CN104137335A - Rfid antenna modules and methods - Google Patents

Rfid antenna modules and methods Download PDF

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Publication number
CN104137335A
CN104137335A CN201380008129.0A CN201380008129A CN104137335A CN 104137335 A CN104137335 A CN 104137335A CN 201380008129 A CN201380008129 A CN 201380008129A CN 104137335 A CN104137335 A CN 104137335A
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CN
China
Prior art keywords
antenna
chip
module
substrate
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380008129.0A
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Chinese (zh)
Inventor
大卫·芬恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feinics Amatech Teoranta Ltd
Original Assignee
Feinics Amatech Teoranta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2012/066183 external-priority patent/WO2013034426A1/en
Application filed by Feinics Amatech Teoranta Ltd filed Critical Feinics Amatech Teoranta Ltd
Publication of CN104137335A publication Critical patent/CN104137335A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

An RFID chip (CM) is flip-chip mounted and connected to a surface of a substrate (MT), such as for a 6- pad ISO smart card antenna module (AM). A winding core (WC) for an antenna (MA) stiffens, stabilizes and planarizes substrate (MT) to enhance reliability of the connections. The flip-chip antenna module (FCAM) interfaces with a contactless reader. Contact pads (CP) on the opposite side of the substrate (MT) provide a contact interface. Also disclosed is first forming an antenna (MA) on an antenna substrate (AS), then joining it to the module substrate (MT). Such an antenna may be an embedded wire, or an etched metal layer.

Description

RFID Anneta module and method
Technical field
The present invention relates to " secure file ", for example E-Passport, electronics ID card and smart card (data medium), this secure file has RFID (radio-frequency (RF) identification) chip or chip module (CM) and operates with " noncontact " pattern (ISO 14443), this secure file comprises also can be with double nip (DI or the DIF) card of contact mode (ISO 7816-2) operation, and more specifically, relate to and improve the coupling between parts in smart card, for example improve the module antenna (MA) that is connected with RFID chip (CM) and in the card (CB) of smart card and and module antenna (MA) respond to the coupling between the gain antenna (BA) being coupled, thereby improve the mutual of RFID chip (CM) and external RF ID reader thereupon.
Background technology
For the object of this discussion, RFID transponder generally includes substrate, is laid in RFID chip or the chip module (CM) in substrate or in substrate and is laid in the antenna in this substrate or in this substrate.This transponder can form the basis of secure file (for example E-Passport, smart card or national ID card), and it also can be called as " data medium ".Chip (CM) also can be called as integrated circuit (IC).
RFID chip (CM) can only for example, operate with noncontact (contactless) pattern (ISO 14443), or can be also can for example, with double nip (DI, the DIF) chip module (CM) of contact mode (ISO 7816-2) and noncontact mode operation.The RF signal that RFID chip (CM) can provide from the external RF ID reader device by communicating with, obtain energy.Chip module (CM) can be lead frame type chip module or expoxy glass cake core module.Expoxy glass module can be used perforation to electroplate and be metallized on a side (contact side) or both sides, to promote and the interconnection of antenna.
The substrate that can be called as " inlay (inlay) substrate " (for example, for E-Passport) or " card " (for example, for smart card) can comprise one or more material layers, for example polyvinyl chloride (PVC), Merlon (PC), polyethylene (PE), PET (PE of doping), PET-G (derivative of PE), Teslin tM, paper or cotton/noil etc.
Can be called " card antenna " antenna (CA) and can use ultrasonic wave generator (ultrasonic tool) to be installed to inlay substrate, and be electrically connected with chip module (CM).For example, referring to US 6,698,089 and US 6,233,818, it is incorporated in this by reference.The typical pattern of card antenna (CA) is generally rectangle, to have the form of plane (two dimension) coil (helical) of multiturn number, is laid in the peripheral surrounding (or relevant portion of this substrate) of this substrate.For example, referring to US 7,980,477 (2011, Finn).
Module antenna (MA) can be integrated into the Anneta module (AM) that comprises RFID chip (CM) and module antenna (MA), instead of directly this RFID chip (CM) is electrically connected with card antenna (CA).For example, than card antenna (CA) (approximately 50mm × 80mm), this module antenna (MA) can be very little (for example approximately 15mm × 15mm).This module antenna (MA) can be coupled with card antenna (CA) induction, instead of electrical connection.In this case, card antenna (CA) can be called as gain antenna (BA).This gain antenna (BA) can comprise a part for the peripheral surrounding that is laid in card (CB), with the another part that can comprise coupling coil (CC), this coupling coil (CC) is laid in the interior zone of card (CB), for being coupled with described module antenna (MA) induction.Term card antenna (CA) and gain antenna (BA) can be used alternatingly at this.
US 20120038445 (2012, Fen En (Finn)) transponder and the gain antenna (BA) with Anneta module (AM) disclosed, this Anneta module (AM) has chip module (CM) and antenna (MA), this gain antenna (BA) have card of being laid in (CB) peripheral surrounding, there is outside and the internal antenna structure (D, E) of the form of planar coil.This Anneta module (AM) can be placed make its antenna (MA) only with described antenna structure in one or the second antenna structure overlapping, to respond to it coupling.
US 5,084, the title of 699 (1992, Trovan) is the impedance matching coil assembling (Impedance Matching Coil Assembly For An Inductively Coupled Transponder) of the transponder for responding to coupling.Attention directing Fig. 5.The coil assembling using in the transponder of inductive power supply comprises primary coil (156) and the secondary coil (158) around the same coil of formation ferrite bar (160).The lead-in wire (162) of this primary coil is left unsteady, and the lead-in wire of this secondary coil (164) is connected to the integrated identification circuit of transponder.
Title is that the US 5,955,723 (1999, Siemens) of contactless chip card (Contactless Chip Card) discloses data medium configuration, and it comprises semiconductor chip.Attention directing Fig. 1.The first conductor loop (2) is connected to semiconductor chip (1), and has at least one winding and size and be approximately the transverse cross-sectional area of the size of this semiconductor chip.At least one second conductor loop (3) have at least one winding, size be approximately described data medium configuration size transverse cross-sectional area and form size and be approximately the region of the 3rd loop (4) of the size of the first conductor loop (2).The first conductor loop (2) and at least one the second conductor loop (3) are responded to each other coupling by the 3rd loop (4).
US 6,378,774, (2002, relief printing plate (Toppan)) disclose and have comprised for the IC module of contactless transmission and the smart card of antenna.This IC module has contact function and contactless function.This IC module has the first coupling coil (8), and this antenna has the second coupling coil (3).The first coupling coil and the second coupling coil are made as mutually closely coupling by cloth, and are coupled with contactless state by transformer coupled.Show the variety of way that forms this first coupling coil (8).For example, in Figure 14, the first coupling coil (8) wound coil framework (17), this magazine (17) is provided around the sealing resin (16) of IC chip (6).
Title is for adjusting the US 7 of resonance frequency (Adjusting Resonance Frequency By Adjusting Distributed Inter-Turn Capacity) by adjusting distributed turn-to-turn capacity, 928,918 (2011, Jin Yatuo (Gemalto)) disclose the method for adjust the frequency tuning of resonant circuit with the wire turn with the regular spaces that generates spuious turn-to-turn capacity.
US 8,130,166 (2012, ASSA ABLOY (Assa Abloy)) disclose the coupling device and the smart card (Coupling Device For Transponder And Smart Card With Such Device) with this device for transponder.Attention directing Fig. 6.Coupling device is formed by continuous conductive path, this continuous conductive path has core (12) and two end portion (11,11 '), this core (12) is at least formed for the little helical with transponder device induction coupling, one of the each self-forming of described end portion (11,11 ') for the large helical of reader device induction coupling.
The title of US 2010/0176205 (2010, SPS) is the chip card (Chip Card With Dual Communication Interface) with double interface communication.Attention directing Fig. 4.Card (22) comprises for concentrating and/or amplifying electromagnetic device (18), this device (18) can guide received electromagnetic current, the particularly coil guiding towards the antenna (13) of microelectronic modules (11) from contactless chip card reader.Can comprise for concentrating and/or amplifying electromagnetic device (18) metallic plate that is laid in described card (22), is positioned at chamber (23) below that holds described microelectronic modules (11), or can comprise by being laid in described card (22), be positioned at the antenna that at least one coil of chamber (23) below that holds described microelectronic modules (11) forms.
Herein, below patent and publication be cited, and can " merged by reference ": CA 2,279,176 (1998, PAV); DE 39 35 364 (1990, ADE); DE 43 11 493 (2000, Ah agate Tyke (Amatech)); NL 9100347 (1992, ' Nedaplatin (Nedap) '); US 5,773,812 (1998, ADE); US 6,008,993 (1999, ADE); US 6,142,381 (2000, Finn etc.); US 6,190,942 (2001, " PAV "); US 6,095,423 (2000, Siemens (Siemens)); US 6,310,778 (2001, Finn etc.); US 6,406,935 (2002, ASK); US 6,719,206 (2004, On Track); US 7,320,738 (2008, FCI); US 8,100,337 (2012, " SPS "); US 2008/0283615 (2008, Finn); US 2008/0308641 (2008, Finn); US 2008/0314990 (2008, Si Maida (Smartrac)); US 20090057414; US 2002/0020903 (2002, ADE); US 20100283690 (2010, SPS); US 2011/0163167 (2011, SPS).
Summary of the invention
The object of this invention is to provide manufacturing for example, improvement technology for the Anneta module (AM) of secure file (smart card (SC)).
The winding magnetic core (WC) with tubular body portion (B) and two ends is installed to modular belt (MT) by one of its end, module antenna (MA) is around described winding magnetic core (WC), and chip (CM) is laid on the described modular belt (MT) in described winding magnetic core (WC).Arrange connecting line (wb), and dome packaging body (glob-top) (GT) is applied on this chip (CM), to fill fully the interior zone of described winding magnetic core (WC).Described module antenna (MA), winding magnetic core (WC) and chip (CM) can be injection molding (overmold) with mould piece (MM) subsequently.Winding magnetic core (WC) can have flange (F) at an end.
According to the embodiment of the present invention, can comprise for the Anneta module (AM) of smart card (SC): modular belt (MT); Chip (CM), is laid on the surface of described modular belt (MT); And module antenna (MA), be laid on the described surface of described modular belt (MT), and be connected with described chip (CM); It is characterized in that: supporting construction (DS, WC) be fixed (secure) to the described surface of described modular belt (MT), as the winding magnetic core for described module antenna (MA) and as the dam body (dam) that is used for the dome packaging body (GT) that covers described chip (CM); Wherein, described supporting construction (DS, WC) comprise tubular body portion (B), this tubular body portion (B) has two relative open end, one of them open end is fixed to the described surface of described modular belt (MT), and another open end is free end.Described supporting construction (WC) can have flange (F), and this flange (F) is laid in around the described free end of described main part (B).Described module antenna (MA) can be laid in the outside of described main part (B); And described chip (CM) can be laid on the inner modular belt (MT) of main part (B).At least one slit (S) can extend through main part (B), to allow at least one end of corresponding described module antenna (MA) outside inner through this main part (B) to main part (B) from main part (B).In described supporting construction inside, dome packaging body can at least cover described chip (CM).Mould piece (MM) can cover described chip (CM), described supporting construction (DS, WC) and described module antenna (MA).Contact pad (CP) can be laid on the contrary surface of described modular belt (MT), docks for contact.
Smart card (SC) can comprise the Anneta module (AM) being laid in card (CB), this smart card (SC) has gain antenna (BA) and is laid in the coupling coil (CC) of the interior zone of described card (CB), and this gain antenna (BA) has the exterior section around the periphery that is laid in described card (CB); Wherein, described Anneta module (AM) is laid in the interior zone of described card (CB), the induction coupling for described module antenna (MA) with described coupling coil (CC).Groove (R) can be provided in described card (CB), and this groove (R) is for holding described Anneta module (AM).At least a portion coupling coil (CC) can be embedded in this groove (R).
