DE3439411C1 - Method of producing solder joints on conductor tracks of thin-film circuits - Google Patents

Method of producing solder joints on conductor tracks of thin-film circuits

Info

Publication number
DE3439411C1
DE3439411C1 DE3439411A DE3439411A DE3439411C1 DE 3439411 C1 DE3439411 C1 DE 3439411C1 DE 3439411 A DE3439411 A DE 3439411A DE 3439411 A DE3439411 A DE 3439411A DE 3439411 C1 DE3439411 C1 DE 3439411C1
Authority
DE
Germany
Prior art keywords
substrate
conductor tracks
thin
soldered
solder joints
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3439411A
Other languages
German (de)
Inventor
Helmut Dipl.-Ing. 7151 Oberbrüden Zappe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bosch Telecom GmbH
Original Assignee
ANT Nachrichtentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANT Nachrichtentechnik GmbH filed Critical ANT Nachrichtentechnik GmbH
Priority to DE3439411A priority Critical patent/DE3439411C1/en
Application granted granted Critical
Publication of DE3439411C1 publication Critical patent/DE3439411C1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method of producing solder joints on conductor tracks (2) of thin-film circuits disposed on a substrate (1) with good thermal conductivity comprises soldering platelets (4) made of an electrically conducting, thermally insulating material onto the conductor tracks (2) at the points where contacts (3) are to be soldered on. The contacts (3) can then be soldered on to the top surface of the platelets (4) without it being necessary to preheat the substrate with good thermal conductivity. <IMAGE>

Description

Patentansprüche: 1. Verfahren zur Herstellung von Lötstellen auf Leiterbahnen von Dünnschichtschaltungen, welche sich auf einem gut wärmeleitfähigen Substrat befinden, dadurch gekennzeichnet, daß auf den Leiterbahnen (2), dort wo Kontakte (3) angelötet werden sollen, Plättchen (4) aus einem elektrisch leitfähigen, wärmeisolierenden Material angelötet werden, auf deren Oberseite dann die Kontakte (3) angelötet werden. Claims: 1. A method for producing solder joints Conductor tracks of thin-film circuits, which are on a highly thermally conductive Substrate are, characterized in that on the conductor tracks (2) where Contacts (3) are to be soldered, plate (4) made of an electrically conductive, heat-insulating material are soldered, on the top then the contacts (3) to be soldered on.

2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß Plättchen (4) aus CrNi-Stahl verwendet werden. 2. The method according to claim 1, characterized in that platelets (4) made of stainless steel can be used.

3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß Plättchen (4) aus wärmeisolierendem Kunststoff, deren Oberfläche mit einem elektrisch leitfähigen Material beschichtet ist verwendet werden. 3. The method according to claim 1, characterized in that platelets (4) made of heat-insulating plastic, the surface of which with an electrically conductive Material coated is to be used.

4. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Plättchen an ihrer Oberfläche mit Gold, Silber oder Zinn beschichtet sind. 4. The method according to any one of the preceding claims, characterized in, that the platelets are coated on their surface with gold, silver or tin.

Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung von Lötstellen auf Leiterbahnen von Dünnschichtschaltungen, welche sich auf einem gut wärmeleitfähigen Substrat befinden. The present invention relates to a method of manufacture of soldering points on conductor tracks of thin-film circuits, which are on a well thermally conductive substrate.

Das Anlöten von Kontakten auf den Leiterbahnen von Dünnschichtschaltungen, deren Trägersubstrat aus einem gut wärmeleitfähigen Material, z. B. Al203 Keramik besteht, ist nicht ohne Vorheizen des Substrats möglich. Solche gut wärmeleitenden Substrate haben den Vorteil, daß sie die von den Bauelementen, mit denen das Substrat bestückt ist, erzeugte Wärme möglichst schnell an das die Substrate aufnehmende Gehäuse abgeben. Wegen der guten Wärmeleitfähigkeit heizt sich aber bei einem normalen Lötvorgang das Substrat nur schwach auf, so daß das Lot nicht richtig zerfließt Deshalb muß das Substrat vor dem Lötvorgang aufgeheizt werden. The soldering of contacts on the conductor tracks of thin-film circuits, whose carrier substrate made of a highly thermally conductive material, e.g. B. Al203 ceramic is not possible without preheating the substrate. Such good thermal conductivity Substrates have the advantage that they are those of the components with which the substrate is equipped, generated heat as quickly as possible to the receiving the substrates Hand in housing. Because of the good thermal conductivity, however, a normal one heats up Soldering process only weakly on the substrate, so that the solder does not flow properly Therefore, the substrate must be heated before the soldering process.

Das Vorheizen des Substrats stellt kein Problem dar, wenn es noch nicht in seinem Gehäuse untergebracht ist. Sobald aber das Substrat im Gehäuse angeordnet ist, ist ein Vorheizen nicht mehr möglich. Deshalb müßte das Substrat jedesmal aus seinem Gehäuse herausgelöst werden, wenn eine Lötung und die dafür erforderliche Vorheizung des Substrats vorzunehmen wäre. Preheating the substrate is not a problem if it is still is not housed in its housing. But as soon as the substrate is arranged in the housing preheating is no longer possible. Therefore the substrate would have to run out every time its housing can be detached if a soldering and the necessary for it Preheating of the substrate would be made.

Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren zur Herstellung von Lötstellen auf Leiterbahnen von Dünnschichtschaltungen, die sich auf einem gut wärmeleitfähigen Substrat befinden, anzugeben, wodurch es möglich ist, auf diesen Lötstellen ohne Vorheizung des Substrats innerhalb eines Gehäuses Kontakte anzulöten. The invention is therefore based on the object of providing a method for Manufacture of soldering points on conductor tracks of thin-film circuits, which are are located on a highly thermally conductive substrate, which makes it possible is, on these solder joints without preheating the substrate inside a housing Solder contacts.

Erfindungsgemäß wird diese Aufgabe dadurch gelöst, daß auf den Leiterbahnen, dort wo Kontakte angelötet werden sollen, Plättchen aus einem elektrisch leitfähigen, wärmeisolierenden Material aufgelötet werden, auf deren Oberseite dann die Kontakte angelötet werden. According to the invention, this object is achieved in that on the conductor tracks, where contacts are to be soldered, plates made of an electrically conductive, heat-insulating material are soldered, on the top of which then the contacts be soldered on.

Zweckmäßige Ausführungen der Erfindung gehen aus den Unteransprüchen hervor. Appropriate embodiments of the invention are based on the subclaims emerged.

Anhand eines in der Zeichnung dargestellten Ausführungsbeispiels wird nun die Erfindung näher erläutert. Using an exemplary embodiment shown in the drawing the invention will now be explained in more detail.

Die Figur zeigt einen Ausschnitt eines Substrats 1, das aus einem gut wärmeleitfähigen Material, z. B. Al2O3, hergestellt ist Mit einer auf dem Substrat 1 befindlichen Dünnschichtleiterbahn 2 soll ein Kontakt 3, beispielsweise ein Bonddrähtchen oder die Anschlußleitung eines Bauelements, verlötet werden. Auf die unten beschriebene Weise wird dazu eine Lötstelle gebildet, auf der der Kontakt 3 ohne Vorheizen des gut wärmeleitfähigen Substrats aufgelötet werden kann. Somit ist es möglich, eine solche Lötung an einem innerhalb eines Gehäuses angeordneten Substrat vorzunehmen. The figure shows a section of a substrate 1, which consists of a good thermally conductive material, e.g. B. Al2O3, is made with one on the substrate 1 located thin-film conductor 2 should be a contact 3, for example a bonding wire or the connection line of a component to be soldered. To the one described below Way, a soldering point is formed on which the contact 3 without preheating the well thermally conductive substrate can be soldered. Thus it is possible to use a to make such soldering on a substrate arranged within a housing.

