DE3227645A1 - Electronic component and a method for its production - Google Patents

Electronic component and a method for its production

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Publication number
DE3227645A1
DE3227645A1 DE19823227645 DE3227645A DE3227645A1 DE 3227645 A1 DE3227645 A1 DE 3227645A1 DE 19823227645 DE19823227645 DE 19823227645 DE 3227645 A DE3227645 A DE 3227645A DE 3227645 A1 DE3227645 A1 DE 3227645A1
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Germany
Prior art keywords
wire
housing
component according
crimped
components
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823227645
Other languages
German (de)
Inventor
Gottfried 8411 Etterzhausen Beer
Alfred Dipl.-Chem. Dr. 8400 Regensburg Engl
Hans-Joachim 8400 Regensburg Struck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
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Siemens AG
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Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19823227645 priority Critical patent/DE3227645A1/en
Publication of DE3227645A1 publication Critical patent/DE3227645A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0101—Neon [Ne]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention relates to an electronic component having axial connecting wires and a preferably cylindrical body, whose connecting wires are cut off to form wire stumps which, for their part, are crushed to form connecting tabs (11, 12). These connecting tabs (11, 12) allow the components to be passed directly into a magazine (15) or even directly onto a board (18) from an axial belt, while maintaining the polarity orientation, and to be mounted on the board (18) dispensing with holes for the connecting wires in the same manner, and with a comparatively small space requirement, as in the case of wire-less components (for example diodes with a cylindrical body and metallised connecting surfaces at the ends) which have been developed especially for wire-less fitment. <IMAGE>

Description

Elektronisches Bauelement und Verfahren zu dessenElectronic component and method for it

Herstellung Die Erfindung betrifft ein elektronisches Bauelement, insbesondere eine Diode, mit einem vorzugsweise zylinderförmigen Gehäuse, von dessen beiden Stirnseiten sich jeweils eine elektrische Anschlußeinrichtung in Axialrichtung des Gehäuses erstreckt.Manufacture The invention relates to an electronic component, in particular a diode, with a preferably cylindrical housing, of the Both end faces each have an electrical connection device in the axial direction of the housing extends.

Elektronische Bauelemente werden in letzter Zeit zunehmend durch die sogenannte Drahtlosbestuckung mittels Bestückungsautomaten elektrisch mit einer Schaltung verbunden. Bei dieser Drahtlosbestückung werden nicht mehr - wie bisher üblich - Anschlußdrähte der einzelnen Bauelemente durch Bohrungen in einer Platine geführt; vielmehr werden die Bauelemente zunächst beispielsweise mittig auf die Unterseite der Platine geklebt, und die gewünschten elektrischen Kontakte werden durch Lötverbindungen zwischen Leiterbahnen auf der Platine und metallisierten Anschlußflächen der Bauelemente hergestellt. Solche Bauelemente können passive Bauelemente, also Widerstände oder Kondensatoren, in Quader- oder Zylinderform sein, sowie Halbleiterbauelemente in bestimmten Gehäusen (beispielsweise SOT 23) oder aber Dioden in Zylinderform (beispielsweise DO 35). Die Lötverbindung kann durch Tauch-, Schlepp- oder Schwall-Lötung hergestellt werden, wobei auch eine Reflow-Lötung möglich ist.Electronic components are lately increasingly by the so-called wireless placement by means of placement machines electrically with a Circuit connected. With this wireless equipment, no more - as before Common - connecting wires of the individual components through holes in a board guided; rather, the components are initially, for example, centered on the Glued underside of the board, and the desired electrical contacts are made by soldering connections between conductor tracks on the circuit board and metallized connection surfaces of the components manufactured. Such components can be passive components, that is Resistors or capacitors, cuboid or cylindrical, as well as semiconductor components in certain housings (for example SOT 23) or diodes in cylinder shape (e.g. DO 35). The soldered connection can be made by dip, drag or surge soldering can be made, reflow soldering is also possible.

In Fig. 1 ist eine sogenannte "MELF"-Diode dargestellt, die aus einem zylindrischen Körper 1 besteht, der an seinen Stirnseiten jeweils einen metallisierten Anschluß 2 bzw. 3 besitzt. Widerstände und Kondensatoren werden in ähnlicher Form angeboten.In Fig. 1, a so-called "MELF" diode is shown, which consists of a there is a cylindrical body 1, each of which has a metallized on its end faces Connection 2 or 3 has. Resistors and capacitors are made in a similar fashion offered.

