AU2013214133A1 - RFID antenna modules and methods - Google Patents

RFID antenna modules and methods Download PDF

Info

Publication number
AU2013214133A1
AU2013214133A1 AU2013214133A AU2013214133A AU2013214133A1 AU 2013214133 A1 AU2013214133 A1 AU 2013214133A1 AU 2013214133 A AU2013214133 A AU 2013214133A AU 2013214133 A AU2013214133 A AU 2013214133A AU 2013214133 A1 AU2013214133 A1 AU 2013214133A1
Authority
AU
Australia
Prior art keywords
antenna
module
chip
substrate
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2013214133A
Other languages
English (en)
Inventor
David Finn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feinics Amatech Teoranta Ltd
Original Assignee
Feinics Amatech Teoranta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2012/066183 external-priority patent/WO2013034426A1/en
Application filed by Feinics Amatech Teoranta Ltd filed Critical Feinics Amatech Teoranta Ltd
Publication of AU2013214133A1 publication Critical patent/AU2013214133A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
AU2013214133A 2012-02-05 2013-02-05 RFID antenna modules and methods Abandoned AU2013214133A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201261595088P 2012-02-05 2012-02-05
US61/595,088 2012-02-05
PCT/EP2012/066183 WO2013034426A1 (en) 2011-09-11 2012-08-20 Rfid antenna modules and methods of making
AUPCT/EP2012/066183 2012-08-20
US201261693262P 2012-08-25 2012-08-25
US61/693,262 2012-08-25
US201261704624P 2012-09-24 2012-09-24
US61/704,624 2012-09-24
PCT/EP2013/052200 WO2013113945A1 (en) 2012-02-05 2013-02-05 Rfid antenna modules and methods

Publications (1)

Publication Number Publication Date
AU2013214133A1 true AU2013214133A1 (en) 2014-07-31

Family

ID=48904432

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2013214133A Abandoned AU2013214133A1 (en) 2012-02-05 2013-02-05 RFID antenna modules and methods

Country Status (8)

Country Link
JP (1) JP2015511353A (hu)
KR (1) KR20140123562A (hu)
CN (1) CN104137335A (hu)
AU (1) AU2013214133A1 (hu)
BR (1) BR112014019291A8 (hu)
CA (1) CA2860936A1 (hu)
MX (1) MX2014009459A (hu)
WO (1) WO2013113945A1 (hu)

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EP2840530A1 (fr) * 2013-08-23 2015-02-25 Gemalto SA Dispositif électronique à mémoire
FR3013483B1 (fr) * 2013-11-15 2015-12-25 Oberthur Technologies Procede de fabrication d'un dispositif radiofrequence et carte rfid associee
FR3024000B1 (fr) * 2014-07-15 2018-04-06 Oberthur Technologies Entite electronique rfid a condensateur rapporte
KR101892689B1 (ko) * 2014-10-14 2018-08-28 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
JP2016212778A (ja) * 2015-05-13 2016-12-15 凸版印刷株式会社 デュアルインターフェース通信媒体
CN104866895A (zh) * 2015-06-11 2015-08-26 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN104881701B (zh) * 2015-06-11 2018-11-23 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN105808000B (zh) * 2016-03-10 2018-12-07 昆山维信诺科技有限公司 Oled显示装置及制作方法
EP3428769A4 (en) 2016-03-10 2019-03-13 Kunshan Visionox Technology Co., Ltd. DISPLAY DEVICE WITH NFC COMMUNICATION FUNCTION
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
US10236564B2 (en) * 2016-07-27 2019-03-19 Intel Corporation Wearable electronic device with detachable antenna support
JP2018097724A (ja) * 2016-12-15 2018-06-21 凸版印刷株式会社 Ｉｃモジュール、およびｉｃモジュールを搭載した媒体
CN107275304A (zh) * 2017-06-28 2017-10-20 山东齐芯微系统科技股份有限公司 Fcos条带引线键合工艺
CN107546181B (zh) * 2017-08-18 2019-07-05 华进半导体封装先导技术研发中心有限公司 雷达组件封装体
US11108156B2 (en) * 2017-09-27 2021-08-31 Intel Corporation Differential on-chip loop antenna
JP2020136391A (ja) * 2019-02-15 2020-08-31 株式会社村田製作所 巻線型インダクタ部品
JP6801739B2 (ja) * 2019-04-18 2020-12-16 株式会社村田製作所 アンテナモジュール及び通信装置

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WO1991000603A1 (fr) 1989-07-03 1991-01-10 Sokymat Sa Procede de fabrication de composants electroniques comportant un bobinage en fil fin, et dispositif de maintien du fil de bobinage permettant une fabrication selon ce procede
DE3935364C1 (hu) 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De
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Also Published As

Publication number Publication date
MX2014009459A (es) 2015-06-05
BR112014019291A2 (hu) 2017-06-20
KR20140123562A (ko) 2014-10-22
JP2015511353A (ja) 2015-04-16
WO2013113945A1 (en) 2013-08-08
BR112014019291A8 (pt) 2017-07-11
CN104137335A (zh) 2014-11-05
CA2860936A1 (en) 2013-08-08

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Legal Events

Date Code Title Description
MK1 Application lapsed section 142(2)(a) - no request for examination in relevant period