CN102339407A - Thin circuit board with induction coil and method for manufacturing circuit board - Google Patents
Thin circuit board with induction coil and method for manufacturing circuit board Download PDFInfo
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- CN102339407A CN102339407A CN2010102392610A CN201010239261A CN102339407A CN 102339407 A CN102339407 A CN 102339407A CN 2010102392610 A CN2010102392610 A CN 2010102392610A CN 201010239261 A CN201010239261 A CN 201010239261A CN 102339407 A CN102339407 A CN 102339407A
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- Prior art keywords
- magnetic induction
- inductive coil
- circuit board
- substrate
- induction substrate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Abstract
The invention discloses a novel thin circuit board structure and a manufacturing method thereof. The circuit board comprises a magnetic induction substrate, an induction coil and a metal wiring layer, wherein the magnetic induction substrate is prepared from organic resin and inorganic powder; the induction coil is formed on one side surface of the magnetic induction substrate; the metal wiring layer is formed on one side surface of the magnetic induction substrate and electrically connected with the induction coil; and the induction coil is arranged on the surface of the magnetic induction substrate according to the magnetic flux characteristic of the magnetic induction substrate. The substrate of the thin circuit board is prepared from an organic resin material mixed with wave absorbing powder, so that the electromagnetic wave absorbing characteristic of the substrate is considered while the induction coil is designed, and an additional layer and a circuit structure required by a radio frequency identification (RFID) tag can be manufactured on the induction coil.
Description
Technical field
The present invention is relevant with a kind of slim circuit board and manufacturing approach thereof with inductive coil.In specific words, its be about a kind of consider microwave absorbing property the slim circuit board and the manufacturing approach thereof of inductive coil design.
Background technology
(radio frequency identification technology RFID), is a kind of communication technology that sees through electromagnetic wave signal identification specific objective and read and write related data to radio frequency identification technique.The principle system of RF identification element running utilizes outside radio-frequency discriminating reader (RFID reader) launching electromagnetic wave to touch the radio-frequency discriminating element (like RF identification label RFID tag) that is in the induction range; This radio-frequency discriminating element can be supplied the running of the radio-frequency discriminating chip on it because of electromagnetic induction produces electric current, sends electromagnetic wave then and responds the effect that this inductor is reached radio-frequency discriminating.Owing to be to see through way of electromagnetic induction to carry out identification, need not set up any mechanicalness or optical contacting between frequency identification system (like reader reader) and the identification target (like RF identification label).Radio-frequency discriminating has many advantages; Long such as effective identification distance, can store and transmit that a large amount of information, identification speed are fast, can to repeat to rewrite data, security in the label preferable etc., so widely industry is used for replacing traditional identification bar code (bar code).The application of radio-frequency discriminating element now extends to retail logistics supply, a plurality of fields such as checking application are followed the trail of, reached to assets.
As shown in Figure 1, it forms structural section figure for the radio-frequency discriminating element 100 that a typical case in the prior art has inductive coil.As shown in the figure; Typical radio-frequency discriminating element 100 main systems by a flexible base plate 101, inductive coil 103, metal wiring layer 105, and four parts such as a radio-frequency discriminating chip 107 constitute; Wherein existing flexible base plate 101 is not had a radar absorption characteristic, so the design of inductive coil 103 need not be considered the magnetic flux characteristic of flexible base plate 101.This flexible base plate 101 is the form substrate that is provided with as radio-frequency discriminating element 100 each parts; Its PET (polyethylene terephthalate that use more; Gather terephthaldehyde's diethylester) etc. soft materials form, and have light weight, flexible, advantage such as be easy to carry about with one.The inductive coil 103 of the upper surface of flexible base plate 101 is used for receiving the electromagnetic wave that is sent by external radio frequency identification reader, to produce electric current by way of electromagnetic induction.The lower surface of flexible base plate 101 is formed with a metal wiring layer 105, and it can see through interconnection structure 104 and be electrically connected with inductive coil 103.This metal wiring layer 105 also contains the wiring zone of radio-frequency discriminating element 100, makes radio-frequency discriminating chip 107 be electrically connected inductive coil 103.
According to prior art, be formed with several through holes 109 that are communicated with upper and lower surfaces in the flexible base plate 101 and let the metal wiring layer 105 of flexible base plate 101 lower surfaces and the radio-frequency discriminating chip 107 of flexible base plate 101 upper surfaces produce electrically connects.By this, the electric current that inductive coil 103 generates because of electromagnetic induction can be delivered to radio-frequency discriminating chip 107 via metal wiring layer 105 and supply its running, responds outside radio-frequency discriminating reader to send electromagnetic wave, accomplishes actions such as tag recognition or data transfer/write.