Für derartige, gewöhnlich als Schüttgut angelieferte Bauelemente ergeben sich bei einer automatischen Bestückung jedoch erhebliche Orientierungsprobleme. For such components, which are usually delivered in bulk However, there are considerable orientation problems with automatic assembly.

Solche Orientierungsprobleme werden# dagegen bei der Verwendung von Bauelementen bzw. Dioden vermieden, die in Axialrichtung jeweils einen Anschlußdraht haben und bereits vom Bauelement-Hersteller unmittelbar im Anschluß an die elektrische Prüfung und Kennzeichnung in bekannter Weise axial gegurtet werden. Orientation problems of this kind are # on the other hand, when using Components or diodes avoided which each have a connecting wire in the axial direction have and already from the component manufacturer immediately following the electrical Testing and labeling are axially strapped in a known manner.

Fig. 2 zeigt ein Bauelement mit einem Glaskörper 4, der stirnseitig sich in Axialrichtung erstreckende Anschlußdrähte 5 bzw. 6 besitzt. Mittels dieser Anschlußdrähte kann das Bauelement gegurtet und so eindeutig orientiert eingesetzt werden. Ein Bestückungsautomat, der mit entsprechenden Schneid- und Biegewerkzeugen ausgestattet ist, wird dann mit dem Gurt versorgt und verdrahtet so die Bauelemente mit richtiger Orientierung auf einer Platine. Gegebenenfalls kann auch eine Zwischenlagerung in entsprechenden Magazinen vorgenommen werden. Fig. 2 shows a component with a glass body 4, the end face has connecting wires 5 and 6 extending in the axial direction. By means of this Connecting wires can be taped to the component and used in a clearly oriented manner will. A pick and place machine with appropriate cutting and bending tools is equipped, is then supplied with the belt and thus wired the components with correct orientation on a circuit board. If necessary, intermediate storage can also be used can be made in appropriate magazines.

Fig. 3 zeigt ein Beispiel eines Bauelements aus einem Glaskörper 4, bei dem Anschlußdrähte 7 und 8 ~etagenförmig nach unten gebogen sind, um so einfach auf einer Platine verlötbar zu sein. Die nach unten gebogenen Drähte 7 und 8 reichen nämlich bis nahe zur Oberfläche der Platine, da die Enden der Drähte 7 und 8 etwa in einer Mantellinie des Glaskörpers 4 liegen. 3 shows an example of a component made from a glass body 4, where the connecting wires 7 and 8 ~ are bent downwards in layers, all the more simple to be solderable on a circuit board. Wires 7 and 8, which are bent down, are sufficient namely to close to the surface of the board, since the ends of the wires 7 and 8 approximately lie in a surface line of the glass body 4.

Die Bauelemente der Beispiele der Fig. 2 und 3 haben gegenüber dem Bauelement der Fig. 1 den Vorteil, daß ihre richtige Orientierung auf einer Platine gewährleistet ist, so daß ein automatisches Bestücken ohne Fehler der Polung der Bauelemente durchgeführt werden kann. Nachteilhaft an den Beispielen der Fig. 2 und 3 ist aber, daß ein größeres Rastermaß und damit ein größerer Platzbedarf auf der Platine benötigt wird, wodurch eine entsprechende dichte Belegung der Platine mit Bauteilen behindert wird.The components of the examples of FIGS. 2 and 3 have compared to the Component of FIG. 1 has the advantage that its correct orientation on a circuit board is guaranteed, so that automatic loading without errors in the polarity of the Components can be carried out. Disadvantages of the examples in FIG. 2 and 3 is, however, that a larger grid size and thus a larger space requirement on the board is required, whereby a correspondingly dense occupancy of the board is hindered with components.

Es ist daher Aufgabe der Erfindung, ein elektronisches Bauelement zu schaffen, dessen elektrische Anschlußeinrichtungen einerseits einen geringen Platzbedarf haben und andererseits ohne besonderen Aufwand richtig orientierbar sind.It is therefore the object of the invention to provide an electronic component to create, the electrical connection devices on the one hand a low Have space requirements and, on the other hand, can be correctly oriented without any special effort are.

