CN104080285B - 一种陶瓷壳体结构件及其制备方法 - Google Patents
一种陶瓷壳体结构件及其制备方法 Download PDFInfo
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Abstract
本发明实施例提供了一种陶瓷壳体结构件,包括陶瓷壳体和边框,陶瓷壳体包括陶瓷平板和部分嵌设在陶瓷平板内的陶瓷突出件,边框通过陶瓷突出件沿陶瓷平板的厚度方向与陶瓷平板贴合在一起,边框的上表面与下表面分别与陶瓷壳体的上表面和下表面齐平,陶瓷平板和陶瓷突出件的材质分别为致密陶瓷材料和多孔陶瓷材料,边框的材质为合金、金属基复合材料或塑料。所述边框能够保护陶瓷壳体的边缘不直接与其他物质发生碰撞,所述陶瓷突出件能够增加陶瓷壳体与边框之间的结合力,从而提高本发明陶瓷壳体结构件的整体抗摔能力,扩大了陶瓷壳体结构件的应用范围。本发明实施例还提供了一种陶瓷壳体结构件的制备方法,简单易行,适于大规模生产和应用。
Description
技术领域
本发明涉及陶瓷产品结构,特别是涉及一种陶瓷壳体结构件及其制备方法。
背景技术
随着智能手机等数码产品的快速发展,研发独具特色的数码产品结构材料成为抢占商业卖点的一个重要方向。陶瓷作为一类常用的结构材料受到了业界的关注。可理解地,壳体材料需要具备一定的抗摔性能,同时还应该是低成本的,易于制备的。而陶瓷材料因其脆性较大而易在与其它物体碰撞时被损坏,这个缺点制约着陶瓷材料作为壳体的应用。
发明内容
有鉴于此,本发明实施例第一方面提供了一种陶瓷壳体结构件,用以解决现有技术中陶瓷壳体不抗摔的问题。本发明实施例第二方面提供了一种陶瓷壳体结构件的制备方法。
第一方面,本发明实施例提供了一种陶瓷壳体结构件,包括陶瓷壳体和边框组,所述陶瓷壳体包括陶瓷平板和部分嵌设在所述陶瓷平板内的陶瓷突出件,所述边框通过所述陶瓷突出件沿所述陶瓷平板的厚度方向与所述陶瓷平板贴合在一起,所述边框的上表面与下表面分别与所述陶瓷壳体的上表面和下表面齐平,所述陶瓷平板的材质为致密度在90%以上的致密陶瓷材料,所述陶瓷突出件的材质为多孔陶瓷材料,所述边框的材质为合金、金属基复合材料或塑料。
优选地,所述多孔陶瓷材料的孔隙率为20~60%,孔洞大小为1~1200微米。
优选地,所述致密陶瓷材料为氧化铝基陶瓷或氧化锆基陶瓷,所述氧化铝和氧化锆晶粒大小为微米级或纳米级。
优选地,所述多孔陶瓷材料为氧化铝基陶瓷或氧化锆基陶瓷,所述氧化铝和氧化锆晶粒大小为微米级或纳米级。
优选地,所述陶瓷突出件部分嵌设在所述边框内。
本发明实施例第一方面提供了一种陶瓷壳体结构件,包括陶瓷壳体和边框,边框能够保护陶瓷壳体的边缘不直接与其他物质发生碰撞,从而降低陶瓷壳体因硬物撞击而破碎的可能性,陶瓷壳体中的陶瓷突出件为具有高孔隙率的多孔陶瓷材料,能够增加陶瓷壳体与边框之间的结合力,从而提高本发明陶瓷壳体结构件的整体抗摔能力,扩大了陶瓷壳体结构件的应用范围。
第二方面,本发明实施例提供了一种陶瓷壳体结构件的制备方法,包括以下步骤:
取陶瓷粉料,球磨制得致密陶瓷浆料;另取陶瓷粉料,加入造孔剂,球磨制得多孔陶瓷浆料;将所述致密陶瓷浆料和多孔陶瓷浆料分别干燥后造粒,并分别填充至陶瓷壳体模具的陶瓷平板对应槽和陶瓷突出件对应槽中,制胚成型得陶瓷胚;再将所得陶瓷胚烧结后制得陶瓷壳体,所述陶瓷壳体包括致密度在90%以上的致密陶瓷材料的陶瓷平板和多孔陶瓷材料的陶瓷突出件,所述陶瓷突出件部分嵌设在所述陶瓷平板内;
