CN104079260B - 振动元件、振子、振荡器、电子设备以及移动体 - Google Patents
振动元件、振子、振荡器、电子设备以及移动体 Download PDFInfo
- Publication number
- CN104079260B CN104079260B CN201410104030.7A CN201410104030A CN104079260B CN 104079260 B CN104079260 B CN 104079260B CN 201410104030 A CN201410104030 A CN 201410104030A CN 104079260 B CN104079260 B CN 104079260B
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- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000010453 quartz Substances 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- 230000010355 oscillation Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 2
- 230000001133 acceleration Effects 0.000 abstract description 36
- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 description 41
- 239000000463 material Substances 0.000 description 20
- 230000005284 excitation Effects 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 238000000605 extraction Methods 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/202—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement
- H10N30/2023—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement having polygonal or rectangular shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/208—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using shear or torsion displacement, e.g. d15 type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013075014A JP6107330B2 (ja) | 2013-03-29 | 2013-03-29 | 振動素子、振動子、発振器、電子機器および移動体 |
| JP2013-075014 | 2013-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104079260A CN104079260A (zh) | 2014-10-01 |
| CN104079260B true CN104079260B (zh) | 2018-04-03 |
Family
ID=51600339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410104030.7A Active CN104079260B (zh) | 2013-03-29 | 2014-03-20 | 振动元件、振子、振荡器、电子设备以及移动体 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9035709B2 (https=) |
| JP (1) | JP6107330B2 (https=) |
| CN (1) | CN104079260B (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6051885B2 (ja) * | 2013-01-18 | 2016-12-27 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器および移動体 |
| JP2014241573A (ja) * | 2013-01-29 | 2014-12-25 | 日本電波工業株式会社 | 水晶振動子、振動子パッケージ及び水晶発振器 |
| JP2014146944A (ja) * | 2013-01-29 | 2014-08-14 | Nippon Dempa Kogyo Co Ltd | 水晶振動子、振動子パッケージ及び発振器 |
| JP6435606B2 (ja) * | 2013-03-29 | 2018-12-12 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器および移動体 |
| JP6107330B2 (ja) * | 2013-03-29 | 2017-04-05 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器および移動体 |
| US9762206B2 (en) * | 2014-02-07 | 2017-09-12 | Samsung Electro-Mechanics Co., Ltd. | AT-cut quartz crystal vibrator with a long side along the X-axis direction |
| USD760230S1 (en) * | 2014-09-16 | 2016-06-28 | Daishinku Corporation | Piezoelectric vibration device |
| JP6578708B2 (ja) * | 2015-04-02 | 2019-09-25 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器および移動体 |
| JP2017212595A (ja) * | 2016-05-25 | 2017-11-30 | 日本電波工業株式会社 | 圧電デバイス |
| JP2020198492A (ja) * | 2019-05-31 | 2020-12-10 | 京セラ株式会社 | 水晶素子、水晶デバイス及び電子機器並びに水晶素子の製造方法 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002198772A (ja) * | 2000-12-27 | 2002-07-12 | Toyo Commun Equip Co Ltd | 高周波圧電デバイス |
| JP2004304448A (ja) * | 2003-03-31 | 2004-10-28 | Kyocera Kinseki Corp | 水晶振動板 |
| JP2006005676A (ja) * | 2004-06-17 | 2006-01-05 | Epson Toyocom Corp | 水晶振動子とその製造方法 |
| US7098574B2 (en) * | 2002-11-08 | 2006-08-29 | Toyo Communication Equipment Co., Ltd. | Piezoelectric resonator and method for manufacturing the same |
| JP2007174562A (ja) * | 2005-12-26 | 2007-07-05 | Epson Toyocom Corp | 圧電振動片および圧電デバイス |
| US8026652B2 (en) * | 2007-12-28 | 2011-09-27 | Epson Toyocom Corporation | Quartz crystal resonator element, quartz crystal device, and method for producing quartz crystal resonator element |