Diese Aufgabe wird bei einem elektronischen Bauelement nach dem Oberbegriff des Patentanspruchs 1 erfindungsgemäß dadurch gelöst, daß die Anschlußeinrichtungen jeweils aus einem zumindest an seinem Ende gequetschten Draht bestehen.This task is performed in the case of an electronic component according to the preamble of claim 1 achieved according to the invention in that the connection devices each consist of a wire crimped at least at its end.

Der Draht selbst ist derart flach gequetscht, daß er sich bis nahe zu einer Verlängerungslinie des Mantels des zylindrischen Gehäuses erstreckt. Dabei kann das gequetschte Ende des Drahtes etwa 0,1 mm von dieser Verlängerungslinie entfernt sein. Der Draht ist vorzugsweise nach einem Abstand von etwa 0,5 mm vom Gehäuse über eine Länge von etwa 1 mm gequetscht. Das Gehäuse selbst kann ein Glasgehäuse sein.The wire itself is crimped so flat that it comes close extends to an extension line of the shell of the cylindrical housing. Included the crimped end of the wire can be about 0.1mm from this extension line be distant. The wire is preferably at a distance of about 0.5 mm from Housing squeezed over a length of about 1 mm. The housing itself can be a glass housing be.

Ein Verfahren zum Herstellen des erfindungsgemäßen Bauelements zeichnet sich dadurch aus, daß die Drähte in die gewünschte Länge zu Drahtstummeln abgeschnitten und diese gequetscht werden. Es ist aber auch möglich, die Drähte zunächst zu quetschen und dann an der Quetschstelle abzuschneiden. Das Schneiden und das Quetschen kann mit dem gleichen Werkzeug vorgenommen werden.A method for producing the component according to the invention is characterized is characterized by the fact that the wires are cut to the desired length to form wire stubs and these are squeezed. But it is also possible to squeeze the wires first and then cut off at the pinch point. The cutting and the squeezing can can be made with the same tool.

Bei der Erfindung werden also die dicht am Bauelementkörper abgeschnittenen Anschlußdrähte zu Fahnen gequetscht.In the invention, the cut off close to the component body Connecting wires squeezed into flags.

Mittels dieser Fahnen können die Bauelemente für die Drahtlosbestückung eingesetzt werden, wobei die richti- ge Polaritäts-Orientierung dadurch gewährleistet ist, daß die zwangsläufige Orientierung aus der axialen Gurtung bzw. aus dem Magazin bis zur Positionierung auf der Platine beibehalten wird.By means of these flags, the components for wireless assembly are used, with the correct ge polarity orientation this ensures that the inevitable orientation from the axial chord or from the magazine is retained until it is positioned on the board.

Nachfolgend wird die Erfindung an Hand der Zeichnung näher erläutert. Es zeigen: Fig. 1 bis 3 Beispiele herkömmlicher Bauelemente (bereits erläutert), Fig. 4 ein Ausführungsbeispiel des erfindungsgemäßen elektronischen Bauelements, Fig. 5 einen Schnitt durch ein Magazin zur Lagerung des Bauelements von Fig. 4 und Fig. 6 ein Ausführungsbeispiel des mit einer Platine verlöteten erfindungsgemäßen elektronischen Bauelements.The invention is explained in more detail below with reference to the drawing. They show: FIGS. 1 to 3 examples of conventional components (already explained), 4 shows an embodiment of the electronic component according to the invention, 5 shows a section through a magazine for storing the component from FIGS 6 shows an embodiment of the inventive soldered to a circuit board electronic component.

