JP2013534364A - Thin circuit board having induction coil and method for manufacturing the same - Google Patents

Abstract

  The present invention provides a novel thin circuit board structure and a method for manufacturing the same. The circuit board includes a magnetic induction board manufactured from an organic resin and an inorganic powder, an induction coil formed on one side surface of the magnetic induction board, and an induction coil formed on one side surface of the magnetic induction board. And an electrically connected metal wiring layer, and the induction coil is installed on the surface of the magnetic induction substrate with reference to the magnetic flux characteristics of the magnetic induction substrate. The substrate of the thin circuit board is manufactured from an organic resin material mixed with electromagnetic wave absorbing powder, and when the induction coil is designed, the board is provided with an electromagnetic wave absorption characteristic, and an additional layer of demand is added to the radio frequency recognition tag thereon. And the circuit structure can be manufactured.

Description

  The present invention relates to a thin circuit board having an induction coil and a method for manufacturing the same. Specifically, the present invention relates to a thin circuit board in which an induction coil is designed in consideration of electromagnetic wave absorption characteristics and a manufacturing method thereof.

  Radio frequency identification technology (RFID) is a communication technology that recognizes a specific target using an electromagnetic wave signal and reads related data. The principle of operating the radio frequency recognition element is to touch the radio frequency recognition element (for example, radio frequency identification tag RFID tag) within the inductive range as the electromagnetic wave is emitted using an external RFID reader. The radio frequency recognition element generates an electric current by electromagnetic induction, operates a radio frequency recognition chip thereon, and then emits an electromagnetic wave to respond to the inductor to achieve the effect of radio frequency recognition. It is. Since recognition is performed by electromagnetic induction, there is no need to make mechanical or optical contact between a radio frequency recognition system (for example, a reader) and a recognition target (for example, a radio frequency recognition tag). Radio frequency recognition has many advantages such as effective recognition distance is relatively long, a large amount of information can be stored and transmitted, recognition speed is fast, data in the tag can be rewritten, and safety is good. Therefore, it has been widely applied to replace the traditional recognition bar code in the field. Currently, radio frequency recognition elements are used in many fields such as retail logistics supply, property tracking, and verification applications.

  As shown in FIG. 1, the figure is a structural cross-sectional view of a typical radio frequency recognition element 100 having an induction coil according to the prior art. As shown in the drawing, a typical radio frequency recognition element 100 is mainly composed of four members such as a flexible substrate 101, an induction coil 103, a metal wiring layer 105, and a radio frequency recognition chip 107, of which Since the conventional flexible substrate 101 does not have the property of absorbing electromagnetic waves, the design of the induction coil 103 need not consider the magnetic flux property of the flexible substrate 101. The flexible substrate 101 is a structural base on which each member of the radio frequency recognition element 100 is installed, and is always formed of a soft material such as PET (polyethylene terephthalate), and the material is light and flexible. And has the advantages of being easy to carry. An induction coil 103 located on the upper surface of the flexible substrate 101 receives an electromagnetic wave emitted from an external radio frequency recognition reader and generates a current by an electromagnetic induction method. A metal wiring layer 105 is formed on the lower surface of the flexible substrate 101, and the metal wiring layer 105 is electrically connected to the induction coil 103 by the interconnection structure 104. The metal wiring layer 105 further includes a circuit wiring region of the radio frequency recognition element 100 and electrically connects the radio frequency recognition chip 107 to the induction coil 103.

  According to the prior art, by forming a plurality of through holes 109 penetrating the upper surface and the lower surface in the flexible substrate 101, the metal wiring layer 105 on the lower surface of the flexible substrate 101 and the upper surface of the flexible substrate 101 are present. The radio frequency recognition chip 107 is electrically connected. As a result, the current generated by the electromagnetic induction of the induction coil 103 is transmitted to the radio frequency recognition chip 107 via the metal wiring layer 105 to operate it, and the electromagnetic wave is emitted to the external radio frequency recognition reader. By responding, operations such as tag recognition or data transmission / writing are completed.