| JP2012253630A (ja) * | 2011-06-03 | 2012-12-20 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013042440A (ja) * | 2011-08-19 | 2013-02-28 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| CN102957396A (zh) * | 2011-08-19 | 2013-03-06 | 精工爱普生株式会社 | 振动元件、振子、电子装置、电子设备及移动体 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435108A (ja) * | 1990-05-25 | 1992-02-05 | Toyo Commun Equip Co Ltd | 超薄板多重モード水晶フィルタ素子 |
| JP2001144578A (ja) | 1999-11-15 | 2001-05-25 | Tokyo Denpa Co Ltd | 圧電振動子 |
| JP2002033640A (ja) * | 2000-07-17 | 2002-01-31 | Toyo Commun Equip Co Ltd | 圧電デバイス |
| JP3952811B2 (ja) | 2002-03-11 | 2007-08-01 | セイコーエプソン株式会社 | 圧電振動片、圧電振動片の製造方法および圧電デバイス |
| JP2004165743A (ja) | 2002-11-08 | 2004-06-10 | Toyo Commun Equip Co Ltd | 圧電基板、圧電振動素子、圧電振動子、圧電発振器、圧電基板ウェハ、圧電基板ウェハの構造、及び製造方法 |
| JP2006203700A (ja) | 2005-01-21 | 2006-08-03 | Epson Toyocom Corp | 圧電基板の製造方法、圧電振動素子、圧電振動子、及び圧電発振器 |
| JP4305542B2 (ja) * | 2006-08-09 | 2009-07-29 | エプソントヨコム株式会社 | Atカット水晶振動片及びその製造方法 |
| US8963402B2 (en) * | 2010-11-30 | 2015-02-24 | Seiko Epson Corporation | Piezoelectric vibrator element, piezoelectric module, and electronic device |
| JP2012186639A (ja) * | 2011-03-04 | 2012-09-27 | Seiko Epson Corp | 圧電振動片、圧電振動子、電子デバイス |
| TW201251157A (en) * | 2011-06-03 | 2012-12-16 | Seiko Epson Corp | Piezoelectric vibration element, manufacturing method for piezoelectric vibration element, piezoelectric vibrator, electronic device, and electronic apparatus |
| CN102957394B (zh) * | 2011-08-18 | 2016-12-21 | 精工爱普生株式会社 | 振动元件、振子、电子装置、电子设备、移动体及振动元件的制造方法 |
| TWI578585B (zh) * | 2012-03-27 | 2017-04-11 | 精工愛普生股份有限公司 | 振動元件、振動器、電子裝置、電子機器及移動體 |
| US9013242B2 (en) * | 2012-03-27 | 2015-04-21 | Seiko Epson Corporation | Resonator element, resonator, electronic device, electronic apparatus, and mobile object |
| JP2013255051A (ja) * | 2012-06-06 | 2013-12-19 | Seiko Epson Corp | 振動素子、振動子、電子デバイス、電子機器及び振動素子の製造方法 |
| JP6107330B2 (ja) * | 2013-03-29 | 2017-04-05 | セイコーエプソン株式会社 | 振動素子、振動子、発振器、電子機器および移動体 |
-
2013
- 2013-03-29 JP JP2013075014A patent/JP6107330B2/ja active Active
-
2014
- 2014-03-20 CN CN201410104030.7A patent/CN104079260B/zh active Active
- 2014-03-20 US US14/220,705 patent/US9035709B2/en active Active
-
2015
- 2015-04-17 US US14/689,371 patent/US20150222243A1/en not_active Abandoned
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002198772A (ja) * | 2000-12-27 | 2002-07-12 | Toyo Commun Equip Co Ltd | 高周波圧電デバイス |
| US7098574B2 (en) * | 2002-11-08 | 2006-08-29 | Toyo Communication Equipment Co., Ltd. | Piezoelectric resonator and method for manufacturing the same |
| JP2004304448A (ja) * | 2003-03-31 | 2004-10-28 | Kyocera Kinseki Corp | 水晶振動板 |
| JP2006005676A (ja) * | 2004-06-17 | 2006-01-05 | Epson Toyocom Corp | 水晶振動子とその製造方法 |
| JP2007174562A (ja) * | 2005-12-26 | 2007-07-05 | Epson Toyocom Corp | 圧電振動片および圧電デバイス |
| US8026652B2 (en) * | 2007-12-28 | 2011-09-27 | Epson Toyocom Corporation | Quartz crystal resonator element, quartz crystal device, and method for producing quartz crystal resonator element |
| JP2012253630A (ja) * | 2011-06-03 | 2012-12-20 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013042440A (ja) * | 2011-08-19 | 2013-02-28 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| CN102957396A (zh) * | 2011-08-19 | 2013-03-06 | 精工爱普生株式会社 | 振动元件、振子、电子装置、电子设备及移动体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6107330B2 (ja) | 2017-04-05 |
| JP2014200026A (ja) | 2014-10-23 |
| US20140292434A1 (en) | 2014-10-02 |
| US20150222243A1 (en) | 2015-08-06 |
| CN104079260A (zh) | 2014-10-01 |
| US9035709B2 (en) | 2015-05-19 |
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