CN103366215A - Data carrier for contactless data transmission and method for producing the same - Google Patents
Data carrier for contactless data transmission and method for producing the same Download PDFInfo
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- CN103366215A CN103366215A CN2013101146805A CN201310114680A CN103366215A CN 103366215 A CN103366215 A CN 103366215A CN 2013101146805 A CN2013101146805 A CN 2013101146805A CN 201310114680 A CN201310114680 A CN 201310114680A CN 103366215 A CN103366215 A CN 103366215A
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- data carrier
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- carrier according
- day line
- copper facing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Near-Field Transmission Systems (AREA)
- Details Of Aerials (AREA)
Abstract
The invention relates to a data carrier for contactless data transmission and a method for producing the same. The data carrier for contactless data transmission comprises a substrate, and a chip having at least one connecting pad, wherein the chip is arranged on the substrate with one side thereof which is away from the connecting pad, and a first copper-plated prepreg layer is arranged on the chip and at least partially arranged on the substrate and has a contact opening facing the connecting pad. A plated-through-hole is located in the contact opening and used for generating conductive connection between the connecting pad of the chip and a copper layer of the first copper-plated prepreg layer, wherein a first antenna structure is formed in the copper layer of the first copper-plated prepreg layer.
Description
Related application
The application is in the part continuation application of the common pending trial U.S. Patent application No. 12/556,404 of submission on September 9th, 2009.U.S. Patent application No. 12/556,404 requires in the benefit of priority of the German patent application No. 102008046407.4 of submission on September 9th, 2008.The full content of U.S. Patent application No. 12/556,404 and German patent application No. 102008046407.4 is incorporated this paper thus by reference into.
Background technology
In many kinds of service sectors (for example, in cashless payment transaction or in the field as the person identifier of I.D., E-Passport etc.) have the data carrier of integrated circuit such as the form use with credit card, bank card, the card of paying in cash etc.In these data carriers of vast scale, utilize contact via the external contact district of electronic module realize power supply and/or with the exchanges data of external unit.Because in the situation that these data carriers have exposed the contact region that is used for data carrier is connected to read/write equipment, therefore have following risk: the contact region is polluted, thus, because poor contact forms, the data transmission that between the relevant read/write equipment of data carrier and terminal, may make a mistake.For fear of defects, developed contactless data carrier, that is, be used for the data carrier of contactless exchanges data (for example, passing through inductive coupling).
Especially, because to the ever-increasing needs of the document that can contactlessly read that is used for person identifier (such as, E-Passport), contactless application needs the especially thin robust data carrier that can have cost-benefit ground to produce.
DE 102 00 569 A1 disclose a kind of smart cards that comprise a plurality of card layers, and card is stacked puts and be connected to each other by heat and pressure for these.Interior carrier layer has: aerial coil, the coil pad that has a plurality of conductor rails and be arranged in the place, end; And cut away section, be used for admitting chip module.The contact that the coil pad is arranged in the both sides in the conductor rail cross section that is formed by the conductor rail of advancing side by side each other forms in the district.
Because the direct contact that chip module is connected with the chip of the coil pad of aerial coil connection, although realized the structure of the generally relatively flat of smart card, the generation with this smart card of its three-layer structure be complexity and the cost intensity.
Summary of the invention
Embodiment described herein provides can be simply and the data carrier with contactless coupling that has cost-benefit ground to produce.
In a specific implementations, a kind of data carrier for contactless data transmission comprises: substrate; Chip has at least one connection gasket, and wherein, described chip is arranged on the described substrate with its side away from described connection gasket; The first copper facing preimpregnation bed of material, wherein, the described first copper facing preimpregnation bed of material is arranged on the described chip and is arranged at least in part on the described substrate, and has the contact openings towards described connection gasket; And plated-through-hole, be in the described contact openings, be used between the copper layer of the connection gasket of described chip and the described first copper facing preimpregnation bed of material, producing conduction and be connected, wherein, formation first day line structure in the copper layer of the described first copper facing preimpregnation bed of material.
In addition, can comprise the chip with at least one connection gasket according to the data carrier of described embodiment, wherein, chip is arranged on the substrate with its side away from connection gasket (that is, rear side).In this case, for example, chip can attenuation or not attenuation (unthinned), perhaps can be arranged in shell.In addition, can chip be fixed on the substrate by suitable bonding agent.The copper facing preimpregnation bed of material is arranged on the chip and is arranged on the substrate at least in part.The copper facing preimpregnation bed of material has the contact openings of the connection gasket top that is in chip.Plated-through-hole in contact openings is used for producing to conduct electricity between the copper layer of the connection gasket of chip and the copper facing preimpregnation bed of material being connected.To for example can be formed in the copper layer of the copper facing preimpregnation bed of material by the antenna structure that engraving method produces.