  By utilizing the electromagnetic wave induction mechanism, the radio frequency recognition element is very sensitive to the use environment such as metal and liquid during high frequency operation, and is particularly adhered to a metal surface or a container containing liquid. In such an environment, the electromagnetic wave signal emitted from the external reader and the radio frequency recognition element is susceptible to interference with metal or liquid near the radio frequency recognition element, causing problems such as inability to read the induction signal. Such problems can cause very severe consequences for passive radio frequency recognition elements. On the other hand, as shown in FIG. 1, in a general passive radio frequency recognition tag, a magnetic induction stick (ferrite sheet) or an electromagnetic wave absorption stick is provided between the radio frequency recognition element 100 and the metal surface 102. (Referred to as "inducted signal"), which prevents the received / emitted electromagnetic waves from causing phenomena such as surface waves, cavity resonance waves, reflected waves, and / or electromagnetic interference on the metal or liquid surface. To prevent problems that cannot be read well.

  However, magnetic induction sticks that are commonly used in the industry not only occupy a considerable amount in the production cost of the radio frequency recognition element, but also because the magnetic induction stick has a certain thickness, It is difficult to reduce the thickness and the magnetic induction stick must be carefully selected according to the induction coil design of the radio frequency recognition element. Therefore, in the process of manufacturing a thin circuit board, the present inventor considers magnetic flux characteristics set in advance on the board when designing the induction coil, so that the magnetic induction is applied when the thin circuit board is applied to the metal surface later. The trouble of selecting and using a stick is eliminated, the radio frequency recognition element of the present invention can be applied to a thin design, and in particular, a thin circuit board structure having an electromagnetic wave absorbing action and a manufacturing method thereof have been developed.

  In view of the problems existing in the prior art, the present invention discloses a thin circuit board and a method for manufacturing the same. The substrate of the thin circuit board according to the present invention is manufactured from an organic resin material mixed with electromagnetic wave absorbing powder, so that the thin circuit board has the characteristics of absorbing electromagnetic waves and the characteristics of a general flexible circuit board. Additional layers and circuit structures required for the radio frequency recognition element can be formed on the substrate.

  In one embodiment of the present invention, the thin circuit board includes components such as a magnetic induction board, an induction coil, and a metal wiring layer. The induction coil is formed on one surface of the magnetic induction substrate. The metal wiring layer is formed on one surface of the magnetic induction substrate and is electrically connected to the induction coil. The radio frequency recognition chip is installed on one surface of the magnetic induction substrate and is electrically connected to the metal wiring layer. When designing the induction coil, the magnetic induction board is installed on the surface of the magnetic induction board in consideration of the magnetic flux characteristics of the magnetic induction board, and the current generated by the induction coil by electromagnetic induction is provided to the radio frequency recognition chip to provide the radio frequency recognition chip. And is configured to emit an electromagnetic wave and respond to an external inductor.

  In another embodiment of the present invention, the induction coil is installed on one side surface of the magnetic induction substrate with a design surrounded by a plurality of layers, and sandwiching the magnetic induction layer between the induction coils of each layer, Increases magnetic inductivity and strengthens electromagnetic wave absorption effect. The magnetic induction layer and the magnetic induction substrate are made of the same material.

  An object of the present invention is to form a magnetic induction substrate made of an organic resin and an inorganic powder, an induction coil formed on one side surface of the magnetic induction substrate, and an induction coil formed on one side surface of the magnetic induction substrate. An induction coil is provided with a metal wiring layer electrically connected to the coil, and the induction coil provides a novel thin circuit board installed on the surface of the magnetic induction board in consideration of the magnetic flux characteristics of the magnetic induction board. Since the structural support substrate adopted here has an electromagnetic wave absorbing function, the thin circuit board can obtain a good radio frequency recognition effect without installing a separate magnetic induction stick or electromagnetic wave absorbing stick.

  Another object of the present invention is to form a magnetic induction substrate manufactured from an organic resin and an inorganic powder, to form an induction coil on one side surface of the magnetic induction substrate, and to consider the magnetic flux characteristics of the magnetic induction substrate. A novel thin film circuit board manufacturing method comprising: forming the induction coil on a surface of a magnetic induction substrate; and forming a metal wiring layer electrically connected to the induction coil on one side surface of the magnetic induction substrate. Is to provide. In the present invention, an induction coil and a magnetic induction layer are alternately installed to design a multi-layer induction coil, and the effective induction distance of the induction coil is increased.