According to the embodiment of the present invention, the method for manufacture Anneta module (AM) can comprise: the tubular support structure (DS, WC) with two relative open end is sticked on the surface of described modular belt (MT); And be wound around the lead-in wire for module antenna (MA) around described tubular support structure (DS, WC).Described module antenna (MA) can use flying trident coiling (flyer winding) technology to be wound.Before being wound around lead-in wire around described supporting construction, the first end that is used to form the lead-in wire of described module antenna (MA) can be fixed to the first pin; And the first end portion of lead-in wire can be through the first joint sheet (BP) on described modular belt (MT).After described supporting construction is wound around lead-in wire, the second end portion of lead-in wire can be through the second joint sheet (BP) on described modular belt (MT); And the second end that is used to form the lead-in wire of described module antenna (MA) can be fixed to the second pin.The first end portion and the second end portion can be connected to the first joint sheet and the second joint sheet.
According to the embodiment of the present invention, the method for manufacture Anneta module (AM) can comprise: described module antenna (MA) is installed to modular belt (MT); Described modular belt (MT) is installed and be connected to chip (CM); Cover described chip (CM) and connecting line thereof with resin (GT); It is characterized in that: described module antenna (MA) being installed afterwards and being installed and connecting described chip (CM) afterwards, cover described chip (CM) and connecting line thereof by the interior zone resin (GT) with resin filling module antenna (MA).
Smart card (SC) can comprise card (CB) and Anneta module (AM).Card (CB) can have gain antenna (BA), and this gain antenna (BA) comprises the winding around the periphery that is laid in described card (CB) and is laid in the coupling coil (CC) of the interior zone of described card (CB).In the inside of coupling coil (CC), the Anneta module (AM) with module antenna (MA) can be laid in the groove of described card (CB), and can be coplanar with described coupling coil (CC) in fact, make module antenna (MA) and described coupling coil (CC) induction coupling (transformer coupled).
According to the embodiment of the present invention, can comprise for the Anneta module (AM) of smart card (SC): substrate (MT, 202,402); Chip (CM, 1010), is laid on the surface of described substrate (MT), and is connected (Fig. 9, Figure 10) with the lip-deep pad (1022) of described substrate (MT) in the mode of flip-chip; And antenna (MA, 230,430), be laid on the described surface of described substrate (MT), and be connected with described chip (CM); It is characterized in that: supporting construction (DS, WC, 220,420) is fixed to the described surface of described substrate (MT), as the winding magnetic core for described antenna (MA); Wherein, described supporting construction (DS, WC, 220,420) comprise tubular body portion (B), this tubular body portion (B) has two relative open end (220a/b, 420a/b), one of them open end is fixed to the described surface of described substrate (MT), and another open end is free end.
According to the embodiment of the present invention, the method for manufacture Anneta module (AM) can comprise: substrate (MT) is installed and joined to chip (CM) in the mode of flip-chip; It is characterized in that: the tubular support structure (DS, WC, 220,420) with two relative open end (220a/b, 410a/b) is sticked on the surface of described substrate (MT, 202,402); And be wound around the lead-in wire for antenna (MA) around described tubular support structure (DS, WC).Described substrate (MT) is being installed and joined to chip (CM) before, can be by electric conducting material (1014,1024) be applied at least one in the pad (1022) in projection (bump) (1012) and the described substrate (1020) on described chip (CM, 1010).Described electric conducting material can comprise nano silver wire.
According to the embodiment of the present invention, can comprise for the Anneta module (AM) of smart card (SC): module substrate (MT); And chip (CM), be laid on the surface of described module substrate (MT); It is characterized in that: it is upper that antenna (MA) is laid in antenna substrate (AS), and this antenna substrate (AS) separates with described module substrate (MT); Opening (OP) in described antenna substrate (AS), this opening (OP), in the time that described antenna substrate (AS) is incorporated into described module substrate (MT), holds this chip (CM).Described chip (CM) can be installed and be connected to module substrate (MT) in the mode of flip-chip.Described antenna (MA) can comprise the lead-in wire being embedded in described antenna substrate (AS), or can be gone out by the etching metal layer antenna substrate (AS), for example, by laser-induced thermal etching (ablation).
Brief description of the drawings
With detailed reference to disclosed execution mode, and with accompanying drawing (FIG), non-limiting example of the present invention is described.Accompanying drawing is the form of schematic diagram substantially.For clarity, can give prominence to some elements in figure, and omit other element.Some accompanying drawings can be the form of schematic diagram.Although be mainly to describe of the present inventionly under the background of various exemplary execution mode, should be understood that, be not intended to the present invention to be confined to these specific execution modes, and, can be by the single feature combination with one another of different execution modes.Any word (legend, annotation, Reference numeral etc.) occurring in accompanying drawing is incorporated herein by reference.
Fig. 1 is the viewgraph of cross-section of the part of double nip (DI) smart card (SC), it shows the have module antenna Anneta module (AM) of (MA) and outside " contact " and " contactless " reader device.
Figure 1A, 1B, 1C are the viewgraph of cross-section of some Anneta modules (AM).
Fig. 1 D illustrates the have Anneta module schematic diagram of smart card (SC) of (AM), and this Anneta module (AM) has the chip (CM) that is installed to modular belt (MT) in the mode of flip-chip.
Fig. 2 is the viewgraph of cross-section with the Anneta module (AM) of the module antenna (MA) being laid on dam structure (DS), and Fig. 2 A is the perspective view of this dam structure (DS).
Fig. 2 B, 2C are the plane graphs for the bottom surface of the modular belt of Anneta module (AM) (MT).
Fig. 3 is the perspective view for for example above form the technology of module antenna (MA) at the winding magnetic core (WC) of Anneta module (AM), and Fig. 3 A is the plane graph of this technology.
Fig. 4 is the viewgraph of cross-section that can be wound around the winding magnetic core (WC) of module antenna (MA) thereon.Fig. 4 A-4F is illustrated in the upper viewgraph of cross-section that forms the Anneta module (AM) with its module antenna (MA) of winding magnetic core (WC).
Fig. 5 is the exploded cross-sectional view that the Anneta module (AM) in the card (CB) that is installed in smart card (SC) is shown.
Fig. 6 A is the viewgraph of cross-section of the Anneta module (AM) with bilateral modular belt (MT), and this bilateral modular belt (MT) has the through hole and the opening that extend through described modular belt (MT).
Fig. 6 B is the schematic diagram illustrating for exemplary contact pad (CP) layout/layout of Anneta module (AM).
Fig. 7 is the viewgraph of cross-section that the module antenna (MA) with a coil is shown.
Fig. 7 A is the viewgraph of cross-section that the module antenna (MA) with two coils is shown.
Fig. 7 B is the schematic diagram that two coils of link block antenna (MA) are shown.
Fig. 7 C is the plane graph for the bottom surface of the modular belt of Anneta module (AM) (MT), and it shows the antenna structure (AS) with two antenna part (MA1, MA2).
Fig. 7 D is the diagrammatic view of antenna structure (AS).
Fig. 7 E is the schematic diagram of the dome packaging body on the chip (CM) that Anneta module (AM) is shown.
Fig. 7 F is the schematic diagram that illustrates that chip (CM) to Anneta module (AM) and module antenna (MA) carry out injection moulding.
Fig. 8 A is the end view with the chip module of Bonding IC.
Fig. 8 B is the end view with the chip module of suprabasil flip-chip.
Fig. 8 C is the end view with the substrate of antenna, and this substrate is for example for the chip module of Fig. 8 B.
Fig. 8 D is the schematic diagram of 8 shim pattern that contact for ISO 7816.
Fig. 8 E is the schematic diagram of 6 shim pattern that contact for ISO 7816.
Fig. 9 is the viewgraph of cross-section of flip-chip Anneta module (FCAM).
Figure 10 is the exploded cross-sectional view for chip is installed to the technology of substrate in the mode of flip-chip.
Figure 11 is the plane graph of antenna substrate (AS).
Figure 11 A is along passing through the obtained viewgraph of cross-section of line 11A-11A of Figure 11.
Embodiment
By the content that numerous embodiments is described illustrate that the present invention instructs, and described execution mode should be construed as illustrative but not determinate.Apart from contrary instruction, any size that propose herein and material or technique should be interpreted as be roughly property and exemplary.
In main contents below, can be used as the various features of invention disclosed herein and the example of execution mode is discussed taking the transponder of the form of secure file (its can as smart card or national ID card).Obviously, many features and execution mode can be applied to (being incorporated into easily) other forms of secure file, for example E-Passport.As used herein, any one in term " transponder ", " smart card ", " data medium " etc. can be interpreted as referring to similar any other device operating under ISO 14443 or similar RFID standard.The full content of following standard is incorporated in this by reference:
-ISO/IEC 14443 (identification card-contactless integrated circuit card-contactless card) is that definition is for the contactless card of identifying and the international standard that defines the host-host protocol for communicating by letter with this contactless card.
-ISO/IEC 7816 is international standards relevant with the electronic identification card with contact (particularly smart card).
Typical data medium described herein can comprise: (i) Anneta module (AM), it has RFID chip or chip module (CM) and module antenna (MA), (ii) card (CB) and (iii) gain antenna (BA), it is laid on card (CB), to strengthen the coupling between module antenna (MA) and the antenna of external RF ID " reader ".In the time mentioning " chip module " herein, apart from contrary clearly, should notice that it comprises " chip ", vice versa.Module antenna (MA) can comprise the conductive trace (trace) of lead-in wire coil, etching or printing in the modular belt for Anneta module (AM) (MT) substrate, or can be directly incorporated on chip self.
Spread all over various execution mode disclosed herein, except being otherwise noted specially (in other words, unless be left out), the element that is called as " CM " will be bare integrated circuit (IC) crystal grain (die) (or RFID chip) the most rightly, instead of chip module (having the crystal grain of carrier).On the other hand than, Fig. 8 A and Fig. 8 B have presented the example of " chip module " for example, particularly with the IC chip (" CM ") of installing and be connected to substrate.There is " chip module " (crystal grain and carrier) of installing and being connected to module antenna wherein (MA) and can be called as Anneta module (AM).
Gain antenna (BA) can form by lead-in wire being embedded in inlay substrate or card (CB).But, it should be understood that, antenna can utilize the technique except lead-in wire is embedded in substrate to form, for example addition (additive) technique or cancellation (subtractive) technique, for example printed antenna structure, coil-winding technology (for example US 6, 295, disclosed in 720), in the antenna substrate separating, form and be transferred to the antenna structure of inlay substrate (or layer of inlay substrate), the antenna structure going out from conductive layer etching (comprising laser-induced thermal etching) in substrate, in substrate or be formed on electric conducting material of laying in the passage in substrate etc.In the time mentioning in this article " inlay substrate ", apart from clear and definite contrary, should notice that it comprises " card " (vice versa), and for any other substrate of secure file.
Following description majority is under the background of double nip (DI, DIF) smart card, and most contactless operation that relates to this Smart Card with Dual Interface.The many instructions that propose herein can be applied to the E-Passport etc. only with Touchless manipulation pattern.Conventionally, any property roughly of being of a size of of proposing herein, and the material that proposes to be herein intended to be exemplary.
Conventionally, the coupling between module antenna (MA) and the antenna of external RF ID reader can be by being incorporated in gain antenna (BA) in card (CB) and being enhanced.In some respects, gain antenna (BA) is similar with card antenna (CA).But, than the card antenna (CA) being directly electrically connected with RFID chip or chip module (for example, at US 7,980, in 477), gain antenna (BA) and module antenna (MA) induction coupling, this module antenna (MA) can be connected with RFID chip (CM).This type of induction coupling is compared to the more difficult realization of direct electrical connection.
As used herein, term " coupling " (with and distortion) refer between two elements, depend on induction, magnetic, condenser type or the reactance coupling (comprising its combination, above-mentioned arbitrary can be described as " induction is coupled ") that are generated electromagnetic field and the reaction to this (alternately) by another element by point element.Corresponding thereto according to, term " connection " (with and distortion) refer to that two elements are electrically connected to each other, wherein between two elements alternately by the mobile generation of the electronics between two elements.Normally, two elements that induction is coupled each other are not electrically connected to each other.For example, for element (the module antenna MA of laying located adjacent one another and coupling coil CC) the induction coupling each other conventionally of lead-in wire coil, and not electrical connection between two elements.Corresponding thereto according to, module antenna MA is electrically connected with RFID chip (CM) element conventionally.The winding of gain antenna BA and coil (for example outside winding OW, inner winding IW and coupling coil CC element) are electrically connected to each other conventionally, but also can present induction coupling each other.Module antenna MA is not electrically connected each other with coupling coil CC, but induction coupling (or " transformer coupled ") each other.
