DE3046192A1 - Un-encapsulated compact integrated circuit carrier - incorporated into automatic machine readable identity cards and has device joined by film conductors to contact pads through windows - Google Patents

Un-encapsulated compact integrated circuit carrier - incorporated into automatic machine readable identity cards and has device joined by film conductors to contact pads through windows

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Publication number
DE3046192A1
DE3046192A1 DE19803046192 DE3046192A DE3046192A1 DE 3046192 A1 DE3046192 A1 DE 3046192A1 DE 19803046192 DE19803046192 DE 19803046192 DE 3046192 A DE3046192 A DE 3046192A DE 3046192 A1 DE3046192 A1 DE 3046192A1
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DE
Germany
Prior art keywords
windows
film
connection points
window
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19803046192
Other languages
German (de)
Other versions
DE3046192C2 (en
Inventor
Yahya Dipl.-Ing. 8000 München Haghiri-Tehrani
Joachim Hoppe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GAO Gesellschaft fuer Automation und Organisation mbH
Original Assignee
GAO Gesellschaft fuer Automation und Organisation mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GAO Gesellschaft fuer Automation und Organisation mbH filed Critical GAO Gesellschaft fuer Automation und Organisation mbH
Priority to DE19803046192 priority Critical patent/DE3046192A1/en
Priority to US06/317,873 priority patent/US4549247A/en
Priority to NLAANVRAGE8105002,A priority patent/NL189937C/en
Priority to IT25059/81A priority patent/IT1139726B/en
Priority to CH7364/81A priority patent/CH661816A5/en
Priority to SE8106889A priority patent/SE457677B/en
Priority to FR8121783A priority patent/FR2494908B1/en
Priority to GB8135224A priority patent/GB2088630B/en
Publication of DE3046192A1 publication Critical patent/DE3046192A1/en
Application granted granted Critical
Publication of DE3046192C2 publication Critical patent/DE3046192C2/de
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

The device is fixed by a contact system on the support. The conducting paths are fixed at one end to the device and at the other to contact pads. The contact pads are on one side of the supporting plate and the device on the other. Contact is established through windows cut in the plate with the connecting pads of the device. The windows may be directly aligned with the connecting pads and the conducting paths joined direct or extended conductors overlapping the windows joined to the connecting pads by their underside by gold filament wire. The conducting tracks may be inserted through the windows and lapped over the underside of the device which is glued to the plate or lapped over the underside of the plate and connected to the upper face of the device. Unencapsulated integrated circuits are incorporated in e.g. identity cards submitted to daily usage in automatic machines where a minimum contact area of 1 to 2 mm2 is required. The small dimensions of the integrated circuit carrier allows a small surface area to be subject to mechanical constraints.

Description

Die Erfindung betrifft ein Trägerelement fürThe invention relates to a support element for

IC-Bausteine, bei dem der Baustein mit Hilfe einer sogenannten Kontaktspinne derart auf einem Träger befestigt ist, daß die Leiterbahnen der Spinne an jeweils einem Ende mit den entsprechenden Anschlußpunkten des Bausteins verbunden sind und an jeweils anderen Enden in Kontaktflächen münden.IC components in which the component is made with the help of a so-called contact spider is mounted on a carrier in such a way that the conductor tracks of the spider to each are connected at one end to the corresponding connection points of the module and open into contact surfaces at the other ends.

üblicherweise werden IC-Bausteine in einfach zu handhabende Gehäuse, z.B. in sog. Dual-In-line-Gehäuse eingebaut, die relativ zu den Abmaßen des Bausteins ein großes Volumen aufweisen. Das wirkt sich vor allem bei komplexen Schaltungsanordnungen nachteilig aus, wenn diese auf engstem Raum unterzubringen sind.IC components are usually packaged in easy-to-use housings, e.g. built into so-called dual-in-line housing, which is relative to the dimensions of the component have a large volume. This is particularly important in the case of complex circuit arrangements disadvantageous when these are to be accommodated in a very small space.