  Other objects, features and advantages of the present invention will become better understood with reference to the following detailed examples and the associated drawings and claims.

  The system and method of the present invention can be better understood with reference to the following drawings and description. Reference may be made to the drawings described below for embodiments not specifically limited herein. The components appearing in the drawings are not drawn to scale, but merely emphasize the principles of the invention. In the drawings, the same reference numerals are used for the same members.

FIG. 1 is a cross-sectional view of a typical radio frequency recognition tag according to the prior art. FIG. 2 is a cross-sectional view of a radio frequency recognition tag according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of another radio frequency recognition tag according to an embodiment of the present invention.

  Referring to FIG. 2, it is a cross-sectional view of a radio frequency recognition element 200 according to an embodiment of the present invention. In the embodiment of the present invention, a radio frequency recognition element 200 in which a radio frequency recognition chip 207 is installed on a thin film circuit board having an induction coil is shown as an example. The metal surface 202 is drawn below the radio frequency recognition element 200 to show its use and installation relationship. As shown in the drawing, the radio frequency recognition element 200 of the present invention is mainly composed of four members such as a magnetic induction substrate 201, an induction coil 203, a metal wiring layer 205, and a radio frequency recognition chip 207, of which a magnetic induction is included. The substrate 201 and the induction coil 203 form a metal wiring layer 205 and a thin circuit board. In the present invention, the magnetic induction substrate 201 is a plate material having good electromagnetic wave absorption characteristics, and this is not only a base material having a structure for installing each member of the radio frequency recognition element 200 but also a radio frequency recognition element. When the 200 approaches a metal or liquid surface in a high frequency (eg, 13.56 MHz) or ultra high frequency (eg, 900 MHz) environment, it may cause phenomena such as surface waves, cavity resonance waves, reflected waves, and / or electromagnetic interference. Is effectively suppressed, and it is possible to prevent generation of a problem that the induction signal cannot be read well. The present invention can be easily applied to an environment where a conventional radio frequency recognition element (for example, RFID) cannot be used due to the electromagnetic wave absorption function inherent to the magnetic induction substrate 201. For example, it is possible to adhere to a metal surface such as cans or a medicine bottle containing a liquid, or install it in a metal case of a mobile device such as a mobile phone, without separately mounting an expensive electromagnetic wave absorption stick used conventionally. Therefore, a considerable amount of tag production costs can be reduced.

  The magnetic induction substrate 201 according to the present invention is manufactured by mixing two materials of an organic resin and an inorganic powder. Among them, the organic resin gives the magnetic induction substrate 201 mechanical characteristics and possibilities in the manufacturing process, The inorganic powder imparts an electromagnetic wave absorbing function to the magnetic induction substrate 201. In one embodiment, the organic resin in the magnetic induction substrate 201 is a PI (polyimide) material that is always used for a flexible printed circuit board. The substrate made of this material is light, flexible, easy to carry, easy to manufacture, can be applied to a spool-type continuous manufacturing process (roll-to-roll), and has a large area. This improves the applicability of radio frequency recognition tag products that are continuously manufactured. However, it should be noted that in other embodiments, the organic resin of the magnetic induction substrate 201 can be formed of other suitable materials having the same characteristics. For example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), polyether sulfone (Polysulfene, PES), polyphenylsulfone (PE) , Polyparaphenylene benzobisoxazole (Poly-p-phenylenebenzenebenzoxole, PBO), liquid crystal polymer (Liquid Crystal Polymer, LCP), acrylate (Acrylate), polyurethane (Polyethane, PU), or epoxy resin (Epoxy) Including Narubutsu, the present invention is not limited to these.