Fig. 4 zeigt ein Ausführungsbeispiel des erfindungsgemäßen elektronischen Bauelements mit einem Glaskörper 10, in dem sich eine (nicht dargestellte) Diode befindet, und Anschlußfahnen 11, 12, die zur Kontaktgabe der Diode dienen. Die Anschlußfahnen 11, 12 sind beispielsweise durch Abschneiden der Anschlußdrähte 5, 6 (vgl. Fig. 2) zu Drahtstummeln und anschließendes Quetschen dieser Drahtstummeln entstanden. Die Anschlußfahnen 11, 12 beginnen dabei jeweils in einem Abstand a von etwa 0,5 mm vom Glaskörper 10 und haben eine Längserstreckung b von etwa 1 mm. Der Abstand c zwischen dem unteren Ende der Anschlußfahnen 11, 12 und der Verlängerungslinie des Man--tels des Glaskörpers 10 beträgt höchstens 0,1 mm. Selbstverständlich können diese Maße in gewünschter Weise verändert werden.Fig. 4 shows an embodiment of the electronic according to the invention Component with a glass body 10, in which there is a (not shown) diode is located, and connecting lugs 11, 12, which are used to make contact with the diode. The connecting flags 11, 12 are, for example, by cutting off the connecting wires 5, 6 (see. Fig. 2) to wire stumps and subsequent squeezing of these wire stubs. The connecting lugs 11, 12 each begin at a distance a of approximately 0.5 mm from the glass body 10 and have a longitudinal extension b of about 1 mm. The distance c between the lower end of the terminal lugs 11, 12 and the extension line of the jacket of the glass body 10 is at most 0.1 mm. Of course you can these dimensions can be changed as desired.

Fig. 5 zeigt einen Querschnitt durch ein Magazin 15 zur Lagerung der Bauelemente von Fig. 4. Die Anschlußfahnen 11, 12 liegen in Aussparungen, so daß die richtige Orien- tierung der Bauelemente gewährleistet werden kann. Das Magazin 15 selbst kann aus zwei Hälften 16, 17 hergestellt sein, die durchsichtig sind, aus Kunststoff bestehen und miteinander verklebt sind, oder aber auch aus einem stranggepreßten Endlosprofil gefertigt, auf die gewünschte Länge beschnitten sein.Fig. 5 shows a cross section through a magazine 15 for storing the Components of Fig. 4. The terminal lugs 11, 12 are in recesses so that the correct orientation orientation of the components can be guaranteed can. The magazine 15 itself can be made of two halves 16, 17 which are transparent are made of plastic and are glued together, or else made of made of an extruded endless profile, cut to the desired length be.

Fig. 6 zeigt schließlich einen mittels einer Klebschicht 19 mit einer Platine 18 verklebten Glaskörper 10, dessen elektrische Kontaktgabe über die Anschlußfahnen 11, 12 und Lötstellen 20, 21 zu Leiterbahnen (nicht dargestellt) auf der Platine 18 erfolgt.Fig. 6 finally shows a means of an adhesive layer 19 with a Board 18 glued glass body 10, its electrical contact via the terminal lugs 11, 12 and solder points 20, 21 to conductors (not shown) on the board 18 takes place.

6 Figuren 10 Patentansprüche Leerseite6 figures 10 claims Blank page

Claims (10)

