CN104137335A - Rfid天线模块和方法 - Google Patents

Rfid天线模块和方法 Download PDF

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Publication number
CN104137335A
CN104137335A CN201380008129.0A CN201380008129A CN104137335A CN 104137335 A CN104137335 A CN 104137335A CN 201380008129 A CN201380008129 A CN 201380008129A CN 104137335 A CN104137335 A CN 104137335A
Authority
CN
China
Prior art keywords
antenna
chip
module
substrate
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380008129.0A
Other languages
English (en)
Chinese (zh)
Inventor
大卫·芬恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feinics Amatech Teoranta Ltd
Original Assignee
Feinics Amatech Teoranta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2012/066183 external-priority patent/WO2013034426A1/en
Application filed by Feinics Amatech Teoranta Ltd filed Critical Feinics Amatech Teoranta Ltd
Publication of CN104137335A publication Critical patent/CN104137335A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
CN201380008129.0A 2012-02-05 2013-02-05 Rfid天线模块和方法 Pending CN104137335A (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201261595088P 2012-02-05 2012-02-05
US61/595,088 2012-02-05
EPPCT/EP2012/066183 2012-08-20
PCT/EP2012/066183 WO2013034426A1 (en) 2011-09-11 2012-08-20 Rfid antenna modules and methods of making
US201261693262P 2012-08-25 2012-08-25
US61/693,262 2012-08-25
US201261704624P 2012-09-24 2012-09-24
US61/704,624 2012-09-24
PCT/EP2013/052200 WO2013113945A1 (en) 2012-02-05 2013-02-05 Rfid antenna modules and methods

Publications (1)

Publication Number Publication Date
CN104137335A true CN104137335A (zh) 2014-11-05

Family

ID=48904432

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380008129.0A Pending CN104137335A (zh) 2012-02-05 2013-02-05 Rfid天线模块和方法

Country Status (8)

Country Link
JP (1) JP2015511353A (hu)
KR (1) KR20140123562A (hu)
CN (1) CN104137335A (hu)
AU (1) AU2013214133A1 (hu)
BR (1) BR112014019291A8 (hu)
CA (1) CA2860936A1 (hu)
MX (1) MX2014009459A (hu)
WO (1) WO2013113945A1 (hu)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104866895A (zh) * 2015-06-11 2015-08-26 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN104881701A (zh) * 2015-06-11 2015-09-02 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN105808000A (zh) * 2016-03-10 2016-07-27 昆山维信诺科技有限公司 Oled显示装置及制作方法
CN107423802A (zh) * 2016-04-12 2017-12-01 英飞凌科技股份有限公司 芯片卡和用于制造芯片卡的方法
CN107546181A (zh) * 2017-08-18 2018-01-05 华进半导体封装先导技术研发中心有限公司 雷达组件封装体
CN109417220A (zh) * 2016-07-27 2019-03-01 英特尔公司 具有可拆离式天线支持的可穿戴电子设备
US11005180B2 (en) 2016-03-10 2021-05-11 Suzhou Qingyue Optoelectronics Technology Co., Ltd. Display device having NFC communication function

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EP2840530A1 (fr) * 2013-08-23 2015-02-25 Gemalto SA Dispositif électronique à mémoire
FR3013483B1 (fr) * 2013-11-15 2015-12-25 Oberthur Technologies Procede de fabrication d'un dispositif radiofrequence et carte rfid associee
FR3024000B1 (fr) * 2014-07-15 2018-04-06 Oberthur Technologies Entite electronique rfid a condensateur rapporte
KR101892689B1 (ko) * 2014-10-14 2018-08-28 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
JP2016212778A (ja) * 2015-05-13 2016-12-15 凸版印刷株式会社 デュアルインターフェース通信媒体
JP2018097724A (ja) * 2016-12-15 2018-06-21 凸版印刷株式会社 Ｉｃモジュール、およびｉｃモジュールを搭載した媒体
CN107275304A (zh) * 2017-06-28 2017-10-20 山东齐芯微系统科技股份有限公司 Fcos条带引线键合工艺
US11108156B2 (en) * 2017-09-27 2021-08-31 Intel Corporation Differential on-chip loop antenna
JP2020136391A (ja) * 2019-02-15 2020-08-31 株式会社村田製作所 巻線型インダクタ部品
JP6801739B2 (ja) * 2019-04-18 2020-12-16 株式会社村田製作所 アンテナモジュール及び通信装置

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US6424301B1 (en) * 2000-03-01 2002-07-23 Siemens Vdo Automotive Corporation Combination battery holder and antenna for keyfob
US20090315320A1 (en) * 2006-09-26 2009-12-24 Advanced Microelectronic And Automation Technology Ltd. Inlays for security documents
CN101946254A (zh) * 2008-02-22 2011-01-12 凸版印刷株式会社 应答器及册子体
WO2011129347A1 (ja) * 2010-04-13 2011-10-20 日立金属株式会社 三軸アンテナ及びそれに用いるコア組立体

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US6424301B1 (en) * 2000-03-01 2002-07-23 Siemens Vdo Automotive Corporation Combination battery holder and antenna for keyfob
US20090315320A1 (en) * 2006-09-26 2009-12-24 Advanced Microelectronic And Automation Technology Ltd. Inlays for security documents
CN101946254A (zh) * 2008-02-22 2011-01-12 凸版印刷株式会社 应答器及册子体
WO2011129347A1 (ja) * 2010-04-13 2011-10-20 日立金属株式会社 三軸アンテナ及びそれに用いるコア組立体

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104866895A (zh) * 2015-06-11 2015-08-26 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN104881701A (zh) * 2015-06-11 2015-09-02 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN105808000A (zh) * 2016-03-10 2016-07-27 昆山维信诺科技有限公司 Oled显示装置及制作方法
US11005180B2 (en) 2016-03-10 2021-05-11 Suzhou Qingyue Optoelectronics Technology Co., Ltd. Display device having NFC communication function
CN107423802A (zh) * 2016-04-12 2017-12-01 英飞凌科技股份有限公司 芯片卡和用于制造芯片卡的方法
CN109417220A (zh) * 2016-07-27 2019-03-01 英特尔公司 具有可拆离式天线支持的可穿戴电子设备
CN109417220B (zh) * 2016-07-27 2021-03-12 英特尔公司 具有可拆离式天线支持的可穿戴电子设备
CN107546181A (zh) * 2017-08-18 2018-01-05 华进半导体封装先导技术研发中心有限公司 雷达组件封装体

Also Published As

Publication number Publication date
CA2860936A1 (en) 2013-08-08
WO2013113945A1 (en) 2013-08-08
JP2015511353A (ja) 2015-04-16
MX2014009459A (es) 2015-06-05
AU2013214133A1 (en) 2014-07-31
KR20140123562A (ko) 2014-10-22
BR112014019291A8 (pt) 2017-07-11
BR112014019291A2 (hu) 2017-06-20

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Application publication date: 20141105