IN2014DN07833A - - Google Patents
Info
- Publication number
- IN2014DN07833A IN2014DN07833A IN7833DEN2014A IN2014DN07833A IN 2014DN07833 A IN2014DN07833 A IN 2014DN07833A IN 7833DEN2014 A IN7833DEN2014 A IN 7833DEN2014A IN 2014DN07833 A IN2014DN07833 A IN 2014DN07833A
- Authority
- IN
- India
- Prior art keywords
- solder paste
- solder
- low temperature
- electronic substrate
- temperature
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A method of assembling components such as electronic components onto a substrate such as an electronic substrate includes applying solder paste to an electronic substrate to form a solder paste deposit placing a low temperature preform in the solder paste deposit processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261613233P | 2012-03-20 | 2012-03-20 | |
PCT/US2013/032137 WO2013142335A1 (en) | 2012-03-20 | 2013-03-15 | Solder preforms and solder alloy assembly methods |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DN07833A true IN2014DN07833A (en) | 2015-04-24 |
Family
ID=49223257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN7833DEN2014 IN2014DN07833A (en) | 2012-03-20 | 2013-03-15 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9801285B2 (en) |
EP (1) | EP2834037A4 (en) |
JP (1) | JP6251235B2 (en) |
KR (1) | KR102087004B1 (en) |
CN (1) | CN104203490B (en) |
IN (1) | IN2014DN07833A (en) |
WO (1) | WO2013142335A1 (en) |
Families Citing this family (14)
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US10431564B2 (en) | 2014-01-27 | 2019-10-01 | Mediatek Inc. | Structure and formation method of chip package structure |
CN104625463A (en) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | Method for producing antioxidative tin bar |
CN104889594B (en) * | 2015-06-08 | 2017-07-11 | 哈尔滨工业大学 | Low temperature ultrasonic SnBi base solders and preparation method thereof, and its ultrasonic brazing ceramics and/or ceramic matric composite method |
WO2017136951A1 (en) * | 2016-02-11 | 2017-08-17 | Celestica International Inc. | Thermal treatment for preconditioning or restoration of a solder joint |
GB2557439B (en) | 2016-10-24 | 2021-06-30 | Jaguar Land Rover Ltd | Apparatus and method relating to electrochemical migration |
DE102018116410A1 (en) * | 2018-07-06 | 2020-01-09 | Endress+Hauser SE+Co. KG | Process for producing a high-temperature-resistant lead-free solder connection and high-temperature-resistant lead-free solder connection |
KR20220011695A (en) * | 2019-05-23 | 2022-01-28 | 알파 어셈블리 솔루션스 인크. | Solder paste for the manufacture of modules in solar cells |
US11310950B2 (en) | 2019-10-22 | 2022-04-19 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
US11278977B2 (en) | 2019-10-22 | 2022-03-22 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
DE102019129971A1 (en) * | 2019-11-06 | 2021-05-06 | Endress+Hauser SE+Co. KG | Method for soldering a component onto a printed circuit board, electronic unit and field device in automation technology |
DE102020129831A1 (en) | 2020-11-12 | 2022-05-12 | Endress+Hauser SE+Co. KG | Process for soldering a component onto a surface of a first printed circuit board |
WO2022153631A1 (en) * | 2021-01-14 | 2022-07-21 | 凸版印刷株式会社 | Card-type medium and card-type medium manufacturing method |
DE102021103360A1 (en) | 2021-02-05 | 2022-08-11 | Few Fahrzeugelektrik Werk Gmbh & Co. Kg | Method of making a pre-tinning assembly and such pre-tinning assembly |
CN117712035B (en) * | 2024-02-06 | 2024-04-30 | 苏州锐杰微科技集团有限公司 | Composite welding spot low-temperature interconnection method for solving substrate warpage problem |
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-
2013
- 2013-03-15 IN IN7833DEN2014 patent/IN2014DN07833A/en unknown
- 2013-03-15 WO PCT/US2013/032137 patent/WO2013142335A1/en active Application Filing
- 2013-03-15 CN CN201380015592.8A patent/CN104203490B/en active Active
- 2013-03-15 KR KR1020147026343A patent/KR102087004B1/en active IP Right Grant
- 2013-03-15 EP EP13764662.6A patent/EP2834037A4/en not_active Withdrawn
- 2013-03-15 US US14/386,601 patent/US9801285B2/en active Active
- 2013-03-15 JP JP2015501809A patent/JP6251235B2/en active Active
-
2017
- 2017-09-27 US US15/716,963 patent/US20180020554A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2015514316A (en) | 2015-05-18 |
US20180020554A1 (en) | 2018-01-18 |
JP6251235B2 (en) | 2017-12-20 |
EP2834037A1 (en) | 2015-02-11 |
CN104203490B (en) | 2018-04-24 |
US9801285B2 (en) | 2017-10-24 |
KR102087004B1 (en) | 2020-03-10 |
CN104203490A (en) | 2014-12-10 |
KR20140138755A (en) | 2014-12-04 |
WO2013142335A1 (en) | 2013-09-26 |
EP2834037A4 (en) | 2016-03-16 |
US20150078810A1 (en) | 2015-03-19 |
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