KR101008452B1 - Pcb with rfid antena, and pcb with both rfid antena and rfid chipset, and management method of manufacturing process using rfid - Google Patents

Abstract

The present invention allows the RFID to be embedded in the "printed circuit board itself," it is possible to change to various uses of the RFID, to implement the antenna as a circuit to increase the space utilization of the printed circuit board, Printed circuit boards with RFID antennas, printed circuit boards with RFID antennas and RFID chipsets to enable automation of the entire plant by allowing the facility to automatically recognize information on the process conditions of each process for the manufacturing process. It is an object of the present invention to provide a manufacturing process management method for a printed circuit board using a circuit board and RFID.

Description

Manufacturing process control method for printed circuit board with RDF antenna, printed circuit board with RDF antenna and RDF chip, and printed circuit board using RDF ＜ PCB WITH RFID ANTENA, AND PCB WITH BOTH RFID ANTENA AND RFID CHIPSET , AND MANAGEMENT METHOD OF MANUFACTURING PROCESS USING RFID}

The present invention relates to a manufacturing process management method for a printed circuit board having an RFID antenna, a printed circuit board having an RFID antenna and an RFID chipset, and a printed circuit board using RFID.

RFID has been applied to various fields such as distribution, logistics, and WMS as the most essential element of ubiquitous computing technology, but mainly applied to limited industrial fields such as networking, automation, and intelligence of companies. There is a strong need for the industry to expand its business model to the public and customer service level in order to revitalize and expand its market.

The RFID is an automatic identification technology that can freely identify and record attached tag information without directly contacting an object using wireless communication technology. The RFID is composed of a tag, an antenna, a reader, a middleware, and an application service platform.

Mobile RFID refers to a form of a handheld RFID reader, such as a fixed or PDA, that mounts a reader on a mobile phone and sends information corresponding to a recognized tag to a mobile communication network (CDMA, HSDPA).

The present invention is based on the technology of embedding RFID in the "printed circuit board itself" as a way to replace the transportation card (subway, bus, etc.) that is used in various transportation facilities as well as the logistics of the product. Doing.

The present invention allows the RFID to be embedded in the "printed circuit board itself," it is possible to change to various uses of the RFID, to implement the antenna as a circuit to increase the space utilization of the printed circuit board, Printed circuit boards with RFID antennas, printed circuit boards with RFID antennas and RFID chipsets to enable automation of the entire plant by allowing the facility to automatically recognize information on the process conditions of each process for the manufacturing process. It is an object of the present invention to provide a manufacturing process management method for a printed circuit board using a circuit board and RFID.

On the other hand, the present invention was created with the above main purpose in mind, but is not necessarily limited to this, it should be noted that does not exclude new objects and effects that can be created or predicted from the configuration of the present invention described below.

A printed circuit board having an RFID antenna according to the present invention for achieving the above object, the first wiring portion formed on the printed circuit board; And a second wiring part formed in an area of the printed circuit board other than an area occupied by the first wiring part, wherein the second wiring part is a circuit pattern formed directly on the printed circuit board itself to implement an RFID antenna. do.

Here, the first wiring portion is formed at the center of the outer surface of the printed circuit board, and the second wiring portion is formed around the first wiring portion in a manner surrounding the first wiring portion.

The first wiring part may be formed at the center of the outer surface of the printed circuit board, and the second wiring part may surround the first wiring part, and the area where the first wiring part is not formed at one or more of the center of the outer surface. Is formed.

In addition, the first wiring part is formed in the center of the outer surface of the printed circuit board, the second wiring part is formed in the peripheral area in a manner surrounding the first wiring part and in the area where the first wiring part is not formed in the center of the outer surface. The circuits implemented in the two regions are antennas implemented to correspond to different frequencies, respectively.

The first wiring portion is formed on an outer surface of the printed circuit board, and the second wiring portion electrically connects the plurality of circuit patterns and the plurality of circuit patterns formed on the plurality of layers constituting the printed circuit board. Implemented by a plurality of vias.