Can simply and there be cost-benefit ground to produce the data carrier of constructing with two stage method.This is by realizing with the copper facing preimpregnation bed of material with antenna structure.
In another specific implementations, a kind of method of the data carrier for generation of being used for contactless data transmission can comprise: will have the chip layout of at least one connection gasket at substrate, wherein, the side away from described connection gasket of described chip is connected to described substrate; The first copper facing prepreg is pressed in layer by layer on the described chip and is laminated at least in part on the described substrate; The contact openings that will be in the connection gasket top of described chip is incorporated in the described copper facing preimpregnation bed of material; Between the copper layer of the connection gasket of described chip and the described copper facing preimpregnation bed of material, produce plated-through-hole; And in the copper layer of the described copper facing preimpregnation bed of material, form antenna structure.
For example can when finishing, introduce production process or form antenna structure.For example form antenna structure by engraving method.In addition, replacedly, can before being pressed in layer by layer the copper facing prepreg wherein, form antenna structure.On the principle, can carry out structuring to the copper facing preimpregnation bed of material before producing data carrier, that is, can use the pre-structurized copper facing preimpregnation bed of material, then the described pre-structurized copper facing preimpregnation bed of material suitably is arranged on the chip.As example, can be with antenna structure and the pre-structuring of electric component to the copper layer, and can or bore a hole pre-structuring to the whole copper facing preimpregnation bed of material with the hole.
In order to produce plated-through-hole, for example, can carry out chemokinesis to the wall in hole, and can carry out subsequently chemistry or chemical electrolysis copper deposition.Then, being electrically connected between this copper deposition connection gasket of causing chip and the copper facing preimpregnation bed of material.
In another illustrative embodiments, the antenna structure of described data carrier can be coil form.
In order to obtain the better stability of data carrier, hardening component can be arranged between chip and the substrate.As example, hardening component is comprised of metal.
In another illustrative embodiments, with described antenna structure side by side, data carrier has another second day line structure, described second day line structure is coupled to described chip equally.In order to increase its inductance, can be connected in series two antenna structures.The second day line structure can for example be the coil with at least one circle.Replacedly, for example, if substrate is the copper facing printed circuit board (PCB), then can directly form the second day line structure at substrate.The example of suitable printed circuit board (PCB) is to be coated with epoxy resin copper, CuSn6(also to have surface through refining, for example Ag, Sn) copper or be coated with FR4 resin copper printed circuit board (PCB) of resinizing.The second day line structure can be arranged on the side of object chip of substrate, be arranged in substrate away from that side of chip or be arranged on these both sides of substrate.If the second day line structure is arranged on these both sides of substrate, then the various piece of antenna structure can connect by through hole.
With the second day line structure side by side, can also arrange any expectation electric component, for example capacitor at substrate.
Inductive coupling that can be by two antenna structures or by these antenna structure or second day line structure directly with chip between direct conduction is connected the coupling of realization chip and second day line structure.
In another illustrative embodiments, described data carrier can also have one or more interlayers and/or overlayer.
Interlayer can for example be arranged between the substrate and the copper facing preimpregnation bed of material that is furnished with chip.In this case, interlayer can have for the contact openings that produces the plated-through-hole that conduction is connected between the copper layer of the connection gasket of chip and the copper facing preimpregnation bed of material.
In another illustrative embodiments, described interlayer can have another third antenna structure.In this case, described interlayer can be the single preimpregnation bed of material or another the second copper facing preimpregnation bed of material.
For example, the data carrier according to each embodiment can be inserted into smart card, interface card or be used in the document (for example, E-Passport) of person identifier.
Description of drawings
With reference to accompanying drawing embodiment is described.In the accompanying drawings, the leftmost side Digital ID of reference marker the figure that occurs first of reference marker.In the different instances in instructions and the accompanying drawing, can indicate similar or identical project to the use of same reference numbers.
Fig. 1 shows the first illustrative embodiments of data carrier with xsect.
Fig. 2 shows the vertical view of the illustrative embodiments of data carrier.
Fig. 3 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier has the second antenna surface.
Fig. 4 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier has the second day line structure.
Fig. 5 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier has the second day line structure.
Fig. 6 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier has interlayer.
Fig. 7 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier has interlayer.
Fig. 8 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier has hardening component.
Fig. 9 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier has hardening component.
Figure 10 shows another illustrative embodiments of data carrier with xsect, wherein, data carrier comprises extra play at least, and this extra play comprises condenser armature, capacitor or electric capacity.