  On the other hand, the inorganic powder material of the magnetic induction substrate 201 is a material having good electromagnetic wave absorption characteristics, which effectively attenuates the electromagnetic wave signal and causes the radio frequency recognition element 200 to receive electromagnetic wave interference in the reverse direction on the metal or liquid surface. To prevent. In the embodiment of the present invention, the material of the inorganic powder is, for example, soft ferrite, alloy material, or metal material. Among them, the soft ferrite includes, but is not limited to, MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite or a mixture thereof. Alloy materials include, but are not limited to, nickel iron alloys, iron silicon alloys, and iron aluminum alloys. Metal materials include, but are not limited to, alloys such as copper, aluminum, iron and nickel. In the present invention, the proportion of mixing the organic resin and the inorganic powder is between about 15% to 35% and 85% to 65%, respectively, and after mixing both, a slurry or paint having electromagnetic wave absorption characteristics can be formed. Can be further solidified into a solid having structural support, for example, a film, a thin film, a plate shape, or a block-shaped base material. The magnetic induction substrate 201 mixed and mixed in the above proportion is completely applicable to the traditional PI soft substrate manufacturing process. For example, operations such as coating, etching / cleaning, carving, and drilling on the magnetic induction substrate 201 are performed. And can be applied to a high-temperature manufacturing process required for a radio frequency recognition chip, for example, a flip chip manufacturing process in surface adhesive technology.

  In the present invention, the magnetic induction substrate 201 simultaneously functions as a structure supporting member and an electromagnetic wave absorbing member of the radio frequency recognition element 200, and further, through holes and circuits necessary for the radio frequency recognition element are formed on the flexible plate manufacturing process. Circuit structures such as wiring and interconnecting contacts can be formed. For example, as shown in FIG. 2, an induction coil 203 is formed on the upper surface of the magnetic induction substrate 201, and the induction coil 203 is designed to be surrounded by a plurality of coils. Accepts electromagnetic waves in different polarization directions emitted from an external radio frequency recognition reader by installation, and generates current by electromagnetic induction methods such as Inductive Coupling or Back-scatter Coupling To do. In the present invention, the induction coil 203 is etched (for example, copper etching and aluminum etching), colloidal silver printing (including screen printing, relief printing, gravure printing, or ink jet method), chemical vapor deposition copper, and electroplating. It is formed by a method such as copper. The material, thickness, number of coils, Q value (quality factor), and installation of the induction coil 203 are designed according to the electromagnetic wave absorption property of the magnetic induction substrate 201 to be used, or slightly adjusted, Impedance matching is performed to maintain the requirement for electromagnetic induction upper limit line polarization. The working frequency of the induction coil 203 of the present invention is determined by its application environment and includes operating frequency bands such as 125/134 KHz (low frequency) and 13.56 MHz (high frequency), but is not limited thereto.

  On the other hand, a metal wiring layer 205 is formed on the lower surface of the magnetic induction substrate 201, which is a part of the coil film group of the radio frequency recognition element 200. The metal wiring layer 205 is coupled to the induction coils 203 at both ends by through holes or interconnecting structures 204a and 204b, thereby transmitting a conductive signal. In another embodiment of the present invention, the metal wiring layer 205 can be used as a ground plane of the induction coil 203, and the induction coil 203 generates too much eddy current by electromagnetic induction to recognize the radio frequency. It is prevented from flowing to the outside of the element 200 to cause electromagnetic interference. In the present invention, the metal wiring layer 205 can also be used as a signal transmission layer or a circuit wiring layer of the radio frequency recognition element 200 at the same time. As shown in FIG. 2, a plurality of through holes 209 penetrating the upper surface and the lower surface are formed on the magnetic induction substrate 201, and the magnetic induction substrate is filled by filling the through holes 209 with a conductive material. 201 is electrically connected to the metal wiring layer 205 on the lower surface. The through-hole 209 is formed at a position corresponding to an opening position (immediately, a coil contact position) on the upper surface of the magnetic induction substrate 201, that is, each connection position of the radio frequency recognition chip 207 (for example, a position having a gold bump). The In the flip chip manufacturing process, the conductive paste 211, for example, anisotropic conductive paste (ACP), anisotropic conductive film (ACF) or / and non-conductive paste (NCP) is wetted at the plurality of coil contact positions. After that, the coil paste (including the induction coil 203 and the metal wiring layer 205) and the radio frequency recognition chip 207 are electrically connected to each other by adhering the bonding position between the coil contact and the radio frequency recognition chip 207 with the conductive paste 211. Connect to to transmit induced current. Through this process, the manufacture of the internal inlay of the radio frequency recognition element 200 of the present invention is completed.