Because of using electromagnetic wave induction mechanism, the radio-frequency discriminating element to the suitable sensitivity of environments for use such as metal and liquid, especially is attached to the metal surface or includes on the container of liquid under operating at high-frequency.Under this kind environment for use; Metal or liquid that the electromagnetic wave signal that external reader and radio-frequency discriminating element send receives near the radio-frequency discriminating element easily disturb; Cause induced signal to read problems such as bad, this problem is especially severe aspect passive radio frequency identification element.To this; Application facet at general passive radio frequency identification label; As shown in Figure 1, can add a magnetic induction paster (ferrite sheet, or be referred to as to inhale the ripple paster) 106 between radio-frequency discriminating element 100 and the metal surface 102; The electromagnetic wave that is received/send to suppress generates phenomenons such as surface wave, cavity resonance ripple, reflection wave or electromagnetic interference (EMI) at metal or liquid surface, and it is bad to avoid induced signal to read.
So, general industry magnetic induction paster commonly used can take many radio-frequency discriminating element costs of manufacture, and the magnetic induction paster has certain thickness in addition, can make the slimming of radio-frequency discriminating element become difficult; Moreover in response to the different inductive coil designs of radio-frequency discriminating element, the magnetic induction paster must be selected for use in order to avoid influence its action effect in discretion.In this; Inventor's conception is when slim circuit board manufacturing process; The preset magnetic flux characteristic of substrate is promptly considered in its inductive coil design; With avoid in the future this slim board application on the metal surface for the puzzlement of selecting the magnetic induction paster for use, in order to do radio-frequency discriminating element of the present invention can be applied in the slimming design, satisfy special to develop a kind of slim board structure of circuit and manufacturing approach thereof of inhaling the ripple effect that have.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, the present invention has disclosed a kind of slim circuit board and manufacturing approach thereof.The substrate system of the slim circuit board of the present invention processes with the organic resin material that is mixed with wave-absorbing powder; Make substrate have radar absorption characteristic; Have simultaneously the characteristic of general flexible circuit board again concurrently, can on slim circuit board, produce the radio-frequency discriminating element required increase layer and circuit structure.
In the present invention's one aspect, a kind of slim circuit board comprises building blocks such as magnetic induction substrate, inductive coil and metal wiring layer.This inductive coil is formed on a wherein side surface of this magnetic induction substrate.Metal wiring layer then is formed on a wherein side surface of this magnetic induction substrate and is electrically connected with this inductive coil.One radio-frequency discriminating chip then is arranged on a wherein side surface of this magnetic induction substrate and is electrically connected with this metal wiring layer.The design department of this inductive coil is considered the magnetic flux characteristic of this magnetic induction substrate to be arranged on the surface of this magnetic induction substrate, operates and send the inductor (reader) that electromagnetic wave is responded the outside in order to do making inductive coil produce electric current by electromagnetic induction with supply radio-frequency discriminating chip.
In another aspect of the present invention, this inductive coil series is the wherein side surface that the design one on top of another of multilayer circle circle is arranged at this magnetic induction substrate, and is gripped with a magnetic induction layer between each layer inductive coil, to strengthen magnetic induction property and to strengthen wave-absorbing effect.This magnetic induction layer material is identical with the material of magnetic induction substrate.
The object of the present invention is to provide a kind of slim circuit board of novelty, this circuit board comprises: a magnetic induction substrate, and made by organic resin and inorganic particle; One inductive coil is formed on the wherein side surface of magnetic induction substrate; Reach a metal wiring layer, be formed on a wherein side surface of magnetic induction substrate, and be electrically connected with inductive coil; Wherein, inductive coil is arranged on the surface of magnetic induction substrate with reference to the magnetic flux characteristic of magnetic induction substrate.The support structure property substrate that it adopts has electromagnetic wave absorption function, makes this slim circuit board need not to dispose extra magnetic induction paster or inhale the ripple paster to reach good radio-frequency discriminating effect.
Another object of the present invention is to provide a kind of thin film circuit board fabrication method of novelty, comprising: a magnetic induction substrate is provided, and the magnetic induction substrate is made by organic resin and inorganic particle; Form the wherein side surface of an inductive coil, and inductive coil is arranged on the surface of magnetic induction substrate with reference to the magnetic flux characteristic of magnetic induction substrate in the magnetic induction substrate; And forming a metal wiring layer in a wherein side surface of magnetic induction substrate, metal wiring layer is electrically connected with inductive coil.Its crossover setting that sees through inductive coil and magnetic induction layer is realized the design of multilayer inductive coil, has increased the actual induction distance of this inductive coil.
After consulting following detailed embodiment and relevant diagram and claim, the person of readding will more can understand the present invention other purpose, characteristic, reach advantage.
Description of drawings
Consult follow-up graphic and description and can more understand system and method for the present invention.Not detailed row and non-restrictive example then please refer to the description of this subsequent drawings in the literary composition.Element in graphic might not meet ratio, and is to depict principle of the present invention with the mode of stressing.In graphic, components identical lies in the part that marks identical correspondence in the different diagrams.
Fig. 1 is the sectional view of a typical RF identification label in the prior art;
Fig. 2 is the sectional view according to the embodiment of the invention one RF identification label;
Fig. 3 is the sectional view according to another RF identification label of the embodiment of the invention.
The main element symbol description:
100 radio-frequency discriminating elements
101 flexible base plates
102 metal surfaces
103 inductive coils
104 interconnection structures
105 metal wiring layers
106 magnetic induction pasters
107 radio-frequency discriminating chips
109 through holes
200 radio-frequency discriminating elements
201 magnetic induction substrates
202 metal surfaces
203 inductive coils
The 204a interconnection structure
The 204b interconnection structure
205 metal wiring layers
207 radio-frequency discriminating chips
209 through holes
211 conducting resinls
213 magnetic induction layers
215 interconnection structures
Embodiment
Please with reference to Fig. 2, it is the sectional view according to the embodiment of the invention one radio-frequency discriminating element 200 now.In an embodiment of the present invention, radio-frequency discriminating chip 207 is arranged on the film circuit board with inductive coil with the illustration as radio-frequency discriminating element 200.Radio-frequency discriminating element 200 belows also are painted with the relation that a metal surface 202 is used for representing its use setting.As shown in the figure; Radio-frequency discriminating element of the present invention 200 main systems by magnetic induction substrate 201, inductive coil 203, metal wiring layer 205, and four parts such as radio-frequency discriminating chip 207 constitute wherein magnetic induction substrate 201, inductive coil 203 and metal wiring layer 205 compositions one slim circuit board.In the present invention; Magnetic induction substrate 201 is to be one to have the sheet material of good microwave absorbing property; The form substrate that it not only is provided with as radio-frequency discriminating element 200 each parts; And can effectively suppress radio-frequency discriminating element 200 and under high frequency (like 13.56MHz) or ultrahigh frequency (like 900MHz) environment, generate phenomenons such as surface wave, cavity resonance ripple, reflection wave or electromagnetic interference (EMI) during near metal or liquid surface, the induced signal of avoiding deriving reads bad problem.Magnetic induction substrate 201 intrinsic electromagnetic wave absorption functions of the present invention make radio-frequency discriminating element 200 of the present invention can be useful in easily in the environment that general existing radio-frequency discriminating element (like RFID) can't use; As stick on metal surfaces such as can or be equipped with on the medicine bottle of liquid or place the metal shell of running gears such as mobile phone; Do not need again the suction ripple paster of the existing costliness of extra collocation, be able to save considerable forming label cost.
On the other hand, the inorganic powder material of magnetic induction substrate 201 is for having the material of good microwave absorbing property, and it can effectively make electromagnetic signal attenuation, avoids radio-frequency discriminating element 200 to receive reverse Electromagnetic Interference at metallic object or liquid surface.The material of inorganic particle can be like soft ferrite in the embodiment of the invention, and it comprises but is not limited to manganese-zinc ferrite, nickel-zinc ferrite, nickel-copper-zinc ferrite, manganese MgZn ferrite, manganese magnalium ferrite, copper-manganese Zn ferrite, vectolite or its potpourri; Alloy material, it comprises but is not limited to Rhometal, ferro-silicium, and ferroaluminium; Metal material, it comprises but is not limited to copper, aluminium, iron, and alloy such as nickel etc.In the present invention; The ratio that organic resin mixes with inorganic particle is respectively between 15%～35% and 85%～65%; Both can form slurry or the coating with microwave absorbing property after mixing; It can further be solidified into the solid with support structure property again, like film, film, tabular, block base material etc.The magnetic induction substrate 201 that the aforementioned proportion mixing preparation forms can be applicable to traditional P I soft board manufacturing process fully; As on magnetic induction substrate 201, carrying out plated film, losing and wash, carve actions such as milling, reach boring; Also applicable to the required high temperature manufacturing process of radio-frequency discriminating chip, as covering brilliant manufacturing process (flip chip) in the surface adhering technology.
