CN107423802A - Chip card and the method for manufacturing chip card - Google Patents
Chip card and the method for manufacturing chip card Download PDFInfo
- Publication number
- CN107423802A CN107423802A CN201710236800.7A CN201710236800A CN107423802A CN 107423802 A CN107423802 A CN 107423802A CN 201710236800 A CN201710236800 A CN 201710236800A CN 107423802 A CN107423802 A CN 107423802A
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- Prior art keywords
- chip
- recess
- card
- coupling
- blank portion
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
Abstract
A kind of chip card is provided in various embodiments.Chip card can have：Chip-card blank portion, the chip-card blank portion have the first recess for being used for accommodating chip carrier and in the first recess, the second recess for accommodating chip, the chip is arranged on chip carrier；And booster antenna structure, the booster antenna structure has the chip coupling regime for being used for that inductive to be carried out with chip, its chips coupling regime can have multiple coupling windings, its chips coupling regime can be embedded in chip-card blank portion, wherein the bottom of the second recess is arranged in chip-card blank portion compared with coupling the highest zone towards the second recess of winding more shallowly.
Description
Technical field
The present invention relates to a kind of chip card and a kind of method for manufacturing chip card.
Background technology
Chip card generally serves as contactless chip card, or is used as following chip card：The chip card can be real
The now data exchange with the non-contacting of the base station outside chip card and based on contact.
In both cases, so-called semiconductor module (also referred to as chip card module) can combine chip-card blank portion
It is used together, the semiconductor module can have chip carrier, such as chip carrier substrate, can on the chip carrier
Chip is installed, antenna can be provided with the chip-card blank portion (also referred to as gain antenna).
Figure 1 illustrates typical chip card module 100.
Chip card module 100 can have the contact side 102 for the operation based on contact, and the contact side can also claim
As ISO sides, because multiple contact sites 112 being arranged on contact side 102 are typically formed according to ISO 7816-2 specification.
In addition, chip card module 100 can have chip carrier 116, the chip carrier generally has polymer, such as
PET (PET), polyimides (PI) or laminated material.
Chip module 100 can also have chip 110.Chip 110 (can be turned over as so-called " flip-chip "
Turning so that the contact site of chip 110 is towards chip carrier 116) (correspondingly, the technique is also referred to as used as " upside-down mounting on plate for installation
Chip ").Chip 110 can be arranged on the second side 104 of chip card module 100.Correspondingly,
Two sides 104 can also be referred to as chip side 104.
Chip card module 100 can be formed as so-called COM modules.This is represented：It is provided with chip carrier 116 and core
The antenna 106 (also referred to as module antenna 106) that piece 110 connects, with by means of coming with the inductive of so-called gain antenna
Send and receive electric signal.This chip card module 100 is also referred to as used as " Coil-on-Module (coil module) " module or COM
Module (represents " coil module " module).
Figure 2 illustrates gain antenna 222, and it is as the gain antenna 222 being embedded into chip-card blank portion 220.
, can be by means of through hole, for example by means of the opening with conductive cladding, i.e. so-called in chip card module 100
" plated through holes " (PHT) connection for establishing between the terminal on the terminal in chip side and ISO sides.
Chip card module (COM moulds can be provided with the chip-card blank portion 220 with gain antenna 222 in fig. 2
Block) 100, and then formed and (be based on english term " Dual for the chip card based on contact and non-contacting data exchange
Interface, double interfaces ", this chip card are correspondingly also referred to as used as DIF chip cards).
This DIF chip cards in the field of public short distance traffic, authentication or banking for example for applying.
In order to using chip card module 100 as chip card a part install, such as in order to by chip card module 100 in area
It is embedded into domain 226 in chip-card blank portion 220, for example can provides or be provided with by means of milling in chip-card blank portion 220
Two-stage recess.
Such as (bottom) is shown in figure 3, and whole chip card module 100 can be provided with the first recess 330.
Can be provided with deeper second recess 226 chip 110 (such as flip-chip installation chip
110)。
Gain antenna 222 usually can be located approximately midway in chip card (or the same thick core of substantially 760 μ m-thicks
Piece card body portion 220) in, to avoid the mechanical imbalance of chip card and bending.