Gain antenna BA disclosed herein (and other features) can increase with useful effect (" reading ") distance between condenser type and Anneta module AM and the outside contactless reader of induction coupling.Owing to reading approximate only several centimetres conventionally of distances, therefore increasing by 1 centimetre will represent great improvement.
double nip (DI) smart card and reader
Fig. 1 shows double nip (DI) smart card SC, and this double nip (DI) smart card SC comprises:
-RFID chip (or chip module) CM, it can be double nip (DI) chip or chip module, is laid in the bottom surface of substrate or modular belt MT (or chip carrier band or metal lead wire frame);
-multiple (for example 6) contact pad CP, for implementing contact docking (ISO 7816) on the end face at modular belt MT; And
-module antenna MA, is laid in the bottom surface of modular belt MT, is typically formed according to helical (coil) pattern by etched conductor or lead-in wire.
-modular belt MT supports and affects the interconnection between RFID chip CM, contact pad CP and module antenna MA, and it can be monolateral (only in a side, metallizing) or bilateral (on both sides, all metallizing).
-RFID chip CM can be connected in any suitable manner, for example, with the mode of flip-chip connect or Bonding to modular belt MT.
-RFID chip CM and module antenna MA can be injection molding by mould piece MM, for protection CM and MA parts and interconnection line.
-as used herein, " chip module " comprises one or more bare semiconductor crystal grain (chip), it comprises integrated circuit (IC) chip." mixing " chip module can comprise for the chip of contact docking with for the chip of contactless docking etc.For the exemplary reference of DIF chip solution US 6,378,774 (2002, Toppan), and (one of them chip is carried out contact function for two chip solutions, and another chip is carried out non-contact function) exemplary reference US 2010/0176205 (2010, SPS).
-ferrite component (film or layer) can merge in Anneta module AM, between contact pad CP and module antenna MA, with the attenuating that reduces to be caused by the contact pad CP conducting electricity.
-RFID chip CM, chip belt MT, contact pad CP and module antenna MA form " Anneta module " AM jointly.
This smart card SC also comprises:
-substrate, for smart card, it can be called as " card " CB.(for E-Passport, this substrate will be " inlay substrate ".)
-gain antenna BA (or card antenna CA) is illustrated around the periphery that is laid in card CB (only therein), typically is the form of rectangle, plane thread (having multiturn number).
-as used herein, term card CB intention comprises any substrate of supporting gain antenna BA containing antenna modules A M.Can in card CB, be provided for the groove of containing antenna modules A M.
-smart card can be called as " data medium " or " transponder " etc.
Some exemplary and/or approximate size, material and specifications can be:
-modular belt (MT): epoxy base band, 60 μ m are thick
-chip module (CM): the SLE66 of NXP SmartMx or Infineon (Infineon), or other
-Anneta module (AM): 15mm × 15mm and 300 μ m are thick
-module antenna (MA): the copper lead-in wire winding that some are approximately 50 μ m, is positioned at around chip module CM
-card CB: approximately 54mm × 86mm, 810 μ m are thick, Merlon (PC).Card and card antenna (CA, or gain antenna BA) thereof are greater than chip module CM and module antenna MA (for example 20 times) thereof significantly.
112 μ m copper of-gain antenna BA:3-12 circle, from bonding wire, be embedded in ultrasonically in card CB.Alternatively, gain antenna BA can comprise 80 μ m copper lead-in wires of insulation, and it is laid according to the helical pattern that is approximately 46mm × 76mm (being slightly less than card CB), and pitch of turn is 300 μ m, presents the resonance frequency of 13.56MHz.The self-resonant frequency of the optimization of gain antenna BA can be approximately 13～17MHz.
The example of zero gain antenna can be at US 8,130,166 (2012, " AssaAbloy ") in find, this application is incorporated in this by reference, this gain antenna has the outer part that forms large helical (11,11 ') and the core that forms little helical (12).This large helical is equivalent to the BA in (or being similar to) Fig. 1, and this little helical is equivalent to the CC in Fig. 1.
The example of zero gain antenna can, at US 6,378, find in 774 (2002, " Toppan "), and this application is incorporated in this by reference, and this gain antenna has aerial coil (4) and coupling coil (3).This aerial coil is equivalent to the BA in (or being similar to) Fig. 1, and this coupling coil is equivalent to the CC in Fig. 1.
Zero the invention is not restricted to the use of concrete arbitrarily gain antenna, but details and the manufacture thereof of directional antenna modules A M.
In order to strengthen the coupling between module antenna MA and gain antenna BA, the material (for example ferrite) that represents Electromagnetic Coupling Characteristic can be according to any required pattern, be laid in as film on the surface of card CB, or it is merged or be embedded in card to can be used as particle, or both (film and particles).The ferritic use that is used for the material that strengthens coupling or shielding (prevention) coupling as one here comes into question as the example of the material that represents high electromagnetism magnetic permeability, and it is used with this or that form in conjunction with antenna conventionally.For example, referring to US 5,084,699 (1992, " Trovan ").
Extra play (not shown) (for example cover layer) can be in turn laminated to card CB, to complete the construction of smart card.
Anneta module (AM) can be laid in card (CB), for example, in the groove of milling out, make its module antenna MA and coupling coil CC overlapping, or in coupling coil CC inside, basic and coupling coil CC is coplanar or from another horizontal plane of coupling coil CC.For example, referring to US6,378,774 (2002, Toppan), its full content is incorporated in this by reference.
Fig. 1 also shows the contact reader with contact and the contactless reader with antenna, this contact is used for contact mode (ISO 7816) via contact pad CP and chip module CM interaction (power swap data are provided), this antenna is for interacting with chip module CM via gain antenna BA and module antenna MA (alternatively, via card antenna CA) with noncontact mode (ISO 14443).
the execution mode of Anneta module (AM)
Figure 1A shows the Anneta module (AM) 100 with RFID chip (CM) 110 and coiling module antenna (MA) 130, and the two can be wirebonded to the joint sheet (BP) on the lower surface of modular belt (MT) 102 this RFID chip (CM) 110 and coiling module antenna (MA) 130.More particularly,
-expoxy glass substrate (MT) 102 has multiple contact pads (CP) 104 and multiple joint sheet (BP) 106, described multiple contact pad (CP) 104 is positioned at surface, its top (as can be seen), be used for making to carry out contact with " contact operator scheme " and external reader and dock, and multiple joint sheet (BP) 106 is laid on the surface of side mutually of modular belt (MT) 102;
-chip (CM) 110 can be installed to the bottom surface (as can be seen) of modular belt (MT) 102, and its terminal (CT) 110a, 110b are for example connected to some joint sheets (BP) 106 (as can be seen) chosen on the bottom surface of modular belt (MT) 102 by traditional Bonding.In order to clearly demonstrate, only two Bonding connecting line 114a and 114b are illustrated.
-module antenna (MA) 130 comprises (for example) some circles lead-in wire, for example, according to 3 × 6 configuration (3 layers, every layer has 6 circles), and has two end 130a and 130b.Module antenna 130 can for example be connected to two joint sheets (BP) 106 on the bottom surface of modular belt (MT) 102 by hot press by its end 130a, 130b, as shown.
Zero in order to protect the Bonding (connecting line) between chip terminal CT and joint sheet BP; after module antenna MA is mounted to modular belt MT; and after chip CM is installed and is connected to modular belt MT (before or after installation module antenna MA); the interior zone of module antenna MA can be filled with resin GT, and this module antenna MA is as " dam body " for comprising resin GT.Referring to Figure 1B.
Zero module antenna MA and end thereof, and chip CM and connecting line thereof (it can cover with resin GT) can be injection molding with mould piece (MM).
The set of-said elements (modular belt (MT) 102, chip module (CM) 110 and module antenna (MA) 130 conventionally) can be called as " Anneta module " (AM) 100.
In Figure 1A, modular belt MT can be called as " bilateral ", because it has the conducting element (the contact pad CP on top surface, the joint sheet BP in lower surface) forming in metal level (metallization) in its top and lower surface.In order to clearly demonstrate, the conducting element of modular belt MT inside (for example through hole) is omitted.Alternatively, modular belt can be " monolateral ", and it only metallizes in one side, and for example, the side that only (faces up) at top, for contact pad CP.For single-side belt, opening can extend through modular belt MT, so that chip CM the bottom surface from being laid in modular belt MT and/or module antenna MA are communicated with to the back side of some the contact pad CP that chosen on the top surface of modular belt MT.
Fig. 1 C shows middle module antenna (MA) or the coil block 130 using of disclosed Anneta module (for example Anneta module of (but being not limited to) Figure 1A) here.Lead-in wire coil 112 for module antenna (MA) can be wound with the coil winding instrument of any appropriate, and is laid on film support layer 132.Module antenna MA can comprise some circle lead-in wires, and can be the form of annular (cylindrical), and this annular internal diameter (ID) is approximately 9mm, and external diameter (OD) is approximately 10mm.
Film support layer 132 can be the nitrile film that 60 μ m are thick, and its entirety has the external dimensions of about 10-15mm × 10-15mm, or is approximately the twice large (in one dimension, from one side to another side) that will be installed in module antenna MA wherein.Central opening 134 can be provided by film 132, conventionally and the position alignment of module antenna MA, and has almost the diameter equally large with the ID of module antenna MA.Opening 134 can be formed by perforation procedure.In the time that Anneta module AM is assembled, opening 134 for example, for holding chip CM (110, Figure 1A) and Bonding thereof.
Two opening 136a and 136b can be provided by film 132 (with the perforation procedure identical with central opening 134), be respectively used to allow to join respectively antenna lead end 112a and 112b to joint sheet BP (106, Figure 1A) on modular belt MT (102).
Can for example, provide release film 138 in a side of film 132 (, the side contrary with module antenna MA).Central opening 134 can extend through or not extend through this release film 138, and this release film 138 can be paper, and thickness is approximately 60 μ m.
Be installed to modular belt MT (102) afterwards, and after chip CM (110) is mounted and connects, module antenna MA 112 can fill to protect chip CM and connecting line thereof with resin.Module antenna MA can be connected before connecting chip CM, to avoid defective chip CM connecting line.Fig. 1 D shows DIF smart card, and this DIF smart card comprises:
-double nip (DIF) RFID chip CM, is laid on the bottom surface of substrate or modular belt MT;
-multiple (for example 6) contact pad CP, for implementing contact docking (ISO 7816) on the end face at modular belt MT; And
-module antenna (MA), is laid on the bottom surface of modular belt (MT), is typically formed according to helical (coil) pattern by etched conductor or lead-in wire.
-substrate MT supports and affects the interconnection between chip CM, contact pad CP and module antenna MA, and it can be monolateral (only metallizing in a side), or bilateral (on both sides, all metallizing).
-chip CM can be connected in any suitable manner, for example, connects (as shown in Figure 1 D) or Bonding (as shown in Figure 1A) to modular belt MT in the mode of flip-chip.
-as used herein, " chip module " comprises one or more bare semiconductor crystal grain (chip)." mixing " chip module can comprise for the chip of contact docking with for the chip of contactless docking etc.For the exemplary reference of DIF chip solution US 6,378,774 (Toppan, 2002), and (one of them chip is carried out contact function for two chip solutions, and another chip is carried out non-contact function) exemplary reference US 2010/0176205 (SPS, 2010).
-chip module CM, chip belt MT, contact pad CP and module antenna MA form " Anneta module " AM jointly.
This smart card also comprises:
-substrate, for smart card, it can be called as " card " CB.(for E-Passport, this substrate will be " inlay substrate ".)
-Ka antenna (CA), is called as gain antenna (BA) sometimes, is laid in around the periphery of card, typically is the form of rectangle, plane thread (having multiturn number).(gain antenna BA can also have coupling coil, and this coupling coil is positioned at the interior section of card CB, for example for the groove of Anneta module AM around, and referring to Fig. 1).
-as used herein, card CB intention comprises any substrate of support card antenna CA containing antenna modules A M.Can in card, be provided for the groove of containing antenna modules A M.Some exemplary and/or approximate size, material and specifications can be:
-modular belt (MT): epoxy base band (or polyimides (Kapton)), 75 μ m～110 μ m are thick
-chip module (CM): NXP SmartMx or Infineon SLE66, or other
-Anneta module (AM): 13mm × 11.8mm and 195 μ m are thick
-module antenna (MA): the copper lead-in wire winding of some 50 μ m or 80 μ m is approximately the size (and being not more than AM in size) of chip module CM
-card CB:85.6mm × 53.97mm, 760 μ m are thick, Merlon (PC).Card and card antenna thereof are greater than chip module CM and module antenna MA (for example 30 times) thereof significantly.
112 μ m copper of-Ka antenna CA:7 circle, from bonding wire, be embedded in ultrasonically in card CB.
Extra play (not shown) (for example cover layer) can be in turn laminated to card, to complete the construction of smart card.
Fig. 1 D also shows the contact reader with contact and the contactless reader with antenna, this contact is for interacting (power swap data are provided) via contact pad CP and RFID chip CM with contact mode (ISO 7816), and this antenna is for interacting via blocking antenna CA and module antenna MA and chip module CM.
on dam structure, be wound around module antenna
Fig. 2 show the bottom surface that dam structure (or be called for short " dam body ") DS 220 can be laid in modular belt MT 202 (top, as shown) upper, and affix to this bottom surface (for example using adhesive).(contrast Fig. 1, Figure 1A and Fig. 1 D, modular belt MT 202 is illustrated and puts upside down, and in the figure, contact pad CP 204 is in bottom, as shown.)
Dam body DS 230 can be called as " winding magnetic core WC " or " supporting construction " or simply be called " ring ", dam body DS 230 has tubular body portion B open end 230a and the 230b relative with two of elongation, and cross section can or be substantially rectangle (or arbitrarily other suitable shapes) for cylindrical (as shown).An end 230 of main part B uses suitable adhesive to be installed to modular belt MT, and another end 230a is free end (not installing).Dam body DS can for example, be formed by plastic material (polyester film (Mylar)), and thickness ' t ' is approximately 200 μ m.The internal diameter (ID) of dam body DS can be approximately 7mm, and the external diameter (OD) of dam body DS can be approximately 8mm.
Although circle of being depicted as (cylindrical), but the cross section of dam body DS can be substantially rectangle, or other suitable shapes (for being wound around in the above module antenna MA), in this case, " ID " should be the inside dimension of main part B, and " OD " should be the external dimensions of main part B.
The module antenna MA 230 from bonding wire (contrast 130) with some layers and the number of turn can be wrapped on dam body DS.Dam body DS should have height ' h ', and this height ' h ' is at least equally high with obtained module antenna MA, for example, be approximately 350 μ m.Dam body DS can flood to increase with ferrite the inductance of module antenna MA.Can during being wound around module antenna MA, support this DS with fixture (not shown).The intermediate products (comprising the module antenna MA and the dam body DS that are installed to modular belt MT) that obtain can be counted as the assembly for Anneta module AM.Two end a, the b (contrast 112a, 112b) that show module antenna MA, these two end a, b extend out to the lip-deep joint sheet BP 206 (contrast 106) of modular belt MT.
RFID chip CM 210 (contrast 110) can be installed on the surface of modular belt MT subsequently, be arranged in the inside of dam body DS, and bottom surface from its terminal CT Bonding to modular belt MT (top, the joint sheet BP on as shown in Figure 2).Afterwards, can protect chip CM and wire-bonded at dam body DS internal applications dome packaging body potting compound GT (not shown), make to complete substantially Anneta module AM 200.RFID chip CM and module antenna MA can be injection molding by mould piece MM (not shown, to see Fig. 1), to protect chip CM and module MA parts, and to each interconnection line of the joint sheet BP on modular belt MT, complete Anneta module AM.
Fig. 2 A shows at least one slit S 232 can be provided the main part B (winding magnetic core WC) by dam body DS, with at least one end (a, b) of allowing corresponding module antenna MA lead-in wire (not shown) from the outside of main part B to dam body DS around " inside " space inwardly through this slit S 232.One or two end (a of module antenna MA, b) can extend internally by one or two slit in main part B (two ends can extend through single slot at different horizontal planes), so that end (a, b) terminate in by dam body DS around modular belt MT on region in.Slit S should have the size (enough wide) adapting to through the diameter of antenna lead wherein.The advantage that the end of antenna lead is terminated in to dam body DS inside is, they can be by the same dome packaging body GT protection (referring to Fig. 4 E) of protection chip CM.
the Anneta module forming on 35mm chip carrier band
Fig. 2 B shows the technology for a module antenna MA of the upper multiple module antenna MA of formation of the winding magnetic core WC on 35mm chip carrier band (modular belt MT).Two end a, b of module antenna MA lead-in wire can extend internally (for example, by the one or more slits in winding magnetic core WC), and to join joint sheet BP to, this joint sheet BP is laid on the modular belt MT of winding magnetic core WC inside.Alternatively, winding magnetic core WC can be omitted, and module antenna MA can be hollow coil.
Fig. 2 C shows the technology for a module antenna MA of the upper multiple module antenna MA of formation of the winding magnetic core WC on 35mm chip carrier band (modular belt MT).Two end a, b of module antenna MA lead-in wire can stretch out, and to join joint sheet BP to, this joint sheet BP is laid in the modular belt MT upper (in the mode shown in Fig. 2) of winding magnetic core WC outside.Alternatively, winding magnetic core WC can be omitted, and module antenna MA can be hollow coil.
Show the upper technology that forms module antenna MA for for example winding magnetic core WC on 35mm chip carrier band (modular belt MT).Two end a, b of module antenna MA lead-in wire can stretch out, and are connected to the joint sheet BP on the modular belt MT of winding magnetic core WC outside.Alternatively, winding magnetic core WC can be omitted, and module antenna can be hollow coil.
In Fig. 2 B and 2C, show the square pad for holding chip CM.Multiple less joint sheets are illustrated the inside that is positioned at winding magnetic core WC; it is connected internally to the contact pad CP (not shown) of the side that faces up that is positioned at modular belt MT at modular belt; and the various contact terminals of chip can be wirebonded to described multiple less joint sheet, be next that winding magnetic core WC is carried out to the filling of dome packaging body to protect this Bonding.In Fig. 2 B and Fig. 2 C, show some interconnection lines, in order to clearly demonstrate, other interconnection lines can be omitted.
"flying trident " coil-winding
Fig. 3 shows multiple (being approximately 15) the module antenna MA on 35mm chip carrier band (modular belt MT), for example, shown in Fig. 2 C (end stretches out from WC), be wrapped in the type winding magnetic core WC.Winding magnetic core WC can be set as two row by cloth, and two winding magnetic core WC install expediently side by side, through the width of 35mm belt carrier.35mm chip carrier band can advance along workbench (stage), sometimes stops to be wound around multiple (for example two) module antenna MA.Multiple (for example 15) telescopic " fixing " pin is to extending from workbench, these pins are close in 35mm belt carrier, be positioned at the both sides of described belt carrier, each pin pair is associated with the each winding magnetic core WC in (15) winding magnetic core WC.Can provide less number (more minority) (for example 2 s') line mouth (nozzle), for example, to provide and to be wound around the lead-in wire for module antenna MA around the lead-in wire magnetic core WC of same number (2).
Conventionally, in order to form given module antenna MA, line mouth can be first by the first end of lead-in wire around the first pin to being wound around, the first end of lead-in wire is fixed to (grappling, " fixing ") to the first pin.Then, line mouth moves towards winding magnetic core WC, and the first end portion of lead-in wire is extended (passing through) through one or two joint sheet BP on (striding across) modular belt MT.Then, line mouth " leaps " (spiraling) repeatedly (for example 20 times) around winding magnetic core WC, will go between and be wound around around this winding magnetic core WC---therefore, and called after " flying trident " coiling technology.For example, after having completed (20) number of turn specifying number, line mouth leaves winding magnetic core WC, the second end portion of lead-in wire is through the second two joint sheets for module antenna MA, with the second end of lead-in wire is fixed (knotting) the second pin on.Then, process can join joint sheet separately to for the end portion of the lead-in wire of two joint sheet BP of module antenna MA.
Before the end portion of splice module antenna BP, first forming multiple module antenna MA can be easily.Notice in figure to have formed several/(6) module antenna MA, their two end portion extend past joint sheet BP, and are knotted to corresponding pin pair.Then,, in following step, the end portion of module antenna MA can be engaged (for example using thermode) and arrive joint sheet BP separately.After having completed the formation of module antenna MA, the remainder of lead terminal (between joint sheet BP and the pin being associated) can be cut, and pin can be stretched, and " unnecessary " lead-in wire is for example removed by intake system.
The formation of module antenna MA and the joint sheet BP that their end portion is joined to separately can carry out before chip CM is inserted on modular belt MT.By completing before these steps chip CM being carried out to Bonding (for example, referring to Fig. 4 D), between the joint aging time of the end of module antenna MA, will be interference-free to the Bonding of chip CM.
Flying trident coiling technology shown in Fig. 3, applicable to being wound around module antenna MA on the dam structure DS at Fig. 2, Fig. 2 A, is also applicable to be wound around module antenna MA on the dam structure WC of Fig. 4.
The following patent that relates to flying trident coiling is incorporated in this by reference: US 5,261,615 (1993, Gustafson (Gustafson)); US 5,393,001 (1995, Gustafson); US 5,572,410 (1996, Gustafson); US 5,606,488 (1997, Gustafson); US 5,649,352 (1997, Gustafson).
Fig. 3 A shows some additional details and/or the modification about above-mentioned technology.Four Anneta modules of a line (AM) that form are illustrated along a side of 35mm belt carrier to be laid.Supporting construction multiple tubuloses, open-ended (WC, DS) has been disposed in corresponding multiple position, and these positions are used to form corresponding multiple Anneta module AM.Multiple telescopic fixing pin for lead terminal is integrated in shuttle (shuttle) (workbench).These pins are positioned in the adjacent place of belt carrier to (indicating #a, #b), be positioned at the each corresponding position for Anneta module.Some or all in the illustrative methods that forms a series of module antenna MA for the position of Anneta module AM can comprise the following steps, (but being not limited to) is according to following order conventionally
-lead-in wire can be clamped by clamp system.
-then, lead-in wire can be guided by line mouth, and the first telescopic fixing pin that process is associated with first (illustrating on the right) Anneta module AM in Anneta module AM is to the first pin 1a in (1a, 1b).
Zero coiling line mouth can be controlled by x-y-z servo system (not shown).
-then, lead-in wire can be directed, through the first opening in shuttle, arrives the first winding magnetic core WC being associated with first Anneta module AM.
Opening in zero shuttle can be convenient between joint aging time (occurring) below, and disconnection will go between.
-then, line mouth moves (spiraling) around winding magnetic core WC, is formed for the lead-in wire of the number of turn of the predetermined number (for example 20) of module antenna MA.
-then, line mouth is outwards led, and through the edge of 35mm belt carrier, crosses the second opening in shuttle, arrives the second pin 1b of the first scalable pin centering being associated with first Anneta module.
-then, not that lead-in wire is knotted on the second pin 1b, but line mouth around the second pin 1b, towards next pin being associated with next (from the right second) Anneta module for example, to partly (about 90 degree) guiding lead-in wire of the first pin 2a in (2a, 2b).The part of this lead-in wire is wound around and can enough lead-in wire grappling (fixing) be arrived to pin 2a.
-then, line mouth will, around pin 2a, towards this lead-in wire of lead-in wire core directs of second (from the right) Anneta module, pass through another opening in shuttle.
-then, line mouth moves (spiraling) around the second winding magnetic core WC, is formed for the lead-in wire of the number of turn of the predetermined number (for example 20) of module antenna MA.
-above step (the line mouth opening that outwards guiding is crossed in shuttle arrives the second pin of scalable pin centering, the first pin that arrives next scalable pin centering, part around (anchor leg) and inwardly guides the opening of crossing in shuttle to arrive next winding magnetic core etc.) continues, and to the last a winding magnetic core has been tied with module antenna MA.Then, lead-in wire can be around last scalable pin to the second pin (4b) in (4a, 4b) tied a knot (by line mouth).
Zero in Fig. 3 A, and line mouth is illustrated and leaves the 3rd (from the right) winding magnetic core, towards the pin being associated with this Anneta module position, the direction of the second pin in 3a, 3b is seted out.
-then, the end portion of the lead-in wire of each joint sheet of process BP can be engaged, as described above with reference to Figure 3.
