CN104159701B - 助焊剂、焊料组合物和电子电路安装基板的制造方法 - Google Patents
助焊剂、焊料组合物和电子电路安装基板的制造方法 Download PDFInfo
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- CN104159701B CN104159701B CN201380013308.3A CN201380013308A CN104159701B CN 104159701 B CN104159701 B CN 104159701B CN 201380013308 A CN201380013308 A CN 201380013308A CN 104159701 B CN104159701 B CN 104159701B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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| JP2012-054833 | 2012-03-12 | ||
| JP2012054833A JP5531188B2 (ja) | 2012-03-12 | 2012-03-12 | フラックス、はんだ組成物および電子回路実装基板の製造方法 |
| PCT/JP2013/056660 WO2013137200A1 (ja) | 2012-03-12 | 2013-03-11 | フラックス、はんだ組成物及び電子回路実装基板の製造方法 |
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| CN104159701B true CN104159701B (zh) | 2017-03-01 |
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| US (1) | US9609762B2 (palace) |
| EP (1) | EP2826589B1 (palace) |
| JP (1) | JP5531188B2 (palace) |
| KR (1) | KR102013759B1 (palace) |
| CN (1) | CN104159701B (palace) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP3034230B1 (en) * | 2013-08-12 | 2018-04-18 | Senju Metal Industry Co., Ltd | Flux, solder paste and soldered joint |
| JP6342208B2 (ja) * | 2014-04-28 | 2018-06-13 | 株式会社タムラ製作所 | はんだ付け用フラックス組成物およびそれを用いた電子基板 |
| CN104476007B (zh) * | 2014-12-17 | 2015-10-28 | 东莞永安科技有限公司 | 一种高熔点无铅无卤焊锡膏及其制备方法 |
| KR102365812B1 (ko) * | 2014-12-25 | 2022-02-21 | 주식회사 쿠라레 | 변성 액상 디엔계 고무 및 그 변성 액상 디엔계 고무를 함유하는 수지 조성물 |
| TWI713498B (zh) | 2015-03-24 | 2020-12-21 | 美商羅門哈斯公司 | 核-殼水性乳膠 |
| JP6310893B2 (ja) * | 2015-09-30 | 2018-04-11 | 株式会社タムラ製作所 | フラックス組成物、はんだ組成物、および電子基板の製造方法 |
| JP6268507B1 (ja) | 2017-06-07 | 2018-01-31 | 千住金属工業株式会社 | やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ、及びフラックスコートはんだ |
| JP6635986B2 (ja) * | 2017-07-12 | 2020-01-29 | 株式会社タムラ製作所 | はんだ組成物および電子基板 |
| JP6477842B1 (ja) * | 2017-11-24 | 2019-03-06 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JP6540788B1 (ja) * | 2017-12-29 | 2019-07-10 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JP6540789B1 (ja) * | 2017-12-29 | 2019-07-10 | 千住金属工業株式会社 | 樹脂組成物及びはんだ付け用フラックス |
| TWI817980B (zh) * | 2018-01-16 | 2023-10-11 | 日商千住金屬工業股份有限公司 | 助焊劑及焊膏 |
| JP6544498B1 (ja) * | 2019-01-15 | 2019-07-17 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JP6540833B1 (ja) * | 2018-01-17 | 2019-07-10 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| KR20210031870A (ko) * | 2018-08-10 | 2021-03-23 | 가부시키가이샤 코키 | 플럭스 및 솔더 페이스트 |
| US11618109B2 (en) * | 2020-06-30 | 2023-04-04 | Electronics And Telecommunications Research Institute | Wire for electric bonding |
| CN118417761A (zh) * | 2024-05-09 | 2024-08-02 | 北京达博长城锡焊料有限公司 | 5g通讯线束焊接用锡丝助焊剂及其制备方法和锡丝 |
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- 2013-03-11 WO PCT/JP2013/056660 patent/WO2013137200A1/ja active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2013137200A1 (ja) | 2013-09-19 |
| US9609762B2 (en) | 2017-03-28 |
| KR20140133512A (ko) | 2014-11-19 |
| US20150102090A1 (en) | 2015-04-16 |
| EP2826589A1 (en) | 2015-01-21 |
| EP2826589B1 (en) | 2017-05-31 |
| JP2013188761A (ja) | 2013-09-26 |
| KR102013759B1 (ko) | 2019-08-23 |
| CN104159701A (zh) | 2014-11-19 |
| JP5531188B2 (ja) | 2014-06-25 |
| EP2826589A4 (en) | 2016-04-20 |
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