Patentansprüche 1. Elektronisches Bauelement, insbesondere Diode, mit vorzugsweise zylinderförmigem Gehäuse, von dessen beiden Stirnseiten sich jeweils eine elektrische Anschlußeinrichtung (10, 11) in Axialrichtung des Gehäuses ererstreckt, d a d u r c h g e k e n n z e i c h -n e t , daß die Anschlußeinrichtungen jeweils aus einem zumindest an seinem Ende gequetschten Draht bestehen.Claims 1. Electronic component, in particular diode, with a preferably cylindrical housing, each of which has two end faces an electrical connection device (10, 11) extends in the axial direction of the housing, d a d u r c h e k e n n z e i c h -n e t that the connection devices respectively consist of a wire crimped at least at its end. 2. Bauelement nach Anspruch 1, d a d u r c h g e -k e n n z e i c h n e t , daß der Draht derart flach gequetscht ist, daß er sich bis nahe zu einer Verlängerungslinie des Mantels des zylindrischen Gehäuses (10) erstreckt.2. The component according to claim 1, d a d u r c h g e -k e n n z e i c n e t that the wire is crimped so flat that it comes close to one Extension line of the shell of the cylindrical housing (10) extends. 3. Bauelement nach Anspruch 2, d a d u r c h g e -k e n n z e i c h n e t , daß das gequetschte Ende des Drahtes etwa 0,1 mm von der Verlängerungslinie entfernt ist.3. The component according to claim 2, d a d u r c h g e -k e n n z e i c Note that the crimped end of the wire is about 0.1 mm from the extension line away. 4. Bauelement nach einem der Ansprüche 1 bis 3, d a -d u r c h g e k e n n z e i c h n e t , daß der Draht nach einem Abstand von etwa 0,5 mm vom Gehäuse (10) über eine Länge von etwa 1 mm gequetscht ist.4. Component according to one of claims 1 to 3, d a -d u r c h g e it does not indicate that the wire is removed after a distance of about 0.5 mm from the housing (10) is squeezed over a length of about 1 mm. 5. Bauelement nach einem der Ansprüche 1 bis 4, d a -d u r c h g e k e n n z e i c h n e t , daß das Gehäuse ein Glasgehäuse ist.5. Component according to one of claims 1 to 4, d a -d u r c h g e does not indicate that the housing is a glass housing. 6. Bauelement nach einem der Ansprüche 1 bis 4, d a -d u r c h g e k e n n z e i c h n e t , daß das Gehäuse ein Kunststoffgehäuse oder ein mit einer Kunststoffumhüllung bzw. Lackierung versehenes Gehäuse ist.6. Component according to one of claims 1 to 4, d a -d u r c h g e it is not indicated that the housing is a plastic housing or one with a Housing provided with plastic coating or painting. 7. Verfahren zum Herstellen des Bauelements nach einem der Ansprüche 1 bis 5, d a d u r c h g e k e n n -z e i c h n e t , daß die Drähte in die gewünschte Länge zu Drahtstummeln abgeschnitten und diese gequetscht werden.7. A method for producing the component according to one of the claims 1 to 5, d u r c h e k e n n -z e i c h n e t that the wires in the desired Cut the length to wire stubs and squeeze them. 8. Verfahren zum Herstellen des Bauelements nach einem der Ansprüche 1 bis &, d a d u r c h g e k e n n -z e i c h n e t , daß die Drähte gequetscht und an der Quetschstelle abgeschnitten werden.8. A method for producing the component according to one of the claims 1 to &, d u r c h e k e n n -z e i c h n e t that the wires are crushed and cut off at the pinch point. 9. Verfahren nach Anspruch 7 oder 8, d a d u r c h g e k e n n z e i c h n e t , daß das Schneiden und Quetschen mit dem gleichen Werkzeug vorgenommen wird.9. The method according to claim 7 or 8, d a d u r c h g e k e n n z e i c h n e t that the cutting and crimping were done with the same tool will. 10. Verwendung des an seinem Ende gequetschten Drahtes für die Beibehaltung der Polaritäts-Orientierung des Bauelements nach einem der Ansprüche 1 bis 9 bei dessen axialer Gurtung.10. Using the wire crimped at its end for retention the polarity orientation of the component according to one of Claims 1 to 9 its axial waling.
DE19823227645 1982-07-23 1982-07-23 Electronic component and a method for its production Withdrawn DE3227645A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2584864A1 (en) * 1985-07-11 1987-01-16 Sept Doloy Sa Construction of connection combs for hermetic packages intended for microelectronics
EP0246692A2 (en) * 1986-05-19 1987-11-25 North American Philips Corporation Surface-mounted electrical power resistor
DE4114391A1 (en) * 1991-05-03 1992-11-05 Hohenloher Spulenkoerper SURFACE MOUNTABLE ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2584864A1 (en) * 1985-07-11 1987-01-16 Sept Doloy Sa Construction of connection combs for hermetic packages intended for microelectronics
EP0246692A2 (en) * 1986-05-19 1987-11-25 North American Philips Corporation Surface-mounted electrical power resistor
EP0246692A3 (en) * 1986-05-19 1989-07-12 North American Philips Corporation Surface-mounted electrical device
DE4114391A1 (en) * 1991-05-03 1992-11-05 Hohenloher Spulenkoerper SURFACE MOUNTABLE ELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
US7005311B2 (en) 1993-09-30 2006-02-28 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102212B2 (en) 1993-09-30 2006-09-05 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7288831B2 (en) 1993-09-30 2007-10-30 Osram Gmbh Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
US7102215B2 (en) 1997-07-29 2006-09-05 Osram Gmbh Surface-mountable light-emitting diode structural element
US7183632B2 (en) 1997-07-29 2007-02-27 Osram Gmbh Surface-mountable light-emitting diode structural element
US7508002B2 (en) 1997-07-29 2009-03-24 Osram Gmbh Surface-mountable light-emitting diode structural element

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