On the other hand, a printed circuit board having both an RFID antenna and an RFID chipset according to the present invention for achieving the above object, the copper foil coated laminate layer configured to form a circuit pattern on the upper and lower surfaces and to mount the RFID chipset; And a prepreg layer in which prepreg and copper foil are sequentially stacked on upper and lower surfaces of the copper foil coated laminate, wherein the copper foil coated laminate layer is configured to mount the RFID chipset and be electrically connected to each other, and Installed on both sides of the pad, the pair of position recognition marks configured to adjust the position when the RFID chipset is matched with the pad, and the upper portion of the pair of position recognition marks without opening each cover And an anisotropic conductive film (ACF) installed to be interposed between the pad and the RFID chipset stacked with each other.

The printed circuit board including both the RFID antenna and the RFID chipset according to the present invention further includes Ag bumps formed on the pads.

In addition, the anisotropic conductive film has a width smaller than the distance of each of the pair of position recognition marks spaced apart from each other, so that the upper portion of the anisotropic conductive film does not cover each of the pair of position recognition marks.

In addition, the anisotropic conductive film, each of the pair of position recognition marks has a width greater than the distance from each other, so that the upper portion of the anisotropic conductive film does not cover each of the pair of position recognition marks open, A portion corresponding to the position where each of the pair of position recognition marks is formed includes a routed hole.

On the other hand, another printed circuit board having both an RFID antenna and an RFID chipset according to the present invention for achieving the above object, the circuit pattern is formed on the upper and lower surfaces, the copper foil coated laminate layer configured to mount the RFID chipset; And a prepreg layer in which a first prepreg and a copper foil are sequentially stacked on upper and lower surfaces of the copper foil coated laminate, wherein the copper foil coated laminate layer is configured to mount the RFID chipset and be electrically connected to each other. Ag bumps formed on the pads, a pair of position recognition marks installed on both sides of the pad and configured to adjust a position when the RFID chipset and the pad are matched, and the pair of position recognition marks, respectively A second prep installed to be interposed between the Ag bumps and the RFID chipset stacked with each other, the hole corresponding to a position where each of the pair of position recognition marks is formed so as to be opened at an upper portion thereof without covering the gap; It is characterized by including a leg.

In addition, a printed circuit board including both an RFID antenna and an RFID chipset according to the present invention may include: a first wiring part formed on the printed circuit board; And a second wiring part formed in an area of the printed circuit board other than the area occupied by the first wiring part, wherein the second wiring part is a circuit pattern formed directly on the printed circuit board itself to implement an RFID antenna.

Here, the first wiring portion is formed at the center of the outer surface of the printed circuit board, and the second wiring portion is formed around the first wiring portion in a manner surrounding the first wiring portion.

The first wiring part may be formed at the center of the outer surface of the printed circuit board, and the second wiring part may surround the first wiring part, and the area where the first wiring part is not formed at one or more of the center of the outer surface. Is formed.

In addition, the first wiring part is formed in the center of the outer surface of the printed circuit board, the second wiring part is formed in the peripheral area in a manner surrounding the first wiring part and in the area where the first wiring part is not formed in the center of the outer surface. The circuits implemented in the two regions are antennas implemented to correspond to different frequencies, respectively.

The first wiring portion is formed on an outer surface of the printed circuit board, and the second wiring portion electrically connects the plurality of circuit patterns and the plurality of circuit patterns formed on the plurality of layers constituting the printed circuit board. Implemented by a plurality of vias.

On the other hand, manufacturing process management method for a printed circuit board using RFID according to the present invention for achieving the above object, the step of putting a printed circuit board having the characteristics described above in the product process; Comparing the product process conditions obtained through the RFID embedded in the inserted printed circuit board with the product process conditions for the printed circuit board which has already been processed before the input; If it is determined by the comparison step that the product process conditions for the inserted printed circuit board and the product process conditions for the printed circuit board which have already been processed before the input are different from each other, the product process condition information for the input printed circuit board is obtained. Transmitting to the facility to change facility process conditions; Conducting a product process based on the changed facility process conditions; And recording a history of the product process progress.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. It should be noted that terms such as 'substantial' and 'approximately' used throughout the present specification are not only in the case of configurations that are exactly the same as the configurations disclosed in the present invention, but also in the lexical sense, even though there is a difference in the literary meaning. If the modification can be carried out to the extent that the same effect can be obtained it was used to mean that it is included in the technical scope of the invention. In addition, although the technology corresponding to the present invention, description of the technical content that is widely known and used in the art will be omitted.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Like reference numerals designate like parts throughout the specification.