Here, when using DIF modules 100, typically, vertical position of second recess 226 than embedded gain antenna 222
Put deeper.In figure 3, this passes through following true visible：Second recess 226 is from the first surface 220s1 in chip-card blank portion 220
The depth 226t of measurement is more than such as the spacing 224h between lower plane and surface 220s1：The plane connection gain antenna 222
The surface towards first surface 220s1 of chip coupling regime 224.
Because second recess 226 stretches out the plane or its chip coupling regime 224 of gain antenna 222 from surface 220s1
Plane, so chip coupling regime 224 must be arranged to so that it is not damaged in formation, the second recess 226 of such as milling
It is bad.In addition to the second recess 226 is for width that chip 110 is arranged on needed for the second recess 226, it is necessary to provided with peace
Region-wide, to consider to produce tolerance, (such as the positioning of the alignment tolerance of gain antenna 222 or its chip coupling regime 224 is public
Difference and/or milling tolerance).
This is represented：The coupling regime 224 of gain antenna 222 can be relatively large with the lateral middle away from chip card module 100
Horizontal spacing set, and then between chip coupling regime 224 and chip card module 100 or the antenna 106 being disposed thereon
Only exist small lateral stacking.
In other words, the internal diameter 224i of gain antenna (or chip coupling regime 224) is more than the size (example of the second recess 226
Such as diameter) 226b.
Due to this limitation of gain antenna geometry (or chip coupling regime 224), damage gain antenna 222 (or
Its chip coupling regime 224) inductive between module antenna 106 quality.
Because it may require that gain antenna 222 (or its chip coupling regime 224) for good or optimal inductive
With the good superposition of module antenna 106, but because limitation can not be realized so that can limit the electrical efficiency of the design, such as
Minimum field strength HminAspect and/or (expression " Very High Bit Rate (the superelevation bits in terms of data transmission rate VHBR
Rate) ", German " sehrhohe Bitrate ").
On the other hand, in the presence of the demand for following chip card：In the chip card, eliminate (or at least reducing) and be described above
Device above-mentioned geometry limitation and (therefrom caused) electricity limitation.
The content of the invention
In various embodiments, there is provided there is the chip card of FCOS-COM modules, the FCOS-COM modules have pole
The semiconductor chip of its thin semiconductor chip, i.e. thickness in about 30 μm to about 80 μm of scope, the semiconductor core
Piece is a part for chip card, and the chip card has embedded antenna, such as wire antenna, for COM module inductives.
Rule of thumb, the thin chip of thickness in this range is sufficiently flexible, is fractureed to be resisted under mechanical load.Thin falls
The combined contactless COM modules of feasibility or availability of cartridge chip are shown.
In various embodiments, in order to which chip card module is embedded into chip card, the depth of the second recess can be small
In the spacing of the upside of gain antenna (or chip coupling regime of gain antenna) between the first surface in chip-card blank portion.By
This, can realize (transverse direction) superposition between the chip coupling regime of gain antenna and the second recess.
In various embodiments, extremely thin (such as substantially 30 μm to greatly to 80 μ m-thicks) upside-down mounting core can be used
Piece, the flip-chip can realize the second extremely flat recess, and second recess can be with the chip coupling of gain antenna
Conjunction region (such as laterally) superposition.Can be to this condition：The depth of second recess can be less than the chip of gain antenna
Spacing between the upside of coupling regime and the upside of chip card so that during (such as milling) second recess is formed, antenna,
Such as the danger that antenna cables will not be damaged.
Therefore, in various embodiments, using the teaching of the invention it is possible to provide or it is provided with following geometries of chip coupling regime：It is described
Geometry is provided and is superimposed with the good of the region of module antenna, and this causes the inductive of high quality.
Arrangement from routine according to different embodiments on the contrary, can realize：Select chip coupling regime with it is second recessed
The design of the unrelated electricity optimization of the geometry in portion.
In various embodiments, there is provided chip card.Chip card can have：Chip-card blank portion, the chip-card blank portion
With for accommodate the first recess of chip carrier and in the first recess, the second recess for accommodating chip, it is described
Chip is arranged on chip carrier；And booster antenna structure, the booster antenna structure, which has, to be used to carry out inductance coupling with chip
The chip coupling regime of conjunction, its chips coupling regime can have multiple coupling windings, and its chips coupling regime can be embedding
Enter in chip-card blank portion, wherein the bottom of the second recess is more shallow compared with coupling the highest zone towards the second recess of winding
It is arranged in chip-card blank portion.
