CN104094084A - 具有分开z轴部分的微电子机械系统(MEMS)质量块 - Google Patents
具有分开z轴部分的微电子机械系统(MEMS)质量块 Download PDFInfo
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- CN104094084A CN104094084A CN201380007523.2A CN201380007523A CN104094084A CN 104094084 A CN104094084 A CN 104094084A CN 201380007523 A CN201380007523 A CN 201380007523A CN 104094084 A CN104094084 A CN 104094084A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5733—Structural details or topology
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/082—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for two degrees of freedom of movement of a single mass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0848—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration using a plurality of mechanically coupled spring-mass systems, the sensitive direction of each system being different
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710665108.6A CN107576322B (zh) | 2012-02-01 | 2013-01-14 | 具有分开z轴部分的微电子机械系统(MEMS)质量块 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/363,537 | 2012-02-01 | ||
US13/363,537 US8978475B2 (en) | 2012-02-01 | 2012-02-01 | MEMS proof mass with split z-axis portions |
PCT/US2013/021411 WO2013115967A1 (en) | 2012-02-01 | 2013-01-14 | Mems proof mass with split z-axis portions |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710665108.6A Division CN107576322B (zh) | 2012-02-01 | 2013-01-14 | 具有分开z轴部分的微电子机械系统(MEMS)质量块 |
Publications (2)
Publication Number | Publication Date |
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CN104094084A true CN104094084A (zh) | 2014-10-08 |
CN104094084B CN104094084B (zh) | 2017-09-05 |
Family
ID=48869102
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710665108.6A Active CN107576322B (zh) | 2012-02-01 | 2013-01-14 | 具有分开z轴部分的微电子机械系统(MEMS)质量块 |
CN201380007523.2A Active CN104094084B (zh) | 2012-02-01 | 2013-01-14 | 具有分开z轴部分的微电子机械系统(MEMS)质量块 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710665108.6A Active CN107576322B (zh) | 2012-02-01 | 2013-01-14 | 具有分开z轴部分的微电子机械系统(MEMS)质量块 |
Country Status (3)
Country | Link |
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US (2) | US8978475B2 (zh) |
CN (2) | CN107576322B (zh) |
WO (1) | WO2013115967A1 (zh) |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
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US8978475B2 (en) | 2012-02-01 | 2015-03-17 | Fairchild Semiconductor Corporation | MEMS proof mass with split z-axis portions |
US9006846B2 (en) | 2010-09-20 | 2015-04-14 | Fairchild Semiconductor Corporation | Through silicon via with reduced shunt capacitance |
US9062972B2 (en) | 2012-01-31 | 2015-06-23 | Fairchild Semiconductor Corporation | MEMS multi-axis accelerometer electrode structure |
US9069006B2 (en) | 2012-04-05 | 2015-06-30 | Fairchild Semiconductor Corporation | Self test of MEMS gyroscope with ASICs integrated capacitors |
US9094027B2 (en) | 2012-04-12 | 2015-07-28 | Fairchild Semiconductor Corporation | Micro-electro-mechanical-system (MEMS) driver |
US9095072B2 (en) | 2010-09-18 | 2015-07-28 | Fairchild Semiconductor Corporation | Multi-die MEMS package |
US9156673B2 (en) | 2010-09-18 | 2015-10-13 | Fairchild Semiconductor Corporation | Packaging to reduce stress on microelectromechanical systems |
