EP0418561B1 - Solid electrolytic chip capacitor and method of manufacture - Google Patents
Solid electrolytic chip capacitor and method of manufacture Download PDFInfo
- Publication number
- EP0418561B1 EP0418561B1 EP90115788A EP90115788A EP0418561B1 EP 0418561 B1 EP0418561 B1 EP 0418561B1 EP 90115788 A EP90115788 A EP 90115788A EP 90115788 A EP90115788 A EP 90115788A EP 0418561 B1 EP0418561 B1 EP 0418561B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- anode
- cathode
- anode body
- auxiliary clip
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000007787 solid Substances 0.000 title description 6
- 239000007784 solid electrolyte Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000012808 vapor phase Substances 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
Definitions
- the invention relates to a solid electrolytic capacitor in chip design with a sintered anode body made of a valve metal, an oxide layer applied on the valve metal, serving as a dielectric, an anode wire sintered into the anode body, a solid electrolyte serving as a cathode, an anode connection, a cathode connection with an anode body partially encircling U-shaped auxiliary bracket and a plastic covering.
- Such a capacitor is known from US 4,483,062.
- the U-shaped auxiliary bracket engages around the anode body and causes the body to be guided laterally during assembly.
- the object of the invention is to provide a solid electrolytic capacitor in chip design of the type mentioned at the outset, which has the smallest possible external dimensions.
- the cathode connection has a further auxiliary bracket which partially surrounds the anode body and is arranged opposite the U-shaped auxiliary bracket.
- a method for producing such a solid electrolytic capacitor is the subject of claim 2.
- the 1 shows a sintered anode body 1 made of a valve metal, such as e.g. Tantalum exists.
- a solid electrolyte e.g. B. semiconducting manganese dioxide.
- the sintered body 1 is arranged in a cathode connection 2, which is part of a carrier tape 3, to which the anode connection 4 is also attached.
- the cathode connection 2 has a U-shaped auxiliary bracket 5, which partially surrounds the sintered body 1 laterally. Opposite the U-shaped auxiliary bracket 5, a further auxiliary bracket 6 is arranged, which limits the deflection of the sintered body 1 upwards, for example when the weld connection 8 between the anode wire 7 and the anode connection 4 is made.
- the anode wire 7 is made of the same material as the anode body 1, i.e. in the case of a tantalum capacitor also made of tantalum.
- the arrangement of the upper auxiliary bracket 6 ensures that the anode body 1 is in any case arranged within the casing 9 when a plastic casing 9 is attached.
- the wall thickness of the casing 9 is only determined by the distance between the U-shaped auxiliary bracket 5 and the upper auxiliary bracket 6.
- FIG. 2 shows a plan view of a capacitor, from which it can be seen that cathode connection 2 and anode connection 4 are arranged on a continuous carrier tape 3.
- FIG. 3 shows an assembly procedure for producing a solid electrolytic capacitor in chip design.
- the sintered body 1 is advantageously inserted by a so-called pick-and-place machine into the “nest” formed by the cathode connection 2 and the anode connection 4.
- the movement sequence of the pick-and-place machine during the positioning of the anode body 1 is indicated by the arrows 11.
- the cathode contact arranged on the sintered body 1 is connected to the cathode connection by means of the solder 10.
- the manufacture of the sintered anode bodies up to the manufacture of the cathode contact, e.g. a silver conductive lacquer layer is carried out, for example, by the method known from DE 27 40 745 C2.
- the anode bodies are attached to holding devices and processed further. Since the exact distance of the anodes on the holding device is not a prerequisite for the assembly process, the smallest possible distance can be selected.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
Die Erfindung betrifft einen Festelektrolytkondensator in Chip-Bauweise mit einem gesinterten Anodenkörper aus einem Ventilmetall, einer auf dem Ventilmetall aufgebrachten, als Dielektrikum dienenden Oxidschicht, einem in den Anodenkörper eingesinterten Anodendraht, einem als Kathode dienenden Festelektrolyt, einem Anodenanschluß, einem Kathodenanschluß mit einem den Anodenkörper teilweise umgreifenden U-förmigen Hilfsbügel und einer Kunststoffumhüllung.The invention relates to a solid electrolytic capacitor in chip design with a sintered anode body made of a valve metal, an oxide layer applied on the valve metal, serving as a dielectric, an anode wire sintered into the anode body, a solid electrolyte serving as a cathode, an anode connection, a cathode connection with an anode body partially encircling U-shaped auxiliary bracket and a plastic covering.