In various embodiments, chip card can also have chip carrier and the core being arranged on the chip carrier
Piece, wherein chip carrier can be contained in the first recess；It is contained in its chips in the second recess.
In various embodiments, the bottom of the second recess can be with the maximum 450 μm depth in the surface away from chip-card blank portion
Degree is arranged in chip-card blank portion, and the first recess can be arranged in chip-card blank portion from the surface.
In various embodiments, booster antenna structure can be applied on carrier thin film, wherein the highest of coupling winding
Region can be the peak of the chip coupling regime of booster antenna structure.
In various embodiments, between the bottom of the second recess and the highest zone towards the second recess for coupling winding
Spacing can be at least 50 μm.
In various embodiments, at least five coupling windings in multiple coupling windings are laterally folded with the first recess
Add.
In various embodiments, there is provided chip card.Chip card can have：Chip-card blank portion, the chip-card blank portion
With for accommodate the first recess of chip carrier and in the first recess, the second recess for accommodating chip, it is described
Chip is arranged on chip carrier, wherein the first recess is laterally to chip carrier region gauge；And booster antenna structure, it is described
Booster antenna structure has the chip coupling regime for being used for that inductive to be carried out with chip, and its chips coupling regime can have
Multiple coupling windings, its chips coupling regime can be embedded in chip-card blank portion, and at least five in plurality of coupling winding
Individual coupling winding is laterally positioned within chip carrier region.
In various embodiments, chip can have 80 μm or smaller of thickness.
In various embodiments, at least a portion of chip coupling regime can be arranged on bottom and the core of the second recess
Between second side in piece card body portion, second side is opposite with first side in chip-card blank portion, and first side has first
Recess and the second recess.
In various embodiments, there is provided the method for manufacturing chip card.This method can have：By gain antenna knot
Structure is embedded into chip-card blank portion, and the booster antenna structure has the chip coupled zone for being used for that inductive to be carried out with chip
Domain, its chips coupling regime can have multiple coupling windings；Core will be arranged on for the first recess for accommodating chip carrier
In piece card body portion；With will be arranged on for the second recess for accommodating chip in the first recess, the chip can be arranged on chip
On carrier, wherein the bottom of the second recess with couple winding the highest zone towards the second recess compared with can be more shallow set
In chip-card blank portion.
In various embodiments, there is provided the method for manufacturing chip card.This method can have：By gain antenna knot
Structure is embedded into chip-card blank portion, and the booster antenna structure has the chip coupled zone for being used for that inductive to be carried out with chip
Domain, its chips coupling regime can have multiple coupling windings；Core will be arranged on for the first recess for accommodating chip carrier
In piece card body portion, wherein the first recess is laterally to chip carrier region gauge；With will be set for the second recess for accommodating chip
Put in the first recess, the chip can be arranged on chip carrier, at least five couplings in plurality of coupling winding
Winding can be laterally positioned within chip carrier region.
Brief description of the drawings
Embodiments of the invention are shown in the drawings and illustrated in detail below.
Accompanying drawing is shown：
Fig. 1 shows the schematic diagram with the upper side and lower side of the conventional chip carrier of chip and antenna component；
Fig. 2 shows the schematic diagram with the conventional chip card of gain antenna and the recess for being embedded in chip carrier；
Fig. 3 shows the schematic cross section with the chip-card blank portion for being used for the recess for being embedded in chip carrier, wherein not showing
Go out chip carrier and chip (top) or chip carrier and chip (lower section) are shown；
Fig. 4 shows the signal horizontal stroke according to the chip-card blank portion with the recess for being used to be embedded in chip carrier of different embodiments
Sectional view, chip carrier and chip (top) or chip carrier and chip (lower section) are shown not shown in it；
Fig. 5 shows schematic diagram (left side) and the increasing of the chip carrier with chip and antenna component according to different embodiments
The schematic diagram (right side) of the chip coupling regime of beneficial antenna, there is shown with the overlap-add region of antenna；
Fig. 6 shows the flow chart for being used to manufacture the method for chip card according to different embodiments；With
Fig. 7 shows the flow chart for being used to manufacture the method for chip card according to different embodiments.