-in last step, lead-in wire can be cut, and pin can be stretched, and remaining lead-in wire is removed.
single flange winding magnetic core
Fig. 4 shows the winding magnetic core WC 420 that can be wound around module antenna MA thereon.The winding magnetic core WC that can be called as " supporting construction " can for example, be made up of plastic material (, glass fibre strengthens PPS (polyphenylene sulfide)).As dam structure DS 220, winding magnetic core WC can be form of annular rings or tubular structure, there is cross section circular or that be roughly rectangle, and two relative open end 420a, 420b, one of them open end will be fixed (stickup) to the bottom surface of modular belt MT, and another open end is free end (not installing).
Winding magnetic core WC comprises main part B 422 and flange section F 424, and this flange section F424 extends (as can be seen, to the left or to the right) from top (as can be seen) the free end radially outward of main part B.(this and dam body DS 220 contrast, and two ends in dam body DS 220 are mutually the same in essence.)
Flange F contributes to make main part B hardening, and contributes to retrain the winding (because it is wound) of (comprising) module antenna MA.By the mode of analogy, in the time installing on modular belt MT, flange F is as a flange of " line cylinder (bobbin) ", and the surface of modular belt MT is as second flange of " line cylinder ".Module antenna MA will be wound in the coil-winding region between two " line cylinder " flanges.Fig. 4 shows the part of modular belt MT with imaginary line (dotted line), and indicates the coil-winding region forming between flange F and the lower surface of modular belt MT.(modular belt MT can be expoxy glass, covers copper in both sides, etched to form joint sheet BP on bottom surface, forms contact pad CP in a supine side.)
Winding magnetic core WC 420 can have following size (being similar to):
Thickness t=～0.85mm of-main part B
Width fw=～0.5mm of-flange F
External diameter OD (comprising flange F)=～9.4mm of-winding magnetic core WC
Inner diameter, ID=～6.7mm of-winding magnetic core WC
Height h1=～the 0.250mm in-coil-winding region
Height h2=～0.100mm of-flange F
Total height h3=～0.350mm of-main part B
Coil-winding region between the surface of flange F and modular belt MT can hold (comprising) for 112 μ m diameters of about 20 circles of module antenna MA from bonding wire.(being greater than or less than 112 μ lead-in wire m) can be for module antenna MA to have other diameters.
For forming module antenna MA 430 on winding magnetic core WC, and the technique that further forms Anneta module AM is described with reference to figure 4A-Fig. 4 F, and generally includes:
-WC is fixed to MT
-MA is wrapped on WC
-be CM dispense adhesive
-arrange CM, adhesive is solidified to (will solidify from bonding wire)
-Bonding (by CM and MA Bonding to the BP on MT)
-dome packaging body is filled the inside (covering CM) of WC
-MA, WC, CM are carried out to injection moulding
Fig. 4 A shows first step, and wherein winding magnetic core WC 420 for example uses adhesive to be adhered to modular belt MT.Adhesive can be applied to the surface of end 420b or the modular belt MT of winding magnetic core WC.The final thickness of adhesive can be approximately 30 μ m.Alternatively, winding magnetic core WC can not use adhesive (for example, by rotating welding (Friction welding technique)) to be adhered to modular belt MT.In process of production, winding magnetic core WC (or be called simply " ring ") can be placed on multiple positions along the belt carrier of 35mm, for coil-winding (coiling of the module antenna MA on winding magnetic core WC or dam body DS) is prepared.This step can be called " be periphery and put ".
The contact pad CP (contrast 104) docking for (with external reader) contact is illustrated the (bottom that faces up that is positioned at modular belt MT, on surface as can be seen), for double nip (DI) Anneta module AM.It should be understood, however, that the present invention can be implemented in the background of Anneta module AM that only there is no these contact pads CP with noncontact mode operation.
Fig. 4 B shows (assembling, installation) the winding magnetic core WC to modular belt MT that is stuck.Coil-winding region forms between flange F and the surface of modular belt MT.In this figure and ensuing figure, in order to clearly demonstrate, adhesive is omitted.
Fig. 4 C shows next step, wherein, in the coil-winding region of module antenna MA 430 between flange F and the surface of modular belt MT, around main part B, be wrapped on winding magnetic core WC.This can carry out in the mode (using " flying trident " coiling technology) of describing shown in Fig. 3 and with reference to figure 3.Can form by other coil-winding technology the coil of module antenna MA.In this step, can be connected with pad BP separately from the end (a, b) of the outward extending module antenna MA of winding magnetic core WC.Although not shown, winding magnetic core 420 can have at least one slit (S) (being equivalent at least one slit (S) shown in Fig. 2 B), extend to the end (a, b) that allows module antenna MA the joint sheet (BP) that is positioned at winding magnetic core WC inside.
The coil (wire turn) of lead-in wire can equally as shown fitly be arranged.But, as shown, the coil of lead-in wire (wire turn) by the surface restraint of flange F and modular belt MT in inside, territory, coil winding region.Module antenna MA can comprise lead-in wire and two ends (a, b) of 20 circles altogether (coil) that are arranged in coil-winding region, and these two ends extend past joint sheet BP separately on the surface of modular belt MT.
Fig. 4 D shows the next step that forms Anneta module MA, and its chips CM (contrast 110) is installed in the interior zone of winding magnetic core WC.Then, can between the terminal of chip 110 (contrast 110a, 110b) and some lip-deep chosen joint sheet BP of modular belt MT, form Bonding wb (contrasting 114a, 114b).In this step, if the end (a, b) of module antenna MA is not connected before, the end (a, b) of this module antenna MA also can be engaged to some lip-deep chosen joint sheet BP of modular belt MT.
Fig. 4 E shows next step, and wherein the interior zone of winding magnetic core WC can be filled with dome packaging body potting compound GT etc., to protect chip CM and Bonding wb.If apply heat to solidify dome packaging body GT, this heat also can make to form the bonding together from bonding wire of wire turn (coil) of module antenna MA.
Fig. 4 F shows next step, wherein mould piece MM can form (by injection moulding) at the end (a, b) of module antenna MA, module antenna MA, winding magnetic core WC, dome packaging body GT upper (being included on chip CM and Bonding).Mould piece MM can extend past the outward flange (flange) of flange F, enters into a little coil-winding region (except leaded place, this region), and this can contribute to mould piece MM to keep in place.In less degree, if replace winding magnetic core WC to use, dam structure DS (Fig. 2) (it is also adhered to modular belt MT at an end) also can contribute to support (retain, catch) mould piece MM.
The process that is formed for the module antenna MA of above-mentioned Anneta module AM can contrast Toppan ' 774; it illustrates (Figure 14) wound coil framework or around the coil with the magnetic core that is arranged on epoxy resin flange around, this epoxy resin protection crystal grain and the Bonding to this crystal grain.For example, in above-mentioned technology (Fig. 4 A-Fig. 4 F)
-winding magnetic core WC only has a flange (another " virtual " flange at the relative open end place of supporting construction is the surface of modular belt MT),
-tubular support structure (WC, DS) can be used as the dam body of the dome packaging body GT resin for applying after comprising,
-on modular belt MT, form module antenna MA after, chip CM (and, also can be performed after the end of splice module antenna MA the Bonding of chip CM) can be installed.
Fig. 5 (contrast Fig. 1) shows the Anneta module AM (it is the Anneta module 200 of Fig. 2 or the Anneta module 400 of Fig. 4 F) in the recess R in the card CB that is arranged on smart card SC, this smart card SC has gain antenna BA and coupling coil CC, this gain antenna BA has the exterior section that is positioned at card periphery, and described coupling coil CC is positioned at the interior zone (being for example positioned at around recess R) of card.At least some (comprising all) lead-in wire wire turns of coupling coil CC can be embedded in the bottom of recess R, to strengthen induction (transformer) coupling between coupling coil CC and module antenna MA.Recess R can form by laser ablation for the passage or the wide groove that hold the wire turn that goes between in bottom.
exemplary antenna module (AM)
Fig. 6 A shows the Anneta module AM with double-side band, in modular belt MT, has opening, and this opening is for being connected to the end (a, b) of module antenna MA the bottom surface (or other regions of top metallization) of contact pad CP.Because bottom metalization BM does not need the interconnection for module antenna MA and chip CM, therefore, bottom metalization BM can be removed from the below of module antenna MA.Conductive through hole is provided by modular belt MT, for chip CM is connected to contact pad CP.Shown here be not by chip CM Bonding to through hole (in Fig. 7 A), but chip CM can be bonded to the trace of being chosen in the bottom metal layers MB being associated with those through holes by the mode with flip-chip (spherical).Can be below chip CM (as see, on top) bottom filler is provided, this chip CM is supported on to modular belt MT go up, and is fixed to modular belt MT.
Fig. 6 B shows the contact pad layout/layout about Fig. 6 A.The lead terminal (a, b) of module antenna MA can be connected to LA and the LB on the bottom surface of modular belt MT.
Metal is removed to (for example, by laser ablation (or laser-impact probing)) from the contact pad CP of Anneta module AM, and to improve with the electromagnetic coupled of external contact formula reader (Fig. 1) (reading distance) can be useful.Metal is removed and can adopt various forms from contact pad (CP), for example, provide multiple and pass through the perforation of some chosen contact pads, the size of some chosen contact pads is modified or increased the size in the gap between some contact pads of choosing etc., these for example can be on August 25th, 2012 submit to 61/693,262 in be described.
there is the module antenna (MA) of a coil
In sum, winding magnetic core WC (be generally ring form, or have the tubular structure of two ends) is installed to the top surface (as shown) of chip carrier band MT (or modular belt, MT).End away from the winding magnetic core WC of belt carrier MT has flange F.Coil-winding region between the top surface of flange F and belt carrier MT can hold (comprising) some (for example 20-30) circle lead-in wire (for example 112 μ m diameters from bonding wire), to form module antenna MA, it can form by flying trident coiling technology.Two joint sheet BP-a on the end " a " of module antenna MA, the top surface that " b " can be engaged to belt carrier MT and BP-b.
Joint sheet " bp " also can be laid on the top surface of the belt carrier MT in the interior zone of winding magnetic core WC, for afterwards the RFID chip (not shown) in the winding magnetic core WC being laid on the top surface of belt carrier MT is connected to (for example passing through Bonding).Each joint sheet " bp " is associated with in joint sheet BP-a and BP-b given one, is attached thereto by conductive trace (not shown).For the contact pad CP of contact docking (ISO 7816) can be laid in belt carrier MT bottom (as see) surface, and be for example connected to the additional joint sheet (not shown) on the top surface of belt carrier MT (in the interior zone of winding magnetic core WC) by through hole (not shown), this additional joint is paid somebody's debt and expected repayment later and will be connected with RFID chip.
Fig. 7 (contrast Fig. 4 C) shows the module antenna MA being formed by a coil, this coil has 18 circles altogether, and there is two ends " a " and " b ", two ends stretch out from module antenna MA, and are connected with in two joint sheet BP-a on belt carrier MT and BP-b one respectively.
Lead-in wire conventionally can be around the main part B of winding magnetic core WC, a wire turn is on another wire turn, because the coiling region between belt carrier MT and flange F becomes with lead-in wire filling, the outside radial expansion of this lead-in wire---cause for example three (3) layers of lead-in wire, every layer has six (6) circles.
Show the module antenna MA that comprises two coil C1 and C2 to Fig. 7 A diagrammatic, each coil has 9 circles, and whole module antenna MA has 18 circles altogether.Each coil C1 and C2 have two ends.Coil C2 illustrates with " X circle (X ' s) ".Coil C2 is illustrated wound coil C1.Modular belt MT is shown as bilateral, but can be also monolateral.
Fig. 7 B schematically shows two coil C1 and can be connected parallel to each other with C2.Coil C2 is shown in broken lines.(two coil C1 can be connected by different way with C2, as shown in Fig. 7 D.)
Coil C1 can be the first coil being wrapped on winding magnetic core WC, and can comprise 9 circle lead-in wire and two end 1a, 1b.Coil C2 can be the second coil being wrapped on winding magnetic core WC, and can comprise 9 circle lead-in wire and two end 2a, 2b.
The first end 2a of the second coil C2 can be connected with the first end 1a of the first coil C1 at the first joint sheet BP-a.The second end 2b of the second coil C2 can be connected with the second end 1b of the first coil C1 at the second joint sheet BP-b.
When with suitable (substantially measure-alike, total number of turns is mutually equal) but the module antenna MA (Fig. 7) with single coil while comparing, have the module antenna MA (Fig. 7 A, 7B) of two coil C1, C2 can be better with card on gain antenna BA coupling, or direct and outside contactless reader coupling, cause larger reading/writing distance and energy acquisition, and make potentially gain antenna BA seem unnecessary.This can be owing to being strengthened each other by the RF signal of two coil transmittings (or reception), or higher quality factor (Q), or two coils are with respect to other characteristics of a coil mode, and perhaps this characteristic comprises the electric capacity being formed by two parallel connected ends of coil.
The wire turn of coil (C1, C2) is conventionally unnecessary equally neat as shown.Conventionally,, no matter be a coil (Figure 1A) or two coils (Figure 1B), enough fill the whole coiling region between flange F and belt carrier MT with the wire turn of module antenna MA.Should also be understood that with particular reference to the execution mode (Figure 1B) of two coils:
-two coil C1 and C2 can be to be wound with mutually the same or contrary direction.
-two coil C1 and C2 can have the unequal number of turn, and for example, Inside coil C1 has 10-12 circle, and external coil C2 has 6-8 circle---and more generally, external coil C2 has the still less number of turn of (or more) than Inside coil C1.
-two coil C1 can be connected parallel to each other with C2---and the interior extremity 1a of Inside coil C1 is connected with the interior extremity 2a of external coil C2, and the external end 1b of Inside coil C1 is connected with the external end 2b of external coil C2.
-two coil C1 can be connected parallel to each other with C2---and the interior extremity 1a of Inside coil C1 is connected with the external end 2b of external coil C2, and the external end 1b of Inside coil C1 is connected with the interior extremity 2a of external coil C2.
-two coil C1 can be connected in mode not parallel to each other with C2, for example, the interior extremity 1a of Inside coil C1 is connected with the external end 2b of external coil C2, and the external end 1b of Inside coil C1 is connected with a terminal (via joint sheet) of RFID chip, and the interior extremity 2a of external coil C2 is connected with another terminal (via another joint sheet) of RFID chip.
In addition two of module antenna MA coil C1 and unnecessary Inside coil and the external coil of being arranged to of C2.But
-mono-coil can form (winding) on another coil, instead of within another coil or outside.
The various wire turns of-two coils can be intersected with each other.
-two coil C1 and C2 can be wound around (once two) in the mode of two-wire winding simultaneously.In addition, can implement following modification
-coil C1 and C2 do not need to be wrapped on above-mentioned specific winding magnetic core.They can be wrapped on other magnetic cores, are directly wrapped on the resin or mould piece of encapsulation RFID chip, and can be air core coil etc.
-coil the C1 and the C2 that are depicted as above coaxially to each other also can form in out-of-alignment mode
-module antenna MA can comprise the coil more than two, for example three coils (C1, C2, C3), and each coil has 6 circles (for 18 circle MA).
-coil C1 and C2 need to not formed by lead-in wire, and they can use any additive process (for example, printing) or subtractive processes (for example, etching) to be formed electrical traces
-Ferrite Material (for example film or particle) can merge in winding magnetic core WC, and it is upper that this winding magnetic core WC is positioned at belt carrier MT, or be arranged in the coating (for example insulating coating) on lead-in wire
-capacitive element can be formed in belt carrier or on belt carrier, and is connected with the one or both in coil.
with the module antenna of two parts
Fig. 7 C (Fig. 6 A of contrast 61/693,262) shows the bottom surface for the modular belt MT of Anneta module (AM).Show the antenna structure (AS) for module antenna (MA), this antenna structure (AS) comprises two module antenna part MA1 and MA2.These two module antenna part MA1, MA2 can be arranged to coaxially to each other, as internal antenna structure and external antenna structure.Two module antenna part MA1, MA2 can be winding arounds, or the trace of patterning, or one be winding around, and another is trace patterns.These two module antenna part MA1, MA2 can interconnect in any suitable manner each other, to obtain effective result.
Fig. 7 D (contrast 61/693, Fig. 6 B of 262) show the exemplary antenna arrangements AS that can use in Anneta module AM, this antenna structure AS has two parts (contrast MA1, MA2), and these two parts interconnect each other, and this antenna structure comprises:
-there is the exterior section OS of external end 7 and interior extremity 8;
-there is the interior section IS of external end 9 and interior extremity 10;
The external end 7 of-exterior section OS is connected with the interior extremity 10 of interior section IS;
The interior extremity 8 of-exterior section OS is left and is not connected with the external end 9 of interior section IS;
-this has formed so-called " accurate dipole " antenna structure AS.
Shown in 13/205,600 (announce on February 16th, 2012, publication number is 2012/0038445) that zero this layout is to submit on August 8th, 2011, with the gain antenna BA as in the card CB of smart card SC
Shown in 13/310,718 (announce on March 29th, 2012, publication number is 2012/0074233) that zero this layout is to submit on December 3rd, 2011, with the gain antenna BA as in the card CB of smart card SC
Contact pad CP described herein and antenna structure AS can use UV nanosecond or picosecond laser, utilize the laser-induced thermal etching (insulation technology) that the copper on modular belt MT is covered to " seed " layer to form.The module antenna MA that surrounds chip CM can be used as the dam body for dome packaging body, and this dome packaging body is employed to protect chip CM and the connecting line to modular belt MT thereof.Referring to Figure 1B above.Also referring to Fig. 7 A of US 61595088.
Not (or in some cases, except) use dome packaging body, can realize protection by transfer modling mould piece (MM), this mould piece (MM) covering/protection module antenna MA and chip CM and connecting line thereof.Before or after module antenna MA is installed to modular belt (and before transfer modling), chip CM can be installed to modular belt MT.
Be incorporated in by reference this 61/704,624 and disclose the Anneta module (AM) for smart card (SC), this Anneta module (AM) comprising: modular belt (MT); Be laid in the lip-deep chip (CM) of described modular belt (MT); And be laid on the surface of described modular belt (MT) and the module antenna (MA) being connected with described chip (CM); It is characterized in that: described module antenna comprises the first coil (C1) and the second coil (C2).This first coil can be connected in parallel with each other with the second coil.Described the second coil (C2) can be around described the first coil (C1).This second coil (C2) can have the number of turn substantially the same with the first coil (C1).This first coil and the second coil can be to be wound with mutually the same direction.Anneta module (AM) can be by sticking on tubular support structure (DS, WC) on the surface of modular belt (MT) and make; And be wound around the lead-in wire for module antenna (MA) around described tubular support structure (DS, WC); It is characterized in that, this module antenna comprises two coils (C1, C2).Described module antenna (MA) can be wound by flying trident coiling technology.
Fig. 7 E, 7F show Anneta module AM, this Anneta module AM there is carrier substrates or with MT, be positioned at RFID chip CM on the bottom surface (as can be seen) of described substrate MT, be also installed to the antenna MA on the bottom surface of described substrate MT and be positioned at the ISO 7816 contact pad CP on the end face (as can be seen) of described substrate MT.In Fig. 7 E, dome packaging body (contrast Fig. 4 E) be used in chip CM (and connecting line, if any) upper, and antenna MA is as the dam body for comprising this dome packaging body.In Fig. 7 F, mould piece (contrast Fig. 4 F) is laid in chip CM (with dome packaging body, if any) and on described antenna MA.
As shown, antenna MA and chip CM are located immediately at contact pad CP below, and with quite (occupying roughly the same overall area) of contact pad CP size.About the region between chip CM and antenna MA, it is typically for interconnection (contrast Fig. 2 B, 2C), and this region is not generally available to or is not suitable for antenna MA, therefore, the region sum that can be used for antenna is restricted to the only exterior section of overall area (referring to Fig. 7 E).
It should be understood that larger region allows more antenna winding or the number of turn, and as general suggestion, be the bigger the better.As discussed in more detail below, when attempting to install while thering is the etching antenna of trace patterns in the region limiting, can be used for this " problem " in space of antenna MA by special concern, and in the time attempting antenna to be incorporated in 6 pad modules (it is significantly less than 8 pad modules), this problem can be aggravated widely.
suprabasil flip-chip (FCOS)
Fig. 8 A and Fig. 8 B have repeated FCOS tMshown in some prior aries, by Infineon Technologies Co., Ltd (Infineon Technologies AG) propose, this technology is guided to memory and microprocessor card, this microprocessor card is contact-type card.Show two " chip modules ", described " chip module " comprises and is installed to carrier substrates (FR4, PET) or the IC chip of a side of band (contrast above so-called modular belt MT) (above so-called chip or chip module " CM " of contrast), this IC chip (CM) is connected with the ISO contact (contrasting above so-called contact pad CP) being laid on the opposite side of described substrate.This chip module nonjoinder has antenna (module antenna MA).Mention 6 contact and 8 contact chip modules---in other words, there is the chip module of 6 or 8 contact pads.
Fig. 8 A shows standard chips module cross section, this standard chips module has the FR4 of being installed to substrate and (is called card, contrast modular belt MT) a side IC chip (CM) and be positioned at the ISO contact (contact pad, CP) on the opposite side of this substrate.This IC chip is wirebonded to the bottom surface of the contact pad on the opposite side that is positioned at this substrate.This is the representative of " monolateral " modular belt (substrate), should only in a side of band, have the metallization being patterned by " monolateral " modular belt.This IC chip and Bonding are packed.
Fig. 8 B shows FCOS tMcard, the useful non-conductivity adhesive of this jig (NCA) is installed to the IC chip of a side of PET substrate, and is the electrical chip connecting line (instead of bonding wire) of projection.This substrate has conductive trace in its lower surface.This IC chip is installed to this conductive trace in the mode of flip-chip, and this conductive trace is connected with conductive through hole, and this conductive through hole extends through the bottom surface of this substrate arrival ISO contact.This is the representative of " bilateral " modular belt (substrate), should on the both sides of this band, all have the metallization being patterned by " bilateral " modular belt.(contrast Fig. 6 A.)
As pointed in Infineon, flip chip technology (fct) is with reference to the technique of the interconnection of semiconductor chip and carrier.This technology makes to increase the packed bulk density of element on carrier and allows the electrical interconnects more direct and more stable than Wire Bonding Technology to become possibility.Different from Wire Bonding Technology, up to the present, Wire Bonding Technology is almost used uniquely in smart card module, and controlled collapsible chip connec-tion relates to chip is carried out to upside-down mounting, and namely, its electrical interconnects line (pad) is overturn towards carrier side.In addition, do not need encapsulation (dome packaging body).This electrical interconnects line uses electric conducting material (so-called projection) to make, between chip contact and carrier.This system is mechanically combined by the adhesive between chip and carrier.Due to the development of the new material for flip chip technology (fct) and the optimization of production technology, likely in field of intelligent cards, use now flip chip technology (fct).
Flip chip technology (fct) is known, and has the many different technology that can be used for ball cloth and plant (ball-bumping) integrated circuit (IC) chip, such as but not limited to below, it is incorporated in this by reference:
-US 5,249,098 (1993, US business huge long-pending (LSI Logic))
-US?5,381,848(1995，LSI?Logic)
-US 5,988,487 (1999, Fujitsu (Fujitsu), Semi-Pac)
-US?6,293,456(2001，SphereTek)
some problems that solve
Smart card, chip card or integrated circuit card (ICC) are any pouch-type cards with embedded IC.Smart card is made of plastics, normally polyvinyl chloride, but be sometimes polyester, acronitrile-butadiene-styrene or the Merlon based on PETG.
Contact intelligent card has the contact area of about 1 square centimeter (0.16 square inch), and it comprises several gold-plated contact pads.In the time being inserted in reader, these pads provide electrical connection, and these pads are used as for example, communication medium between smart card and main frame (, computer, point of sales terminal) or mobile phone.Contact type intelligent card is communicated by letter with external reader by RF induction technology, and only need to approach antenna and communicate by letter.Interface card is implemented non-contact interface and contact interface on the single card with some shared Storage and Processings.In main contents below, double nip (DI, or DEF) card can be discussed.For the exemplary reference of DIF chip solution US 6,378,774, (2002, Toppan), and for the exemplary reference of two chip solutions (one of them chip is carried out contact function, and another chip is carried out non-contact function) US 2010/0176205 (2010, SPS).
