DE4431606A1 - Chip card module with copper coil on a carrier - Google Patents

Chip card module with copper coil on a carrier

Info

Publication number
DE4431606A1
DE4431606A1 DE4431606A DE4431606A DE4431606A1 DE 4431606 A1 DE4431606 A1 DE 4431606A1 DE 4431606 A DE4431606 A DE 4431606A DE 4431606 A DE4431606 A DE 4431606A DE 4431606 A1 DE4431606 A1 DE 4431606A1
Authority
DE
Germany
Prior art keywords
card module
semiconductor chip
chip card
chip
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE4431606A
Other languages
German (de)
Inventor
Josef Dipl Ing Mundigl
Detlef Dipl Ing Houdeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE4431606A priority Critical patent/DE4431606A1/en
Publication of DE4431606A1 publication Critical patent/DE4431606A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05644—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/4569—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48799—Principal constituent of the connecting portion of the wire connector being Copper (Cu)
    • H01L2224/488—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48838—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/48844—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20755—Diameter ranges larger or equal to 50 microns less than 60 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20756—Diameter ranges larger or equal to 60 microns less than 70 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20757—Diameter ranges larger or equal to 70 microns less than 80 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20758—Diameter ranges larger or equal to 80 microns less than 90 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20759—Diameter ranges larger or equal to 90 microns less than 100 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/2076—Diameter ranges equal to or larger than 100 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

A flat carrier (1) of flexible non-conducting material has a recess (2) into which a semiconductor chip (3) is inserted and fastened with an adhesive (4). A coil (7) of lacquer-insulated Cu wire is positioned on the carrier. The ends of the coil are coated with a soft Sn solder to join the coil to the chip on chip contact areas (5) with local melting. Pref. the contact areas are enlarged with a Au deposit.

Description

Die Erfindung betrifft einen Chipkartenmodul mit einem auf einem flexiblen, nicht-leitenden Trägerkörper angeordneten Halbleiterchip, mit dem die zwei Enden einer Lackdrahtspule elektrisch leitend verbunden sind sowie ein Verfahren zu des­ sen Herstellung.The invention relates to a chip card module with a a flexible, non-conductive support body Semiconductor chip, with which the two ends of a magnet wire coil are electrically connected and a method for the production.

Bei solchen Chipkartenmodulen werden üblicherweise lackiso­ lierte Kupfer-Wickeldrahte mit etwa 50 bis 250 µm Durchmesser verwendet. Die Enden der Spule werden mittels leitender Ver­ bindungen, z. B. Silberleitkleber, mit dem Halbleiterchip ver­ bunden.In such chip card modules are usually lackiso gelled copper winding wires with a diameter of about 50 to 250 µm used. The ends of the coil are connected by means of conductive Ver ties, e.g. B. conductive silver adhesive with the semiconductor chip ver bound.

Da Chipkarten und somit auch die für den Einbau in eine Chip­ karte bestimmten Chipkartenmodule in großen Stückzahlen her­ gestellt werden, muß ein kostengünstiges und einfaches, d. h. also ein möglichst leicht automatisierbares Verfahren zu ihrer Herstellung gefunden werden.Since chip cards and therefore also those for installation in a chip certain chip card modules in large numbers be provided, an inexpensive and simple, d. H. a process that can be automated as easily as possible their manufacture can be found.

Die Aufgabe der Erfindung ist es also, einen Chipkartenmodul sowie ein Verfahren zur Herstellung eines Chipkartenmoduls anzugeben, der oder das diese Forderungen erfüllt.The object of the invention is therefore a chip card module and a method for producing a chip card module indicate who meets these requirements.

Die Aufgabe wird durch einen Chipkartenmodul gemäß Anspruch 1 sowie ein Verfahren gemäß Anspruch 5 gelöst. Vorteilhafte Weiterbildungen der Erfindung sind in den abhängigen Ansprü­ chen angegeben.The object is achieved by a chip card module according to claim 1 and a method according to claim 5 solved. Beneficial Further developments of the invention are in the dependent claims Chen specified.

Vorzugsweise werden die Enden mit einem Lötzinn durch Eintau­ chen in ein Zinnbad versehen, so daß sie auf einfache Weide durch lokales Aufschmelzen des Weichlotes auf Kontaktfelder des Halbleiterchips mit diesem verbunden werden können. Der Trägerkörper muß dabei aus einem temperaturbeständigen Ther­ moplast sein, der die Anforderungen an Weichlötungen erfüllt. Ein besonderer Vorteil der Erfindung ist, daß durch die Ver­ zinnung nicht nur Weichlot an die Enden der Lackdrahtspule gebracht wird, sondern auch die Schutzlackschicht entfernt wird. Somit spart man sich einen Verfahrensschritt gegenüber der Herstellung einer Verbindung mittels Silberleitkleber.Preferably the ends are soldered with a thaw Chen in a tin bath, so that it is easy pasture by locally melting the soft solder onto contact fields of the semiconductor chip can be connected to this. Of the  Carrier body must be made of a temperature-resistant Ther be plastic that meets the requirements for soft soldering. A particular advantage of the invention is that the Ver not only soldering soft solder to the ends of the enamelled wire coil brought, but also the protective lacquer layer removed becomes. This saves one procedural step the establishment of a connection using conductive silver adhesive.