In the present invention; Magnetic induction substrate 201 is structural support and the suction ripple spare of while as radio-frequency discriminating element 200, can see through the soft board manufacturing process on it and form the required through hole (throughhole) of radio-frequency discriminating element, wiring (trace), reaches the contact circuit structures such as (interconnect) that interconnects.As shown in Figure 2; The upper surface of magnetic induction substrate 201 is formed with inductive coil 203; This inductive coil 203 is multiturn loop design; It is to be provided with to receive by external radio frequency identification reader (reader) electromagnetic wave on the different polarised directions that is emitted in, to produce electric current by induction coupling (Inductive Coupling) or back scattering coupling way of electromagnetic induction such as (Back-scatter Coupling).In the invention, this inductive coil 203 can adopt etching (like copper etching and aluminium etching), elargol printing (comprising screen painting, letterpress, intaglio printing or ink-jetting style etc.), chemical depositing copper, and mode such as electro-coppering form.The material of inductive coil 203, thickness, the number of turn, Q value (quality factor) and the wave absorbtion matter that the corresponding employed magnetic induction substrate 201 of meeting is set etc. design or finely tune reaching required impedance matching (ImpedanceMatching), and maintain linearly polarized requirement on the electromagnetic induction.The frequency of operation of inductive coil 203 of the present invention can be looked its environment of applications and decided, and it comprises but is not limited to running frequency ranges such as 125/134KHz (low frequency), 13.56MHz (high frequency).
On the other hand, the lower surface of magnetic induction substrate 201 is formed with a metal wiring layer 205, is the some for the coil module of radio-frequency discriminating element 200.Metal wiring layer 205 can see through through hole or interconnection structure 204a, and 204b couples with the inductive coil 203 at two ends respectively, with the conduction electrical signals.In other embodiment of the present invention; Metal wiring layer 205 also can be used as the ground plane (ground plane) of inductive coil 203, to guide out because of electromagnetic induction is generated too much vortex flow that radio-frequency discriminating element 200 is outer avoids producing electromagnetic interference (EMI) with inductive coil 203.In the present invention, metal wiring layer 205 can be simultaneously as the signal transfer layer or the wiring layer of radio-frequency discriminating element 200.As shown in Figure 2, be formed with the through hole 209 that several are communicated with upper and lower surfaces on the magnetic induction substrate 201, those through hole 209 inside can be filled up conductive material and produce electrically connect with the metal wiring layer 205 with magnetic induction substrate 201 lower surfaces.The aperture position (being the coil connecting point position) that through hole 209 is positioned at magnetic induction substrate 201 upper surfaces is each pin position (as being with golden projection bump) of corresponding radio-frequency discriminating chip 207.In covering brilliant manufacturing process; These a plurality of coil connecting point positions can be put conducting resinl 211; Like anisotropic conducting rubber (ACP), anisotropic conducting membrance (ACF) or non-conductive adhesive (NCP) etc.; Bind then by the pin of this conducting resinl 211 afterwards, make coil module (comprising inductive coil 203 and metal wiring layer 205) and radio-frequency discriminating chip 207 produce electrically connect to transmit induction current with coil contact and radio-frequency discriminating chip 207.So far step has promptly been accomplished the making of the inside dummy slider (Inlay) of radio-frequency discriminating element 200 of the present invention.
In embodiments of the present invention, the induction current that radio-frequency discriminating chip 207 meeting induction receiving coils 203 are produced is also used and is sent electromagnetic wave to respond outside radio-frequency discriminating reader, accomplishes the identification action of RF component.Radio-frequency discriminating chip 207 can be the combination of multiple functional circuit, and it comprises but is not limited to: exchanging changes DC circuit, and the radiofrequency signal that external reader is brought converts direct supply to; Mu balanced circuit provides the radio-frequency discriminating chip 207 stable power; Modulation circuit is removed carrier wave to take out real modulating signal; Microprocessor, the signal decoding of bringing external reader, and require echo back data to give external reader according to it; Storer, the position of depositing recognition data as radio-frequency discriminating element 200; And modulation circuit, be downloaded to inductive coil behind the information modulation that above-mentioned microprocessor is seen off and see off to CR.
After accomplishing radio-frequency discriminating chip 207 bonding, the making of radio-frequency discriminating element 200 of the present invention promptly comes to an end.Yet; In other embodiments; Radio-frequency discriminating element 200 of the present invention is the inside dummy slider that can be used as RF identification label (comprises inductive coil, magnetic induction substrate, with parts such as chip), and it can carry out one paster pressing step (lamination) again to accomplish last RF identification label finished product.Label pressing step is the final manufacturing process that label is produced; This manufacturing process is with carrying out hot pressing in the inside dummy slider insertion autohension paster of RF identification label or the ticket card; Make inductive coil 203 in the originally exposed externally environment, magnetic induction substrate 201, enclosed in the smt package, become the operable label product of client with position such as radio-frequency discriminating chip 207.According to the difference of dealer's demand, produced RF identification label kenel is also different, as from the RF identification label of the RF identification label of stickiness, three layers of soft cassette, and the RF identification label of five layers of hard card formula etc.The final products of those kenels can be applicable in the application such as stored value card, gate inhibition's card, label paster, theftproof chip.
As shown in Figure 2, in being provided with, radio-frequency discriminating element 200 can be arranged to its metal wiring layer towards the metal surface 202, and the inductive coil part is then towards the outside.In practical application, this metal surface 202 possibly be betal can skin of IC circuit board, battery, metallic carrier or the can of mobile phone inside etc.Because magnetic induction substrate 201 intercepts between inductive coil 203 and metal surface 202, so the electromagnetic wave that set-up mode can make inductive coil 203 receive or emit can not receive the influence of this metal surface 202.So, above-mentioned set-up mode is merely one of embodiments of the invention, and in other embodiment, the inductive coil 203 and the metal wiring layer 205 of radio-frequency discriminating element 200 of the present invention also possibly be arranged on the same side of magnetic induction substrate 201.
The ripple material will be inhaled by the radio-frequency discriminating element design system of the invention described above embodiment and base material combines, and does not need as prior art, to be provided with extra magnetic induction paster or inhale the ripple paster just to reach the radio frequency induction identification effect that we desire.Except the cost that saves a paster, because radio-frequency discriminating element of the present invention has been vacateed the space (thickness of about 150 μ m～200 μ m) that original reservation is provided with the magnetic induction paster, so in the element more accommodation space can be provided.As shown in Figure 3, it is the sectional view according to another embodiment of the present invention one RF identification label.Among this embodiment among radio-frequency discriminating element and Fig. 2 the radio-frequency discriminating circuit elements design similar, precisely because utilized the height space that spares in the radio-frequency discriminating element inductive coil 203 to be designed to the loop construction of plural layer setting one on top of another.In the present embodiment, 203 of the inductive coils of this each layer more are provided with the whole wave-absorbing effect that magnetic induction layer 213 is used as the separation layer between layer and the layer and strengthens the radio-frequency discriminating element internal.The material of this magnetic induction layer 213 is identical with the material of magnetic induction substrate 201, has good electromaganic wave absorbing property.In embodiments of the present invention, magnetic induction coil 203 can adopt the Layer increasing method of filming to be formed on the inductive coil 203 of bottom earlier, continues to form the inductive coil 203 of its layer more on it.The metal wiring layer 205 that the inductive coil 203 of the superiors can see through under a through hole or interconnection structure 215 and the magnetic induction substrate 201 again produces electrically connects.The advantage of multilayer inductive coil in present embodiment design is that the space that script capable of using is kept for magnetic induction or inhaled the ripple paster is provided with the plural layer inductive coil; Increase the number of turn of coil in constant unit area, and then significantly increase the detection-sensitive distance of radio-frequency discriminating element of the present invention.Must notice that the double-deck inductive coil among Fig. 3 is merely an exemplary embodiment, in other embodiments, but this inductive coil 203 can up form the distance of reaction that the loop construction of multilayer more further increases the radio-frequency discriminating element.
It is said to sum up to state the present invention two embodiment; Design characteristic of the present invention is to provide one to have wave absorbtion matter and can carry out the base material of complete soft board manufacturing process again simultaneously and make the radio-frequency discriminating element; Need not dispose extra suction ripple paster on its element, save considerable cost of manufacture.Inductive coil and magnetic induction layer can be adopted multilayer design again in the invention, but with the distance of reaction of further increase RF identification label.
Above-mentioned explanation is the embodiment that has the slim circuit board of inductive coil about the present invention, in following embodiment, the invention provides a kind of manufacturing approach with slim circuit board of inductive coil.In the method; One magnetic induction substrate at first is provided; This magnetic induction substrate is made by organic resin and inorganic particle; Wherein this organic resin system gives the feasibility on this magnetic induction substrate mechanical property and the manufacturing process, and this inorganic particle then makes this magnetic induction substrate that the electromagnetic function of absorption is arranged; Then; On a wherein side surface of this magnetic induction substrate, form an inductive coil; This inductive coil series is arranged on the surface of this magnetic induction substrate with reference to the magnetic flux characteristic of this magnetic induction substrate; It can be used to receive the electromagnetic wave that is sent by external radio frequency identification reader, to produce electric current by way of electromagnetic induction; Afterwards; On a wherein side surface of this magnetic induction substrate, form a metal wiring layer again; This metal wiring layer is electrically connected with this inductive coil with the transmission electrical signals, or can inductive coil be guided out outside the slim circuit board to avoid producing electromagnetic interference (EMI) because of electromagnetic induction generates too much vortex flow.
This method can further be adhered to the wherein side surface of an integrated circuit in this magnetic induction substrate, and makes this integrated circuit be electrically connected this inductive coil via this metal wiring layer.And in another method embodiment, can form the above inductive coil of one deck on the magnetic induction substrate, more be formed with the whole wave-absorbing effect that a magnetic induction layer is used as the separation layer between layer and the layer and strengthens the radio-frequency discriminating element internal between its each layer inductive coil.
In said method embodiment, be to constitute in this magnetic induction substrate or the magnetic induction layer by organic resin and inorganic particle, its organic resin and inorganic particle account for the percentage by weight of magnetic induction substrate and magnetic induction layer about 15～35% and 85～65% respectively.This organic resin is selected from following material or its combination: pi (polyimide; PI), gather terephthaldehyde's diethylester (polyethylene terephthalate; PET), gather naphthalenedicarboxylic acid second diester (polyethylene naphthalate; PEN), polypropylene (polypropylene, PP), polyethers stone wind (Polyethersulfone, PES), gather phenylene ether sulfone (Polyphenylene Sulfone; PPSU), polyphenyl oxazole co-polymer (Poly-p-phenylene benzobisoxazole; PBO), liquid crystal polymer (Liquid Crystal Polymer, LCP), acryl resin (Acrylate), polyurethane (Polyurethane, PU) or epoxy resin (Epoxy).And this inorganic particle is selected from following material or its combination: manganese-zinc ferrite, nickel-zinc ferrite, nickel-copper-zinc ferrite, manganese MgZn ferrite, manganese magnalium ferrite, copper-manganese Zn ferrite, vectolite, Rhometal, ferro-silicium, ferroaluminium, copper, aluminium, iron or nickel.
Embodiment described in the literary composition and figure say that system supplies to give the person of readding, and in order to do it understanding of overall property are arranged for the variant example structure of the present invention.Those diagrams and explanation are not to be intended to description that the device that utilizes structure described herein or method and all elements in the system and characteristic are made integrality.In consulting instructions book of the present invention, the skilled persons will in field of the present invention will be more can be understood many other the embodiment of the present invention, its be able to adopt by or derive from exposure of the present invention.Be not contrary under the situation of category of the present invention, can carrying out the displacement and the change of structure and logic in the invention.For example: in the present invention, the inductive coil of radio-frequency discriminating element and metal wiring layer can be arranged on the same side of magnetic induction substrate; The magnetic induction substrate of radio-frequency discriminating element also possibly adopt the design of multi-layer soft circuit board; The radio-frequency discriminating chip that the radio-frequency discriminating element adopts or coupled possibly exercised other functions beyond the radio-frequency discriminating, like voltage stabilizing, rectification, conversion of signals etc.; After completing, the radio-frequency discriminating element can further carry out other manufacturing technology steps, like the label pressing, stamp sign etc.In addition, graphicly shown in the instructions only be used to be tool but not draw in proportion.Some part in the accompanying drawing may be exaggerated emphasical, and other parts maybe be by simple.In view of the above, embodiments of the invention and accompanying drawing reason are regarded as describing and non-limiting matter, and will be limited by the claim scope.
Claims (16)
1. a slim circuit board is characterized in that, described circuit board comprises:
One magnetic induction substrate, made by organic resin and inorganic particle;
One inductive coil is formed on the wherein side surface of described magnetic induction substrate; And
One metal wiring layer is formed on the wherein side surface of described magnetic induction substrate, and is electrically connected with described inductive coil;
Wherein, described inductive coil is arranged on the surface of described magnetic induction substrate with reference to the magnetic flux characteristic of described magnetic induction substrate.
2. slim circuit board as claimed in claim 1 is characterized in that, described inductive coil comprises the above coil of one deck, is formed with a magnetic induction layer between described each layer inductive coil, and described magnetic induction layer is made by organic resin and inorganic particle.
3. slim circuit board as claimed in claim 1 is characterized in that, organic resin in the described magnetic induction substrate and inorganic particle account for the percentage by weight of described magnetic induction substrate about 15～35% and 85～65% respectively.
4. slim circuit board as claimed in claim 2 is characterized in that, organic resin in the described magnetic induction layer and inorganic particle account for the percentage by weight of described magnetic induction layer about 15～35% and 85～65% respectively.
5. like claim 3 or 4 described slim circuit boards; It is characterized in that described organic resin is selected from following material or its combination: pi, gather terephthaldehyde's diethylester, gather, gather phenylene ether sulfone, polyphenyl oxazole co-polymer, liquid crystal polymer, acryl resin, polyurethane or epoxy resin to naphthalenedicarboxylic acid second diester, polypropylene, polyethers stone wind.
6. like claim 3 or 4 described slim circuit boards; It is characterized in that described inorganic particle is selected from following material or its combination: manganese-zinc ferrite, nickel-zinc ferrite, nickel-copper-zinc ferrite, manganese MgZn ferrite, manganese magnalium ferrite, copper-manganese Zn ferrite, vectolite, Rhometal, ferro-silicium, ferroaluminium, copper, aluminium, iron or nickel.
7. slim circuit board as claimed in claim 1 is characterized in that, a wherein side surface of described magnetic induction substrate adheres to an integrated circuit, and described integrated circuit is electrically connected described metal wiring layer.
8. slim circuit board as claimed in claim 7 is characterized in that described integrated circuit is electrically connected described inductive coil.
9. slim circuit board as claimed in claim 1 is characterized in that, described slim circuit board is a radio-frequency discriminating element.
10. the manufacturing approach with slim circuit board of inductive coil is characterized in that, described method comprises:
One magnetic induction substrate is provided, and described magnetic induction substrate is made by organic resin and inorganic particle;
Form the wherein side surface of an inductive coil, and described inductive coil is arranged on the surface of described magnetic induction substrate with reference to the magnetic flux characteristic of described magnetic induction substrate in described magnetic induction substrate; And
Form the wherein side surface of a metal wiring layer in described magnetic induction substrate, described metal wiring layer is electrically connected with described inductive coil.
11. manufacturing approach as claimed in claim 10 is characterized in that, described inductive coil comprises the above coil of one deck, is formed with a magnetic induction layer between described each layer inductive coil, and described magnetic induction layer is made by organic resin and inorganic particle.
12. manufacturing approach as claimed in claim 10 is characterized in that, organic resin in the described magnetic induction substrate and inorganic particle account for the percentage by weight of described magnetic induction substrate about 15～35% and 85～65% respectively.
13. manufacturing approach as claimed in claim 11 is characterized in that, organic resin in the described magnetic induction layer and inorganic particle account for the percentage by weight of described magnetic induction layer about 15～35% and 85～65% respectively.
14. like claim 12 or 13 described manufacturing approaches; It is characterized in that described organic resin is selected from following material or its combination: pi, gather terephthaldehyde's diethylester, gather, gather phenylene ether sulfone, polyphenyl oxazole co-polymer, liquid crystal polymer, acryl resin, polyurethane or epoxy resin to naphthalenedicarboxylic acid second diester, polypropylene, polyethers stone wind.
15. like claim 12 or 13 described manufacturing approaches; It is characterized in that described inorganic particle is selected from following material or its combination: manganese-zinc ferrite, nickel-zinc ferrite, nickel-copper-zinc ferrite, manganese MgZn ferrite, manganese magnalium ferrite, copper-manganese Zn ferrite, vectolite, Rhometal, ferro-silicium, ferroaluminium, copper, aluminium, iron or nickel.