Embodiment
Fig. 1 shows the illustrative embodiments of data carrier 10 with xsect.By bonding coat 60 chip is fixed on the substrate 20.Chip 30 has two connection gaskets 35, and is arranged on the substrate 20 with its rear side away from connection gasket 35.The copper facing preimpregnation bed of material 40 is arranged in chip 30 and substrate 20 tops.The copper facing preimpregnation bed of material is also called RCC paper tinsel or resin coated copper foil.In the copper facing preimpregnation bed of material 40, two plated-through-holes 50 are positioned at connection gasket 35 tops.In each situation, two plated-through-holes 50 are arranged in contact openings 45.As example, can contact openings be incorporated in the copper facing preimpregnation bed of material by laser drill.Two plated-through-holes 50 are used for producing to conduct electricity between the copper layer of the connection gasket 35 of chip 30 and the copper facing preimpregnation bed of material 40 being connected.In the copper layer of the copper facing preimpregnation bed of material 40, form antenna structure 48.In this illustrative embodiments, antenna structure 48 comprises the coil with a plurality of circles.
Fig. 2 shows the vertical view of the illustrative embodiments of data carrier 10.In this illustrative embodiments, form the antenna structure 48 of coil form at the copper facing preimpregnation bed of material 40.At place, the end of antenna structure 48, in each situation, form the connection gasket 35(signal here of object chip) plated-through-hole 50.
Fig. 3 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier has the second day line structure.Except illustrative embodiments shown in Figure 1, this illustrative embodiments also has second day line structure 28 in that side away from chip 30 of substrate 20.Substrate 20 can for example be the copper facing printed circuit board (PCB), has formed corresponding antenna structure 28 thereon.Second day line structure 28 is connected to first day line structure 48 by plated-through-hole 70 conductions.First day line structure 48 is connected to two connection gaskets 35 of chip 30 by plated-through-hole 50.
Fig. 4 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier has the second day line structure equally.Compare with illustrative embodiments shown in Figure 3, here, second day line structure 28 is positioned on that side of object chip 30 of substrate 20.In this illustrative embodiments, first day line structure 48 is connected with the second day line structure by plated-through-hole 70 conduction connections equally.Have also that the conduction by plated-through-hole 50 is connected between the connection gasket 35 of first day line structure 48 and chip 30.
Fig. 5 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier has the second day line structure.In this illustrative embodiments, second day line structure 28 extends on the top side and downside of substrate 20.Two parts of second day line structure 28 are by plated-through-hole 29 connections each other in an electrically conductive.In this illustrative embodiments, second day line structure 28 is connected to first day line structure 48 by plated-through-hole 70 conductions equally.First day line structure 48 is connected to the connection gasket 35 of chip by plated-through-hole 50 conductions.
Fig. 6 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier has interlayer 80.Interlayer 80 is between the substrate 20 that is applied with chip 30 and the copper facing preimpregnation bed of material 40.Shown in illustrative embodiments in, interlayer 80 is the copper facing preimpregnation bed of material equally.In the copper layer of the copper facing preimpregnation bed of material of interlayer 80, form conductor structure 82.With contact openings 85 and plated-through-hole 90 side by side, the part that the connection gasket 35 that described conductor structure 82 is chips 30 is connected with conduction between the antenna structure 48.
Fig. 7 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier has interlayer 80.Compare with illustrative embodiments shown in Figure 6, this illustrative embodiments has the interlayer 80 with another antenna structure 88.Before applying the copper facing preimpregnation bed of material 40, with antenna structure 88 structurings to the copper layer of the copper facing preimpregnation bed of material of interlayer 80.In this illustrative embodiments, antenna structure 88 is the coils with a plurality of circles.Antenna structure 88 is connected with antenna structure and is connected by plated-through-hole 70 and the conduction of being connected.
Fig. 8 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier 10 has hardening component 100.Hardening component 100 is arranged between substrate 20 and the chip 30.Chip 30 and hardening component 100 are connected to each other by bonding coat 60.As in the illustrative embodiments among Fig. 1, by the plated-through-hole 50 that is arranged in contact openings 45, between the connection gasket 35 of chip 30 and antenna structure 48, realize that conduction is connected.
Fig. 9 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier has hardening component 100.In this illustrative embodiments, data carrier 10 not only has hardening component, and has additional interlayer 80.Hardening component 100 is between the copper facing preimpregnation bed of material 40 and interlayer 80.In this illustrative embodiments, interlayer 80 be equally have with Fig. 7 in the copper facing preimpregnation bed of material of the similar antenna structure 88 of illustrative embodiments.
Figure 10 shows another illustrative embodiments of data carrier 10 with xsect, wherein, data carrier 10 comprises extra play (for example, the preimpregnation bed of material) at least, and this extra play comprises condenser armature, capacitor or electric capacity.By bonding coat 60 chip 30 is fixed on the substrate 20.Chip 30 has two connection gaskets 35.The copper facing preimpregnation bed of material 40 is arranged on chip 30 and the substrate 20 and (perhaps according to orientation, arranges under it).According to the orientation of the object of institute's reference, this paper to ' ... on ' use also can represent ' exist ... under '.The copper facing preimpregnation bed of material 40 is arranged on chip 30 and the substrate 20.The copper facing preimpregnation bed of material 40 also is called as RCC paper tinsel or resin coated copper foil.In the copper facing preimpregnation bed of material 40, two plated-through-holes 50 are positioned on the connection gasket 35.In each situation, these two plated-through-holes 50 are arranged in contact openings 45.As example, can contact openings be incorporated in the copper facing preimpregnation bed of material 40 by laser drill.This two plated-through-holes 50 are used for producing to conduct electricity between the copper layer of the connection gasket 35 of chip 30 and the copper facing preimpregnation bed of material 40 being connected.In the copper layer of the copper facing preimpregnation bed of material 40, form antenna structure 48.In this illustrative embodiments, antenna structure 48 comprises the coil with a plurality of circles.
Figure 10 has also illustrated to being positioned at two extra plays 104 on chip 30 and the antenna structure 48 and 106 use.In the layer 104 and 106 each can comprise the preimpregnation bed of material 40 and condenser armature 108, capacitor or electric capacity.Can not use two extra plays 104.On the contrary, can use single layer 104.In addition, can be with the one or more Rotate 180 degree in layer 104 and/or 106, so that the location of the preimpregnation bed of material 40 and electric capacity 108 is opposite with the location of illustrating.In addition, this layer 104 and/or 106 can be used with other embodiment of the present disclosure.
Figure 10 has also illustrated to have the extra play 40 of another antenna structure 112.Antenna structure 112 by structuring to the copper layer of the copper facing preimpregnation bed of material of extra play 40.In this illustrative embodiments, antenna structure 112 is the coils with a plurality of circles.Antenna structure 112 is connected with antenna structure and is connected by at least one or a plurality of plated-through-hole 114 conductions.
Can strengthen the capacity of antenna structure disclosed herein to one or more use of layer in 104 and 106 with electric capacity attribute, thereby remove in the situation that require the additional antenna capacity to use the needs of exterior antenna.In addition, one or more layer 104 and 106 can structurally strengthen data carrier configuration disclosed herein, so that can reduce each layer of structure and/or can reduce in size or even eliminate hardening component.
Claims (22)
1. data carrier that is used for contactless data transmission comprises:
Substrate;
Chip has at least one connection gasket, and wherein, described chip layout is on described substrate;
The first copper facing preimpregnation bed of material, the described first copper facing preimpregnation bed of material are arranged on described chip and the described substrate and have contact openings towards described connection gasket;
Plated-through-hole is in the described contact openings, and be used between the copper layer of the connection gasket of described chip and the described first copper facing preimpregnation bed of material, producing conduction and be connected, wherein, formation first day line structure in the copper layer of the described first copper facing preimpregnation bed of material; And
The first capacitance structure forms on the described first copper facing preimpregnation bed of material, and described the first capacitance structure is electrically coupled to described chip.
2. data carrier according to claim 1, wherein, described first day line structure is that the form with coil of at least one circle forms.
3. data carrier according to claim 1 wherein, is arranged hardening component between substrate and chip.
4. data carrier according to claim 3, wherein, described hardening component is comprised of metal.
5. data carrier according to claim 1, wherein, described data carrier has the second day line structure and described second day line structure is coupled to described chip.
6. data carrier according to claim 5, wherein, described second day line structure is the coil with at least one circle.
7. data carrier according to claim 5, wherein, described second day line structure is formed in the copper layer that applies on the described substrate.
8. data carrier according to claim 7, wherein, described second day line structure is that the form with coil of at least one circle forms.
9. data carrier according to claim 5, wherein, described second day line structure be arranged in described substrate on that side of described chip.
10. data carrier according to claim 5, wherein, described second day line structure is arranged on that side away from described chip of described substrate.
11. data carrier according to claim 5, wherein, described second day line structure be arranged in described substrate on that side of described chip and be arranged on that side away from described chip of described substrate.
12. data carrier according to claim 5, wherein, described chip is inductively coupled to described second day line structure by described first day line structure.
