CN104010752A - 银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件 - Google Patents

银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件 Download PDF

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Publication number
CN104010752A
CN104010752A CN201280062600.XA CN201280062600A CN104010752A CN 104010752 A CN104010752 A CN 104010752A CN 201280062600 A CN201280062600 A CN 201280062600A CN 104010752 A CN104010752 A CN 104010752A
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CN
China
Prior art keywords
silver
colored particulate
particulate
liquid
fine particles
Prior art date
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Pending
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CN201280062600.XA
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English (en)
Chinese (zh)
Inventor
岩崎敬介
柿原康男
饭田哲二
大杉峰子
山本洋介
石谷诚治
森井弘子
林一之
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Toda Kogyo Corp
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Toda Kogyo Corp
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Filing date
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Application filed by Toda Kogyo Corp filed Critical Toda Kogyo Corp
Publication of CN104010752A publication Critical patent/CN104010752A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/05—Submicron size particles
    • B22F2304/054—Particle size between 1 and 100 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
CN201280062600.XA 2011-12-28 2012-12-21 银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件 Pending CN104010752A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-289478 2011-12-28
JP2011289478A JP2013139589A (ja) 2011-12-28 2011-12-28 銀微粒子及びその製造法並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
PCT/JP2012/083336 WO2013099818A1 (fr) 2011-12-28 2012-12-21 Particules fines d'argent, procédé de production associé, et pâte conductrice, membrane conductrice et dispositif électrique contenant lesdites particules fines d'argent

Publications (1)

Publication Number Publication Date
CN104010752A true CN104010752A (zh) 2014-08-27

Family

ID=48697303

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280062600.XA Pending CN104010752A (zh) 2011-12-28 2012-12-21 银微粒及其制造方法、以及含有该银微粒的导电性糊、导电性膜和电子器件

Country Status (5)

Country Link
JP (1) JP2013139589A (fr)
KR (1) KR20140113910A (fr)
CN (1) CN104010752A (fr)
TW (1) TW201341087A (fr)
WO (1) WO2013099818A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105761778A (zh) * 2016-04-22 2016-07-13 无锡南理工科技发展有限公司 一种低温固化型导电银浆料的制备方法
CN114054769A (zh) * 2021-11-17 2022-02-18 广东羚光新材料股份有限公司 一种银微粉及其制备方法和应用

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014098186A (ja) * 2012-11-14 2014-05-29 Mitsui Mining & Smelting Co Ltd 銀粉
JP6143627B2 (ja) * 2013-10-03 2017-06-07 住友金属鉱山株式会社 アンモニア回収方法
KR102318523B1 (ko) * 2014-06-11 2021-10-27 반도 카가쿠 가부시키가이샤 은미립자 분산체, 은미립자 및 그 제조방법
TWI548472B (zh) * 2014-07-18 2016-09-11 中國鋼鐵股份有限公司 微米級球形銀粒及其製造方法、導電膠及太陽能電池之電極
JP6263146B2 (ja) * 2015-04-06 2018-01-17 株式会社ノリタケカンパニーリミテド 導電膜付基板、その製造方法、およびポリイミド基板用導電性ペースト
CN107530782A (zh) * 2015-04-17 2018-01-02 阪东化学株式会社 银微粒子组合物
JP6856350B2 (ja) * 2015-10-30 2021-04-07 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP7183504B2 (ja) * 2017-09-06 2022-12-06 住友金属鉱山株式会社 湿式ニッケル粉末の粗大粒子低減方法
CN109465467B (zh) * 2018-12-24 2022-04-12 北京光禾生物科技有限公司 液态纳米银制备方法
WO2023189993A1 (fr) * 2022-03-31 2023-10-05 日清エンジニアリング株式会社 Microparticule d'argent

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101347841A (zh) * 2008-09-03 2009-01-21 西北大学 粒度可控高振实密度银粉的制备方法
JP2009030084A (ja) * 2007-07-25 2009-02-12 Furukawa Electric Co Ltd:The 微粒子分散液の製造方法、及び微粒子分散液
CN101591488A (zh) * 2008-05-26 2009-12-02 富葵精密组件(深圳)有限公司 油墨及利用该油墨制作导电线路的方法
CN101626856A (zh) * 2007-03-30 2010-01-13 三菱麻铁里亚尔株式会社 银微粒子、银微粒子的制造方法、和银微粒子的制造装置
CN101804458A (zh) * 2009-02-12 2010-08-18 施乐公司 经有机胺稳定的银纳米颗粒及其制备方法
CN101875130A (zh) * 2009-12-08 2010-11-03 华中科技大学 一种纳米银颗粒的制备方法
TW201124215A (en) * 2009-10-02 2011-07-16 Toda Kogyo Corp Fine silver particles, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2004096470A1 (ja) * 2003-04-28 2006-07-13 住友金属鉱山株式会社 銀微粒子コロイド分散液の製造方法と銀微粒子コロイド分散液および銀導電膜
JP2009215573A (ja) * 2008-03-07 2009-09-24 Fujifilm Corp 棒状金属粒子及びその製造方法、並びに棒状金属粒子含有組成物、及び帯電防止材料

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101626856A (zh) * 2007-03-30 2010-01-13 三菱麻铁里亚尔株式会社 银微粒子、银微粒子的制造方法、和银微粒子的制造装置
JP2009030084A (ja) * 2007-07-25 2009-02-12 Furukawa Electric Co Ltd:The 微粒子分散液の製造方法、及び微粒子分散液
CN101591488A (zh) * 2008-05-26 2009-12-02 富葵精密组件(深圳)有限公司 油墨及利用该油墨制作导电线路的方法
CN101347841A (zh) * 2008-09-03 2009-01-21 西北大学 粒度可控高振实密度银粉的制备方法
CN101804458A (zh) * 2009-02-12 2010-08-18 施乐公司 经有机胺稳定的银纳米颗粒及其制备方法
TW201124215A (en) * 2009-10-02 2011-07-16 Toda Kogyo Corp Fine silver particles, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device
CN101875130A (zh) * 2009-12-08 2010-11-03 华中科技大学 一种纳米银颗粒的制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105761778A (zh) * 2016-04-22 2016-07-13 无锡南理工科技发展有限公司 一种低温固化型导电银浆料的制备方法
CN105761778B (zh) * 2016-04-22 2018-09-21 无锡南理工科技发展有限公司 一种低温固化型导电银浆料的制备方法
CN114054769A (zh) * 2021-11-17 2022-02-18 广东羚光新材料股份有限公司 一种银微粉及其制备方法和应用
CN114054769B (zh) * 2021-11-17 2024-05-03 广东羚光新材料股份有限公司 一种银微粉及其制备方法和应用

Also Published As

Publication number Publication date
WO2013099818A1 (fr) 2013-07-04
TW201341087A (zh) 2013-10-16
KR20140113910A (ko) 2014-09-25
JP2013139589A (ja) 2013-07-18

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Application publication date: 20140827