DE3329477A1 - Miniature wire link for producing connections on assemblies - Google Patents
Miniature wire link for producing connections on assembliesInfo
- Publication number
- DE3329477A1 DE3329477A1 DE19833329477 DE3329477A DE3329477A1 DE 3329477 A1 DE3329477 A1 DE 3329477A1 DE 19833329477 DE19833329477 DE 19833329477 DE 3329477 A DE3329477 A DE 3329477A DE 3329477 A1 DE3329477 A1 DE 3329477A1
- Authority
- DE
- Germany
- Prior art keywords
- miniature
- wire bridge
- connection points
- assemblies
- miniature wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
Abstract
Description
Miniatur-Drahtbrücke zum Herstellen von VerbindungenMiniature wire bridge for making connections
auf Baugruppen Die Erfindung betrifft eine Miniatur-Drahtbrücke zum Herstellen von Verbindungen auf Baugruppen, wie sie im Oberbegriff des Patentanspruches 1 näher bezeichnet ist.on assemblies The invention relates to a miniature wire bridge for Establishing connections to assemblies as described in the preamble of the claim 1 is designated in more detail.
In der Hauptanmeldung ist beschrieben, daß beim entwerfen von Layouts für Leiterplatten oder in Filmtechnik herzustellenden Hybridschaltungen es nicht immer möglich ist mit Leiterbahnen die miteinander zu verbindenden Punkte direkt zu erreichen. Damit nicht teure Mehrschichtschaltungen angewendet werden müssen, wird in der Hauptanmeldung vorgeschlagen)Miniatur-Drahtbriicken einzusetzen, die wie ein Bauelement an den Stellen bestückt werden, wo eine Iieiterbahnkreuzung erforderlich ist. Die Miniatur-Drahtbrücken sind dafür speziell hergestellt und haben wie die Bauelemente entsprechende Anschlußpunkte. Da å je nach Ausführungsform einer Miniatur-Drahtbrücke für die eigenständige Herstellung spezielle Werkzeuge erforderlich sind, kann dies zu einer nennenswerten Verteuerung führen.In the main application it is described that when designing layouts for printed circuit boards or hybrid circuits to be produced using film technology, it is not It is always possible to directly connect the points to be connected with conductor tracks to reach. So that expensive multi-layer circuits do not have to be used, proposed in the main application) to use miniature wire bridges that like a component can be assembled at the points where a line crossing is required is. The miniature wire bridges are specially made for this and, like the Components corresponding connection points. Because å depending on the embodiment of a miniature wire bridge Special tools are required for independent production, this can be lead to a significant increase in price.
Die Aufgabe der Erfindung besteht deshalb darin, ein weiteres Verfahren zur Herstellung von Verbindungen auf Baugruppen anzugeben, wobei bereits vorgefertigte Konfigurationen übernommen werden können. Deshalb wird vorgeschlagen, wie dies in den Patentansprüchen 1 und 2 angegeben ist, daß für Niniatur-Transistoren vorgefertigte Anschlußpunkte und Gehäuse verwendet werden.The object of the invention is therefore to provide a further method for the production of connections on assemblies to be specified, with already prefabricated Configurations can be adopted. So it is suggested that this be done in Claims 1 and 2 indicate that prefabricated for miniature transistors Connection points and housing can be used.
Es wird damit in vorteilhafter Weise erreicht, daß keine speziellen Werkzeuge zur Herstellung von Miniatur-Drahtbrücken notwendig sind. Mit den bei Miniatur-Transistoren vorhandenen drei Anschlüssen lassen sich nahezu alle vorkommenden Drahtbrücken auf einfache Weise realisieren.It is thus achieved in an advantageous manner that no special Tools for making miniature wire bridges are necessary. With the at Miniature transistors existing three connections can be used almost all occurring Realize wire bridges in a simple way.
Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand von Zeichnungen näher erläutert. Es zeigt: Fig. 1 eine Miniatur-Drahtbrücke, deren Anschlußpunkte aus einem einzigen Stück Metall bestehen.An exemplary embodiment of the invention is described below with reference to FIG Drawings explained in more detail. It shows: FIG. 1 a miniature wire bridge, its connection points consist of a single piece of metal.