13. data carrier according to claim 5, wherein, described chip is coupled to described second day line structure by the conduction connection.
14. data carrier according to claim 1 also comprises: the second capacitance structure, on described the second capacitance structure, form, described the second capacitance structure is electrically coupled to described chip.
15. data carrier according to claim 1, also comprise interlayer, wherein, described interlayer is arranged between the substrate and the described first copper facing preimpregnation bed of material that is furnished with chip, wherein, described interlayer has for the contact openings that produces the plated-through-hole that conduction is connected between the copper layer of the connection gasket of described chip and the described first copper facing preimpregnation bed of material.
16. data carrier according to claim 1, wherein, described the first capacitance structure comprises the preimpregnation bed of material and condenser armature.
17. data carrier according to claim 15, wherein, described interlayer is the preimpregnation bed of material.
18. data carrier according to claim 15, wherein, described interlayer is the second copper facing preimpregnation bed of material.
19. the method for generation of the data carrier that is used for contactless data transmission comprises:
To have the chip layout of at least one connection gasket on substrate;
The first copper facing prepreg is pressed in layer by layer on the described chip and is laminated at least in part on the described substrate;
The contact openings that will be in described connection gasket top is incorporated in the described first copper facing preimpregnation bed of material;
Between the copper layer of the connection gasket of described chip and the described first copper facing preimpregnation bed of material, produce plated-through-hole;
In the copper layer of the described first copper facing preimpregnation bed of material, form the first day line structure; And
Form the first capacitance structure on the described first copper facing preimpregnation bed of material, described the first capacitance structure is electrically coupled to described chip.
20. the method for generation of data carrier according to claim 19, wherein, the process that forms the first day line structure in the copper layer of the described first copper facing preimpregnation bed of material was carried out before the process of the lamination first copper facing preimpregnation bed of material.
21. the method for generation of data carrier according to claim 19, wherein, the process that forms the first day line structure in the copper layer of the described first copper facing preimpregnation bed of material is carried out after the process of the lamination first copper facing preimpregnation bed of material.
22. the method for generation of data carrier according to claim 19, wherein, described substrate has the copper layer, and described copper layer is structurized before applying described chip.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/440,156 US8724340B2 (en) | 2008-09-09 | 2012-04-05 | Data carrier for contactless data transmission and a method for producing such a data carrier |
| US13/440,156 | 2012-04-05 | ||
| US13/440156 | 2012-04-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103366215A true CN103366215A (en) | 2013-10-23 |
| CN103366215B CN103366215B (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310114680.5A Active CN103366215B (en) | 2012-04-05 | 2013-04-03 | The data medium transmitted for contactless data and production method thereof |
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| CN (1) | CN103366215B (en) |
| DE (1) | DE102013103365B4 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762418A (en) * | 2014-01-09 | 2014-04-30 | 东莞晶汇半导体有限公司 | Technology for sputtering antenna on surface of radio frequency module |
| CN106374208A (en) * | 2016-10-09 | 2017-02-01 | 华进半导体封装先导技术研发中心有限公司 | High-bandwidth organic substrate antenna structure and manufacturing method |
| CN111937007A (en) * | 2018-04-09 | 2020-11-13 | 捷德移动安全有限责任公司 | Portable dual-interface data carrier with metal frame |
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| DE102020126881B3 (en) | 2020-10-13 | 2021-11-18 | Infineon Technologies Ag | Chip card body, method for forming a chip card body and chip card |
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| US20100067200A1 (en) * | 2008-09-09 | 2010-03-18 | Henrik Ewe | Data carrier for contactless data transmission and a method for producing such a data carrier |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762418A (en) * | 2014-01-09 | 2014-04-30 | 东莞晶汇半导体有限公司 | Technology for sputtering antenna on surface of radio frequency module |
| CN106374208A (en) * | 2016-10-09 | 2017-02-01 | 华进半导体封装先导技术研发中心有限公司 | High-bandwidth organic substrate antenna structure and manufacturing method |
| CN106374208B (en) * | 2016-10-09 | 2019-06-18 | 华进半导体封装先导技术研发中心有限公司 | High bandwidth organic substrate antenna structure and production method |
| CN111937007A (en) * | 2018-04-09 | 2020-11-13 | 捷德移动安全有限责任公司 | Portable dual-interface data carrier with metal frame |
| CN111937007B (en) * | 2018-04-09 | 2024-04-19 | 捷德移动安全有限责任公司 | Portable dual interface data carrier with metal frame |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102013103365B4 (en) | 2022-02-03 |
| DE102013103365A1 (en) | 2013-10-10 |
| CN103366215B (en) | 2016-08-03 |
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