Bevor das Substrat in sein Gehäuse eingesetzt wird, werden überall dort, wo Lötstellen vorgesehen sind, elektrisch leitende, wärmeisolierende Plättchen 4 auf die Leiterbahnen 2 gelötet. Für diesen Lötvorgang wird das Substrat 1 auf die für das Zerfließen des Lotes 5 notwendige Temperatur aufgeheizt. Das so präparierte Substrat wird nun in seinem Gehäuse untergebracht. Das Anlöten der Kontakte auf den Plättchen 4 kann dann im Gehäuse erfolgen, ohne daß ein Vorheizen des Substrats noch nötig ist. Weil nämlich die Plättchen 4 aus einem wärmeisolierenden Material bestehen, heizen sie sich beim Löten so stark auf, daß das Lot 6 zerfließt. Die zwischen den Plättchen 4 und den Leiterbahnen 2 vorhandene Lötschicht 5 weicht dabei nicht auf, weil sich das darunterliegende Substrat 1 wegen seiner guten Wärmeleitfähigkeit nur schwach aufheizt. Before the substrate is put into its case, be everywhere Electrically conductive, heat-insulating platelets where soldering points are provided 4 soldered to the conductor tracks 2. For this soldering process, the substrate 1 is on the temperature necessary for the dissolving of the solder 5 is heated. The so prepared The substrate is now placed in its housing. Soldering the contacts on the plate 4 can then take place in the housing without preheating of the substrate is still necessary. Because the plate 4 is made of a heat-insulating material exist, they heat up so much during soldering that the solder 6 dissolves. the The soldering layer 5 present between the platelets 4 and the conductor tracks 2 gives way not because the underlying substrate 1 because of its good thermal conductivity only slightly heats up.

Die Plättchen 4 können beispielsweise aus einem CrNi-Stahl oder einem wärmeisolierenden Kunststoff, der mit einer Silber-, Gold- oder Zinnschicht umgeben ist, hergestellt sein. The plate 4 can, for example, made of a CrNi steel or a heat-insulating plastic, which is surrounded with a layer of silver, gold or tin is to be made.

Claims (1)

Als Lot kommt z. B. ein Zinn-Blei-Silber-Gemisch in Frage. As a plumb line z. B. a tin-lead-silver mixture in question.
DE3439411A 1984-10-27 1984-10-27 Method of producing solder joints on conductor tracks of thin-film circuits Expired - Lifetime DE3439411C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3439411A DE3439411C1 (en) 1984-10-27 1984-10-27 Method of producing solder joints on conductor tracks of thin-film circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3439411A DE3439411C1 (en) 1984-10-27 1984-10-27 Method of producing solder joints on conductor tracks of thin-film circuits

Publications (1)

Publication Number Publication Date
DE3439411C1 true DE3439411C1 (en) 1992-09-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE3439411A Expired - Lifetime DE3439411C1 (en) 1984-10-27 1984-10-27 Method of producing solder joints on conductor tracks of thin-film circuits

Country Status (1)

Country Link
DE (1) DE3439411C1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4316497C2 (en) * 1992-07-07 2002-10-31 Northern Telecom Ltd Method for fastening a passive dielectric component on a printed circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US573345A (en) * 1896-12-15 Tym pan-gage

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US573345A (en) * 1896-12-15 Tym pan-gage

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-Z.: "Feinwerktechnik" 75(1971)H. 5, S. 201-206 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4316497C2 (en) * 1992-07-07 2002-10-31 Northern Telecom Ltd Method for fastening a passive dielectric component on a printed circuit board

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8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8363 Opposition against the patent
8320 Willingness to grant licences declared (paragraph 23)
8366 Restricted maintained after opposition proceedings
8305 Restricted maintenance of patent after opposition
D3 Patent maintained restricted (no unexamined application published)
8339 Ceased/non-payment of the annual fee