IN2014DN07833A - - Google Patents
Info
- Publication number
- IN2014DN07833A IN2014DN07833A IN7833DEN2014A IN2014DN07833A IN 2014DN07833 A IN2014DN07833 A IN 2014DN07833A IN 7833DEN2014 A IN7833DEN2014 A IN 7833DEN2014A IN 2014DN07833 A IN2014DN07833 A IN 2014DN07833A
- Authority
- IN
- India
- Prior art keywords
- solder paste
- solder
- low temperature
- electronic substrate
- temperature
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261613233P | 2012-03-20 | 2012-03-20 | |
PCT/US2013/032137 WO2013142335A1 (en) | 2012-03-20 | 2013-03-15 | Solder preforms and solder alloy assembly methods |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DN07833A true IN2014DN07833A (zh) | 2015-04-24 |
Family
ID=49223257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN7833DEN2014 IN2014DN07833A (zh) | 2012-03-20 | 2013-03-15 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9801285B2 (zh) |
EP (1) | EP2834037A4 (zh) |
JP (1) | JP6251235B2 (zh) |
KR (1) | KR102087004B1 (zh) |
CN (1) | CN104203490B (zh) |
IN (1) | IN2014DN07833A (zh) |
WO (1) | WO2013142335A1 (zh) |
Families Citing this family (14)
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US10431564B2 (en) * | 2014-01-27 | 2019-10-01 | Mediatek Inc. | Structure and formation method of chip package structure |
CN104625463A (zh) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | 一种抗氧化锡棒的生产方法 |
CN104889594B (zh) * | 2015-06-08 | 2017-07-11 | 哈尔滨工业大学 | 低温超声SnBi基钎料及其制备方法,及其超声钎焊陶瓷和/或陶瓷基复合材料的方法 |
CA3014085A1 (en) * | 2016-02-11 | 2017-08-17 | Celestica International Inc. | Thermal treatment for preconditioning or restoration of a solder joint |
GB2557439B (en) | 2016-10-24 | 2021-06-30 | Jaguar Land Rover Ltd | Apparatus and method relating to electrochemical migration |
DE102018116410A1 (de) * | 2018-07-06 | 2020-01-09 | Endress+Hauser SE+Co. KG | Verfahren zur Herstellung einer hochtemperaturfesten bleifreien Lotverbindung und hochtemperaturfeste bleifreie Lotverbindung |
WO2020233839A1 (en) * | 2019-05-23 | 2020-11-26 | Alpha Assembly Solutions Inc. | Solder paste for module fabrication of solar cells |
US11278977B2 (en) | 2019-10-22 | 2022-03-22 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
US11310950B2 (en) | 2019-10-22 | 2022-04-19 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
DE102019129971A1 (de) * | 2019-11-06 | 2021-05-06 | Endress+Hauser SE+Co. KG | Verfahren zum Auflöten eines Bauelements auf eine Leiterplatte, Elektronikeinheit und Feldgerät der Automatisierungstechnik |
DE102020129831A1 (de) | 2020-11-12 | 2022-05-12 | Endress+Hauser SE+Co. KG | Verfahren zum Auflöten eines Bauelements auf eine Oberfläche einer ersten Leiterplatte |
EP4280104A1 (en) * | 2021-01-14 | 2023-11-22 | Toppan Inc. | Card-type medium and card-type medium manufacturing method |
DE102021103360A1 (de) | 2021-02-05 | 2022-08-11 | Few Fahrzeugelektrik Werk Gmbh & Co. Kg | Verfahren zur Herstellung einer Vorverzinnungsanordnung und derartige Vorverzinnungsanordnung |
CN117712035B (zh) * | 2024-02-06 | 2024-04-30 | 苏州锐杰微科技集团有限公司 | 一种用于解决基板翘曲问题的复合焊点低温互连方法 |
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WO2015041018A1 (ja) * | 2013-09-20 | 2015-03-26 | 住友金属鉱山株式会社 | Bi基はんだ合金、並びにそれを用いた電子部品のボンディング方法および電子部品実装基板 |
US10253395B2 (en) * | 2015-10-27 | 2019-04-09 | Tdk Corporation | Electronic circuit module component |
-
2013
- 2013-03-15 US US14/386,601 patent/US9801285B2/en active Active
- 2013-03-15 WO PCT/US2013/032137 patent/WO2013142335A1/en active Application Filing
- 2013-03-15 EP EP13764662.6A patent/EP2834037A4/en not_active Withdrawn
- 2013-03-15 CN CN201380015592.8A patent/CN104203490B/zh active Active
- 2013-03-15 KR KR1020147026343A patent/KR102087004B1/ko active IP Right Grant
- 2013-03-15 JP JP2015501809A patent/JP6251235B2/ja active Active
- 2013-03-15 IN IN7833DEN2014 patent/IN2014DN07833A/en unknown
-
2017
- 2017-09-27 US US15/716,963 patent/US20180020554A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2015514316A (ja) | 2015-05-18 |
US20180020554A1 (en) | 2018-01-18 |
CN104203490A (zh) | 2014-12-10 |
EP2834037A1 (en) | 2015-02-11 |
KR20140138755A (ko) | 2014-12-04 |
US9801285B2 (en) | 2017-10-24 |
CN104203490B (zh) | 2018-04-24 |
US20150078810A1 (en) | 2015-03-19 |
JP6251235B2 (ja) | 2017-12-20 |
WO2013142335A1 (en) | 2013-09-26 |
KR102087004B1 (ko) | 2020-03-10 |
EP2834037A4 (en) | 2016-03-16 |
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