Embodiment
Below in detailed description, with reference to appended accompanying drawing, the accompanying drawing forms a part for the description, and
In order to illustrate to show specific embodiment in the accompanying drawing, the present invention can be implemented in said embodiment.Thus,
Term such as described (multiple) accompanying drawing of the reference such as " top ", " lower section ", " front ", " rear ", "front", "rear" in direction takes
To use.Because the part of embodiment can be with a variety of different orientation positions, direction term is used to illustrate and not
It is restricted in any way.It should be understood that：Other embodiments can be used and can carry out in structure or patrol
Change on volume, without departing from protection scope of the present invention.It should be understood that：As long as no especially otherwise indicated, herein
The feature of the different exemplary embodiments of description can be just combined with each other.Therefore, the following detailed description can not manage
Solve to be restrictive, sense, and protection scope of the present invention is limited by following description.
Within the scope of this specification, term " connection ", " connection " and " coupling " is direct and indirect for describing
Connection, directly or indirect connection and directly or indirect coupling.In the accompanying drawings, same or similar element is provided with
Identical reference, as long as this is appropriate.
Fig. 4 shows the schematic cross section of chip card 401, and the chip card has chip-card blank portion 220, the chip card
Body portion has the recess 226,330 for being used for being embedded in chip carrier 116：According to different embodiments, the He of chip carrier 116 is not shown
Chip 110 (top), or chip carrier 116 and chip 110 (lower section) are shown.
Fig. 5 exemplifies chip card module 400 according to different implementation, has the chip of chip 110 and module antenna 106
The schematic diagram (right side) of the schematic diagram (left side) of carrier 116 and the chip coupling regime 224 of gain antenna 222, there is shown with day
The overlap-add region of line 106,224.
In various embodiments, equipment or equipment a part combination Fig. 4 and Fig. 5 description component, material, work
With, size, spacing etc. correspond to the component for combining Fig. 1 to 3 and describing, material, effect, size, spacing etc..Therefore, it is possible to not enter
Row repeats, and component, material, effect, size, spacing etc. can be provided with identical reference.
, can be in chip-card blank portion 220 from chip-card blank portion 220 according to different embodiments as figure 4 illustrates
First surface 220s1 rise and be provided with the first recess 330 with width 330b.
First recess 330 for example can be arranged in chip-card blank portion 220 by means of milling.Of course it is also possible to by other
Known method is used to form opening in chip-card blank portion 220.
Chip-card blank portion 220 is as described above can to have polymeric material, such as PET in various embodiments like that
And/or PI.For example, chip-card blank portion 220 can be formed to multilayer, such as with laminated material.The thickness in chip-card blank portion 220
Can be following typical thickness：The thickness for example can substantially 760 μm.Chip-card blank portion 220, which can have, to be different from
Appropriate thickness.
In various embodiments, the second recess 226 can be provided with the first recess 330.Second recess 226
If extend from the bottom of the first recess 330 away from the first recess 330.Second recess 226 can have width 226b and
Depth 226t, wherein the depth 226t of the second recess 226 can be measured from the first surface 220s1 in chip-card blank portion 220.The
Two recesses 226 for example can be arranged in chip-card blank portion 220 by means of milling.Of course it is also possible to by other known method
For forming opening in chip-card blank portion 220.
In various embodiments, the first recess 330 can be used in accommodating chip carrier 116, and the energy of the second recess 226
It is enough in the chip 110 for accommodating and being arranged on chip carrier 116.Chip 110 can be arranged on chip carrier as flip-chip
On 116.
Second recess 226 for example can be arranged on lateral center within the first recess 330.Certainly, the energy of the second recess 226
It is enough to be arranged within the first recess 330 so that when chip carrier 116 is arranged in the first recess 330, installed in chip
Chip 110 on carrier 116 is located approximately midway in the second recess 226.
In various embodiments, chip card 401 can have gain antenna 222 (also referred to as booster antenna structure
222).Gain antenna 222 can for example set, for example be embedded in chip-card blank portion 220.
In various embodiments, booster antenna structure can be applied on carrier thin film.