Ein derartiger Kondensator ist aus der US 4 483 062 bekannt. Dabei umgreift der U-förmige Hilfsbügel den Anodenkörper und bewirkt, daß der Körper bei der Montage seitlich geführt wird.Such a capacitor is known from US 4,483,062. The U-shaped auxiliary bracket engages around the anode body and causes the body to be guided laterally during assembly.
Beim Verschweißen des Anodendrahtes mit dem Anodenanschluß besteht allerdings die Gefahr, daß der Anodenkörper aus dem Hilfsbügel herausgedrückt wird. Diese mögliche Verschiebung muß bei der späteren Umhüllung mit einem Kunststoff berücksichtigt werden, damit der Anodenkörper auf jeden Fall innerhalb der Kunststoffumhüllung angeordnet wird. Dies führt dazu, daß die Außenabmessungen des Chips größer sind als eigentlich erforderlich wäre.When welding the anode wire to the anode connection, however, there is a risk that the anode body will be pushed out of the auxiliary bracket. This possible shift must be taken into account in the subsequent covering with a plastic, so that the anode body is definitely arranged within the plastic covering. This means that the outer dimensions of the chip are larger than would actually be required.
Aus der US-PS 4497105 ist es zwar bekannt, bei einem Kondensator der eingangsgenannten Art einen weiteren Hilfsbügel gegenüber dem ersten U-förmigen Hilfsbügel anzuordnen, jedoch verhindert der zusätzliche Hilfsbügel auch nicht eine Bewegung des Anodenkörpers in vertikaler Richtung.From US-PS 4497105 it is known to arrange a further auxiliary bracket relative to the first U-shaped auxiliary bracket in a capacitor of the type mentioned, but the additional auxiliary bracket also does not prevent movement of the anode body in the vertical direction.
Aufgabe der Erfindung ist es, einen Festelektrolytkondensator in Chip-Bauweise der eingangs genannten Art anzugeben, der möglichst kleine Außenabmessungen besitzt.The object of the invention is to provide a solid electrolytic capacitor in chip design of the type mentioned at the outset, which has the smallest possible external dimensions.
Diese Aufgabe wird bei einem Festelektrolytkondensator in Chip-Bauweise der eingangs genannten Art erfindungsgemäß dadurch gelöst, daß der Kathodenanschluß einen weiteren den Anodenkörper teilweise umgreifenden Hilfsbügel besitzt, der gegenüber dem U-förmigen Hilfsbügel angeordnet ist.This object is achieved according to the invention in a solid electrolytic capacitor in chip design of the type mentioned at the outset in that the cathode connection has a further auxiliary bracket which partially surrounds the anode body and is arranged opposite the U-shaped auxiliary bracket.
Ein Verfahren zum Herstellen eines derartigen Festelektrolytkondensators ist Gegenstand des Anspruchs 2.A method for producing such a solid electrolytic capacitor is the subject of
Der Gegenstand der Erfindung wird anhand des folgenden Ausführungsbeispiels näher erläutert.The object of the invention is explained in more detail using the following exemplary embodiment.
In der dazugehörenden Zeichnung zeigen
- FIG 1
- eine Seitenansicht des Kondensators,
- FIG 2
- eine Draufsicht auf den Kondensator und
- FIG 3
- ein Montageverfahren.
- FIG. 1
- a side view of the capacitor,
- FIG 2
- a top view of the capacitor and
- FIG 3
- an assembly process.
