CN104111583B - 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法 - Google Patents
感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法 Download PDFInfo
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- CN104111583B CN104111583B CN201410381347.5A CN201410381347A CN104111583B CN 104111583 B CN104111583 B CN 104111583B CN 201410381347 A CN201410381347 A CN 201410381347A CN 104111583 B CN104111583 B CN 104111583B
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Classifications
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/116—Redox or dye sensitizer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
- Y10S430/121—Nitrogen in heterocyclic ring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Physics & Mathematics (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Engineering & Computer Science (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
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| JP2006-105416 | 2006-04-06 | ||
| CNA200680017652XA CN101180578A (zh) | 2005-05-23 | 2006-05-22 | 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法 |
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| CN2010105396454A Pending CN102012634A (zh) | 2005-05-23 | 2006-05-22 | 感光性树脂组合物,感光性元件,光致抗蚀图形的形成方法及印刷电路板的制造方法 |
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| JP4586919B2 (ja) * | 2006-04-18 | 2010-11-24 | 日立化成工業株式会社 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| JP4847582B2 (ja) | 2007-04-04 | 2011-12-28 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物および積層体 |
| JP5117235B2 (ja) * | 2008-03-21 | 2013-01-16 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物および積層体 |
| JP5117234B2 (ja) * | 2008-03-21 | 2013-01-16 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物および積層体 |
| US8361697B2 (en) | 2008-03-21 | 2013-01-29 | Asahi Kasei E-Materials Corporation | Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board |
| JP5117233B2 (ja) * | 2008-03-21 | 2013-01-16 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物および積層体 |
| JP5327310B2 (ja) * | 2009-02-26 | 2013-10-30 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| KR101719025B1 (ko) * | 2010-04-15 | 2017-03-22 | 닛코-매터리얼즈 가부시키가이샤 | 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
| PH12013500757A1 (en) | 2010-12-16 | 2013-06-03 | Resonac Corp | Photosensitive element, method for forming resist pattern, and method for producing printed circuit board |
| CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
| JP6229256B2 (ja) * | 2011-10-31 | 2017-11-15 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| WO2013084283A1 (ja) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント |
| WO2013084282A1 (ja) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント |
| US9341946B2 (en) * | 2012-05-25 | 2016-05-17 | Lg Chem, Ltd. | Photosensitive resin composition, pattern formed using same and display panel comprising same |
| CN104871045B (zh) * | 2013-06-07 | 2018-02-02 | 株式会社艾迪科 | 着色感光性组合物和化合物 |
| MY190719A (en) * | 2014-05-23 | 2022-05-12 | Showa Denko Materials Co Ltd | Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element |
| KR102061130B1 (ko) * | 2015-05-21 | 2020-02-20 | 창저우 트론리 어드벤스드 일렉트로닉 머티어리얼스 컴퍼니, 리미티드 | 피라졸린계 증감제 및 그 제조방법과 응용 |
| JP6911369B2 (ja) * | 2017-02-15 | 2021-07-28 | Tdk株式会社 | 積層コイル部品の製造方法 |
| KR20260006056A (ko) * | 2019-10-16 | 2026-01-12 | 가부시끼가이샤 레조낙 | 감광성 수지 필름, 레지스트 패턴의 형성 방법, 및 배선 패턴의 형성 방법 |
| CN113929624A (zh) * | 2020-07-13 | 2022-01-14 | 常州强力电子新材料股份有限公司 | 一种吡唑啉类化合物、感光性树脂组合物及图形化方法 |
| CN120271511A (zh) * | 2025-06-09 | 2025-07-08 | 杭州福斯特电子材料有限公司 | 增感剂、感光树脂组合物、感光干膜及其制备方法 |
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-
2006
- 2006-05-22 KR KR1020087028775A patent/KR100934046B1/ko active Active
- 2006-05-22 CN CN201410381347.5A patent/CN104111583B/zh active Active
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| US4845011A (en) * | 1987-10-23 | 1989-07-04 | Hoechst Celanese Corporation | Visible light photoinitiation compositions |
| US5221595A (en) * | 1990-03-27 | 1993-06-22 | Hoechst Aktiengesellschaft | Photopolymerizable mixture and recording material prepared therefrom |
| JPH05179226A (ja) * | 1991-05-07 | 1993-07-20 | Nippon Kagaku Kogyosho:Kk | 光線遮蔽剤 |
| CN1205784A (zh) * | 1995-12-21 | 1999-01-20 | 株式会社可隆 | 光敏树脂组合物 |
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| CN104111583A (zh) | 2014-10-22 |
| US20100279229A1 (en) | 2010-11-04 |
| US20090029289A1 (en) | 2009-01-29 |
| US8192916B2 (en) | 2012-06-05 |
| US8198008B2 (en) | 2012-06-12 |
| TW200702916A (en) | 2007-01-16 |
| KR20080108624A (ko) | 2008-12-15 |
| SG160355A1 (en) | 2010-04-29 |
| TWI417663B (zh) | 2013-12-01 |
| KR20070110937A (ko) | 2007-11-20 |
| CN104133342A (zh) | 2014-11-05 |
| TWI334965B (https=) | 2010-12-21 |
| WO2006126480A1 (ja) | 2006-11-30 |
| US20100285408A1 (en) | 2010-11-11 |
| CN101180578A (zh) | 2008-05-14 |
| KR100934046B1 (ko) | 2009-12-24 |
| KR100935779B1 (ko) | 2010-01-06 |
| KR100953245B1 (ko) | 2010-04-16 |
| CN104133343B (zh) | 2016-11-16 |
| KR20100009547A (ko) | 2010-01-27 |
| US7993809B2 (en) | 2011-08-09 |
| KR20080108623A (ko) | 2008-12-15 |
| CN104133342B (zh) | 2018-01-23 |
| TW201100961A (en) | 2011-01-01 |
| KR100932581B1 (ko) | 2009-12-17 |
| CN102012634A (zh) | 2011-04-13 |
| CN104133343A (zh) | 2014-11-05 |
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