Now, a printed circuit board and a manufacturing method thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Printed Circuit Board with RFID Antenna

First, Figure 1 is a plan view of a printed circuit board implemented with an RFID antenna according to an embodiment of the present invention.

The present invention has the basic idea of implementing the RFID antenna as a circuit on the printed circuit board itself, and therefore there is no particular limitation on whether the RFID chip is mounted or not.

As shown in FIG. 1, the printed circuit board 100 according to the present invention basically includes a first wiring part 1 and a second wiring part 2, 2 ′, and 2 ″.

The first wiring part 1 corresponds to a main circuit pattern formed on the printed circuit board 100, and the second wiring parts 2, 2 ′, and 2 ″ are other than the area occupied by the first wiring part 1. A circuit pattern formed in an area of a printed circuit board of the circuit board, wherein the second wiring parts 2, 2 ', 2 "are formed on a circuit pattern directly formed on the printed circuit board 100 itself to implement an RFID antenna. Corresponding.

Specific methods of implementing such an RFID antenna on a printed circuit board are illustrated in FIGS. 1A to 1C, respectively.

First, as an implementation method illustrated in FIG. 1A, the first wiring unit 1 is formed at a substantially outer center portion of the printed circuit board 100, and the second wiring unit 2 is formed in such a first wiring line. It is formed around it in a manner surrounding the portion 1.

In other words, this corresponds to a method of widening a predetermined space in which an antenna can be implemented outside the product and implementing the circuit.

In addition, as an implementation method illustrated in FIG. 1B, the first wiring unit 1 is similarly formed at the center of the outer surface of the printed circuit board 100, and the second wiring units 2 and 2 ′ are formed in the first unit. It is formed in the peripheral area in the manner which surrounds the wiring part 1, and in the area | region where the circuit pattern like the 1st wiring part 1 was not formed in one or more of the said center part of the said outer surface.

That is, this corresponds to a method of implementing an antenna as a circuit in an empty space after wiring inside the product.

Here, when the second wiring portions 2 and 2 'are formed in the region where the circuit pattern is not formed in the center of the outer surface together with the peripheral region in the manner surrounding the first wiring portion 1, these two regions Since the circuits implemented in the antennas are implemented in different circuit patterns to correspond to different frequencies, it is possible to respond to various frequencies on one substrate.

Finally, as an implementation method illustrated in FIG. 1C, the first wiring unit 1 is formed on an outer surface of the printed circuit board 100, and the second wiring unit 2 ″ constitutes the printed circuit board. A plurality of circuit patterns formed on a plurality of layers and a plurality of vias electrically connecting the plurality of circuit patterns are implemented.

That is, this corresponds to a method of forming an antenna in each layer of the multilayer substrate and implementing the multilayer antenna.

As described above, when the RFID antenna is implemented on the printed circuit board itself, since the printed circuit board has a relatively large area, only a part of the printed circuit board can be wired and the antenna of the RFID can be implemented in the remaining area, thereby increasing space utilization.

In addition, it is possible to change to various uses of RFID, that is, in case of HHP, it is possible to connect the network with its own OS and send and receive programs and data. It can be used for all systems.

In addition, by implementing various antennas in the printed circuit board at the same time, it is possible to respond to the various frequencies required.

Printed circuit board with both RFID antenna and RFID chipset

Example 1

2 and 3 are cross-sectional views of a printed circuit board in which an RFID antenna according to an exemplary embodiment of the present invention is implemented and a RFID chipset is mounted therein.

The printed circuit board according to the present embodiment has a prepreg 21 and a copper foil on the upper and lower surfaces of the copper foil coated laminate layer 10 and the copper foil coated laminate layer 10 configured to have a circuit pattern formed on the upper and lower surfaces and to mount the RFID chipset. 22 is composed of prepreg layers 20 stacked sequentially.

As shown in FIG. 2, the copper clad laminating layer 10 includes a chip mounting pad 11 configured to mount the RFID chipset 40 and to be electrically connected to each other.

In addition, a pair of position recognition marks 12 are formed on both sides of the pad 11, and the position of the RFID chipset 40 and the pad 11 is adjusted.

 In addition, an anisotropic conductive film (ACF) 30 is interposed between the pad 11 and the RFID chipset 40 that are stacked on each other to keep them bonded to each other. Here, the anisotropic conductive film 30 according to the present embodiment, unlike in the prior art, does not necessarily cover each of the pair of position recognition marks 12 above, that is, the position recognition mark 12 above It should be kept open.

In order not to cover each of the pair of position recognition marks 12 as described above, the upper portion of the anisotropic conductive film 30 is spaced apart from each other. It can be configured to have a width smaller than the given distance. The anisotropic conductive film 30 having such a size may be used by cutting a plurality of pieces to have the above-described width from one whole film sheet.

Alternatively, the anisotropic conductive film 30, although not shown in the drawing, may be formed so as to have an open shape without covering each of the pair of position recognition marks 12. Each of the pair of position recognition marks 12 may have a width greater than a distance from each other, but may be configured to include a hole by routing a portion corresponding to a position where each of the pair of position recognition marks 12 is formed. .

As shown in FIG. 3, Ag bumps 50, which are conductive pastes, may be additionally formed on the pads 11 to increase contact reliability between the pads 11 and the RFID chipset.

When the structure of the copper foil laminated layer 10 mentioned above is completed, the prepreg 21 and the copper foil 22 are laminated | stacked and crimped sequentially on both surfaces, and the prepreg layer 20 is formed.

The prepreg 21 refers to a sheet-like material which is hardened to a B-stage by impregnating a thermosetting resin in a base material such as a glass cloth, and refers to a semi-cured state of the resin. Prepreg is generally used a high viscosity epoxy resin.

Meanwhile, in the printed circuit board itself illustrated in FIGS. 2 and 3, the above-described RFID antenna may be implemented and formed as a circuit as illustrated in FIG. 1, and a redundant description thereof will be omitted.

[Example 2]

4 is a cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention. Hereinafter, a description will be given focusing on the configuration differences from the first embodiment according to FIG. 2 described above.

As shown in FIG. 4A, the printed circuit board according to the present exemplary embodiment has a copper foil coated laminate layer 10 and a copper foil coated laminate layer configured such that a circuit pattern is formed on the upper and lower sides, and the RFID chipset 40 is mounted. It consists of the prepreg layer 20 in which the 1st prepreg 21 and the copper foil 22 were laminated | stacked sequentially on the upper and lower surfaces of 10).

The copper-clad laminate layer 10 includes a chip mounting pad 11 configured to mount an RFID chipset 40 to be electrically connected to each other, an Ag bump 50 formed on the pad 11, and the pad ( A pair of position recognition marks 12 are installed on both sides of the center 11 and configured to adjust the position of the RFID chipset 40 and the pad 11 when they are matched.

And, as shown in FIG. 4B, a portion corresponding to the position where each of the pair of position recognition marks 12 is formed so as not to cover each of the pair of position recognition marks 12 is opened. A second prepreg 30 ′ having a routed hole A is provided to be interposed between the Ag bump 50 and the RFID chipset 40. The second prepreg 30 ′ is different from the anisotropic conductive film 30 of Example 1, and the second prepreg 30 ′ is formed of a copper clad laminate layer 10 or a prepreg layer 20. By having substantially the same size as can reduce the manufacturing process can be improved productivity.

The configuration and application of other matters have already been sufficiently described in the first embodiment, and thus descriptions of redundant contents will be omitted.

Manufacturing Process Management Method for Printed Circuit Board Using RFID

Hereinafter, a manufacturing process management method for a printed circuit board using RFID according to the present embodiment will be described with reference to FIG. 5.

First, a printed circuit board in which RFIDs according to FIGS. 1 to 4 are embedded (in a core part) is introduced into a product process (S10 and S20). Process information on the printed circuit board including the RFID, that is, the process related information on the number of stacking, stacking pressure and time, etc. is loaded from the installation side by the RFID. Therefore, the productivity of the product can be maximized as compared to the prior art, which reads a bar code or the like for each of the input products and modifies the process conditions on the installation side.