US9246018B2 (en) | 2010-09-18 | 2016-01-26 | Fairchild Semiconductor Corporation | Micromachined monolithic 3-axis gyroscope with single drive |
US9278845B2 (en) | 2010-09-18 | 2016-03-08 | Fairchild Semiconductor Corporation | MEMS multi-axis gyroscope Z-axis electrode structure |
US9278846B2 (en) | 2010-09-18 | 2016-03-08 | Fairchild Semiconductor Corporation | Micromachined monolithic 6-axis inertial sensor |
US9352961B2 (en) | 2010-09-18 | 2016-05-31 | Fairchild Semiconductor Corporation | Flexure bearing to reduce quadrature for resonating micromachined devices |
US9425328B2 (en) | 2012-09-12 | 2016-08-23 | Fairchild Semiconductor Corporation | Through silicon via including multi-material fill |
US9444404B2 (en) | 2012-04-05 | 2016-09-13 | Fairchild Semiconductor Corporation | MEMS device front-end charge amplifier |
US9488693B2 (en) | 2012-04-04 | 2016-11-08 | Fairchild Semiconductor Corporation | Self test of MEMS accelerometer with ASICS integrated capacitors |
US9618361B2 (en) | 2012-04-05 | 2017-04-11 | Fairchild Semiconductor Corporation | MEMS device automatic-gain control loop for mechanical amplitude drive |
US9625272B2 (en) | 2012-04-12 | 2017-04-18 | Fairchild Semiconductor Corporation | MEMS quadrature cancellation and signal demodulation |
CN107003130A (zh) * | 2014-12-18 | 2017-08-01 | 赖斯阿克里奥公司 | 微机电陀螺仪 |
CN107270883A (zh) * | 2016-03-31 | 2017-10-20 | 意法半导体股份有限公司 | 具有对应的电气参数的降低的漂移的mems多轴陀螺仪的微机械检测结构 |
CN107407695A (zh) * | 2015-01-28 | 2017-11-28 | 因文森斯公司 | 平移式z轴加速度计 |
CN108449949A (zh) * | 2015-11-20 | 2018-08-24 | 罗伯特·博世有限公司 | 微机械的转速传感器及其运行方法 |
US10060757B2 (en) | 2012-04-05 | 2018-08-28 | Fairchild Semiconductor Corporation | MEMS device quadrature shift cancellation |
US10065851B2 (en) | 2010-09-20 | 2018-09-04 | Fairchild Semiconductor Corporation | Microelectromechanical pressure sensor including reference capacitor |
CN108872638A (zh) * | 2017-05-08 | 2018-11-23 | 株式会社村田制作所 | 电容式微电子机械加速度计 |
CN109946481A (zh) * | 2019-04-02 | 2019-06-28 | 四川知微传感技术有限公司 | 一种基于刚度补偿的mems闭环加速度计 |
CN111103436A (zh) * | 2018-10-25 | 2020-05-05 | 美国亚德诺半导体公司 | 低噪声多轴加速度计及相关方法 |
US10697994B2 (en) | 2017-02-22 | 2020-06-30 | Semiconductor Components Industries, Llc | Accelerometer techniques to compensate package stress |
CN111650401A (zh) * | 2020-06-03 | 2020-09-11 | 西安交通大学 | 一种同平面贴装的金属基集成式谐振加速度计 |
CN112034205A (zh) * | 2020-08-11 | 2020-12-04 | 上海矽睿科技有限公司 | 一种微机电系统的三轴加速度计 |
CN109946481B (zh) * | 2019-04-02 | 2024-04-19 | 四川知微传感技术有限公司 | 一种基于刚度补偿的mems闭环加速度计 |
Families Citing this family (33)
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US8739626B2 (en) * | 2009-08-04 | 2014-06-03 | Fairchild Semiconductor Corporation | Micromachined inertial sensor devices |
US8754694B2 (en) | 2012-04-03 | 2014-06-17 | Fairchild Semiconductor Corporation | Accurate ninety-degree phase shifter |
US8742964B2 (en) | 2012-04-04 | 2014-06-03 | Fairchild Semiconductor Corporation | Noise reduction method with chopping for a merged MEMS accelerometer sensor |
CN104395842A (zh) * | 2012-04-30 | 2015-03-04 | 惠普发展公司,有限责任合伙企业 | 基于用户敲击的命令的控制信号 |
US20150106041A1 (en) * | 2012-04-30 | 2015-04-16 | Hewlett-Packard Development Company | Notification based on an event identified from vibration data |
KR101461277B1 (ko) * | 2012-09-21 | 2014-11-12 | 삼성전기주식회사 | Mems 소자 |
KR101531088B1 (ko) * | 2013-05-30 | 2015-07-06 | 삼성전기주식회사 | 관성센서 |