Die Erfindung wird nachfolgend anhand eines Ausführungsbei­ spiels mit Hilfe einer Figur näher erläutert.The invention is illustrated below with the aid of an embodiment game explained with the help of a figure.

Die Figur zeigt einen flexiblen, nicht leitenden Trägerkörper 1, der eine gebrochen dargestellte Ausnehmung 2 aufweist, in die ein Halbleiterchip 3 eingesetzt ist. Der Halbleiterchip 3 ist dabei mittels eines Klebers 4 befestigt. Auf den Träger­ körper 1 ist eine Spule 7 aus lackisoliertem Kupferwickel­ draht angeordnet. Die Enden 6 dieser Spule sind mit einem Weichlot aus Zinn versehen, das zur Verbindung der Spule 7 mit dem Halbleiterchip 3 auf Kontaktfelder 5 des Halbleiter­ chips 3 lokal aufgeschmolzen wird. Die Kontaktfelder 5 sind dabei in vorteilhafter Weise gegenüber üblichen Kontaktfelder von Halbleiterchips mittels einer Goldauflage vergrößert. Bei dem erfindungsgemäßen Chipkartenmodul sowie seiner erfin­ dungsgemäßen Herstellung können zusätzliche Abdeckungen des Halbleiterchips 3 sowie der Spulenenden 6 vermieden werden.The figure shows a flexible, non-conductive carrier body 1 , which has a broken-out recess 2 , into which a semiconductor chip 3 is inserted. The semiconductor chip 3 is attached by means of an adhesive 4 . On the support body 1 , a coil 7 made of enameled copper winding wire is arranged. The ends 6 of this coil are provided with a soft solder made of tin, which is melted locally to connect the coil 7 with the semiconductor chip 3 to contact fields 5 of the semiconductor chip 3 . The contact fields 5 are advantageously enlarged in comparison to conventional contact fields of semiconductor chips by means of a gold plating. With the chip card module according to the invention and its production according to the invention, additional covers of the semiconductor chip 3 and the coil ends 6 can be avoided.

Claims (7)

1. Chipkartenmodul mit einem auf einem flexiblen, nicht- leitenden Trägerkörper (1) angeordneten Halbleiterchip (3), mit dem die zwei Enden (6) einer Lackdrahtspule (7) elek­ trisch leitend verbunden sind, dadurch gekennzeichnet, daß die Verbindung zwischen dem Halbleiterchip (3) und den Spulenenden (6) eine Lötverbindung ist.1. Chip card module with a flexible, non-conductive carrier body ( 1 ) arranged semiconductor chip ( 3 ) with which the two ends ( 6 ) of a magnet wire coil ( 7 ) are electrically connected, characterized in that the connection between the semiconductor chip ( 3 ) and the coil ends ( 6 ) is a solder connection. 2. Chipkartenmodul nach Anspruch 1, dadurch gekennzeichnet, daß die Enden (6) der Lackdrahtspule (7) mit Lötzinn versehen sind.2. Chip card module according to claim 1, characterized in that the ends ( 6 ) of the enamel wire coil ( 7 ) are provided with solder. 3. Chipkartenmodul nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Halbleiterchip (3) mittels einer Goldauflage ver­ größerte Kontaktfelder (5) aufweist.3. Chip card module according to claim 1 or 2, characterized in that the semiconductor chip ( 3 ) by means of a gold plating ver larger contact fields ( 5 ). 4. Chipkartenmodul nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß der Halbleiterchip (3) auf den Trägerkörper (1) geklebt ist.4. Chip card module according to one of claims 1 to 3, characterized in that the semiconductor chip ( 3 ) is glued to the carrier body ( 1 ). 5. Chipkartenmodul nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß der Halbleiterchip (3) in einer Ausnehmung des Trägerkör­ pers (1) angeordnet ist.5. Chip card module according to one of claims 1 to 4, characterized in that the semiconductor chip ( 3 ) in a recess of the Trägerkör pers ( 1 ) is arranged. 6. Verfahren zum Herstellen eines Chipkartenmoduls mit den Verfahrensschritten:
  • - Kleben eines Halbleiterchips (3) auf einen Trägerkörper
  • - Verzinnen der Enden (6) einer Lackdrahtspule (7),
  • - Löten der verzinnten Spulenenden (6) auf Kontaktfelder (5) des Halbleiterchips (3).
6. Method for producing a chip card module with the method steps:
  • - Gluing a semiconductor chip ( 3 ) to a carrier body
  • - Tinning the ends ( 6 ) of a magnet wire coil ( 7 ),
  • - Soldering the tinned coil ends ( 6 ) on contact fields ( 5 ) of the semiconductor chip ( 3 ).
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß das Lötzinn der Spulenenden (6) lokal auf die Kontaktfel­ der (5) aufgeschmolzen wird.7. The method according to claim 6, characterized in that the solder of the coil ends ( 6 ) is melted locally on the contact field of ( 5 ).
DE4431606A 1994-09-05 1994-09-05 Chip card module with copper coil on a carrier Ceased DE4431606A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4431606A DE4431606A1 (en) 1994-09-05 1994-09-05 Chip card module with copper coil on a carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4431606A DE4431606A1 (en) 1994-09-05 1994-09-05 Chip card module with copper coil on a carrier