取边框原料和所述陶瓷壳体,通过一体化成型的方法制得陶瓷壳体结构件,所述边框通过所述陶瓷突出件沿所述陶瓷平板的厚度方向与所述陶瓷平板贴合在一起,所述边框的上表面与下表面分别与所述陶瓷壳体的上表面和下表面齐平,所述边框的材质为合金、金属基复合材料或塑料。
优选地,当所述边框的材质为合金时,所述一体化成型的方法为压铸成型,具体操作为:将陶瓷壳体放入陶瓷壳体结构件压铸模具腔中,用液态或半固态的合金原料压铸成型,即得陶瓷壳体结构件。
优选地,所述造孔剂选自碳粉、石墨、木粉、焦碳、石蜡和塑料粉中的一种或多种。
优选地,所述造孔剂占所述多孔陶瓷浆料总体积的20~60%。
优选地,所述陶瓷粉料主要成分为氧化铝或氧化锆,所述氧化铝和氧化锆晶粒粒度为微米级或纳米级。
优选地,所述陶瓷突出件部分嵌设在所述边框内。
本发明实施例第二方面提供的一种陶瓷壳体结构件的制备方法,简单易行,适于大规模生产和应用。
本发明实施例的优点将会在下面的说明书中部分阐明,一部分根据说明书是显而易见的,或者可以通过本发明实施例的实施而获知。
附图说明
图1为本发明实施例一制得的陶瓷壳体结构件的结构示意图;
图2为本发明实施例一制得的陶瓷壳体的主视图;
图3为本发明实施例一制得的陶瓷壳体的右视图;
图4为本发明实施例一制得的陶瓷壳体的俯视图;
图5为本发明实施例二制得的陶瓷壳体结构件的结构示意图;
图6为本发明实施例二制得的陶瓷壳体的主视图;
图7为本发明实施例二制得的陶瓷壳体的右视图;
图8为本发明实施例二制得的陶瓷壳体的俯视图。
具体实施方式
以下所述是本发明实施例的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明实施例原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明实施例的保护范围。
本发明实施例第一方面提供了一种陶瓷壳体结构件,用以解决现有技术中陶瓷壳体不抗摔的问题。本发明实施例第二方面提供了一种陶瓷壳体结构件的制备方法。
第一方面,本发明实施例提供了一种陶瓷壳体结构件,包括陶瓷壳体和边框,所述陶瓷壳体包括陶瓷平板和部分嵌设在所述陶瓷平板内的陶瓷突出件,所述边框通过所述陶瓷突出件沿所述陶瓷平板的厚度方向与所述陶瓷平板贴合在一起,所述边框的上表面与下表面分别与所述陶瓷壳体的上表面和下表面齐平,所述陶瓷平板的材质为致密度在90%以上的致密陶瓷材料,所述陶瓷突出件的材质为多孔陶瓷材料,所述边框的材质为合金、金属基复合材料或塑料。
优选地,所述致密陶瓷材料为氧化铝基陶瓷或氧化锆基陶瓷,所述氧化铝和氧化锆晶粒大小为微米级或纳米级。
优选地,所述多孔陶瓷材料为氧化铝基陶瓷或氧化锆基陶瓷,所述氧化铝和氧化锆晶粒大小为微米级或纳米级。
其中,陶瓷壳体与边框紧密地结合在一起,两者组成一完整的陶瓷壳体结构件。边框的形状不限,以实际需要为准,通常包括弯角结构。边框的材质可以为合金、金属基复合材料或塑料。所述合金可以为铝合金,镁合金,锌合金等,优选为铝合金。
陶瓷平板的形状和厚度不限,可以依据产品的实际需要制作成各种形状。优选地,所述陶瓷平板为矩形平板。陶瓷平板的上下表面具有一定的平面度。
陶瓷突出件的形状、位置不限,可以部分嵌入设置在陶瓷平板的各边缘侧面或下表面等可与边框相接触的位置,所述可与边框相接触包括陶瓷突出件突出陶瓷平板的部分可与边框贴合在一起或可部分或完全嵌设在边框内,其作用在于利用陶瓷突出件的多孔陶瓷材料的高孔隙率,使边框材质能充斥在孔洞中,从而增强陶瓷平板和边框之间的结合力。可理解地,为了增强结合力,陶瓷突出件突出陶瓷平板的部分应尽可能多地与边框相接触。优选地,所述陶瓷突出件部分嵌设在所述边框内。
优选地,所述多孔陶瓷材料的孔隙率为20~60%,孔洞大小为1~1200微米。多孔陶瓷,蜂窝陶瓷,孔梯度陶瓷,泡沫陶瓷等均属于本发明实施例多孔陶瓷材料的定义内。
所述陶瓷突出件的设置数量不限,可根据实际需要设定多个,可对称或非对称设置。
所述致密陶瓷材料和多孔陶瓷材料的主要成分不限。优选地,所述致密陶瓷材料和所述多孔陶瓷材料为氧化铝基陶瓷或氧化锆基陶瓷,所述氧化铝和氧化锆晶粒大小为微米级或纳米级。其中,氧化铝基陶瓷即氧化铝掺杂其它氧化物形成的陶瓷,氧化锆基陶瓷即氧化锆掺杂其它氧化物形成的陶瓷,这些其它氧化物可以选自但不限于氧化钇和氧化镁,陶瓷壳体的材质可以同时含有氧化铝和氧化锆。
陶瓷平板的颜色不限,可以为由氧化铝或氧化锆为主的白色,或通过杂质和色剂等物质掺入形成的其它颜色(如黑色、蓝色或多色等),或在特定气氛中烧结所形成的颜色。
本发明实施例第一方面提供了一种陶瓷壳体结构件,包括陶瓷壳体和边框,边框能够保护陶瓷壳体的边缘不直接与其他物质发生碰撞,从而降低陶瓷壳体因硬物撞击而破碎的可能性,陶瓷壳体中的陶瓷突出件为具有高孔隙率的多孔陶瓷材料,能够增加陶瓷壳体与边框之间的结合力,从而提高本发明陶瓷壳体结构件的整体抗摔能力,扩大了陶瓷壳体结构件的应用范围。
第二方面,本发明实施例提供了一种陶瓷壳体结构件的制备方法,包括以下步骤:
取陶瓷粉料,球磨制得致密陶瓷浆料;另取陶瓷粉料,加入造孔剂,球磨制得多孔陶瓷浆料;将所述致密陶瓷浆料和多孔陶瓷浆料分别干燥后造粒,并分别填充至陶瓷壳体模具的陶瓷平板对应槽和陶瓷突出件对应槽中,制胚成型得陶瓷胚;再将所得陶瓷胚烧结后制得陶瓷壳体,所述陶瓷壳体包括致密度在90%以上的致密陶瓷材料的陶瓷平板和多孔陶瓷材料的陶瓷突出件,所述陶瓷突出件部分嵌设在所述陶瓷平板内;
取边框原料和所述陶瓷壳体,通过一体化成型的方法制得陶瓷壳体结构件,所述边框通过所述陶瓷突出件沿所述陶瓷平板的厚度方向与所述陶瓷平板贴合在一起,所述边框的上表面与下表面分别与所述陶瓷壳体的上表面和下表面齐平,所述边框的材质为合金、金属基复合材料或塑料。
优选地,所述造孔剂选自碳粉、石墨、木粉、焦碳、石蜡和塑料粉中的一种或多种。
优选地,所述造孔剂占所述多孔陶瓷浆料总体积的20~60%。
优选地,所述陶瓷突出件部分嵌设在所述边框内。
其中,陶瓷粉料的组成可应不同的产品性能要求进行调整,无特别限定。陶瓷粉料的主要成分不限。优选地,所述陶瓷粉料主要成分为氧化铝或氧化锆,晶粒粒度为微米级或纳米级。本发明实施例将陶瓷平板作为外观件,因此,为了得到外观为不同颜色的陶瓷平板,可在陶瓷粉料中掺杂其它氧化物形成致密陶瓷材料,这些其它氧化物可以选自但不限于氧化钇和氧化镁,还可通过加入色剂或在特定气氛中烧结获得外观为不同颜色的陶瓷平板,陶瓷粉料可以同时包括氧化铝和氧化锆。
优选地,球磨过程中加入聚乙烯醇或锆干凝胶作为粘结剂。优选地,粘结剂的加入量为陶瓷粉料质量的1~15%。
优选地,球磨过程中还可加入蒸馏水或乙醇为介质,以及加入油酸为分散剂,加入硬脂酸为助磨剂。
优选地,所述造粒为制得过20~80目筛的颗粒。
制胚成型的具体方式不限,可以为干压成型,模压成型,等静压成型,热压铸成型,注浆成型,挤压成型,轧模成型,注射成型或原位凝固成型,优选为干压成型。优选地,所述干压成型的压力为15~60MPa。
成型烧结的具体方式不限,可以为常压烧结,热压烧结,等静压烧结,反应烧结,气氛烧结,电火花烧结或放电等离子烧结,优选为热压烧结。由于烧结成型的陶瓷壳体在后续操作中将会被放入模具中按压,如果不平,会导致碎裂,因此烧结过程中必须保证所制备的陶瓷壳体的上下表面的平面度,一般采用加压烧结来保证平整度。
烧结过程的具体条件依据陶瓷粉料的成分进行设定。当所述陶瓷粉料的主要成分为氧化铝时,烧结条件优选为:在150~450℃以1℃/min的速率升温,在700~950℃时以2℃/min的速率升温,升温至1400~1600℃后,保温2~4小时,然后自然降温冷却至室温。当所述陶瓷粉料的主要成分为氧化锆时,烧结条件优选为:升温至600~700℃保温2小时,然后缓慢升至1600℃保温2小时,然后自然降温冷却至室温。
陶瓷平板的形状和厚度不限,可以依据产品的实际需要制作成各种形状。优选地,所述陶瓷平板为矩形平板。陶瓷平板的上下表面具有一定的平面度。
陶瓷突出件的形状、位置不限,可以部分嵌入设置在陶瓷平板的各边缘侧面或下表面等可与边框相接触的位置,所述可与边框相接触包括陶瓷突出件突出陶瓷平板的部分可与边框贴合在一起或可部分或完全嵌设在边框内,其作用在于利用陶瓷突出件的多孔陶瓷材料的高孔隙率,使边框材质能充斥在孔洞中,从而增强陶瓷平板和边框之间的结合力。可理解地,为了增强结合力,陶瓷突出件突出陶瓷平板的部分应尽可能多地与边框相接触。优选地,所述陶瓷突出件部分嵌设在所述边框内。
一体化成型的方法包括注塑成型、注射成型、铸造成型和压铸成型等常规一体化生产的方法,制得的陶瓷壳体结构件中陶瓷壳体紧密地嵌在边框内。边框的形状不限,以实际需要为准,通常包括弯角结构。边框的材质可以为合金、金属基复合材料或塑料。所述合金可以为铝合金,镁合金,锌合金等,优选为铝合金。
优选地,当所述边框的材质为合金时,所述一体化成型的方法为压铸成型,具体操作为:将陶瓷壳体放入陶瓷壳体结构件压铸模具腔中,用液态或半固态的合金原料压铸成型,即得陶瓷壳体结构件。
由于陶瓷壳体为多孔陶瓷材料与致密陶瓷材料联合成胚形成的复合体,陶瓷突出件为多孔陶瓷材料,在一体化成型的过程中,液态或熔融状态的合金原料将渗入多孔陶瓷材料中的孔洞中,从而使边框与陶瓷壳体紧密结合,最终形成一体化陶瓷壳体结构件。
本发明实施例第二方面提供的一种陶瓷壳体结构件的制备方法,简单易行,适于大规模生产和应用。
实施例一
一种陶瓷壳体结构件的制备方法,包括以下步骤:
(1)取纯度为99%,粒度为0.5~5微米的氧化铝陶瓷粉料;加入氧化铝陶瓷粉料质量5%的锆干凝胶,以及加入碳粉作为造孔剂;球磨2小时混合均匀制得多孔陶瓷浆料;所述碳粉为多孔陶瓷浆料总体积的20%;
(2)另取如下组分及重量百分比的陶瓷粉料:Al2O3,96%,纯度99%,粒度0.3~3微米;MgO,3%;纯度99%,粒度0.3~3微米;Y2O3,1%;纯度98%,粒度0.3~3微米;加入陶瓷粉料质量1.5%的聚乙烯醇;球磨2小时混合均匀制得致密陶瓷浆料;
(3)提供陶瓷壳体模具,将所得致密陶瓷浆料和多孔陶瓷浆料分别干燥后造粒制得过20目~80目的颗粒,并分别填充至陶瓷壳体模具的陶瓷平板对应槽和陶瓷突出件对应槽中,在40MPa下干压成型得陶瓷胚;
(4)将制得的陶瓷胚放入烧结炉中,在150~450以1℃/min的速率升温,在700~950℃时以2℃/min的速率升温至1600℃,保温4小时,制得陶瓷壳体,烧结过程中对陶瓷胚上下表面进行加压以增加平整度,使陶瓷壳体上下表面具有一定的平面度,制得的白色陶瓷壳体包括致密陶瓷材料的陶瓷平板和多孔陶瓷材料的陶瓷突出件;所述陶瓷突出件部分嵌设在所述陶瓷平板内;
(5)取所得陶瓷壳体放入陶瓷壳体结构件压铸模具腔中,用液态铝合金原料压铸成型,即得陶瓷壳体结构件。
图1为本发明实施例一制得的陶瓷壳体结构件的结构示意图,图2为本发明实施例一制得的陶瓷壳体的主视图,图3为本发明实施例一制得的陶瓷壳体的右视图,图4为本发明实施例一制得的陶瓷壳体的俯视图。结合图1~4可以看出,所述陶瓷壳体10包括陶瓷平板11和部分嵌设在陶瓷平板11内的陶瓷突出件12。本实施例中,所述陶瓷平板11为矩形平板,陶瓷突出件12设置数量为两个,垂直于陶瓷平板11对称设置,所述陶瓷平板11与铝合金边框13通过陶瓷突出件12贴合在一起,本实施例中,陶瓷突出件12突出陶瓷平板11的部分与边框13沿陶瓷平板11的厚度方向贴合在一起。陶瓷平板11的长度L1等于100mm,宽度L2等于60mm,高度L3等于0.8mm,两个陶瓷突出件12垂直对称设置在陶瓷平板11的下表面边缘,陶瓷突出件12为方柱状结构,陶瓷突出件12的长度与陶瓷平板11的长度一致,宽度L4为1.2mm,垂直于陶瓷平板11方向的高度L5为1.2mm,陶瓷突出件12的内部具有大量孔径大小为1~1200微米的孔洞结构(图中未示),孔洞内填充有铝合金材料。陶瓷壳体10的上下表面分别与铝合金边框13的上下表面齐平,即陶瓷壳体10的高度L6与铝合金边框13的高度相等,均为1.4mm。
实施例二
一种陶瓷壳体结构件的制备方法,包括以下步骤:
(1)取粒径0.5~3微米,氧化钇质量占7%的氧化钇增韧的氧化锆陶瓷粉料,即7YSZ料,加入粒径为3~6微米的石墨,再加入7YSZ料质量5%的聚乙烯醇的水溶液;球磨2小时混合均匀制得多孔陶瓷浆料;石墨为多孔陶瓷浆料总体积的40%;
(2)另取粒径0.5~3微米,氧化钇质量占7%的氧化钇增韧的氧化锆陶瓷粉料,即7YSZ料,加入钴黑色料(Co-Cr-Fe-Ni氧化物高温合成)作为陶瓷粉料,其中钴黑色料占陶瓷粉料总质量的5%;加入陶瓷粉料质量5%的聚乙烯醇的水溶液;球磨2小时混合均匀制得致密陶瓷浆料;
(3)提供陶瓷壳体模具,将所得致密陶瓷浆料和多孔陶瓷浆料分别干燥后造粒制得过20目~80目的颗粒,并分别填充至陶瓷壳体模具的陶瓷平板对应槽和陶瓷突出件对应槽中,在60MPa下干压成型得陶瓷胚;
(4)将制得的陶瓷胚放入烧结炉中,升温至650℃,保温2h,再以2℃/min的速率升温至1600℃,保温2h,制得黑色陶瓷壳体,烧结过程中对陶瓷胚上下表面进行加压以增加平整度,使陶瓷壳体上下表面具有一定的平面度,制得的白色陶瓷壳体包括致密陶瓷材料的陶瓷平板和多孔陶瓷材料的陶瓷突出件;所述陶瓷突出件部分嵌设在所述陶瓷平板内;
(5)取所得陶瓷壳体放入陶瓷壳体结构件压铸模具腔中,用液态铝合金原料压铸成型,即得陶瓷壳体结构件。
图5为本发明实施例二制得的陶瓷壳体结构件的结构示意图,图6为本发明实施例二制得的陶瓷壳体的主视图,图7为本发明实施例二制得的陶瓷壳体的右视图,图8为本发明实施例二制得的陶瓷壳体的俯视图。结合图5~8可以看出,所述陶瓷壳体20包括陶瓷平板21和部分嵌设在陶瓷平板21内的陶瓷突出件22。本实施例中,所述陶瓷平板21为矩形平板,陶瓷突出件22设置数量为12个,垂直于陶瓷平板21对称设置,所述陶瓷平板21与铝合金边框23通过陶瓷突出件22贴合在一起,本实施例中,陶瓷突出件22突出陶瓷平板21的部分与边框23沿陶瓷平板21的厚度方向贴合在一起。陶瓷平板21的长度L1’等于100mm,宽度L2’等于60mm,高度L3’等于0.8mm,12个陶瓷突出件22对称间隔设置在陶瓷平板21的下表面边缘,为方柱状结构,陶瓷突出件22的宽度L4’为1.2mm,垂直于陶瓷平板21方向的高度L5’为1.2mm,陶瓷突出件22的内部具有大量孔径大小为1~1200微米的孔洞结构(图中未示),孔洞内填充有铝合金材料。陶瓷壳体20的上下表面分别与铝合金边框23的上下表面齐平,即陶瓷壳体20的高度L6’与铝合金边框23的高度相等,均为1.4mm。