In der FIG 1 ist ein gesinterter Anodenkörper 1 dargestellt, der aus einem Ventilmetall, wie z.B. Tantal besteht. Als Kathode dient ein Festelektrolyt, z. B. halbleitendes Mangandioxid. Der Sinterkörper 1 ist in einem Kathodenanschluß 2 angeordnet, der Teil eines Trägerbandes 3 ist, an dem ebenfalls der Anodenanschluß 4 angebracht ist. Der Kathodenanschluß 2 besitzt einen U-förmig gebildeten Hilfsbügel 5, der den Sinterkörper 1 teilweise seitlich umgreift. Gegenüber dem U-förmigen Hilfsbügel 5 ist ein weiterer Hilfsbügel 6 angeordnet, der die Auslenkung des Sinterkörpers 1 nach oben begrenzt, wenn beispielsweise die Schweißverbindung 8 zwischen Anodendraht 7 und Anodenanschluß 4 hergestellt wird. Der Anodendraht 7 besteht aus dem gleichen Material wie der Anodenkörper 1, d.h. bei einem Tantalkondensator ebenfalls aus Tantal.1 shows a sintered
Durch die Anordnung des oberen Hilfsbügels 6 wird gewährleistet, daß der Anodenkörper 1 bei Anbringen einer Kunststoffumhüllung 9 auf jeden Fall innerhalb der Umhüllung 9 angeordnet ist. Die Wandstärke der Umhüllung 9 wird nur vom Abstand zwischen U-förmig gebogenen Hilfsbügel 5 und oberen Hilfsbügel 6 bestimmt.The arrangement of the upper
In der FIG 2 ist eine Draufsicht auf einen Kondensator dargestellt, aus der ersichtlich ist, daß Kathodenanschluß 2 und Anodenanschluß 4 an einem kontinuierlichen Trägerband 3 angeordnet sind.
In der FIG 3 ist ein Montageverfatiren zur Herstellung eines Festelektrolytkondensators in Chip-Bauweise dargestellt. Der Sinterkörper 1 wird dabei vorteilhafterweise durch einen sogenannten Pick-and-Place-Automaten in das durch Kathodenanschluß 2 und Anodenanschluß 4 gebildet "Nest" eingelegt. Der Bewegungsablauf des Pick-and-Place-Automaten bei der Positionierung des Anodenkörpers 1 ist durch die Pfeile 11 gekennzeichnet.2 shows a plan view of a capacitor, from which it can be seen that
FIG. 3 shows an assembly procedure for producing a solid electrolytic capacitor in chip design. The sintered
Die auf dem Sinterkörper 1 angeordnete Kathodenkontaktierung ist mittels des Lotes 10 mit dem Kathodenanschluß verbunden.The cathode contact arranged on the sintered
In der FIG 3 ist zu erkennen, daß selbst bei Auslenkung des Anodenkörpers 1 eine Begrenzung dieser Bewegung durch den oberen Hilfsbügel 6 gewährleistet ist.In FIG 3 it can be seen that even when the
Die Herstellung der Sinteranodenkörper bis zur Herstellung der Kathodenkontaktierung, z.B. einer Silberleitlackschicht, erfolgt beispielsweise nach dem aus der DE 27 40 745 C2 bekannten Verfahren. Hierbei werden die Anodenkörper an Haltevorrichtungen befestigt und weiterverarbeitet. Da der exakte Abstand der Anoden an der Haltevorrichtung keine Voraussetzung des Montageverfahrens ist, kann der kleinstmögliche Abstand gewählt werden.The manufacture of the sintered anode bodies up to the manufacture of the cathode contact, e.g. a silver conductive lacquer layer is carried out, for example, by the method known from DE 27 40 745 C2. Here, the anode bodies are attached to holding devices and processed further. Since the exact distance of the anodes on the holding device is not a prerequisite for the assembly process, the smallest possible distance can be selected.
Es ist vorteilhaft, den Anodenkörper vor dem Montieren in das Trägerband zu verzinnen. Diese Maßnahme hat bei der Montage die Vorteile, daß die Anoden einen besseren mechanischen Schutz vor Beschädigung aufweisen, daß eine bessere automatische Handhabbarkeit beim Pick-and-Place-Vorgang vorliegt und daß schließlich ein besseres Benetzen bei einem Reflow-Löten auch nach längerer Zwischenlagerung gewahrleistet ist.It is advantageous to tin-plate the anode body before mounting it in the carrier tape. This measure has the advantages during assembly that the anodes have better mechanical protection against damage, that there is better automatic manageability during the pick-and-place process, and that finally better wetting during reflow soldering is ensured even after prolonged storage is.
Dadurch ergibt sich eine höhere Fertigungssicherheit, was die Voraussetzung für hohe Ausbeute und gleichmäßig hohen Qualitäts- und Zuverlässigkeitsstandard der Bauelemente ist.This results in higher manufacturing reliability, which is the prerequisite for high yield and consistently high quality and reliability standards of the components.