16. manufacturing approach as claimed in claim 10; It is characterized in that; Described method further comprises adheres to the wherein side surface of an integrated circuit in described magnetic induction substrate, and described integrated circuit is electrically connected described inductive coil via described metal wiring layer.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102392610A CN102339407A (en) | 2010-07-27 | 2010-07-27 | Thin circuit board with induction coil and method for manufacturing circuit board |
| KR1020137004663A KR20130069739A (en) | 2010-07-27 | 2011-07-15 | Thin pcb having induction coil and manufacturing method thereof |
| PCT/CN2011/077189 WO2012013119A1 (en) | 2010-07-27 | 2011-07-15 | Thin pcb having induction coil and manufacturing method thereof |
| JP2013520953A JP2013534364A (en) | 2010-07-27 | 2011-07-15 | Thin circuit board having induction coil and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102392610A CN102339407A (en) | 2010-07-27 | 2010-07-27 | Thin circuit board with induction coil and method for manufacturing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102339407A true CN102339407A (en) | 2012-02-01 |
Family
ID=45515128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102392610A Pending CN102339407A (en) | 2010-07-27 | 2010-07-27 | Thin circuit board with induction coil and method for manufacturing circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013534364A (en) |
| KR (1) | KR20130069739A (en) |
| CN (1) | CN102339407A (en) |
| WO (1) | WO2012013119A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295049A (en) * | 2013-06-27 | 2013-09-11 | 中国兵器工业集团第五三研究所 | Flexible ultrahigh-frequency anti-metal electronic tag |
| CN103793743A (en) * | 2013-12-13 | 2014-05-14 | 成都佳美嘉科技有限公司 | Flexible high-frequency electronic tag |
| CN105764029A (en) * | 2016-04-19 | 2016-07-13 | 福州市佳璞电子商务有限公司 | RFID transceiver, video positioning system based on RFID, and video positioning method based on RFID |
| CN105875431A (en) * | 2016-04-19 | 2016-08-24 | 福州市佳璞电子商务有限公司 | RFID (radio frequency identification device) transceiver and miniature livestock and poultry flocking alarming system and alarming method based on RFID transceiver |
| CN110429072A (en) * | 2019-08-15 | 2019-11-08 | 广东工业大学 | A kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices |
| CN114048831A (en) * | 2021-11-08 | 2022-02-15 | 惠州中启宏业电子技术有限公司 | Straight-edge anti-theft label |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR102015000943A2 (en) | 2014-01-17 | 2016-06-07 | Dow Agrosciences Llc | increased protein expression in plant |
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- 2010-07-27 CN CN2010102392610A patent/CN102339407A/en active Pending
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- 2011-07-15 JP JP2013520953A patent/JP2013534364A/en not_active Withdrawn
- 2011-07-15 WO PCT/CN2011/077189 patent/WO2012013119A1/en active Application Filing
- 2011-07-15 KR KR1020137004663A patent/KR20130069739A/en not_active Application Discontinuation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1243294A (en) * | 1998-07-28 | 2000-02-02 | 东芝株式会社 | Integrated circuit card, data read-write device and radio mark and mfg. method therefor |
| CN1507503A (en) * | 2002-04-16 | 2004-06-23 | ���������ƴ���ʽ���� | Processing system, processing method and mounting member |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295049A (en) * | 2013-06-27 | 2013-09-11 | 中国兵器工业集团第五三研究所 | Flexible ultrahigh-frequency anti-metal electronic tag |
| CN103793743A (en) * | 2013-12-13 | 2014-05-14 | 成都佳美嘉科技有限公司 | Flexible high-frequency electronic tag |
| CN103793743B (en) * | 2013-12-13 | 2017-03-01 | 上海市信息网络有限公司 | Flexible ultra high frequency IC tag |
| CN105764029A (en) * | 2016-04-19 | 2016-07-13 | 福州市佳璞电子商务有限公司 | RFID transceiver, video positioning system based on RFID, and video positioning method based on RFID |
| CN105875431A (en) * | 2016-04-19 | 2016-08-24 | 福州市佳璞电子商务有限公司 | RFID (radio frequency identification device) transceiver and miniature livestock and poultry flocking alarming system and alarming method based on RFID transceiver |
| CN105875431B (en) * | 2016-04-19 | 2019-03-08 | 福州市佳璞电子商务有限公司 | RFID transceiver, the small-sized livestock and poultry based on RFID transceiver flock together alarm system and alarm method |
| CN105764029B (en) * | 2016-04-19 | 2021-11-26 | 福州佳璞辨溯科技有限公司 | RFID-based video positioning system and positioning method |
| CN110429072A (en) * | 2019-08-15 | 2019-11-08 | 广东工业大学 | A kind of upside-down mounting radio frequency chip and a kind of radio-frequency devices |
| CN114048831A (en) * | 2021-11-08 | 2022-02-15 | 惠州中启宏业电子技术有限公司 | Straight-edge anti-theft label |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013534364A (en) | 2013-09-02 |
| WO2012013119A1 (en) | 2012-02-02 |
| KR20130069739A (en) | 2013-06-26 |
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Application publication date: 20120201 |