Claims (11)
1.一种陶瓷壳体结构件,其特征在于,包括陶瓷壳体和边框,所述陶瓷壳体包括陶瓷平板和部分嵌设在所述陶瓷平板内的陶瓷突出件,所述边框通过所述陶瓷突出件沿所述陶瓷平板的厚度方向与所述陶瓷平板贴合在一起,所述边框的上表面与下表面分别与所述陶瓷壳体的上表面和下表面齐平,所述陶瓷突出件部分嵌入设置在所述陶瓷平板内与所述边框相接触的位置,所述陶瓷平板的材质为致密度在90%以上的致密陶瓷材料,所述陶瓷突出件的材质为多孔陶瓷材料,所述边框的材质为合金、金属基复合材料或塑料。
2.如权利要求1所述的一种陶瓷壳体结构件,其特征在于,所述多孔陶瓷材料的孔隙率为20~60%,孔洞大小为1~1200微米。
3.如权利要求1所述的一种陶瓷壳体结构件,其特征在于,所述致密陶瓷材料为氧化铝基陶瓷或氧化锆基陶瓷,所述氧化铝和氧化锆晶粒大小为微米级或纳米级。
4.如权利要求1所述的一种陶瓷壳体结构件,其特征在于,所述多孔陶瓷材料为氧化铝基陶瓷或氧化锆基陶瓷,所述氧化铝和氧化锆晶粒大小为微米级或纳米级。
5.如权利要求1所述的一种陶瓷壳体结构件,其特征在于,所述陶瓷突出件部分嵌设在所述边框内。
6.一种陶瓷壳体结构件的制备方法,其特征在于,包括以下步骤:
取陶瓷粉料,球磨制得致密陶瓷浆料;另取陶瓷粉料,加入造孔剂,球磨制得多孔陶瓷浆料;将所述致密陶瓷浆料和多孔陶瓷浆料分别干燥后造粒,并分别填充至陶瓷壳体模具的陶瓷平板对应槽和陶瓷突出件对应槽中,制胚成型得陶瓷胚;再将所得陶瓷胚烧结后制得陶瓷壳体,所述陶瓷壳体包括致密度在90%以上的致密陶瓷材料的陶瓷平板和多孔陶瓷材料的陶瓷突出件,所述陶瓷突出件部分嵌设在所述陶瓷平板内;
取边框原料和所述陶瓷壳体,通过一体化成型的方法制得陶瓷壳体结构件,所述边框通过所述陶瓷突出件沿所述陶瓷平板的厚度方向与所述陶瓷平板贴合在一起,所述边框的上表面与下表面分别与所述陶瓷壳体的上表面和下表面齐平,所述陶瓷突出件部分嵌入设置在所述陶瓷平板内与所述边框相接触的位置,所述边框的材质为合金、金属基复合材料或塑料。
7.如权利要求6所述的陶瓷壳体结构件的制备方法,其特征在于,当所述边框的材质为合金时,所述一体化成型的方法为压铸成型,具体操作为:将陶瓷壳体放入陶瓷壳体结构件压铸模具腔中,用液态或半固态的合金原料压铸成型,即得陶瓷壳体结构件。
8.如权利要求6所述的陶瓷壳体结构件的制备方法,其特征在于,所述造孔剂选自碳粉、石墨、木粉、焦碳、石蜡和塑料粉中的一种或多种。
9.如权利要求6所述的陶瓷壳体结构件的制备方法,其特征在于,所述造孔剂占所述多孔陶瓷浆料总体积的20~60%。
10.如权利要求6所述的陶瓷壳体结构件的制备方法,其特征在于,所述陶瓷粉料主要成分为氧化铝或氧化锆,所述氧化铝和氧化锆晶粒粒度为微米级或纳米级。
11.如权利要求6所述的陶瓷壳体结构件的制备方法,其特征在于,所述陶瓷突出件部分嵌设在所述边框内。
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