Es ist daher schon vorgeschlagen worden, die IC-Bausteine unverkapselt zu verarbeiten, wobei der Baustein zur besseren Handhabung beispielsweise auf einem Filmstreifen montiert wird. In diesem Zusammenhang ist die sogenannte Mikropack-Anordnung (siehe Sonderdruck der Fa. Siemens bauteile report" 16, 1978, Heft 2, Seite 40-44) bekannt geworden, die überall dort vorteilhaft eingesetzt werden kann, wo für eine Schaltungsanordnung nur ein eng begrenztes Einbauvolumen zur Verfügung steht (Schaltungen für Uhren, Hörgeräte und dgl.).It has therefore already been proposed that the IC components should be unencapsulated to process, with the block for better handling, for example on a Film strip is mounted. In this context is the so-called micropack arrangement (see special print from Siemens components report "16, 1978, issue 2, pages 40-44) become known, which can be used advantageously wherever for a Circuit arrangement only a tightly limited installation volume is available (circuits for watches, hearing aids and the like).

Als Ausgangsmaterial für die genannte Anordnung wird ein temperaturfester folienstreifen verwendet.A temperature-resistant one is used as the starting material for the arrangement mentioned foil strips used.

Aus diesem werden in äquidistanten Abständen, den Abmaßen des Bausteins angepaßte Fenster ausgestanzt.From this, at equidistant intervals, the dimensions of the building block Customized windows punched out.

Der Folienstreifen wird mit einem leitenden Material beschichtet, aus dem derart Leiterbahnen geätzt werden, daß sich deren Enden freitragend in den Fensterbereich erstrecken.The foil strip is coated with a conductive material, from which conductor tracks are etched in such a way that their ends are self-supporting in the Extend window area.

Schließlich werden die Anschlußpunkte des Bausteins mit den entsprechenden Enden der Leiterbahnen verbunden.Finally, the connection points of the block with the appropriate Ends of the conductor tracks connected.

Die offenen Enden der Leiterbahnen münden in gut zugängigen Kontaktflächen und sind rings um den Fensterbereich auf dem Film angeordnet. Damit lassen sich Mikropack-Anordnungen notfalls auch von Hand in beispielsweise gedruckte Schaltungen üblicher Bauart einlöten.The open ends of the conductor tracks lead to easily accessible contact areas and are arranged around the window area on the film. With that you can If necessary, micropack arrangements can also be made by hand in printed circuits, for example solder in the usual design.

In jüngster Zeit ist auch vorgeschlagen worden, unverkapselte Bausteine der genannten Art beispielsweise in Ausweiskarten oder ähnlichen Datenträgern einzubauen. Dabei ist zu berücksichtigen, daß Ausweiskarten in ihrem täglichen Gebrauch starken Berastungen ausgesetzt sind, so daß eine möglichst kleine Bauform anzustreben ist. Andererseits sollten die Kontaktflächen auf dem den Baustein tradn Film von vornherein so ausgebildet sein, daß eine direkte Kontaktabnahme bei der Benutzung der Karte im Automaten beispielsweise mit Kontaktstiften möglich ist.Recently, unencapsulated building blocks have also been proposed of the type mentioned, for example, to be installed in ID cards or similar data carriers. It should be noted that ID cards are strong in their daily use Are exposed to rests, so that the smallest possible design is to be aimed for. On the other hand, the contact surfaces should be on the film from the outset be designed so that direct contact is made when using the card is possible in the machine, for example, with contact pins.

Da bei der genannten Anordnung die Kontaktflächen, die bei galvanischer Kontaktabnahme in einem Automaten eine Mindestfläche von 1-2 mm2 aufweisen müssen, rings um den Fensterbereich angeordnet sind, hat die gesamte Anordnung noch erheblich größere Abmaße als der eigentliche IC-Baustein.Since with the arrangement mentioned, the contact surfaces, which in the case of galvanic Contact pick-up in a machine must have a minimum area of 1-2 mm2, are arranged around the window area the entire arrangement considerably larger dimensions than the actual IC component.

Die Aufgabe der Erfindung besteht darin, ein Trägerelement für IC-Bausteine vorzuschlagen, das gegenüber bisher bekannt gewordenen Anordnungen kleinere, dem IC-Baustein besser angepaßte Abmaße aufweist.The object of the invention is to provide a carrier element for IC modules to propose the smaller compared to previously known arrangements, the IC module has better adapted dimensions.

Die Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Kontaktfiächen silber dem Baustein auf der dem Baustein abgewandten Seite der Folie innerhalb des Umrisses des Bausteins angeordnet sind und die Verbindung der Leiterbahnenden mit den entsprechenden Anschlußpunkten des Bausteins durch ausgestanzte Fenster in der Folie hergestellt sind.The object is achieved according to the invention in that the contact surfaces silver on the component on the side of the film facing away from the component within the Outline of the block are arranged and the connection of the conductor track ends with the corresponding connection points of the module through punched-out windows in the Foil are made.

Die erfindungsgemäße Lösung liefert kompakte, flächenmäßig dem IC-Baustein angepaßte, filmkontaktierte IC-Trägerelemente, die überall dort gut einsetzbar sind, wo nur sehr geringe Einbauflächen zur Verfügung stehen.The solution according to the invention provides the IC module with a compact area adapted, film-contacted IC carrier elements that can be used anywhere, where only very little installation space is available.

Die geringen Abmaße des IC-Trägerelements lassen nur eine entsprechend geringe Angriffsfläche gegenüber mechanischen Beanspruchungen zu. Aus diesem Grund sind sie besonders gut für den Einbau in Träger, wie beispielsweise Ausweiskarten geeignet, die in ihrem Gebrauch starken mechanischen Beanspruchungen unterliegen.The small dimensions of the IC carrier element leave only one corresponding low contact surface against mechanical loads. For this reason they are particularly good for installation in carriers such as ID cards suitable, which are subject to strong mechanical stresses in their use.

Weitere Einzelheiten der Erfindung ergeben sich aus den nachfolgend beschriebenen Ausführungsbeispielen.Further details of the invention emerge from the following described embodiments.

In den Zeichnungen zeigen: Fig. 1 eine erfindungsgemäße Anordnung in der Draufsicht, Fig. 2 die Anordnung der Fig. 1 im Schnitt und die Fig. 3 bis 6 weitere Ausführungsbeispielse der Erfindung.The drawings show: FIG. 1 an arrangement according to the invention in plan view, FIG. 2 shows the arrangement of FIG. 1 in section and FIGS. 3 to 3 6 further embodiments of the invention.

In dem in den Fig. 1 und 2 gezeigten Ausführungsbeispiel ist der IC-Baustein 6 auf einen Filmstreifen 1 montiert. Die überlicherweise bei den Filmstreifen, z.B. Super-8-Filmen, vorhandene Perforation 2 kann zum Transport des Films während der Produktionsphasen des Trägerelements genutzt werden.In the embodiment shown in FIGS. 1 and 2, the IC module is 6 mounted on a film strip 1. Commonly used in film strips, e.g. Super 8 films, existing perforation 2 can be used to transport the film during the Production phases of the carrier element are used.

Auf dem Filmstreifen sind Kontaktflächen 4 angeordnet, deren Leiterbahnenden 7 mit den entsprechenden Anschlußpunkten 8 des IC-Bausteins 6 verbunden sind (siehe auch Fig. 2).On the film strip contact surfaces 4 are arranged, the conductor track ends 7 are connected to the corresponding connection points 8 of the IC module 6 (see also Fig. 2).

Die Kontaktflächen 4 sind in ihrer Anordnung sowie ihrer flächenmäßigen Ausdehnung so gewählt, daß während der Ankopplung des Trägerelements an ein elektrisches Gerät eine direkte Kontaktabnahme beispielsweise mit geeigneten Kontaktstiften möglich ist. Die Leiterbahnenden 7 sind über aus dem Film 1 ausgestanzten Fenstern 3 angeordnet. In einer bevorzugten Ausführungsform sind die Fenster 3 derart ausgestaltet, daß die Leiterbahnenden freitragend in den Fensterbereich 3 ragen und somit während der Kontaktierung durch die Fenster hindurch mit dem IC-Baustein verbunden werden können.The contact surfaces 4 are in their arrangement and their areal Expansion chosen so that during the coupling of the carrier element to an electrical Direct contact can be made on the device, for example with suitable contact pins is. The conductor track ends 7 are arranged over windows 3 punched out of the film 1. In a preferred embodiment, the windows 3 are designed such that the conductor ends protrude self-supporting into the window area 3 and thus during the Contact through the window with the IC module can be connected.

Zur Herstellung des Trägerelements wird der Film 1 in einem ersten Arbeitsgang in regelmä#ßigen Abständen einem Stanzvorgang unterzogen, wobei sich beispielsweise das in der Fig. 1 gezeigte Stanzmuster mit den Fenstern 3 ergibt. Anschließend wird eine Seite des Films mit einer leitenden Schicht überzogen, aus der nach bekannten Verfahren die zur Montage des IC-Bausteins notwendigen Leiterbahnen (4,7) yeätzt werden.To produce the carrier element, the film 1 is in a first Work step is subjected to a punching process at regular intervals, whereby for example, the punching pattern shown in FIG. 1 with the windows 3 results. One side of the film is then coated with a conductive layer according to known methods, the conductor tracks necessary for the assembly of the IC module (4,7) can be etched.

In dem gezeigten Ausführungsbeispiel sind die Leiterbahnen in der Form geätzt, daß sich über der Baustein-Oberfläche innerhalb des Umrisses des Bausteins auf dem Film 1 die Kontaktflächen 4 und über den ausgestanzten Fenstern die mit dem Baustein zu verbindenden Leiterbahnen 7 ergeben.In the embodiment shown, the conductor tracks are in the Etched shape that extends over the brick surface within the outline of the brick on the film 1 the contact surfaces 4 and over the punched out windows the ones with the module to be connected conductor tracks 7 result.

Zur Fertigstellung des Trägerelements werden die Leiterbahnenden 7 durch die ausgestanzten Fenser 3 des Films auf die Anschlußpunkte 8 des IC-Bausteins 6 geführt und mit diesem durch einen Lötprozess verbunden.To complete the carrier element, the conductor track ends 7 through the punched-out windows 3 of the film onto the connection points 8 of the IC module 6 and connected to this by a soldering process.

Wie die Fig. 2 zeigt, kann der Baustein - flexibel gehaltert - in einem gewissen Abstand zum Film 1 kontaktiert werden. Steht für den späteren Verwendungszweck des Trägerelements nur eine sehr geringe Einbautiefe zur Verfügung, wird man den Baustein 6, z.B.As shown in Fig. 2, the block - flexibly supported - in a certain distance to the film 1 are contacted. Stands for later use of the carrier element only has a very small installation depth available, one will use the Building block 6, e.g.

durch Verkleben, direkt am Film anliegend, mit den Leiterbahnenden verbinden.by gluing, directly adjacent to the film, with the conductor track ends associate.

Bei den in den Fig. 3 und 4 gezeigten Trägerelementen werden die Leiterbahnenden der Kontaktflächen so vorbereitet, daß auch die Montage von IC-Bausteinen mit gegenüber den ersten Beispielen enger zusammenliegenden Anschlußpunkten möglich ist.In the carrier elements shown in FIGS. 3 and 4, the conductor track ends are the contact surfaces prepared so that the assembly of IC modules with opposite In the first examples, connection points that are closer together are possible.

Bei der in der Fig. 3 gezeigten Ausführungsform werden die Leiterbahnenden 10 vor der Kontaktierung des Bausteins 11 durch die ausgestanzten Fenster 3 auf die den Kontaktflächen 4 gegenüberliegenden Seite des Films gebogen. Die Anschlußpunkte 8 des Bausteins 11 werden dann mit den umgebogenen Leiterbahnenden 10 verbunden.In the embodiment shown in FIG. 3, the conductor track ends are 10 through the punched-out window 3 before contacting the module 11 the side of the film opposite the contact surfaces 4 is bent. The connection points 8 of the module 11 are then connected to the bent conductor track ends 10.

Bei dem in der Fig. 4 gezeigten Ausführungsbeispiel werden die Leiterbahnenden 10 durch die ausgestanzten Fenster 3 des Films um den IC-Baustein gebogen und daraufhin mit den Anschluß punkten des Bausteins verbunden. Der IC-Baustein kann vor dem Biegevorgang durch einen geeigneten Kleber 12 auf dem Film 1 befestigt werden, damit er während des Biegovorc3~lnys sicher I,osiionicrt ist.In the embodiment shown in FIG. 4, the conductor track ends are 10 bent through the punched-out window 3 of the film around the IC module and then connected to the connection points of the module. The IC module can be before the bending process be fixed by a suitable adhesive 12 on the film 1 so that it during des Biegovorc3 ~ lnys sure I, osiionicrt is.

Die Fig. 5 zeigt ein Ausführungsbeispiel des erfindungsgemäßen Trägerelements, bei dem der IC-Baustein 11 in der sogenannten Bondiertechnik kontaktiert ist. In diesem Fall werden die Anschlußpunkte 8 des Bausteins 11 über feine Golddrähtchen 15 durch die Fenster 3 des Films mit den Leiterbahnenden der Kontaktflächen verbunden. Bei dieser Aus- führungsform kann, wie beispielsweise in Fig. 5 gezeigt, die über die ausgestanzten Fenster 3 hinausragende Form der Leiterbahnenden 10 sinnvoll sein.Fig. 5 shows an embodiment of the carrier element according to the invention, in which the IC module 11 is contacted using the so-called bonding technique. In In this case, the connection points 8 of the module 11 are made of fine gold wires 15 connected through the window 3 of the film with the conductor track ends of the contact surfaces. With this out guide form, as for example in FIG. 5 shown, the protruding over the punched window 3 shape of the conductor track ends 10 be useful.

Die Fig. 6 zeigt ein Ausführungsbeispiel des erfindungsgemäßen Trägerelements, bei dem ein IC-Baustein 11 verarbeitet worden ist, der Anschlußpunkte 8a,8b auf der Vor- und Rückseite aufweist.6 shows an embodiment of the carrier element according to the invention, in which an IC module 11 has been processed, the connection points 8a, 8b the front and back.

Die verwendeten Kontaktiertechniken wurden anhand der Fig. 2 und 3 beschrieben.The contacting techniques used were illustrated with reference to FIGS. 2 and 3 described.

Neben der Möglichkeit, die Kontaktflächen aus einer leitenden Filmbeschichtung auszuätzen, ist es auch bekannt geworden, die Elemente unabhängig vom Träger bzw. Film in einem separaten Verfahrensgang in Form einer sogenannten Kontaktspinne herzustellen.In addition to the possibility of the contact surfaces from a conductive film coating etching out, it has also become known to use the elements independently of the carrier or Produce film in a separate process in the form of a so-called contact spider.

Die Kontaktspinne mit den J'eiterbahnenden bzw.The contact spider with the trailing end resp.

Kontaktflächen wird erst während des Kontaktiervorgangs beispielsweise mittels eines Klebers auf dem Film fixiert. Im gleichen Arbeitsgang können die Leiterbahnenden, wie anhand der gezeigten Figur erläutert, mit den entsprechenden Anschlußpunkten des Bausteins verbunden werden.Contact surfaces are only used during the contacting process, for example fixed on the film by means of an adhesive. In the same operation, the conductor ends, as explained with reference to the figure shown, with the corresponding connection points of the block.

Bei dem oben genannten Verfahren werden alle Kontaktflächen und die zugehörigen Leiterbahnenden gemeinsam verarbeitet, da sie Elemente eines gemeinsamen Rahmens, der sogenannten Kontaktspinne sind.In the above procedure, all contact surfaces and the associated conductor track ends processed together, since they are elements of a common Frame, the so-called contact spider.

Es ist andererseits auch möglich, die Elemente (Kontaktfläche mit Leiterbahn) als Einzelstücke herzustellen und gemäß der Erfindung zu verarbeiten. Die Elemente können in diesem Fall aus leitendem Material, das ggf. mit dem Trägerfilm verbunden ist, beispielsweise nach dum "Etikettenprinzip" ausgestanzt werden.On the other hand, it is also possible to use the elements (contact area with Conductor track) to be produced as individual pieces and processed according to the invention. In this case, the elements can be made of conductive material, possibly with the carrier film is connected, for example, punched out according to the "label principle".

Claims (6)

Trägerelement für IC-Bausteine Patentansprüche S Trägerelement für IC-Bausteine, bei dem der Baustein mit Hilfe einer sogenannten Kontaktspinne derart auf einem Träger befestigt ist, daß die Leiterbahnen der Spinne an jeweils einem Ende mit den entsprechenden Anschluß punkten des Bausteins verbunden sind und an den jeweils anderen Enden in Kontaktflächen münden, dadurch g e k e n n z e i c h n e t, daß die Kontaktflächen (4) auf der dem Baustein (6,11) abgewandten Seite der Folie (1) im wesentlichen innerhalb des Umrisses des Bausteins (6,11) angeordnet sind und die Verbindung der Leiterbahnenden (7,10) mit den entsprechenden Anschlußpunkten (8,8a,8b) des Bausteins (6,11) durch ausgestanzte Fenster (3) in der Folie (1) hergestellt sind. Carrier element for IC modules Patent claims S carrier element for IC modules, in which the module with the help of a so-called contact spider in such a way is attached to a support that the conductor tracks of the spider on each one End with the corresponding connection points of the block are connected and at the other ends open into contact surfaces, thereby g e k e n n n z e i c h n e t that the contact surfaces (4) on the side facing away from the module (6, 11) the film (1) arranged essentially within the outline of the building block (6,11) are and the connection of the conductor track ends (7,10) to the corresponding connection points (8,8a, 8b) of the building block (6,11) produced by punched-out windows (3) in the film (1) are. 2. Trägerelement nach Anspruch 1, dadurch g e -k e n n z e i c h n e t, daß die Leiterbahnenden (7) durch die Fenster (3) hindurch direkt, mit im Bereich der Fenster (3) liegenden Anschlußpunkten (8) verbunden sind.2. Support element according to claim 1, characterized in that g e -k e n n z e i c h n e t that the conductor ends (7) through the window (3) through directly, with in the area the window (3) lying connection points (8) are connected. 3. Trägerelement nach Anspruch 1, dadurch g e -k e n n z e i c h n e t, daß die Leiterbahnenden (10) die Fenster (3) flächenmäßig überdecken und die Anschlußpunkte (8) über feine Golddrähte (15) durch Bondiertechnik mit der Unterseite der Leiterbahnen (10) verbunden sind.3. Support element according to claim 1, characterized in that g e -k e n n z e i c h n e t that the conductor ends (10) cover the window (3) in terms of area and the Connection points (8) via fine gold wires (15) by bonding technique with the underside the conductor tracks (10) are connected. 4. Trägerelement nach Anspruch 1, dadurch g e -k e n n z e i c h n e t, daß die Leiterbahnenden (10) durch die Fenster (3) hindurch auf die Rückseite des ggf. mit der Folie (1) verklebten Bausteins (11) gebogen und mit den dort befindlichen Anschluß punkten (8) verbunden sind.4. Carrier element according to claim 1, characterized in that g e -k e n n z e i c h n e t that the conductor ends (10) through the window (3) through to the rear of the building block (11), possibly glued to the film (1), and bent with the ones located there Connection points (8) are connected. 5. Trägerelement nach Anspruch 1, dadurch g e -k e n n z e i c h n e t, daß die Leiterbahnenden (10) durch die Fenster (3) hindurch zwischen Folienunterseite und Bausteinoberseite hineingeführt und mit den auf der Bausteinoberseite angeordneten Anscblußpunkten (8) verbunden sind.5. Carrier element according to claim 1, characterized in that g e -k e n n z e i c h n e t that the conductor ends (10) through the window (3) between the underside of the film and the top of the building block are inserted and with those arranged on the top of the building block Connection points (8) are connected. 6. Trägerelement nach Anspruch 1, dadurch g e -k e n n z e i c h n e t, daß ein Teil der Leiterbahnenden durch die Fenster hindurch zu Anschlußpunkten (8a) auf der Rückseite des mit der Folie verklebten Bausteins (11) gebogen sind und ein Teil der Leiterbahnenden zu direkt unterhalb der Fenster (3) liegenden Anschlußpunkten (8b) geführt sind.6. Support element according to claim 1, characterized in that g e -k e n n z e i c h n e t that part of the conductor track ends through the window to connection points (8a) are bent on the back of the building block (11) bonded to the film and a part of the conductor track ends to connection points located directly below the window (3) (8b) are performed.
DE19803046192 1980-11-21 1980-12-08 Un-encapsulated compact integrated circuit carrier - incorporated into automatic machine readable identity cards and has device joined by film conductors to contact pads through windows Granted DE3046192A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE19803046192 DE3046192A1 (en) 1980-12-08 1980-12-08 Un-encapsulated compact integrated circuit carrier - incorporated into automatic machine readable identity cards and has device joined by film conductors to contact pads through windows
US06/317,873 US4549247A (en) 1980-11-21 1981-11-03 Carrier element for IC-modules
NLAANVRAGE8105002,A NL189937C (en) 1980-11-21 1981-11-05 DEVICE WITH INTEGRATED SWITCHING COMPONENT.
IT25059/81A IT1139726B (en) 1980-11-21 1981-11-13 SUPPORT ELEMENT FOR INTEGRATED CIRCUIT MODULES (IC) WITH COMPACT SHAPE OF MODULE SIZE
CH7364/81A CH661816A5 (en) 1980-11-21 1981-11-16 CARRIER WITH AN IC COMPONENT.
SE8106889A SE457677B (en) 1980-11-21 1981-11-19 DEVICE FOR AN IC COMPONENT CONTAINING FOIL ELEMENT, SPECIFICALLY BEFORE IDENTIFICATION CARD
FR8121783A FR2494908B1 (en) 1980-11-21 1981-11-20 SUPPORT ELEMENT FOR INTEGRATED CIRCUIT MODULES
GB8135224A GB2088630B (en) 1980-11-21 1981-11-23 A carrier element for ic modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803046192 DE3046192A1 (en) 1980-12-08 1980-12-08 Un-encapsulated compact integrated circuit carrier - incorporated into automatic machine readable identity cards and has device joined by film conductors to contact pads through windows

Publications (2)

Publication Number Publication Date
DE3046192A1 true DE3046192A1 (en) 1982-07-15
DE3046192C2 DE3046192C2 (en) 1990-05-23

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3616494A1 (en) * 1985-05-20 1986-11-27 Tektronix, Inc., Beaverton, Oreg. INTEGRATED CIRCUIT BOX AND METHOD FOR PRODUCING AN INTEGRATED CIRCUIT BOX
WO1997044823A1 (en) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Substrate for a semiconductor chip
WO2011047792A1 (en) * 2009-10-22 2011-04-28 Mühlbauer Ag Method for producing vias

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
FR2456390A1 (en) * 1979-05-11 1980-12-05 Thomson Csf Connector grid for integrated circuit encapsulation - forms external contacts and internal links from single piece component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
FR2456390A1 (en) * 1979-05-11 1980-12-05 Thomson Csf Connector grid for integrated circuit encapsulation - forms external contacts and internal links from single piece component

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP-PS Abstract 52-69564 *
Siemens "bauteile report" 16, 1978, H. 2, S. 40-44 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3616494A1 (en) * 1985-05-20 1986-11-27 Tektronix, Inc., Beaverton, Oreg. INTEGRATED CIRCUIT BOX AND METHOD FOR PRODUCING AN INTEGRATED CIRCUIT BOX
WO1997044823A1 (en) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Substrate for a semiconductor chip
US6326683B1 (en) 1996-05-17 2001-12-04 Siemens Aktiengesellschaft Carrier element for a semiconductor chip
WO2011047792A1 (en) * 2009-10-22 2011-04-28 Mühlbauer Ag Method for producing vias

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