Die Verzinnung der Anoden ist in den automatischen Fertigungsablauf integrierbar und geschieht folgendermaßen, daß zunächst die Anoden mit einer Lötpaste beschichtet werden, einem Reflow-Löten (IR- oder Vapor-phase-Verfahren) unterzogen werden und daß danach die Anoden von der Haltevorrichtung abgetrennt und geordnet magaziniert werden. Statt der Magazinierung ist auch die spätere geordnete Bereitstellung über ein Rüttlersystem möglich. Die Verfahrensschritte können vorzugsweise mit Hilfe eines Roboters durchgeführt werden, der einzelne Haltevorrichtungen der Reihe nach verarbeitet:
- Entnahme einer Haltevorrichtung mit Anoden aus dem Halterahmen,
- Beschichten der Anoden mit Lötpaste,
- Reflow-Löten der Paste mit dem Vapor-Phase-Verfahren, wobei das überschüssige Flußmittel abtropft, so daß keine zusätzliche Reinigung erforderlich ist,
- Abschneiden und Magazinierung der Anoden.
- Removal of a holding device with anodes from the holding frame,
- Coating the anodes with solder paste,
- Reflow soldering of the paste using the vapor phase method, the excess flux dripping off, so that no additional cleaning is required,
- Cutting and magazining the anodes.
Die Genauigkeit und Geschwindigkeit moderner Pick-and-Place-Automaten zusammen mit der inzwischen erreichten Flexibilität bezüglich der Handhabung unterschiedlicher, auch extrem kleiner Objekte, macht diese Geräte auch für die Montage von Festelektrolyt-Chipkondensatoren geeignet.The accuracy and speed of modern pick-and-place machines together with the flexibility that has now been achieved with regard to the handling of different, even extremely small objects, makes these devices also suitable for the assembly of solid electrolyte chip capacitors.
Die restlichen Fertigungsschritte wie Umhüllen, Trennen, Biegen der Anschlüsse, Endformieren, Prüfen usw. erfolgen dann in der üblichen Weise.The remaining production steps such as wrapping, cutting, bending the connections, final forming, testing, etc. are then carried out in the usual way.
Zusammenfassend lassen sich folgende wesentliche Vorteile des angeführten Montageverfahrens für Chipkondensatoren anführen:
- höhere Anodendichte pro Haltevorrichtung in der Vorfertigung,
- mechanischer Schutz der Anoden durch Verzinnen der Anoden vor der Montage,
- geordnetes Bereitstellen der Anoden,
- sichere Positionierung der Anoden durch fortlaufendes Trägerbandsystem mit speziell geformten Hilfsbügeln,
- Aufbringen einer Lötpaste für die Kontaktierung der Kathode,
- Positionieren des Anodenkörpers auf dem Trägerband mit einem Pick-and-Place-Automaten,
- Anschweißen des Anodendrahtes unmittelbar nach der Positionierung des Körpers,
- Reflow-Löten des Kathodenanschlusses (unmittelbar nach der Positionierung oder in einem separaten Arbeitsschritt), wobei das Reflow-Löten gleichzeitig mit dem Anschweißen des Anodendrahtes erfolgen kann oder anschließend im Durchlaufverfahren (IR- oder Vapor-Phase) durchgeführt wird.
- higher anode density per holding device in prefabrication,
- mechanical protection of the anodes by tinning the anodes before assembly,
- orderly provision of the anodes,
- Safe positioning of the anodes thanks to a continuous carrier tape system with specially shaped auxiliary bars
- Applying a solder paste for contacting the cathode,
- Positioning the anode body on the carrier tape with a pick-and-place machine,
- Welding the anode wire immediately after positioning the body,
- Reflow soldering of the cathode connection (immediately after positioning or in a separate step), whereby the reflow soldering can be carried out simultaneously with the welding of the anode wire or subsequently carried out in a continuous process (IR or vapor phase).