Gain antenna 222 in various embodiments can have be made up of metal, such as copper, corronil or aluminium,
Gain antenna winding in one plane is set.Gain antenna 222 can be formed as so that it has chip coupling regime
224, the chip coupling regime is formed as so that it can be with the chip that is laterally positioned within chip coupling regime 224
110 inductives or the inductive of module antenna 106 with being conductively connected with chip 110, the module antenna equally can
It is arranged within chip coupling regime 224.Chip coupling regime 224 can have multiple windings, also referred to as coupling winding.Core
Multiple windings of piece coupling regime 224 can form a plane, and the plane for example can be with being formed by gain antenna winding
Plane it is consistent.
Chip coupling regime 224 (or whole gain antenna 222) in various embodiments can be in chip-card blank portion
Be arranged in 220 so that the first surface 220s1 towards chip-card blank portion 220 of multiple windings of chip coupling regime 224 with
The spacing 224h of first surface 220s1 away from chip-card blank portion 220 is set.In various embodiments, the highest of winding is coupled
Region can be the peak of the chip coupling regime of booster antenna structure 222.
In various embodiments, the highest zone and the second recess 226 towards the second recess 226 of winding 224 are coupled
Bottom between spacing can be at least 50 μm.In other words, the upside of multiple windings of chip coupling regime 224 is away from chip card
Difference between the depth 226t of the first surface 220s1 in body portion 220 spacing 224h and the second recess 226 can be more than about 50
μm, such as about 60 μm, such as about 70 μm, such as about 80 μm.
In various embodiments, the highest zone and the second recess 226 towards the second recess 226 of winding 224 are coupled
Bottom between spacing can form safe spacing, not damaged when ensuring when forming the second recess 226, for example in milling
Bad coupling winding 224.
In various embodiments, the second recess 226 can have depth 226t, and the depth is less than chip-card blank portion
Spacing 224h between the upside of 220 first surface and multiple windings of chip coupling regime 224.
In various embodiments, this can be realized by using extremely thin chip 110, the chip for example with
Chip thickness in about 30 μm to about 80 μ ms, for example in about 50 μm to about 70 μm of scope.With reference to
Chip carrier 116 and adhesive 336, such as hot-press mucilage glue, can be the chip that be arranged in the first recess and the second recess
Card module 400 obtains about 250 μm of gross thickness (at the location of chip 110), wherein the chip carrier and adhesion
Agent can be jointly for example with about 100 μm to about 160 μm of thickness.
In various embodiments, the second recess 226 can have and be up to about 450 μm, for example be up to about 350
μm, the depth 226t that is for example up to about 300 μm, is for example up to about 250 μm.
In the case where depth capacity is greater than about 350 μm, the depth 226t of the second recess 226 is in different implementation
Example in certainly also can all the time be also less than chip-card blank portion 220 first surface 220s1 and chip coupling regime 224 it is multiple around
Group towards the spacing 224h between the first surface 220s1 in chip-card blank portion 220 upside.In this case, such as gain
Antenna 222 and chip coupling regime 224 are compared with the vertical center in chip-card blank portion 220 further from chip-card blank portion 220
First surface 220s1 is set.In this case for example also it is possible that：Use following chip 110：The chip is than extremely thin
Chip 110 it is thicker, such as using with general thickness, for example with no more than about 300 μm or even less than about 330
μm thickness chip 110.
Because first surface 220s1 and chip coupling regime 224 of second recess 226 with than chip-card blank portion 220
The depth 226t smaller towards the spacing 224h between the first surface 220s1 in chip-card blank portion 220 upside of multiple windings,
So it can realize in various embodiments：It can abandon coupling the internal diameter 224i of winding 224 and the width of the second recess 226
Horizontal safe spacing between 226b, that is, coupling winding 224 can be set independently of the second recess 226.
In various embodiments, horizontal chip carrier region can be limited by the first recess 330.Due to not passing through
Second recess 226 limits the configuration of chip coupling regime 224, can by multiple coupling windings of chip coupling regime 224, example
As at least five windings (for example, at least six, seven, eight, nine, ten, 11, ten two or more windings) are horizontal
It is arranged on to ground in chip carrier region.
In various embodiments, module antenna 106, the chip carrier energy can be provided with chip carrier 116
Enough it is arranged within the first recess 330.Module antenna 106 can have multiple module antenna windings.