  In the embodiment of the present invention, the radio frequency recognition chip 207 receives the induced current generated from the induction coil 203 and emits an electromagnetic wave, thereby responding to an external radio frequency recognition reader and completing a radio frequency element recognition operation. The radio frequency recognition chip 207 is formed by combining a plurality of functional circuits. For example, an AC / DC conversion circuit that converts a radio frequency signal transmitted from an external reader into a DC power source, a stable power source for the radio frequency recognition chip 207 A voltage stabilization circuit that provides a modulation circuit that removes the carrier wave to obtain the true modulation signal, a microprocessor that decodes the signal transmitted from the external reader and feeds the data back to the external reader according to its request, radio frequency recognition The element 200 includes a memory where the recognition data is stored, and a modulation circuit that modulates information transmitted from the microprocessor and mounts it on an induction coil and sends it to a card reader. Absent.

  After the bonding of the radio frequency recognition chip 207 is completed, the manufacture of the radio frequency recognition element 200 of the present invention is temporarily completed. However, in another embodiment, the radio frequency recognition element 200 of the present invention further includes an internal inlay (including members such as an induction coil, a magnetic induction substrate, and a chip) of the radio frequency recognition tag, and further includes a stick lamination step. By doing so, the last radio frequency recognition tag product can be completed. The tag lamination step is the last manufacturing process in which the tag is manufactured. The manufacturing process was originally exposed to the external environment by fitting the internal inlay of the radio frequency recognition tag into an adhesive stick or a ticket card and compressing it with heat. The induction coil 203 and the magnetic induction substrate 201 are sealed in a stick packing together with the radio frequency recognition chip 207 to form a tag product that can be used by the client. Depending on the demand of the industry, the form of the radio frequency identification tag to be manufactured also differs. For example, there are an adhesive radio frequency recognition tag, a three-layer soft card radio frequency recognition tag, and a five-layer hard card radio frequency recognition tag. The final product in this form can be applied to electronic wallets, access cards, tag sticks, anti-theft chips, and the like.

  As shown in FIG. 2, the radio frequency recognition element 200 is installed such that the metal wiring layer faces the metal surface 202 and the induction coil portion faces the outside. In actual applications, the metal surface 202 may be an IC circuit board, a battery, a metal carrier or a canned metal case inside a mobile phone. Since the magnetic induction substrate 201 is separated between the induction coil 203 and the metal surface 202, such an installation method prevents the electromagnetic wave received or emitted by the induction coil 203 from obtaining the influence of the metal surface 202. be able to. However, the above installation method is only one embodiment of the present invention, and in other embodiments, the induction coil 203 and the metal wiring layer 205 of the radio frequency recognition element 200 of the present invention are on the same side of the magnetic induction substrate 201. It can also be installed.

  In the design of the radio frequency recognition element according to the above-described embodiment of the present invention, the electromagnetic wave absorbing material and the base material are aligned, and it is not necessary to install a separate magnetic induction stick or electromagnetic wave absorbing stick as in the prior art. A radio frequency induction recognition effect can be achieved. In addition to saving the cost associated with the stick, the radio frequency recognition element of the present invention can free up the space originally reserved for installing the magnetic induction stick (thickness of about 150 μm to 200 μm), so there is much more in the element. A storage space can be provided. As shown in FIG. 3, this is a cross-sectional view of a radio frequency recognition tag according to another embodiment of the present invention. In this embodiment, the radio frequency recognition element is substantially the same in design as the radio frequency recognition element in FIG. 2, and has a coil structure in which induction coils 203 are stacked in a plurality of layers using an altitude space vacated by the radio frequency recognition element. There are differences in design. In this embodiment, a magnetic induction layer 213 is further provided between the induction coils 203 of the respective layers, and is used as an isolation layer between the layers, thereby enhancing the overall electromagnetic wave absorption effect inside the radio frequency recognition element. The magnetic induction layer 213 is made of the same material as the magnetic induction substrate 201 and has good electromagnetic wave absorption characteristics. In an embodiment of the present invention, the magnetic induction coil 203 is first formed on the base induction coil 203 by the coating film additional layer method, and then the other layer induction coil 203 is formed thereon. The uppermost induction coil 203 is electrically connected to the metal wiring layer 205 below the magnetic induction substrate 201 through a through-hole or an interconnection structure 215. The multi-layer induction coil design according to the present embodiment is to install a multi-layer induction coil using the space originally left in the magnetic induction or electromagnetic wave absorption stick, and increase the number of coils in the same unit area. The radio frequency recognition element of the present invention has a long point such as a significant increase in detection distance. The two-layer induction coil in FIG. 3 is merely an exemplary embodiment, and in other embodiments, the induction coil 203 forms more coil structures thereon to reduce the induction distance of the radio frequency recognition element. It should be noted that it can be further increased.