Publications (1)

Publication Number Publication Date
DE4431606A1 true DE4431606A1 (en) 1996-03-07

Family

ID=6527471

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4431606A Ceased DE4431606A1 (en) 1994-09-05 1994-09-05 Chip card module with copper coil on a carrier

Country Status (1)

Country Link
DE (1) DE4431606A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616424A1 (en) * 1996-04-25 1997-10-30 Manfred Dr Michalk Electrically isolating material with electronic module
DE19642378A1 (en) * 1996-10-14 1998-04-16 Fraunhofer Ges Forschung Contactless chip card
WO1998048379A1 (en) * 1997-04-18 1998-10-29 Pav Card Gmbh Chip card and method for producing a chip card
EP0902475A2 (en) * 1997-09-15 1999-03-17 Microchip Technology Inc. A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor
FR2775810A1 (en) * 1998-03-09 1999-09-10 Gemplus Card Int Ultra-flat thin contact-free chip card production
DE19844089A1 (en) * 1998-06-25 2000-01-13 Pav Card Gmbh Process for the production of transponder chips
WO2000014679A1 (en) * 1998-09-03 2000-03-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for contacting a circuit chip
FR2785072A1 (en) * 1998-10-23 2000-04-28 St Microelectronics Sa Flexible self-adhesive mounted IC assembly by applying double-sided adhesive film on one faces of base plate and forming groove formed in double-sided adhesive with chip arranged inside it
WO2000077729A1 (en) * 1999-06-15 2000-12-21 Gemplus Device and method for making devices comprising at least a chip fixed on a support
US6252777B1 (en) * 1998-02-13 2001-06-26 Shinko Electric Industries Co., Ltd. IC card and its frame
EP1302894A2 (en) * 2001-10-12 2003-04-16 Multitape GmbH Contactless chipcard and manufacturing process
DE10200569A1 (en) * 2001-10-12 2003-05-08 Multitape Gmbh Chip card and manufacturing process
CN103366215A (en) * 2012-04-05 2013-10-23 英飞凌科技股份有限公司 Data carrier for contactless data transmission and method for producing the same
US20150033545A1 (en) * 2013-08-02 2015-02-05 Sumida Corporation Method for manufacturing antenna part

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0079047A2 (en) * 1981-11-05 1983-05-18 BROWN, BOVERI & CIE Aktiengesellschaft Identification card
WO1992022827A1 (en) * 1991-06-05 1992-12-23 Trovan Limited An improved miniature transponder device
WO1993009551A1 (en) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder and process and device for producing it

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0079047A2 (en) * 1981-11-05 1983-05-18 BROWN, BOVERI & CIE Aktiengesellschaft Identification card
WO1992022827A1 (en) * 1991-06-05 1992-12-23 Trovan Limited An improved miniature transponder device
WO1993009551A1 (en) * 1991-11-08 1993-05-13 Herbert Stowasser Transponder and process and device for producing it