Next, the product process conditions obtained through the RFID embedded in the inserted printed circuit board and the product process conditions for the printed circuit board already processed before the input, that is, the current equipment setting conditions are compared (S30).

If it is determined by the comparison step (S30) that the product process conditions for the input printed circuit board and the product process conditions (corresponding to the current equipment setting conditions) for the printed circuit board that has already been processed before the input is different from each other. In addition, the product process condition information on the input printed circuit board is transmitted to the corresponding facility to change the facility process condition (S40).

Next, a product process is performed based on the changed facility process conditions (S50).

Finally, the history of the product process progress is recorded (S60).

As described above, according to the manufacturing process management method according to the present embodiment, it is possible to enhance the automation of the equipment by automatically processing the process conditions of each process and the respective equipment.

Although the preferred embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the scope of the present invention is not limited to the disclosed embodiments, but various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also belong to the scope of the present invention.

1 is a plan view of a printed circuit board implemented with an RFID antenna according to an embodiment of the present invention.

2 to 4 are cross-sectional views of printed circuit boards in which an RFID antenna according to an embodiment of the present invention is implemented and a RFID chipset is mounted therein.

5 is a flowchart illustrating a manufacturing process management method for a printed circuit board using RFID according to an embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

1: first wiring part

2, 2 ', 2 ": second wiring (RFID antenna circuit)

10: copper foil coated laminate layer 11: pad

12: position recognition mark 20: prepreg layer

21: (first) prepreg 22: copper foil

30: anisotropic conductive film 30 ': second prepreg

40: RFID Chipset 50: Ag Bump

Claims (16)