US8973439B1 (en) * | 2013-12-23 | 2015-03-10 | Invensense, Inc. | MEMS accelerometer with proof masses moving in anti-phase direction normal to the plane of the substrate |
US10371715B2 (en) | 2013-12-23 | 2019-08-06 | Invensense, Inc. | MEMS accelerometer with proof masses moving in an anti-phase direction |
US9581614B2 (en) * | 2014-06-02 | 2017-02-28 | Meggit (Orange County), Inc. | High-output MEMS accelerometer |
JP6262629B2 (ja) * | 2014-09-30 | 2018-01-17 | 株式会社日立製作所 | 慣性センサ |
US10203351B2 (en) | 2014-10-03 | 2019-02-12 | Analog Devices, Inc. | MEMS accelerometer with Z axis anchor tracking |
US9611135B1 (en) * | 2015-10-30 | 2017-04-04 | Infineon Technologies Ag | System and method for a differential comb drive MEMS |
US9661411B1 (en) * | 2015-12-01 | 2017-05-23 | Apple Inc. | Integrated MEMS microphone and vibration sensor |
US10393770B2 (en) | 2016-04-28 | 2019-08-27 | Semiconductor Components Industries, Llc | Multi-axis accelerometer with reduced stress sensitivity |
US10203352B2 (en) | 2016-08-04 | 2019-02-12 | Analog Devices, Inc. | Anchor tracking apparatus for in-plane accelerometers and related methods |
US10261105B2 (en) | 2017-02-10 | 2019-04-16 | Analog Devices, Inc. | Anchor tracking for MEMS accelerometers |
US10247753B2 (en) * | 2017-02-14 | 2019-04-02 | Nxp Usa, Inc. | MEMS device with off-axis shock protection |
JP6691882B2 (ja) | 2017-03-03 | 2020-05-13 | 株式会社日立製作所 | 加速度センサ |
US10429407B2 (en) | 2017-03-27 | 2019-10-01 | Nxp Usa, Inc. | Three-axis inertial sensor for detecting linear acceleration forces |
US10759656B2 (en) * | 2017-09-29 | 2020-09-01 | Apple Inc. | MEMS sensor with dual pendulous proof masses |
US10732196B2 (en) | 2017-11-30 | 2020-08-04 | Invensense, Inc. | Asymmetric out-of-plane accelerometer |
US10809277B2 (en) | 2017-12-18 | 2020-10-20 | Nxp Usa, Inc. | Single axis inertial sensor with suppressed parasitic modes |
US10816569B2 (en) | 2018-09-07 | 2020-10-27 | Analog Devices, Inc. | Z axis accelerometer using variable vertical gaps |
US11255873B2 (en) | 2018-09-12 | 2022-02-22 | Analog Devices, Inc. | Increased sensitivity z-axis accelerometer |
US11733263B2 (en) | 2018-09-21 | 2023-08-22 | Analog Devices, Inc. | 3-axis accelerometer |
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JP7188311B2 (ja) | 2019-07-31 | 2022-12-13 | セイコーエプソン株式会社 | ジャイロセンサー、電子機器、及び移動体 |
EP3792637B1 (en) * | 2019-09-11 | 2023-05-03 | Murata Manufacturing Co., Ltd. | Low-noise multi-axis mems accelerometer |
WO2021079607A1 (ja) * | 2019-10-23 | 2021-04-29 | 浜松ホトニクス株式会社 | ミラーデバイスの製造方法 |
JP7464374B2 (ja) * | 2019-10-23 | 2024-04-09 | 浜松ホトニクス株式会社 | ミラーデバイスの製造方法 |
EP3882641B1 (en) | 2020-03-18 | 2023-02-15 | Murata Manufacturing Co., Ltd. | Mems accelerometer with mechanically decoupled proof mass |
US20210385586A1 (en) * | 2020-06-04 | 2021-12-09 | Georgia Tech Research Corporation | Systems and methods having multi-axis sensitivity and translational mode shapes |
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CN107576322A (zh) | 2018-01-12 |
US8978475B2 (en) | 2015-03-17 |
CN107576322B (zh) | 2021-04-09 |
US20150185012A1 (en) | 2015-07-02 |
CN104094084B (zh) | 2017-09-05 |
US9599472B2 (en) | 2017-03-21 |
WO2013115967A1 (en) | 2013-08-08 |
US20130192364A1 (en) | 2013-08-01 |
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