Claims (2)
- Solid-electrolyte capacitor with chip structure, comprising a sintered anode body (1) made of a valve metal, an oxide layer applied to the valve metal and serving as dielectric, an anode wire (7) sintered into the anode body (1), a solid electrolyte serving as cathode, an anode connection (4), a cathode connection (2) having a U-shaped auxiliary clip (5) partly encompassing the anode body and a plastic envelope (9), characterized in that the cathode connection has a further auxiliary clip (6) which partly encompasses the anode body (1) and which is disposed opposite the U-shaped auxiliary clip (5).
- Method of manufacturing solid-electrolyte capacitors with chip construction according to Claim 1, comprising the following method steps:a) Manufacture of the anode bodies (1) with solid electrolyte and cathode contacting,b) Tinning of the anode bodies (1),c) Separation of the anode bodies (1),d) Assembly, with the aid of an automatic pick-and-place machine, on a carrier strip (3) having cathode connections (2) and anode connections (4) using cathode connections (2) having a U-shaped auxiliary clip (5), which partly encompasses the anode body (1), and a further auxiliary clip (6) which partly encompasses the anode body (1) and which is disposed opposite the U-shaped auxiliary clip (5),e) Welding (8) of the anode wires (7) onto the anode connections (4),f) Soldering-on (10) of the cathode connections (2),g) Encapsulation of the capacitors with a plastic (9).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3931245A DE3931245C1 (en) | 1989-09-19 | 1989-09-19 | |
| DE3931245 | 1989-09-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0418561A2 EP0418561A2 (en) | 1991-03-27 |
| EP0418561A3 EP0418561A3 (en) | 1991-05-08 |
| EP0418561B1 true EP0418561B1 (en) | 1994-01-19 |
Family
ID=6389731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP90115788A Expired - Lifetime EP0418561B1 (en) | 1989-09-19 | 1990-08-17 | Solid electrolytic chip capacitor and method of manufacture |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5067048A (en) |
| EP (1) | EP0418561B1 (en) |
| JP (1) | JPH03108308A (en) |
| DE (2) | DE3931245C1 (en) |
| ES (1) | ES2048377T3 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006073791A (en) * | 2004-09-02 | 2006-03-16 | Nec Tokin Corp | Surface-mounting thin capacitor |
| DE102004042753A1 (en) * | 2004-09-03 | 2006-03-30 | Epcos Ag | chip capacitor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2740745C2 (en) * | 1977-09-09 | 1982-05-06 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of solid electrolytic capacitors |
| US4288842A (en) * | 1979-06-11 | 1981-09-08 | Emhart Industries, Inc. | Solid chip capacitor and method of manufacture |
| JPS5778129A (en) * | 1980-10-31 | 1982-05-15 | Matsushita Electric Ind Co Ltd | Method of producing chip shaped solid electrolytic condenser |
| JPS57139917A (en) * | 1981-02-23 | 1982-08-30 | Matsushita Electric Ind Co Ltd | Chip type solid electrolytic condenser and method of producing same |
| JPS5934625A (en) * | 1982-08-20 | 1984-02-25 | 松尾電機株式会社 | Method of producing chip solid electrolyte condenser |
| FR2542923B1 (en) * | 1983-03-18 | 1986-08-29 | Componentes Electronicos Sa Cs | POLARIZED ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD |
| GB2141583A (en) * | 1983-06-17 | 1984-12-19 | Standard Telephones Cables Ltd | Leadless capacitors |
| US5005107A (en) * | 1988-12-07 | 1991-04-02 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
-
1989
- 1989-09-19 DE DE3931245A patent/DE3931245C1/de not_active Expired - Fee Related
-
1990
- 1990-08-17 ES ES90115788T patent/ES2048377T3/en not_active Expired - Lifetime
- 1990-08-17 EP EP90115788A patent/EP0418561B1/en not_active Expired - Lifetime
- 1990-08-17 DE DE90115788T patent/DE59004307D1/en not_active Expired - Fee Related
- 1990-08-30 US US07/574,797 patent/US5067048A/en not_active Expired - Fee Related
- 1990-09-14 JP JP2245975A patent/JPH03108308A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0418561A3 (en) | 1991-05-08 |
| ES2048377T3 (en) | 1994-03-16 |
| JPH03108308A (en) | 1991-05-08 |
| DE59004307D1 (en) | 1994-03-03 |
| EP0418561A2 (en) | 1991-03-27 |
| US5067048A (en) | 1991-11-19 |
| DE3931245C1 (en) | 1991-01-24 |
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