DE2828146A1 - Electrical circuit board - Google Patents

Electrical circuit board

Info

Publication number
DE2828146A1
DE2828146A1 DE19782828146 DE2828146A DE2828146A1 DE 2828146 A1 DE2828146 A1 DE 2828146A1 DE 19782828146 DE19782828146 DE 19782828146 DE 2828146 A DE2828146 A DE 2828146A DE 2828146 A1 DE2828146 A1 DE 2828146A1
Authority
DE
Grant status
Application
Patent type
Prior art keywords
circuit board
electrical circuit
electrical
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19782828146
Other languages
German (de)
Inventor
Dominic Ralph Errichiello
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/096Vertically aligned vias, holes or stacked vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09827Tapered, e.g. tapered hole, via or groove
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09854Hole or via having special cross-section, e.g. elliptical
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10606Permanent holder for component or auxiliary PCB mounted on a PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10863Adaptations of leads or holes for facilitating insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
DE19782828146 1977-07-06 1978-06-27 Electrical circuit board Withdrawn DE2828146A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US81338077 true 1977-07-06 1977-07-06

Publications (1)

Publication Number Publication Date
DE2828146A1 true true DE2828146A1 (en) 1979-01-25

Family

ID=25212214

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782828146 Withdrawn DE2828146A1 (en) 1977-07-06 1978-06-27 Electrical circuit board

Country Status (4)

Country Link
JP (1) JPS5415171A (en)
DE (1) DE2828146A1 (en)
FR (1) FR2397126A2 (en)
GB (1) GB2000913A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3222178A1 (en) * 1982-06-12 1983-12-15 Irion & Vosseler Electrically insulating substrate with metallic conductors
DE3501711A1 (en) * 1985-01-19 1986-10-02 Allied Corp PCB with integral connectors
DE3631947A1 (en) * 1986-09-19 1988-04-07 Ruf Kg Wilhelm Wiring board
DE3629976A1 (en) * 1986-09-03 1988-04-07 Hueco Gmbh Fabrik Fuer Interna generators voltage regulator for
DE3829117A1 (en) * 1988-08-27 1990-03-08 Standard Elektrik Lorenz Ag Metal core printed circuit board
DE4006063A1 (en) * 1989-05-01 1990-11-08 Ibiden Co Ltd A process for producing a circuit board for electronic modules

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2457546A1 (en) * 1979-05-23 1980-12-19 Seima Flexible circuit support for car lamp bulbs - has connecting tracks formed by conductive plastics material linking bulb holders to wiring loom
DE3151655A1 (en) * 1981-12-28 1983-07-07 Siemens Ag Arrangement for cooling component groups
JPS6197996A (en) * 1984-10-19 1986-05-16 Hitachi Ltd Chassis for carrying mechanism part
NL8403596A (en) * 1984-11-27 1986-06-16 Philips Nv Chassis for mounting components.
US4924590A (en) * 1988-01-08 1990-05-15 Siemens Aktiengesellschaft Method for making metal core printed circuit board
US5557503A (en) * 1995-05-12 1996-09-17 International Business Machines Corporation Circuit card having a large module strain relief and heat sink support
US5929375A (en) * 1996-05-10 1999-07-27 Ford Motor Company EMI protection and CTE control of three-dimensional circuitized substrates

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL293033A (en) * 1962-05-21
DE2124887C3 (en) * 1971-05-19 1980-04-17 Philips Patentverwaltung Gmbh, 2000 Hamburg

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3222178A1 (en) * 1982-06-12 1983-12-15 Irion & Vosseler Electrically insulating substrate with metallic conductors
DE3501711A1 (en) * 1985-01-19 1986-10-02 Allied Corp PCB with integral connectors
DE3629976A1 (en) * 1986-09-03 1988-04-07 Hueco Gmbh Fabrik Fuer Interna generators voltage regulator for
DE3631947A1 (en) * 1986-09-19 1988-04-07 Ruf Kg Wilhelm Wiring board
DE3829117A1 (en) * 1988-08-27 1990-03-08 Standard Elektrik Lorenz Ag Metal core printed circuit board
DE4006063A1 (en) * 1989-05-01 1990-11-08 Ibiden Co Ltd A process for producing a circuit board for electronic modules
US5088008A (en) * 1989-05-01 1992-02-11 Ibiden Co., Ltd. Circuit board for mounting electronic components

Also Published As

Publication number Publication date Type
JPS5415171A (en) 1979-02-03 application
FR2397126A2 (en) 1979-02-02 application
GB2000913A (en) 1979-01-17 application

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination