Foundation, Inc. | Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder |
US8580607B2 (en) * | 2010-07-27 | 2013-11-12 | Tessera, Inc. | Microelectronic packages with nanoparticle joining |
TW201210733A (en) * | 2010-08-26 | 2012-03-16 | Dynajoin Corp | Variable melting point solders |
US20120069528A1 (en) * | 2010-09-17 | 2012-03-22 | Irvine Sensors Corporation | Method for Control of Solder Collapse in Stacked Microelectronic Structure |
US8558374B2 (en) * | 2011-02-08 | 2013-10-15 | Endicott Interconnect Technologies, Inc. | Electronic package with thermal interposer and method of making same |
JP5146627B2 (ja) * | 2011-02-15 | 2013-02-20 | 株式会社村田製作所 | 多層配線基板およびその製造方法 |
JP5658088B2 (ja) * | 2011-05-23 | 2015-01-21 | パナソニックIpマネジメント株式会社 | 半導体パッケージ部品の実装構造体および製造方法 |
JP2013080844A (ja) * | 2011-10-04 | 2013-05-02 | Fujitsu Ltd | 基板モジュールの製造方法、基板モジュール及び基板モジュール組立体 |
EP2874780B1 (en) * | 2012-07-18 | 2019-05-15 | Lumileds Holding B.V. | Method of soldering an electronic component with a high lateral accuracy |
US9005330B2 (en) * | 2012-08-09 | 2015-04-14 | Ormet Circuits, Inc. | Electrically conductive compositions comprising non-eutectic solder alloys |
WO2014053066A1 (en) * | 2012-10-04 | 2014-04-10 | Celestica International Inc. | Solder alloy for low-temperature processing |
US20140151096A1 (en) * | 2012-12-04 | 2014-06-05 | Hongjin Jiang | Low temperature/high temperature solder hybrid solder interconnects |
US20160234945A1 (en) * | 2013-09-20 | 2016-08-11 | Sumitomo Metal Mining Co., Ltd. | Bi-BASED SOLDER ALLOY, METHOD OF BONDING ELECTRONIC COMPONENT USING THE SAME, AND ELECTRONIC COMPONENT-MOUNTED BOARD |
US10253395B2 (en) * | 2015-10-27 | 2019-04-09 | Tdk Corporation | Electronic circuit module component |
-
2013
- 2013-03-15 KR KR1020147026343A patent/KR102087004B1/ko active IP Right Grant
- 2013-03-15 EP EP13764662.6A patent/EP2834037A4/en not_active Withdrawn
- 2013-03-15 JP JP2015501809A patent/JP6251235B2/ja active Active
- 2013-03-15 CN CN201380015592.8A patent/CN104203490B/zh active Active
- 2013-03-15 IN IN7833DEN2014 patent/IN2014DN07833A/en unknown
- 2013-03-15 WO PCT/US2013/032137 patent/WO2013142335A1/en active Application Filing
- 2013-03-15 US US14/386,601 patent/US9801285B2/en active Active
-
2017
- 2017-09-27 US US15/716,963 patent/US20180020554A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1154656A (ja) * | 1997-07-31 | 1999-02-26 | Nec Corp | 半田バンプ電極の製造方法及び半田バンプ電極 |
JP2002043466A (ja) * | 2000-07-26 | 2002-02-08 | Denso Corp | ボールグリッドアレイパッケージ |
JP2007088293A (ja) * | 2005-09-22 | 2007-04-05 | Fujitsu Ltd | 基板の反り低減構造および基板の反り低減方法 |
JP2009277777A (ja) * | 2008-05-13 | 2009-11-26 | Tamura Seisakusho Co Ltd | はんだボール搭載方法及び電子部品実装用部材 |
WO2010061428A1 (ja) * | 2008-11-28 | 2010-06-03 | 富士通株式会社 | 電子装置の製造方法、電子部品搭載用基板及びその製造方法 |
JP2012023667A (ja) * | 2010-07-16 | 2012-02-02 | Panasonic Corp | 固体撮像装置 |
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CN104203490B (zh) | 2018-04-24 |
US20150078810A1 (en) | 2015-03-19 |
US20180020554A1 (en) | 2018-01-18 |
EP2834037A4 (en) | 2016-03-16 |
WO2013142335A1 (en) | 2013-09-26 |
CN104203490A (zh) | 2014-12-10 |
JP6251235B2 (ja) | 2017-12-20 |
KR20140138755A (ko) | 2014-12-04 |
US9801285B2 (en) | 2017-10-24 |
IN2014DN07833A (ja) | 2015-04-24 |
EP2834037A1 (en) | 2015-02-11 |
KR102087004B1 (ko) | 2020-03-10 |
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