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616424A1 (en) * 1996-04-25 1997-10-30 Manfred Dr Michalk Electrically isolating material with electronic module
DE19642378C2 (en) * 1996-10-14 2000-06-08 Fraunhofer Ges Forschung Contactless chip card
DE19642378A1 (en) * 1996-10-14 1998-04-16 Fraunhofer Ges Forschung Contactless chip card
WO1998048379A1 (en) * 1997-04-18 1998-10-29 Pav Card Gmbh Chip card and method for producing a chip card
EP0902475A2 (en) * 1997-09-15 1999-03-17 Microchip Technology Inc. A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor
EP0902475A3 (en) * 1997-09-15 2000-07-19 Microchip Technology Inc. A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor
US6252777B1 (en) * 1998-02-13 2001-06-26 Shinko Electric Industries Co., Ltd. IC card and its frame
US7494068B2 (en) 1998-03-09 2009-02-24 Gemalto Sa Contactless transponder
US6957481B1 (en) 1998-03-09 2005-10-25 Gemplus Method for making contactless cards
AU743756B2 (en) * 1998-03-09 2002-02-07 Gemplus Method for making contactless cards
US7204427B2 (en) 1998-03-09 2007-04-17 Gemplus Method for making contactless cards
WO1999046728A1 (en) * 1998-03-09 1999-09-16 Gemplus Method for making contactless cards
FR2775810A1 (en) * 1998-03-09 1999-09-10 Gemplus Card Int Ultra-flat thin contact-free chip card production
DE19844089C2 (en) * 1998-06-25 2001-04-05 Pav Card Gmbh Process for the production of transponder arrangements
DE19844089A1 (en) * 1998-06-25 2000-01-13 Pav Card Gmbh Process for the production of transponder chips
WO2000014679A1 (en) * 1998-09-03 2000-03-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for contacting a circuit chip
FR2785072A1 (en) * 1998-10-23 2000-04-28 St Microelectronics Sa Flexible self-adhesive mounted IC assembly by applying double-sided adhesive film on one faces of base plate and forming groove formed in double-sided adhesive with chip arranged inside it
WO2000025266A1 (en) * 1998-10-23 2000-05-04 Stmicroelectronics S.A. Self-adhesive electronic circuit
US7168623B1 (en) 1998-10-23 2007-01-30 Stmicroelectronics S.A. Self-adhesive electronic circuit
US6667192B1 (en) 1999-06-15 2003-12-23 Gemplus Device and method for making devices comprising at least a chip fixed on a support
FR2795201A1 (en) * 1999-06-15 2000-12-22 Gemplus Card Int DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES HAVING AT LEAST ONE CHIP FIXED ON A SUPPORT
WO2000077729A1 (en) * 1999-06-15 2000-12-21 Gemplus Device and method for making devices comprising at least a chip fixed on a support
EP1302894A3 (en) * 2001-10-12 2003-10-29 Multitape GmbH Contactless chipcard and manufacturing process
DE10200569A1 (en) * 2001-10-12 2003-05-08 Multitape Gmbh Chip card and manufacturing process
EP1302894A2 (en) * 2001-10-12 2003-04-16 Multitape GmbH Contactless chipcard and manufacturing process
CN103366215A (en) * 2012-04-05 2013-10-23 英飞凌科技股份有限公司 Data carrier for contactless data transmission and method for producing the same
CN103366215B (en) * 2012-04-05 2016-08-03 英飞凌科技股份有限公司 The data medium transmitted for contactless data and production method thereof
US20150033545A1 (en) * 2013-08-02 2015-02-05 Sumida Corporation Method for manufacturing antenna part

Similar Documents

Publication Publication Date Title
EP0780006B1 (en) Process for producing a smart card module for contactless smart cards
DE4431606A1 (en) Chip card module with copper coil on a carrier
DE69834768T2 (en) Universal surface finish coating for DCA, SMT and pad-to-pad interconnects
DE1952569A1 (en) Carrier for electrical components and integrated circuits
EP0464232B1 (en) Solder connector and process for making an electrical circuit with this solder connector
DE3342611A1 (en) METHOD FOR PRODUCING A PRINTED SWITCH CARD WITH A DESIRED SHAPE
DE112009002460B4 (en) Flexible circuit board
EP0555668A1 (en) Printed circuit board for electronical power circuit containing power semiconductors
DE19708615C1 (en) Chip-card module design and manufacture
EP0702378B1 (en) Chip inductor
DE1292755B (en) Process for the serial socket and housing installation of semiconductor components
DE3343250C2 (en)
EP0058761A2 (en) Lead frame for resin-encapsulated electrical devices
DE3227645A1 (en) Electronic component and a method for its production
DE19532223C1 (en) Chip card contg. chip module embedded in card having at least two metallisation areas
DE602004012566T2 (en) Assembly for inductors and methods of manufacture
EP1287537A1 (en) Inductive miniature component for smd-mounting and method for the production thereof
DE3439411C1 (en) Method of producing solder joints on conductor tracks of thin-film circuits
DE4131534A1 (en) DEVICE FOR THE INSULATED LEAD OUT OF PATHWAYS FROM A SHIELDING HOUSING
DD295499A5 (en) METHOD FOR MANUFACTURING WIRING SUPPORT WITH WIRE
DE3346461A1 (en) Method for manufacturing a telephone station
DE3046192A1 (en) Un-encapsulated compact integrated circuit carrier - incorporated into automatic machine readable identity cards and has device joined by film conductors to contact pads through windows
DE2928960A1 (en) HOLDING AND CONNECTING DEVICE FOR ELECTRICAL COMPONENTS
DE8517483U1 (en) Electric choke, especially HF choke coil
DE2517132A1 (en) Multi-strand wire electrical conductor - comprises a coated core wire and outer wires adhering to the coating

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection