CN108395250A - 陶瓷与金属结合的手机壳的制造方法 - Google Patents

陶瓷与金属结合的手机壳的制造方法 Download PDF

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CN108395250A
CN108395250A CN201810127737.8A CN201810127737A CN108395250A CN 108395250 A CN108395250 A CN 108395250A CN 201810127737 A CN201810127737 A CN 201810127737A CN 108395250 A CN108395250 A CN 108395250A
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苏亚帅
李敏之
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J-Tech Cnc Technology Co Ltd
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Abstract

本发明陶瓷与金属结合的手机壳的制造方法，包括以下步骤：（1）将陶瓷粉静压得到陶瓷生坯；（2）将陶瓷生坯放入模具中，将金属粉末注射到模具中使金属粉末与陶瓷生坯结合得到手机壳坯件，（3）将手机壳坯件在惰性气体或真空环境下加热至300‑450℃并保温2‑5个小时；（4）将手机壳坯件在惰性气体或真空环境下加热至1200‑1300℃进行烧结，烧结2‑7小时后得到手机壳；（5）将烧结后的手机壳进行CNC外形整形、砂轮精磨、抛光机抛光后得到成品。本发明通过陶瓷粉末和金属粉末制作成陶瓷和金属结合的手机壳，使手机壳可以在容易摔碎的位置采用金属材质，在容易屏蔽信号的位置采用陶瓷材质。陶瓷粉末和金属粉末经过同时烧结成型，工艺简化。

Description

陶瓷与金属结合的手机壳的制造方法
技术领域
本发明涉及手机外壳的制造技术，尤其是涉及的是陶瓷与金属结合的手机壳的制造方法。
背景技术
目前，现有的手机壳的整个壳体主要是金属或非金属材料，大多数金属材料的延伸率δ>5%，为塑性材料，具有良好的抗冲击性，如常温静载的不锈钢、铝等；而大多数非金属材料的延伸率δ≤5%，为脆性材料，在外力作用下仅产生很小的变形容易发生破坏断裂，如常温静载下的玻璃、陶瓷等。金属材料的手机壳或手机边框会造成手机在5G通讯时产生信号屏蔽，非金属材料的手机壳则在跌落时四个角容易碎裂。
发明内容
本发明的目的在于克服上述不足，提供一种信号好、不容易跌碎的陶瓷与金属结合的手机壳的制造方法。
为实现上述目的，本发明的技术解决方案是：陶瓷与金属结合的手机壳的制造方法，包括以下步骤：
（1）将陶瓷粉静压得到陶瓷生坯；陶瓷粉的成分为按重量比例的粒度为0.1-3μm的碳化硅粉80-90份、粒度为0.1-3μm的钇铝石榴石粉5-10份、TiO2粉0.5-1.6份、聚乙烯醇1-3份、聚丙烯铵0.5-1.5份；陶瓷粉的各物料混合均匀后加水制成的浆料注入用于生产陶瓷生坯的模具进行静压；
（2）将陶瓷生坯放入模具中，将金属粉末注射到模具中使金属粉末与陶瓷生坯结合得到手机壳坯件，金属粉末由按重量份数的不锈钢粉末90-95份、石蜡2-6份、高密度聚乙烯2-6份、硬脂酸0.1-0.7份混合均匀形成；
（3）将手机壳坯件在惰性气体或真空环境下加热至300-450℃并保温2-5个小时；
（4）将手机壳坯件在惰性气体或真空环境下加热至1200-1300℃进行烧结，烧结2-7小时后得到手机壳；
（5）将烧结后的手机壳进行CNC外形整形、砂轮精磨、抛光机抛光后得到成品。
优选的，步骤（3）中的加热的升温速率为10-15℃/分钟，步骤（4）加热的升温速率为3-8℃/分钟。
优选的，步骤（1）的陶瓷生坯包括底板和分别设于底板四周的四块侧板，陶瓷生坯的四角均设有缺口，步骤（2）中的金属粉末注射到陶瓷生坯的四角缺口处。
优选的，步骤（2）中的金属粉末的制备方法为不锈钢粉末、石蜡、高密度聚乙烯、硬脂酸在120-160℃的温度下混合2-3小时，注射时模具的温度为50-80℃。
优选的，陶瓷粉为氧化锆陶瓷粉。
通过采用上述的技术方案，本发明的有益效果是：本发明通过陶瓷粉末和金属粉末制作成陶瓷和金属结合的手机壳，使手机壳可以在容易摔碎的位置采用金属材质，在容易屏蔽信号的位置采用陶瓷材质。陶瓷粉末和金属粉末经过同时烧结成型，工艺简化。
具体实施方式
以下具体实施例来进一步说明本发明。
实施例1：
本发明陶瓷与金属结合的手机壳的制造方法，包括以下步骤：
（1）将陶瓷粉静压得到陶瓷生坯；陶瓷粉的成分为按重量比例的粒度为3μm的碳化硅粉90份、粒度为3μm的钇铝石榴石粉10份、TiO2粉1.6份、聚乙烯醇3份、聚丙烯铵1.5份；陶瓷粉的各物料混合均匀后加水制成的浆料注入用于生产陶瓷生坯的模具进行静压；陶瓷生坯包括底板和分别设于底板四周的四块侧板，陶瓷生坯的四角均设有缺口。
（2）将陶瓷生坯放入模具中，将金属粉末注射到模具中使金属粉末与陶瓷生坯结合得到手机壳坯件，金属粉末注射到陶瓷生坯的四角缺口处，将缺口补全。金属粉末由按重量份数的不锈钢粉末95份、石蜡6份、高密度聚乙烯6份、硬脂酸0.7份组成，金属粉末在120℃的温度下混合2小时后，注射入温度为80℃模具内。
（3）将手机壳坯件在惰性气体或真空环境下加热，加热的升温速率为15℃/分钟，加热至450℃后，保温5个小时。
（4）将手机壳坯件在惰性气体或真空环境下加热至1300℃进行烧结，烧结7小时后得到手机壳。
（5）将烧结后的手机壳进行CNC外形整形、砂轮精磨、抛光机抛光后得到成品。
实施例2：
陶瓷与金属结合的手机壳的制造方法，包括以下步骤：
（1）将陶瓷粉静压得到陶瓷生坯；陶瓷粉的成分为按重量比例的粒度为0.1μm的碳化硅粉80份、粒度为0.1μm的钇铝石榴石粉5份、TiO2粉0.5份、聚乙烯醇1份、聚丙烯铵0.5份；陶瓷粉的各物料混合均匀后加水制成的浆料注入用于生产陶瓷生坯的模具进行静压；
（2）将陶瓷生坯放入模具中，将金属粉末注射到模具中使金属粉末与陶瓷生坯结合得到手机壳坯件，金属粉末由按重量份数的不锈钢粉末90份、石蜡2份、高密度聚乙烯2份、硬脂酸0.1份混合均匀形成；
（3）将手机壳坯件在惰性气体或真空环境下加热至300℃并保温2个小时；
（4）将手机壳坯件在惰性气体或真空环境下加热至1200℃进行烧结，烧结2小时后得到手机壳；
（5）将烧结后的手机壳进行CNC外形整形、砂轮精磨、抛光机抛光后得到成品。
实施例3：
陶瓷与金属结合的手机壳的制造方法，包括以下步骤：
（1）将陶瓷粉静压得到陶瓷生坯；陶瓷粉为氧化锆陶瓷粉；
（2）将陶瓷生坯放入模具中，将金属粉末注射到模具中使金属粉末与陶瓷生坯结合得到手机壳坯件，金属粉末由按重量份数的不锈钢粉末92份、石蜡5份、高密度聚乙烯5份、硬脂酸0.5份混合均匀形成；金属粉末的制备方法为不锈钢粉末、石蜡、高密度聚乙烯、硬脂酸在120-160℃的温度下混合2-3小时，注射时模具的温度为50-80℃；
（3）将手机壳坯件在惰性气体或真空环境下加热至320℃并保温3个小时；加热的升温速率为10-15℃/分钟；
（4）将手机壳坯件在惰性气体或真空环境下加热至1260℃进行烧结，烧结5小时后得到手机壳；加热的升温速率为3-8℃/分钟
（5）将烧结后的手机壳进行CNC外形整形、砂轮精磨、抛光机抛光后得到成品。
以上所述的，仅为本发明的较佳实施例而已，不能限定本实用实施的范围，凡是依本发明申请专利范围所作的均等变化与装饰，皆应仍属于本发明涵盖的范围内。

Claims (5)

1.陶瓷与金属结合的手机壳的制造方法，包括以下步骤：
（1）将陶瓷粉静压得到陶瓷生坯；
（2）将陶瓷生坯放入模具中，将金属粉末注射到模具中使金属粉末与陶瓷生坯结合得到手机壳坯件，金属粉末由按重量份数的不锈钢粉末90-95份、石蜡2-6份、高密度聚乙烯2-6份、硬脂酸0.1-0.7份混合均匀形成；
（3）将手机壳坯件在惰性气体或真空环境下加热至300-450℃并保温2-5个小时；
（4）将手机壳坯件在惰性气体或真空环境下加热至1200-1300℃进行烧结，烧结2-7小时后得到手机壳；
（5）将烧结后的手机壳进行CNC外形整形、砂轮精磨、抛光机抛光后得到成品。
2.根据权利要求1所述的陶瓷与金属结合的手机壳的制造方法，其特征在于：步骤（3）中的加热的升温速率为10-15℃/分钟，步骤（4）加热的升温速率为3-8℃/分钟。
3.根据权利要求1所述的陶瓷与金属结合的手机壳的制造方法，其特征在于：步骤（1）的陶瓷生坯包括底板和分别设于底板四周的四块侧板，陶瓷生坯的四角均设有缺口，步骤（2）中的金属粉末注射到陶瓷生坯的四角缺口处。
4.根据权利要求1所述的陶瓷与金属结合的手机壳的制造方法，其特征在于：步骤（2）中的金属粉末的制备方法为不锈钢粉末、石蜡、高密度聚乙烯、硬脂酸在120-160℃的温度下混合2-3小时，注射时模具的温度为50-80℃。
5.根据权利要求1所述的陶瓷与金属结合的手机壳的制造方法，其特征在于：陶瓷粉为氧化锆陶瓷粉。
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Citations (3)

* Cited by examiner, † Cited by third party
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CN104080285A (zh) * 2013-03-25 2014-10-01 华为技术有限公司 一种陶瓷壳体结构件及其制备方法
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