delete In a printed circuit board having an RFID antenna, A first wiring part formed on the printed circuit board; And A second wiring portion formed in an area of the printed circuit board other than the area occupied by the first wiring portion; Including, The second wiring portion is a circuit pattern formed directly on the printed circuit board itself to implement an RFID antenna, The first wiring part is formed in the center of the outer surface of the printed circuit board, the second wiring part is formed in the peripheral area in a manner surrounding the first wiring part, the printed circuit board having an RFID antenna. In a printed circuit board having an RFID antenna, A first wiring part formed on the printed circuit board; And A second wiring portion formed in an area of the printed circuit board other than the area occupied by the first wiring portion; Including, The second wiring portion is a circuit pattern formed directly on the printed circuit board itself to implement an RFID antenna, The first wiring part is formed at the center of the outer surface of the printed circuit board, and the second wiring part is at least one or more of a peripheral area in a manner surrounding the first wiring part and a region in which no circuit pattern is formed in the outer surface center. Printed circuit board having an RFID antenna, characterized in that formed in the area. In a printed circuit board having an RFID antenna, A first wiring part formed on the printed circuit board; And A second wiring portion formed in an area of the printed circuit board other than the area occupied by the first wiring portion; Including, The second wiring portion is a circuit pattern formed directly on the printed circuit board itself to implement an RFID antenna, The first wiring part is formed in the center of the outer surface of the printed circuit board, the second wiring part is formed in the peripheral area in a manner surrounding the first wiring part and in the area where the circuit pattern is not formed in the center of the outer surface, The printed circuit board having an RFID antenna, wherein the circuits implemented in the two regions are antennas implemented to correspond to different frequencies, respectively. In a printed circuit board having an RFID antenna, A first wiring part formed on the printed circuit board; And Second wiring portion formed in an area of the printed circuit board other than the area occupied by the first wiring portion Including, The second wiring portion is a circuit pattern formed directly on the printed circuit board itself to implement an RFID antenna, The first wiring part is formed on an outer surface of the printed circuit board, and the second wiring part is formed by electrically connecting a plurality of circuit patterns and a plurality of circuit patterns formed on a plurality of layers constituting the printed circuit board. Printed circuit board having an RFID antenna, characterized in that implemented by a via. In a printed circuit board having both an RFID antenna and an RFID chipset, A copper foil coated laminate layer configured to have a circuit pattern formed on upper and lower surfaces thereof and to mount the RFID chipset; And Prepreg layer in which prepreg and copper foil are sequentially stacked on upper and lower surfaces of the copper foil coated laminate layer Including, The copper foil coated laminate layer, A chip mounting pad configured to mount the RFID chipset and be electrically connected to each other; A pair of position recognition marks installed on both sides of the pad and configured to adjust a position when the RFID chipset is matched with the pad; An anisotropic conductive film (ACF) formed in an open form without covering each of the pair of position recognition marks and interposed between the pad and the RFID chipset stacked with each other. Printed circuit board comprising a. The method of claim 6, The printed circuit board further comprises an Ag bump formed on the pad. The method of claim 6, The anisotropic conductive film has a width smaller than the distance of each of the pair of position recognition marks, so that the upper portion of the anisotropic conductive film does not cover each of the pair of position recognition marks open. Printed circuit board. The method of claim 6, The anisotropic conductive film has a width larger than a distance of each of the pair of position recognition marks spaced apart from each other, so that the upper portion of the anisotropic conductive film does not cover each of the pair of position recognition marks. Printed circuit board, characterized in that the portion corresponding to the position where each of the pair of position recognition mark is formed comprises a routed hole. In a printed circuit board having both an RFID antenna and an RFID chipset, A copper foil coated laminate layer configured to have a circuit pattern formed on upper and lower surfaces thereof and to mount the RFID chipset; And A prepreg layer in which a first prepreg and a copper foil are sequentially stacked on upper and lower surfaces of the copper foil coated laminate layer Including, The copper foil coated laminate layer, A chip mounting pad configured to mount the RFID chipset and be electrically connected to each other; Ag bumps formed on the pads, A pair of position recognition marks installed on both sides of the pad and configured to adjust a position when the RFID chipset and the pad are matched; The Ag bumps and the RFID chipset, each of which includes a hole in which a portion corresponding to a position at which each of the pair of position recognition marks is formed so as not to cover each of the pair of position recognition marks and is opened, wherein the Ag bumps are stacked on each other Second prepreg installed to be interposed between Printed circuit board comprising a. The method according to any one of claims 6 to 10, A first wiring part formed on the printed circuit board; And A second wiring part formed in an area of the printed circuit board other than the area occupied by the first wiring part; The second wiring portion is a printed circuit board, characterized in that the circuit pattern formed directly on the printed circuit board itself to implement the RFID antenna. The method of claim 11, The first wiring portion is formed in the center of the outer surface of the printed circuit board, the second wiring portion is formed around the first wiring portion in a manner surrounding the printed circuit board. The method of claim 11, The first wiring part is formed at the center of the outer surface of the printed circuit board, and the second wiring part is at least one or more areas of the surroundings in a manner surrounding the first wiring part and the area where the circuit pattern is not formed in the center of the outer surface. Printed circuit board, characterized in that formed on. The method of claim 11, The first wiring part is formed in the center of the outer surface of the printed circuit board, the second wiring part is formed in the peripheral area in a manner surrounding the first wiring part and in the area where the circuit pattern is not formed in the center of the outer surface, Printed circuit board, characterized in that the circuit implemented in the two areas are each implemented to correspond to a different frequency. The method of claim 11, The first wiring part is formed on an outer surface of the printed circuit board, and the second wiring part is formed by electrically connecting a plurality of circuit patterns and a plurality of circuit patterns formed on a plurality of layers constituting the printed circuit board. Printed circuit board, characterized in that implemented by vias. In the manufacturing process management method for a printed circuit board using RFID, A method of manufacturing a printed circuit board according to any one of claims 1 to 10 in the product process; Comparing the product process conditions obtained through the RFID embedded in the inserted printed circuit board with the product process conditions for the printed circuit board which has already been processed before the input; If it is determined by the comparison step that the product process conditions for the inserted printed circuit board and the product process conditions for the printed circuit board which have already been processed before the input are different from each other, the product process condition information for the input printed circuit board is obtained. Transmitting to the facility to change facility process conditions; Conducting a product process based on the changed facility process conditions; And Recording a history of the product process progress Manufacturing process management method for a printed circuit board using RFID comprising a.

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