  According to the above two embodiments of the present invention, the design of the present invention is to manufacture a radio frequency recognition element with a substrate that has electromagnetic wave absorption properties and can perform a complete flexible plate manufacturing process. Since there is no need to arrange an electromagnetic wave absorption stick, a considerable amount of manufacturing costs can be reduced. According to the present invention, the induction distance of the radio frequency recognition tag can be further increased by designing the induction coil and the magnetic induction layer to be multi-layered.

  The embodiment of the thin circuit board having the induction coil according to the present invention has been described above. In the following embodiment, a method for manufacturing the thin circuit board having the induction coil according to the present invention will be described. In this method, first, a magnetic induction substrate is provided, and the magnetic induction substrate is manufactured from an organic resin and an inorganic powder, and the organic resin imparts mechanical characteristics and manufacturing process possibilities to the magnetic induction substrate. The inorganic powder imparts an electromagnetic wave absorbing function to the magnetic induction substrate. Next, an induction coil is formed on one side surface of the magnetic induction substrate, the induction coil is installed on the surface of the magnetic induction substrate with reference to the magnetic flux characteristics of the magnetic induction substrate, and is emitted from an external radio frequency recognition reader. Receiving an electromagnetic wave generated and generating a current by an electromagnetic induction method, and then forming a metal wiring layer on one side surface of the magnetic induction substrate, and the metal wiring layer is electrically connected to the induction coil Thus, an electric signal is transmitted, or an induction coil generates too much eddy current by electromagnetic induction and is prevented from flowing outside the thin circuit board and causing electromagnetic interference.

  The method further attaches an integrated circuit to one side surface of the magnetic induction substrate and electrically connects the integrated circuit to the induction coil via the metal wiring layer. In another method embodiment, one or more induction coils are formed on a magnetic induction substrate, and a magnetic induction layer is further formed between the induction coils of each layer as a layer-to-layer isolation layer. Strengthens the overall electromagnetic wave absorption effect inside the recognition element.

  In the above method embodiment, the magnetic induction substrate or magnetic induction layer is composed of an organic resin and an inorganic powder, and the organic resin and the inorganic powder are about 15 to 35% and 85 to 65 of the magnetic induction substrate and the magnetic induction layer, respectively. Occupy% weight percent. The organic resin is selected from the following materials or compositions thereof: polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), Polyethersulfone (Polyethersulfone, PES), Polyphenylsulfone (Polyphenylene Sulfone, PPSU), Polyparaphenylenebenzobisoxazole (Poly-p-phenylenebenzoxazole, PBO), Liquid crystal polymer (Liquid Crystal Ply, LC) Acrylate), Polyurethane (Polyurethane, PU), or an epoxy resin (Epoxy). The inorganic powder is selected from the following materials or compositions thereof: MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite, nickel iron alloy, iron silicon alloy, iron aluminum alloy, copper, Aluminum, iron, or nickel.

  The structure of different embodiments of the present invention can be generally understood with reference to the embodiments and drawings described in the specification. The drawings and description are not intended to be a complete description of all elements and features in apparatus and systems utilizing the structures or methods described above. By referring to the description of the invention, those skilled in the art will be able to conceive of many other embodiments of the invention, which of course belong to the disclosure of the invention. The present invention is capable of structural and logical substitutions and modifications without departing from the scope of the present invention. For example, in the present invention, the induction coil and the metal wiring layer of the radio frequency recognition element can be installed on the same side of the magnetic induction board, and the magnetic induction board of the radio frequency recognition element adopts a multi-layer flexible circuit board design. The radio frequency recognition chip employed or combined with the radio frequency recognition element may perform other functions other than radio frequency recognition, such as voltage stabilization, rectification, and signal conversion. Other manufacturing steps may be performed after the radio frequency recognition element is manufactured. For example, tag lamination and title printing. Other than the above, the drawings shown in the specification serve only as illustrations and are not manufactured in proportion. Some of the drawings are enlarged to serve as an emphasis and others are simplified. Therefore, the embodiments of the present invention and the drawings are merely examples, and do not limit the present invention. The scope of the present invention should be defined by the claims.