Due to setting for example, at least five coupling windings, most three allowed with conventional design in chip carrier region
Compared to four winding superpositions, can obtain coupling the high superposition of winding and module antenna winding.This is considering other specifications
While can for example realize high data transmission rate and/or apply smaller response field strength.Here, especially by eight or more
Individual coupling winding be arranged on can be brought therewith in chip carrier region the significantly improving of efficiency (such as data transmission rate and/
Or in terms of response field strength).
In order to be contrasted, chip card module 400 is exemplified according to different implementations with identical size in Figure 5
(left side, as the diagrammatic top view of the second side 104 of chip carrier 116, chip 110 and mould are provided with second side
Block antenna 106) and show gain antenna 222 chip coupling regime 224 diagrammatic top view (right side).
This relatively in it is visible：If chip card module 400 is arranged in the first recess 330 so that chip 110 accommodates
(to this referring also to Fig. 4) in the second recess 226, then by that to perform in various embodiments of chip card module 400
Sample, which is vertically situated at, can cause on chip coupling regime 224 by the chip coupling regime 224 of gain antenna 222 or by mould
The bigger covering in the face that block antenna 106 covers, in other words, can cause module antenna 106 to be coupled with the chip of gain antenna
The bigger lateral stacking in region 224, this can bring the advantages of set out above therewith, such as in data transmission rate and/or sound
The advantages of answering field strength aspect.
In the chip card of routine, it must not only be protected with the region of 226 marks in the schematic diagram on the right of the second recess
The winding without chip coupling regime 224 is held, but also safe spacing must be kept so that can only form chip coupled zone
Substantially three outermost windings in domain 224.
In various embodiments, it is at least one at least a portion of chip coupling regime 224, such as coupling winding
Winding can be arranged on the bottom of the second recess 226, and (second recess is at the spacing 226t away from first surface 220s1
Place) between second side in chip-card blank portion 220, second side is opposite with first side in chip-card blank portion 220, and described the
Side has the first recess 330 and the second recess 226 (and for example also having first surface 220s1).This can cause coupling around
Above-mentioned covering and therefrom caused above-mentioned advantage of the group with module antenna winding.
Fig. 6 shows the flow chart 600 for being used to manufacture the method for chip card according to different embodiments.
In various embodiments, this method can have：Booster antenna structure is embedded into chip-card blank portion, it is described
Booster antenna structure has the chip coupling regime for being used for that inductive to be carried out with chip, and its chips coupling regime has multiple
Couple winding (in 610)；It will be arranged on for the first recess for accommodating chip carrier in chip-card blank portion (in 620)；With
It will be arranged on for the second recess for accommodating chip in the first recess, the chip is arranged on chip carrier, wherein second is recessed
The bottom in portion is arranged in chip-card blank portion (630 more shallowly compared with coupling the highest zone towards the second recess of winding
In).
Fig. 7 shows the flow chart 700 for being used to manufacture the method for chip card according to different embodiments.
In various embodiments, this method can have：Booster antenna structure is embedded into chip-card blank portion, it is described
Booster antenna structure has the chip coupling regime for being used for that inductive to be carried out with chip, and its chips coupling regime has multiple
Couple winding (in 710)；It will be arranged on for the first recess for accommodating chip carrier in chip-card blank portion (in 720)；And
And will be arranged on for the second recess for accommodating chip in the first recess, the chip is arranged on chip carrier, plurality of
At least five coupling windings in coupling winding are laterally positioned within chip carrier region (in 730).
Other favourable designs of method are drawn from the description to equipment and vice versa.
Claims (11)
1. a kind of chip card, the chip card has：
Chip-card blank portion, the chip-card blank portion, which has, is used to accommodating the first recess of chip carrier and recessed in described first
Second recess in portion, for accommodating chip, the chip are arranged on the chip carrier；With
Booster antenna structure, the booster antenna structure have the chip coupled zone for being used for that inductive to be carried out with the chip
Domain, wherein the chip coupling regime has multiple coupling windings, wherein the chip coupling regime is embedded in the chip-card blank
In portion,
The bottom of wherein described second recess with it is described coupling winding the highest zone towards second recess compared with more
It is arranged on shallowly in the chip-card blank portion.