Fig. 2 eine Miniatur-Drahtbrücke, die aus Metallstanzstreifen hergestellt wird. Fig. 2 shows a miniature wire bridge made from punched metal strips will.
Bei der in Fig. 1 dargestellten Miniatur-Drahtbrücke D wird die leitende Verbindung aller drei Anschlußpunkte durch ein einziges Stück Metall erreicht,das entsprechend geformt ist. Der zur Isolierung notwendige Kunststoffkörper K hat die gleiche Form wie bei einem Miniatur-Transistor.In the miniature wire bridge D shown in Fig. 1, the conductive Connection of all three connection points achieved by a single piece of metal, the is shaped accordingly. The plastic body K required for insulation has the same shape as a miniature transistor.
In der Fig. 2 ist dargestellt, wie die zur Herstellung von Miniatur-Transistoren benutze Metallstanzstreifen M zur Herstellung von Miniatur-Drahtbrücken D verwendet werden.In Fig. 2 is shown how those for the production of miniature transistors use metal punching strips M for making miniature wire bridges D. will.
Dabei werden anstelle des bei Miniatur-Transistoren üblichen Halbleiterblättchens lediglich Bonddrähte B zur direkten Verbindung der Anschlußpunkte untereinander aufgebracht. Dieser Vorgang bedeutet zwar einen zusätzlichen Arbeitsgang jedoch wird durch die Einsparung eines speziell gestanzten Metallstückes, wie es in Fig. 1 dargestellt ist, dieser Nachteil zumindest wieder aufgehoben. Die Umhüllung der Miniatur-Drahtbrücke D durch einen Kunststoffkörper K erfolgt mit einem bei der Herstellung bei der Miniatur-Transistoren angewendeten Verfahren. Es ist zweckmäßig, derartige Miniatur-Drahtbrücken D besonders zu kennzeichnen, beispielsweise durch eine besondere Farbgebung, damit sie nicht mit den aktiven Bauelementen verwechselt werden können.Instead of the small semiconductor wafers that are common with miniature transistors only bonding wires B for direct connection of the connection points to one another upset. Although this process means an additional work step is achieved by saving a specially stamped metal piece, as shown in Fig. 1 is shown, this disadvantage is at least eliminated. Wrapping the Miniature wire bridge D through a plastic body K is made with one at the Manufacturing process used in miniature transistors. It is appropriate to identify such miniature wire bridges D especially, for example by a special color scheme so that it is not confused with the active components can be.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833329477 DE3329477A1 (en) | 1982-11-02 | 1983-08-16 | Miniature wire link for producing connections on assemblies |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823240425 DE3240425A1 (en) | 1982-11-02 | 1982-11-02 | Miniature wire link for producing connections on assemblies |
DE19833329477 DE3329477A1 (en) | 1982-11-02 | 1983-08-16 | Miniature wire link for producing connections on assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3329477A1 true DE3329477A1 (en) | 1985-03-07 |
Family
ID=25805477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19833329477 Ceased DE3329477A1 (en) | 1982-11-02 | 1983-08-16 | Miniature wire link for producing connections on assemblies |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3329477A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0849982A1 (en) * | 1996-12-20 | 1998-06-24 | Compaq Computer Corporation | Improved transistor/resistor printed circuit board layout |
EP1876872A1 (en) * | 2006-07-07 | 2008-01-09 | Delphi Technologies, Inc. | Printed circuit board for surface mounting of components and method therefor |
-
1983
- 1983-08-16 DE DE19833329477 patent/DE3329477A1/en not_active Ceased
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0849982A1 (en) * | 1996-12-20 | 1998-06-24 | Compaq Computer Corporation | Improved transistor/resistor printed circuit board layout |
EP1876872A1 (en) * | 2006-07-07 | 2008-01-09 | Delphi Technologies, Inc. | Printed circuit board for surface mounting of components and method therefor |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AF | Is addition to no. |
Ref country code: DE Ref document number: 3240425 Format of ref document f/p: P |
|
8127 | New person/name/address of the applicant |
Owner name: TELENORMA TELEFONBAU UND NORMALZEIT GMBH, 6000 FRA |
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8131 | Rejection |