Claims (16)

A magnetic induction substrate manufactured from an organic resin and an inorganic powder;
An induction coil formed on one surface of the magnetic induction substrate;
A metal wiring layer formed on one surface of the magnetic induction substrate and electrically connected to the induction coil;
With
A thin circuit board, wherein the induction coil is installed on a surface of the magnetic induction board with reference to a magnetic flux characteristic of the magnetic induction board.   2. The induction coil according to claim 1, wherein the induction coil includes one or more coils, a magnetic induction layer is formed between the induction coils of each layer, and the magnetic induction layer is manufactured from an organic resin and an inorganic powder. The thin circuit board as described.   2. The thin circuit board according to claim 1, wherein the organic resin and the inorganic powder occupy about 15 to 35% and 85 to 65% by weight of the magnetic induction board, respectively.   3. The thin circuit board according to claim 2, wherein in the magnetic induction layer, the organic resin and the inorganic powder occupy about 15 to 35% and 85 to 65% by weight of the magnetic induction layer, respectively.   The organic resin is selected from polyimide, polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyethersulfone, polyphenylsulfone, polyparaphenylenebenzobisoxazole, liquid crystal polymer, acrylate, polyurethane, or epoxy resin or a composition thereof. The thin circuit board according to claim 3, wherein the thin circuit board is formed.   The inorganic powder is MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite, nickel iron alloy, iron silicon alloy, iron aluminum alloy, copper, aluminum, iron, nickel, or a composition thereof. The thin circuit board according to claim 3 or 4, wherein the thin circuit board is selected from the following.   The thin circuit board according to claim 1, wherein an integrated circuit is attached to one surface of the magnetic induction substrate, and the integrated circuit is electrically connected to the metal wiring layer.   The thin circuit board according to claim 7, wherein the integrated circuit is electrically connected to the induction coil.   The thin circuit board according to claim 1, wherein the thin circuit board is a radio frequency recognition element. Forming a magnetic induction substrate manufactured from an organic resin and an inorganic powder;
Forming an induction coil on one side surface of the magnetic induction substrate, and forming the induction coil on the surface of the magnetic induction substrate with reference to magnetic flux characteristics of the magnetic induction substrate; and one side surface of the magnetic induction substrate Forming a metal wiring layer electrically connected to the induction coil. A method for manufacturing a thin circuit board, comprising:   11. The induction coil according to claim 10, wherein the induction coil includes one or more coils, and a magnetic induction layer is formed between the induction coils of each layer, and the magnetic induction layer is made of an organic resin and an inorganic powder. The manufacturing method of the thin circuit board of description.   11. The thin circuit board according to claim 10, wherein in the magnetic induction substrate, the organic resin and the inorganic powder account for about 15 to 35% and about 85 to 65% by weight of the magnetic induction substrate, respectively. Method.   The thin circuit board of claim 11, wherein the organic resin and the inorganic powder account for about 15 to 35% and about 85 to 65% of the magnetic induction layer, respectively, in the magnetic induction layer. Method.   The organic resin is selected from polyimide, polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyethersulfone, polyphenylsulfone, polyparaphenylenebenzobisoxazole, liquid crystal polymer, acrylate, polyurethane, or epoxy resin or a composition thereof. 14. The method for manufacturing a thin circuit board according to claim 12, wherein the thin circuit board is manufactured.   The inorganic powder is MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite, nickel iron alloy, iron silicon alloy, iron aluminum alloy, copper, aluminum, iron, nickel or a composition thereof. 14. The method of manufacturing a thin circuit board according to claim 12, wherein the thin circuit board is selected from the following.   11. The method of claim 10, further comprising attaching an integrated circuit to one surface of the magnetic induction substrate and electrically connecting the integrated circuit to the induction coil through the metal wiring layer. The manufacturing method of the thin circuit board of description.

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