2. chip card according to claim 1, the chip card also has：
The chip carrier and the chip being arranged on the chip carrier；
Wherein described chip carrier is contained in first recess；With
Wherein described chip is contained in second recess.
3. chip card according to claim 1 or 2,
The bottom of wherein described second recess is arranged on the core with the maximum 450 μm depth in the surface away from the chip-card blank portion
In piece card body portion, first recess is arranged on from the surface in the chip-card blank portion.
4. chip card according to any one of claim 1 to 3,
Wherein described booster antenna structure is applied on carrier thin film；
Wherein it is described coupling winding the highest zone be the chip coupling regime of the booster antenna structure most
High point.
5. chip card according to any one of claim 1 to 4,
Between the highest zone towards second recess of the bottom of wherein described second recess and the coupling winding
Spacing be at least 50 μm.
6. chip card according to any one of claim 1 to 5,
At least five coupling windings in the plurality of coupling winding are laterally superimposed with first recess.
7. a kind of chip card, the chip card has：
Chip-card blank portion, the chip-card blank portion, which has, is used to accommodating the first recess of chip carrier and recessed in described first
Second recess in portion, for accommodating chip, the chip are arranged on the chip carrier, wherein first recess is horizontal
To ground to chip carrier region gauge；With
Booster antenna structure, the booster antenna structure have the chip coupled zone for being used for that inductive to be carried out with the chip
Domain, wherein the chip coupling regime has multiple coupling windings, wherein the chip coupling regime is embedded in the chip-card blank
In portion, it is plurality of it is described coupling winding at least five coupling windings be laterally positioned in the chip carrier region it
It is interior.
8. the chip card according to any one of the claims,
Wherein described chip has 80 μm or smaller of thickness.
9. the chip card according to any one of the claims,
At least a portion of wherein described chip coupling regime is arranged on the bottom of second recess and the chip-card blank portion
The second side between, second side is opposite with first side in the chip-card blank portion, and first side has described first
Recess and second recess.
10. a kind of method for manufacturing chip card, methods described has：
Booster antenna structure is embedded into chip-card blank portion, the booster antenna structure, which has, to be used to carry out inductance with chip
The chip coupling regime of coupling, wherein the chip coupling regime has multiple coupling windings；
It will be arranged on for accommodating the first recess of chip carrier in the chip-card blank portion；With
It will be arranged on for accommodating the second recess of chip in first recess, the chip is arranged on the chip carrier
On；
The bottom of wherein described second recess with it is described coupling winding the highest zone towards second recess compared with more
It is arranged on shallowly in the chip-card blank portion.
11. a kind of method for manufacturing chip card, methods described has：
Booster antenna structure is embedded into chip-card blank portion, the booster antenna structure, which has, to be used to carry out inductance with chip
The chip coupling regime of coupling, wherein the chip coupling regime has multiple coupling windings；
It will be arranged on for accommodating the first recess of chip carrier in the chip-card blank portion, wherein first recess is horizontal
Ground is to chip carrier region gauge；With
It will be arranged on for accommodating the second recess of chip in first recess, the chip is arranged on the chip carrier
On；
It is plurality of it is described coupling winding at least five coupling windings be laterally positioned in the chip carrier region it
It is interior.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016106698.2 | 2016-04-12 | ||
| DE102016106698.2A DE102016106698A1 (en) | 2016-04-12 | 2016-04-12 | Chip card and method for producing a chip card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107423802A true CN107423802A (en) | 2017-12-01 |
Family
ID=59929668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710236800.7A Pending CN107423802A (en) | 2016-04-12 | 2017-04-12 | Chip card and the method for manufacturing chip card |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20170293833A1 (en) |
| CN (1) | CN107423802A (en) |
| DE (1) | DE102016106698A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111224213A (en) * | 2018-11-23 | 2020-06-02 | 英飞凌科技股份有限公司 | Chip card |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3098324B1 (en) * | 2019-07-04 | 2021-09-24 | Smart Packaging Solutions | Electronic module for smart card |
| JP1662551S (en) * | 2019-09-06 | 2020-06-29 |
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Also Published As
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| US20170293833A1 (en) | 2017-10-12 |
| DE102016106698A1 (en) | 2017-10-12 |
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