In the language of present patent application, the RFID chip (CM) in a side of carrier substrates (MT) and contact pad (CP) on the opposite side of this substrate (MT) and be laid in the chip side of substrate (MT) on and the combination of the antenna (MA) that is connected with RFID chip (CM) be called " Anneta module " (" AM ").
The plastic clip (card CB) that chip module (for example Infineon) or Anneta module (AM) are embedded is that quite appearance is flexible, and chip is larger, and normal use causes the possibility of damage higher to it.Card usually carries in wallet or pocket, and this is rugged environment for chip.Therefore, conventionally expect that chip module (only ISO-7816) or Anneta module (additional ISO-14443) are as far as possible little.
Fig. 8 C shows the antenna structure MA in chip (IC) side that is laid in substrate.The typical pattern of antenna is generally rectangle, the form of plane (two dimension) coil (helical) of (for example, the 12) numbers of turn many to have (conductive trace).The antenna typically metal level the chip side of substrate (sheet metal) is gone out by chemical etching.7 solid circles below chip CM and the representative of the circle of dotted line are by the through hole (8 altogether) of base strap MT.
RFID chip CM is typically laid in the center of spiral antenna pattern, makes described space be not useable for the wire turn of antenna.And as mentioned above, around chip CM, very the space of big figure is not useable for etching antenna.Shown here module has 8 contact pads.Some sizes (all is all approximate) of this module can be:
The overall dimension of-8 pad modules is W=13mm × H=12mm (12.8 × 11.8mm)
(6 pad modules can be measured as W=12mm × H=9mm (11.8 × 8.8mm)
-8 contact pads (referring to Fig. 8 D) occupy about 13 × 12mm 2region
(6 gasket design (Fig. 8 E) can be measured as 12mm × 9mm)
-antenna MA is shown having 12 " wire turns ", or path.
Each path of-antenna MA has the width of 0.1mm
Gap between-adjacent path is 0.075mm
" spacing " (width+gap) of-path is 0.175mm (0.1+0.075)
The external dimensions of-antenna MA is approximately 13mm × 12mm
-chip CM is measured as 2mm × 2mm
The inside dimension of antenna MA is approximately 9mm × 8mm.This is the region being occupied by chip CM and connecting line (with 7 through holes) thereof.
For example, due to the restriction in smart card module size (, 13mm × 12mm or 12mm × 9mm), form space around, center that the wire turn quantity of antenna is restricted to silicon crystal grain, this silicon crystal grain is attached and joins to module substrate.This substrate is made up of expoxy glass conventionally, in a supine side of this module, has contact metallization layer, in a ventricumbent side of this module, has jointing metal layer.The antenna of chemical etching forms conventionally in a ventricumbent side.
With reference to ISO 7816, it is incorporated in this by reference.For some backgrounds are provided, as defined in ISO 7816, the overall dimension of card is:
Width 85.47mm-85.72mm
Height 53.92mm-54.03mm
Thickness 0.76mm+0.08mm
The overall dimension of antenna typically with quite (all sizes are all similar to) of the overall dimension of contact pad,
-for 8 pad contact patterns, the overall dimension of contact pad is 13.2mm × 11.8mm, or 156mm 2(and each contact should have the minimum rectangle surf zone that is not less than 1.7 × 2mm).
-for 6 pad contact patterns, the overall dimension of contact pad is 11.8mm × 8.8mm, or 104mm 2.Conventionally,, for 6 pad contacts, two of the bottoms pad (C4 and C8 (reserved)) of 8 shim pattern is omitted.
Contrast with 8 pad contact patterns Anneta modules (AM), clearly near the border of 6 contact pad chip (or antenna) modules, lacked the region that is approximately 1.4mm × 3mm, this causes at least approximately disappearance of (1.4mm/0.175mm) 8 circle antennas (etched).
Chip (IC) can be measured as 2mm × 2mm, or 4mm 2, and this region is not useable for antenna, reserved (all sizes are all similar to).Conventionally, immediately the region around IC chip is also not useable for antenna, for example, and 3mm × 3mm (comprising IC chip), or 10mm 2.
Therefore can find out, than 8 pad contact patterns modules, 6 pad contact patterns can approximately be lacked the space that can be used for antenna (all numerals are all similar to) of 30-50%.And only, in one deck, etching antenna is two-dimentional.
Contrast etching antenna, Wound-rotor type antenna can utilize free space better.Above-mentioned Fig. 1,1A, 1B, 1C, 6A show some examples (it can be the antenna part of the path of winding around or patterning that Fig. 7 C shows) of Wound-rotor type module antenna.Above-mentioned Fig. 2,2B, 2C, 3,3A, 4C-4F, 5,7,7A show some examples around the lead-in wire antenna of dam body (DS) or winding magnetic core (WC).
Another restriction that creates induction antenna by chemical etching is the minimum spacing (or interval) between path, and it uses lithography process economically to realize.Optimal spacing (or interval) between (adjacent) path of the etching antenna of bringing that surpasses (super) 35mm is roughly 100 μ m.(as used herein, term " spacing " can refer to the interval between adjacent conductive path, but not center heart size between its traditional path center line, or the path quantity of per unit length.)
As mentioned above, with reference to figure 1D, some exemplary and/or approximate sizes, material and specification can be:
-modular belt (MT): epoxy base band (or Kapton), 75 μ m-110 μ m are thick
-chip module (CM): NXP SmartMx or Infineon SLE66, or other
-Anneta module (AM): 13mm × 11.8mm and 195 μ m are thick
-module antenna (MA): the copper lead-in wire winding of some 50 μ m or 80 μ m is approximately the size (and being not more than AM in size) of chip module CM
-card CB:85.6mm × 53.97mm, 760 μ m are thick, Merlon (PC).Card and card antenna thereof are greater than chip module CM and module antenna MA (for example 30 times) thereof significantly.
112 μ m copper of-Ka antenna CA:7 circle, from bonding wire, be embedded in ultrasonically in card CB.
some solutions
6 pins (pad) double nips (DI, DIF) module provides and is much better than 8 leaded molded advantages.Because it has reduced size than 8 pin DIF modules; on the surface of each contact pad (copper, nickel gold), required golden quantitative aspects provides cost savings; owing to holding and protecting the required space of crystal grain less; be reduced for the grinding time that produces chamber in card, and for the gold wire of Bonding no longer may.Because its occupation of land is less, after insert module, in card, there is more space to print brand mark and relief features lines.And due to than 8 leaded molded less, 6 leaded moldedly can survive card bending better.
But, due to the occupation of land little (11.8mm × 8.8mm) of 6 pins (pad) DIF module, in fact unlikely above produce functional etchings antenna in the engage side (chip side) of this module.The space (region) of enclosing between chip and the border of chip module as discussed above, is not enough to comprise the etching antenna path for responding to coupling.In addition, because its occupation of land is less, unlikely that silicon crystal grain (chip CM) Bonding is upper to chip module (belt carrier MT), because the interval between silicon crystal grain and described border is not enough to carry out spherical and wedge bonding.
As described with reference to figure 6A above, be not by chip CM Bonding to through hole (in Fig. 7 A), but chip CM can be bonded to the trace of being chosen in the bottom metal layers MB being associated with those through holes by the mode with flip-chip (spherical).Can be below chip CM (as see, on top) bottom filler is provided, this chip CM is supported on to modular belt MT go up, and is fixed to modular belt MT.Although flip-chip bonding can be vacated some spaces for module antenna MA, Wound-rotor type antenna can utilize free space better than etching antenna.
(Fig. 4 E) as mentioned above, after Bonding, can use winding magnetic core or ring (oval, round, rectangle) to control flowing of dome packaging body, meanwhile, this ring is used as the support frame for Wound-rotor type coil, and this Wound-rotor type coil produces by the flying trident principle of coil-winding.
Annular frame (winding magnetic core WC) can be advantageously used in and make the & hardening that flattens of chip carrier band, to protect flip-chip bonding not bending between the normal operating period and when card is inserted into card terminal.In addition, annular frame (winding magnetic core WC) first can be advantageously used in and keep in touch pad surface substantially evenly and completely smooth substantially.Flatness can determine the life-span of card, particularly in the time being regularly inserted into card terminal.Winding magnetic core (WC) can make modular belt (MT) hardening, firm and smooth, particularly in the region of chip (CM), to strengthen reliability.
Because the occupation of land of 6 pad modules reduces, the unique reliable method that produces induction coupling module can be to use the Wound-rotor type coil (have some layer) that is installed to chip carrier band, and this chip carrier band has by the mode of flip-chip bonding and is installed in its lip-deep crystal grain.As described with reference to figure 4A-4F above, can be wrapped in winding magnetic core WC as the Wound-rotor type coil of module antenna MA upper, this winding magnetic core WC has been installed to base strap MT.Alternatively, can be first by coil winding on magnetic core, then can will be installed to base strap MT with the coil of magnetic core.
Fig. 9 (contrast Fig. 4 D) shows Anneta module AM, it is upper that its chips CM (contrast 110) is arranged on a side (chip side) of modular belt (or substrate) MT in the interior zone of winding magnetic core WC, this winding magnetic core WC can before be installed to the chip side of substrate MT.With describe before chip CM Bonding is compared to the technology (Fig. 4 D) of the joint sheet in the chip side of modular belt, in this embodiment, this chip is installed and is connected to conductive trace and the pad in the chip side of substrate MT in the mode of flip-chip, for example with reference example above as Fig. 6 A or the described mode of Fig. 8 B.
Before or after chip CM is installed, and the suitable position in the chip side in substrate MT of winding magnetic core WC, leadthrough module antenna MA can (Fig. 3) described mode be wrapped on this winding magnetic core WC with above.(only for exemplary purpose, show module antenna MA here, this module antenna MA tool haves three layers, and every layer has 6 circles, by fitly stacking.This lead-in wire does not need by so fitly stacking, and can not be 18 circles.) alternatively, first leadthrough module antenna MA can be wrapped on winding magnetic core WC or its improved version, and be attached to subsequently the chip side of substrate MT.Then,, if the end (a, b) of module antenna MA is not connected before, the end (a, b) of described module antenna MA can be engaged to the joint sheet BP in the chip side of substrate MT.
In the execution mode of Fig. 9, before winding magnetic core WC is pasted to substrate MT, chip CM can be installed and joins to substrate MT, and afterwards, antenna MA is wrapped on winding magnetic core WC.Alternatively, before chip CM is installed and engaged, winding magnetic core WC can be installed to substrate MT.In the execution mode of Fig. 4, before winding magnetic core WC is installed, chip CM can be installed to substrate MT, then connect subsequently.
The contrary surface of substrate MT can be provided with the contact pad for ISO-7816, for example 6 contact pads (referring to Fig. 8 E).In the time mentioning modular belt or substrate, this typically means expoxy glass band, covers copper (bilateral) on both sides.
As mentioned above, winding magnetic core WC can have following size (being similar to):
Thickness t=～0.85mm of-main part B
Width fw=～0.5mm of-flange F
External diameter OD (comprising flange F)=～9.4mm of-winding magnetic core WC
Inner diameter, ID=～6.7mm of-winding magnetic core WC
Height h1=～the 0.250mm in-coil-winding region
Height h2=～0.100mm of-flange F
Total height h3=～0.350mm of-main part B
Contrast with the winding magnetic core WC of Fig. 4 D, the winding magnetic core WC of Fig. 9 is less generally---namely, and less OD and less ID.First, due to 6 pads, in contrast to 8 pad contact pad layouts, it can be less.Secondly, because chip CM is installed to substrate MT in the mode of flip-chip, instead of be wirebonded to substrate MT, therefore, around chip CM, need less space, and the ID of winding magnetic core WC can be therefore obviously less.Some the exemplary OD and the ID size that are used for the winding magnetic core WC of Fig. 9 can be:
External diameter OD=～7mm of-winding magnetic core WC, for example (for rectangle) 6.5 × 7.7mm
Inner diameter, ID=～4mm of-winding magnetic core WC, for example (for rectangle) 3.7 × 4.5mm
As mentioned above, the coil-winding region between flange F and the surface of modular belt MT can hold (comprising) for 112 μ m diameters of about 20 circles of module antenna MA from bonding wire.(being greater than or less than 112 μ lead-in wire m) can be for module antenna MA to have other diameters.
After installing and connecting antenna MA and chip CM, the interior zone of winding magnetic core WC can be filled with dome packaging body potting compound GT etc., to protect chip CM.If apply heat to solidify dome packaging body GT, this heat also can make to form the bonding together from bonding wire of wire turn (coil) of module antenna MA.(contrast Fig. 4 E)
Afterwards, mould piece MM can form (by injection moulding) the end (a, b) of module antenna MA, module antenna MA, winding magnetic core WC and dome packaging body GT upper (being included on chip CM).Mould piece MM can extend past the outward flange (flange) of flange F, enters into a little coil-winding region (except leaded place, this region), and this can contribute to mould piece MM to keep in place.(contrast Fig. 4 F)
improve flip-chip bonding
Traditional with flip chip install be related to chip provide can be again mobile projection, for example tin ball, this flip-chip, to having in the substrate of pad, and flows tin ball with heating to be connected affect electricity between chip and substrate (and mechanical) again.Infineon FCOS chip module mentioned above utilizes adhesive techniques (for example DELO-MONOPOX or DELO-MONOPOX AC) to affect being connected between chip and substrate.
By moral dragon (DELO) publish handbook " for the adhesive (Adhesives of flip-chip bonding for flip chip bonding)" being incorporated in by reference this, it discloses and in the adhesive being clamped between projection and base metal, has pressed projection and conducting particles.Process steps can comprise (i) adhesive application, (ii) setting of flip-chip, (iii) be cured with pressure and temperature by thermode, and alternatively, (iv) finally in tunnel furnace, be cured.In order to realize conductivity, gold-plated nickel particles or silver particles are used as the filler for adhesive (DELO-MONOPOX AC).These solids are for having flexible flip-chip and hard substrate contact.In the time pressing this particle, the lip-deep oxide layer in metallic circuit path is broken.(all the other adhesives that are not pressed can keep non-conductive.) whereby, on copper and aluminium circuit paths, also can realize low contact resistance.In the time of manufacturing intelligence card module, flip-chip is the economical selection of chip on board technology.In the standard substrate as FR4 or PET, use DELO-MONOPOX or DELO-MONOPOX AC, to contact flip-chip.
In exemplary fabrication, can for example, buy base strap from a supplier (happy must happy (Interplex)), can for example, buy projection chip from another one supplier (NXP), and use the adhesive of the selective conductivity that comprises suitable conducting particles (such as copper, nickel, gold etc.) chip is combined with substrate and be connected.As used herein, " adhesive of selective conductivity " is only to become electrically-conducting adhesive in the region of exerting pressure, for example DELO-MONOPOX or DELO-MONOPOXAC.In Figure 10, the conductive region of adhesive illustrates with shade.Can use other adhesives (for example those electrically-conducting adhesives) that projection is connected to pad, for example, by only applying adhesive to those regions.
Figure 10 shows the chip (CM) 1010 with two projections 1012 and the substrate (MT) 1020 with two corresponding pads 1022." adhesive of selective conductivity " 1030 is laid between chip 1010 and substrate 1020.In the time that chip 1010 is pressed downwardly onto in substrate 1020, the selected areas (part) 1032 of adhesive 1030 becomes conduction, and all the other regions of adhesive keep non-conductive.By this way, adhesive 1030 by chip 1010 fixing (mechanical connection) to substrate 1020, and projection 1012 with between pad 1022, form and be electrically connected accordingly.
In order to strengthen being electrically connected between projection 1012 and pad 1022, as the guide who carries out flip-chip, electric conducting material can be applied to the projection 1012 of chip and/or be applied to the pad 1022 of substrate.On projection 1012, show some electric conducting materials 1014, on pad 1022, show some electric conducting materials 1024.Exemplary electric conducting material is nano silver wire, and for example 100 μ m are long, and this nano silver wire will form network (grid) on projection and/or gasket surface, to improve the mechanical connection between projection and pad and to be electrically connected.Nano silver wire material can obtain from shell technology (Seashell Technology) (http://www.seashelltech.com/nanoRods.shtml), it is incorporated in this by reference, and nano silver wire material can be applied to the one or both in projection and pad by spraying, ink-jet applications, spray applications etc.
As the alternative of adhesive bond, the traditional flip-chip bonding that relates to the tin projection that again flows can be used for chip (CM) to install and be connected to substrate (MT).
antenna substrate (AS)
The outer peripheral areas that is limited to module substrate MT for the region of antenna MA has been shown in Fig. 8 C, and the central area of module substrate MT is utilized by chip CM and the interconnection line (and through hole) that is associated thereof.An end of antenna MA stops at the pad (through hole) at the edge that is close in module substrate MT, and another end of antenna MA is illustrated in upper termination of pad (through hole) below chip CM.
Figure 11 and Figure 11 A show antenna MA can be in the upper formation of antenna substrate AS (or belt), and the size of this antenna substrate AS is identical with module substrate MT (or belt) substantially, and separates with module substrate MT.
Opening OP in antenna substrate AS can only be greater than chip CM slightly, this opening OP can be provided by antenna substrate AS, for hold chip CM (chip CM can give prominence to by this opening OP) during to module substrate MT at antenna substrate AS combined (and connect).In Figure 11, chip CM and interconnection line thereof (comparison diagram 8C) are shown in broken lines.
As the optimal viewing angle in Figure 11 A, antenna substrate AS can be and can be in its bottom (as see) there is projection on surface, this projection can be for example by use electroconductive binder (contrast Figure 10,1030) and module substrate MT top (as see) corresponding pad connection on surface.In Figure 11, projection (it can be pad) is shown as solid circle.
By avoiding as chip CM region is around left idle problem (contrast Fig. 8 C) by mutual connection line, this region can be used in the additional wire turn (or path) of antenna MA.Some paths in these additional paths shown in broken lines in Figure 11.
Antenna substrate AS can be opaque, or color is deeply dark, to hide module substrate MT, chip CM and antenna MA below.For example, if module substrate MT is transparent (parlex), this can be important security feature.
Antenna MA can be formed by lead-in wire, and it is embedded in antenna substrate AS, as US 6,233, shown in 818.Alternatively, antenna MA can be gone out (contrast Fig. 8 C) by the metal level (sheet metal) from antenna substrate AS by chemical etching.
Alternatively, antenna MA can be by laser-induced thermal etching, and this laser-induced thermal etching can allow meticulous spacing and more path.For example, use UV or green glow nanosecond or picosecond laser, to equal dimensionally the width of laser beam, (be roughly 25 μ path spacing m), the copper that is 17 μ m to thickness by antenna laser-induced thermal etching (insulation technology) covers in " seed " layer (the ventricumbent side of prepreg).After copper seed layer is carried out to laser-induced thermal etching, antenna substrate AS can be by being further processed with lower one or more: sandblast to be to remove the particle of remaining laser ablation, and for electroplating bonding preparing; Deposit carbon body is electroplated with the perforation of supporting perpendicular interconnection; Dry film application and photomask technique; (Cu～6 μ is m) to increase the thickness of path for chemical depositing copper; By nickel and nickel phosphorus (Ni/NiP～9 μ m) or nickel (m) (Pd/Au or Au-0.1 μ m/0.03 μ m or 0.2 μ m) electroplate in case oxidation Ni～9 μ with porpezite/gold or gold.
The US 7,229,022 that is incorporated in by reference this discloses at the substrate separating with the substrate that has RFID chip (two substrates have identical form) mounted antennas array with US 2008/0314990.Then, antenna substrate is placed in the substrate with RFID chip array, and the termination region of each antenna is manually connected to the each chip in transponder location separately.
Although described the present invention with reference to the execution mode of limited quantity, these execution modes should not be regarded as the restriction to scope of the present invention, and should serve as the example of some execution modes.Based on disclosure set forth herein, those skilled in the art can envision other possible modification, amendment and enforcement, and these modification, amendment and enforcement fall into protection scope of the present invention equally.

Claims (15)

1. the Anneta module for smart card (SC) (AM), this Anneta module (AM) comprising:
Substrate (MT, 202,402);
Chip (CM, 1010), be laid on the surface of described substrate (MT), and connect (Fig. 9, Figure 10) described lip-deep pad (1022) to described substrate (MT) in the mode of flip-chip; And
Antenna (MA, 230,430), is laid on the described surface of described substrate (MT), and is connected with described chip (CM);
It is characterized in that:
Supporting construction (DS, WC, 220,420) is fixed to the described surface of described substrate (MT), as the winding magnetic core for described antenna (MA);
Wherein, described supporting construction (DS, WC, 220,420) comprise tubular body portion (B), this tubular body portion (B) has two relative open end (220a/b, 420a/b), one of them open end is fixed to the described surface of described substrate (MT), and another open end is free end.
2. Anneta module according to claim 1 (AM), wherein:
Described supporting construction (WC, 420) has flange (F, 424), and the described free end (420a) that this flange (F, 424) is laid in described main part (B) around.
3. Anneta module according to claim 1 (AM), this Anneta module (AM) also comprises:
The dome packaging body (GT) that at least covers described chip (CM), is positioned at described supporting construction; And
Cover the mould piece (MM) of described chip (CM), described supporting construction (DS, WC) and described antenna (MA).
4. Anneta module according to claim 1 (AM), this Anneta module (AM) also comprises:
In the contrary lip-deep contact pad (CP) of described modular belt (MT), dock for contact.
5. one kind comprises the smart card (SC) of Anneta module claimed in claim 1 (AM), and this smart card (SC) also comprises:
Card (CB);
Gain antenna (BA), has the exterior section around of periphery that is laid in described card (CB); And
Coupling coil (CC), is laid in the interior zone of described card (CB);
Wherein, described Anneta module (AM) is laid in the described interior zone of described card (CB), for described antenna (MA) and described coupling coil (CC) induction are coupled.
6. smart card according to claim 5 (SC), wherein:
Groove (R) is provided in described card (CB), and this groove (R) is for holding described Anneta module (AM).
7. a method of manufacturing Anneta module (AM), the method comprises:
Substrate (MT) is installed and joined to chip (CM) in the mode of flip-chip;
It is characterized in that:
The tubular support structure (DS, WC, 220,420) with two relative open end (220a/b, 410a/b) is sticked on the surface of described substrate (MT, 202,402); And
Be wound around the lead-in wire for antenna (MA) around described tubular support structure (DS, WC).
8. method according to claim 7, the method also comprises:
Described substrate (MT) is being installed and joined to described chip (CM) before, by electric conducting material (1014,1024) be applied to lower at least one: the pad (1022) in projection (1012) and described substrate (1020) on described chip (CM, 1010).
9. method according to claim 8, wherein:
Described electric conducting material comprises nano silver wire.
10. method according to claim 7, the method also comprises:
Use flying trident coiling technology (Fig. 3) to be wound around described antenna (MA, 230,430).
11. 1 kinds of Anneta modules for smart card (SC) (AM), this Anneta module (AM) comprising:
Module substrate (MT); And
Chip (CM), is laid on the surface of described module substrate (MT);
It is characterized in that:
It is upper that antenna (MA) is laid in antenna substrate (AS), and this antenna substrate (AS) separates with described module substrate (MT);
Opening (OP) in described antenna substrate (AS), this opening (OP) for holding described chip (CM) in the time that described antenna substrate (AS) is incorporated into described module substrate (MT).
12. Anneta modules according to claim 11 (AM), wherein:
Described chip (CM) is installed and is connected to module substrate (MT) in the mode of flip-chip.
13. Anneta modules according to claim 11 (AM), wherein:
Described antenna (MA) comprises the lead-in wire being embedded in described antenna substrate (AS).
14. Anneta modules according to claim 11 (AM), wherein:
Described antenna (MA) is gone out by the etching metal layer described antenna substrate (AS).
15. Anneta modules according to claim 14 (AM), wherein:
Carry out etching with laser.
CN201380008129.0A 2012-02-05 2013-02-05 Rfid antenna modules and methods Pending CN104137335A (en)

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US201261595088P 2012-02-05 2012-02-05
US61/595,088 2012-02-05
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EPPCT/EP2012/066183 2012-08-20
US201261693262P 2012-08-25 2012-08-25
US61/693,262 2012-08-25
US201261704624P 2012-09-24 2012-09-24
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JP2015511353A (en) 2015-04-16
WO2013113945A1 (en) 2013-08-08
AU2013214133A1 (en) 2014-07-31
BR112014019291A2 (en) 2017-06-20
MX2014009459A (en) 2015-06-05

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Application publication date: 20141105