CN104009726A - 电子装置及其玻璃封接方法 - Google Patents
电子装置及其玻璃封接方法 Download PDFInfo
- Publication number
- CN104009726A CN104009726A CN201310462656.0A CN201310462656A CN104009726A CN 104009726 A CN104009726 A CN 104009726A CN 201310462656 A CN201310462656 A CN 201310462656A CN 104009726 A CN104009726 A CN 104009726A
- Authority
- CN
- China
- Prior art keywords
- glass sealing
- sealing material
- element mounting
- mounting member
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-034464 | 2013-02-25 | ||
JP2013034464 | 2013-02-25 | ||
JP2013-102485 | 2013-05-14 | ||
JP2013102485A JP6150249B2 (ja) | 2013-02-25 | 2013-05-14 | 電子デバイスのガラス封止方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104009726A true CN104009726A (zh) | 2014-08-27 |
CN104009726B CN104009726B (zh) | 2018-08-14 |
Family
ID=51370244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310462656.0A Expired - Fee Related CN104009726B (zh) | 2013-02-25 | 2013-09-30 | 电子装置及其玻璃封接方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9686879B2 (zh) |
JP (1) | JP6150249B2 (zh) |
KR (1) | KR20140106364A (zh) |
CN (1) | CN104009726B (zh) |
TW (1) | TWI595604B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859179B2 (en) * | 2013-09-27 | 2018-01-02 | Kyocera Corporation | Lid body, package, and electronic apparatus |
KR101578073B1 (ko) * | 2014-07-14 | 2015-12-16 | 코닝정밀소재 주식회사 | 기밀 밀봉 방법 및 기밀 밀봉된 기판 패키지 |
WO2016111281A1 (ja) * | 2015-01-07 | 2016-07-14 | 株式会社村田製作所 | セラミック基板、電子部品およびセラミック基板の製造方法 |
WO2017022504A1 (ja) * | 2015-07-31 | 2017-02-09 | 株式会社村田製作所 | 電子部品及びその製造方法 |
CN109327565A (zh) * | 2017-07-31 | 2019-02-12 | 西安中兴新软件有限责任公司 | 壳体、移动终端和壳体组装装置 |
KR102367889B1 (ko) * | 2017-08-10 | 2022-02-25 | 엘지전자 주식회사 | 이동 단말기 |
CN110213918B (zh) * | 2019-06-24 | 2021-11-23 | Oppo广东移动通信有限公司 | 壳体组件及电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110303347A1 (en) * | 2010-06-15 | 2011-12-15 | Nihon Dempa Kogyo Co., Ltd. | Method for manufacturing surface mounting crystal resonator |
CN102293056A (zh) * | 2009-01-27 | 2011-12-21 | 住友化学株式会社 | 显示面板的制造方法及显示装置用基板 |
JP2012004325A (ja) * | 2010-06-16 | 2012-01-05 | Kyocera Corp | 電子部品収納用容器および電子装置 |
JP2012212845A (ja) * | 2011-03-23 | 2012-11-01 | Kyocera Corp | 電子装置 |
Family Cites Families (33)
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GB1562791A (en) * | 1975-08-22 | 1980-03-19 | Bfg Glassgroup | Lighttransmitting fire-screening panels |
US4071658A (en) * | 1976-12-03 | 1978-01-31 | Gte Sylvania Incorporated | Glass for metal seal |
JPS6070748A (ja) * | 1983-09-28 | 1985-04-22 | Hitachi Ltd | セラミックパッケ−ジの封止方法 |
JPH02144942A (ja) * | 1988-11-28 | 1990-06-04 | Hitachi Ltd | 半導体装置の製造方法 |
US5407119A (en) * | 1992-12-10 | 1995-04-18 | American Research Corporation Of Virginia | Laser brazing for ceramic-to-metal joining |
US5506057A (en) * | 1994-06-15 | 1996-04-09 | Sierracin Corporation | Thin laminated heated glass face ply for aircraft windshields |
US5443912A (en) * | 1993-11-24 | 1995-08-22 | Sierracin Corporation | Laminated environmental protection layer for acrylic aircraft windows |
JP3887137B2 (ja) * | 1999-01-29 | 2007-02-28 | セイコーインスツル株式会社 | 圧電振動子の製造方法 |
US6624003B1 (en) * | 2002-02-06 | 2003-09-23 | Teravicta Technologies, Inc. | Integrated MEMS device and package |
JP3811423B2 (ja) | 2002-04-16 | 2006-08-23 | 京セラ株式会社 | 電子部品収納用容器 |
US7695663B2 (en) * | 2003-05-22 | 2010-04-13 | Ut-Battelle, Llc | Method of making hermetic seals for hermetic terminal assemblies |
US7068126B2 (en) * | 2004-03-04 | 2006-06-27 | Discera | Method and apparatus for frequency tuning of a micro-mechanical resonator |
US8106853B2 (en) * | 2005-12-12 | 2012-01-31 | Nupix, LLC | Wire-based flat panel displays |
US7655553B2 (en) * | 2006-01-11 | 2010-02-02 | Texas Instruments Incorporated | Microstructure sealing tool and methods of using the same |
US7972683B2 (en) * | 2006-03-28 | 2011-07-05 | Innovative Micro Technology | Wafer bonding material with embedded conductive particles |
EP2057659A4 (en) * | 2006-08-30 | 2010-11-24 | Tempronics Inc | GREEN ELECTRODES SEPARATED BY A UNIFORM SPACE |
US20100025722A1 (en) * | 2006-11-14 | 2010-02-04 | Harison Toshiba Lighting Corp. | Light emitting device, its manufacturing method and its mounted substrate |
JPWO2009104314A1 (ja) * | 2008-02-18 | 2011-06-16 | セイコーインスツル株式会社 | 圧電振動子の製造方法、圧電振動子、発振器、電子機器及び電波時計 |
US20100087024A1 (en) * | 2008-06-19 | 2010-04-08 | Noureddine Hawat | Device cavity organic package structures and methods of manufacturing same |
JP2011176501A (ja) * | 2010-02-23 | 2011-09-08 | Seiko Instruments Inc | パッケージの製造方法、圧電振動子、発振器、電子機器および電波時計 |
US20110227173A1 (en) * | 2010-03-17 | 2011-09-22 | Honeywell International Inc. | Mems sensor with integrated asic packaging |
JP5615663B2 (ja) * | 2010-03-26 | 2014-10-29 | セイコーインスツル株式会社 | パッケージマーキング方法 |
US20130128109A1 (en) * | 2010-06-28 | 2013-05-23 | Kyocera Corporation | Wiring substrate, image pickup device, and image pickup module |
JP2012169865A (ja) * | 2011-02-14 | 2012-09-06 | Seiko Instruments Inc | 圧電振動片、圧電振動子、発振器、電子機器、及び電波時計 |
JP2012169862A (ja) * | 2011-02-14 | 2012-09-06 | Seiko Instruments Inc | 水晶デバイス、水晶デバイスの製造方法、圧電振動子、発振器、電子機器、及び電波時計 |
JP5252016B2 (ja) * | 2011-03-18 | 2013-07-31 | 横河電機株式会社 | 振動式トランスデューサ |
JP5853429B2 (ja) * | 2011-06-15 | 2016-02-09 | 株式会社大真空 | 電子部品用パッケージおよび圧電振動デバイス |
US8698258B2 (en) * | 2011-09-30 | 2014-04-15 | General Electric Company | 3D integrated electronic device structure including increased thermal dissipation capabilities |
JP6030436B2 (ja) * | 2011-12-27 | 2016-11-24 | 京セラ株式会社 | 電子デバイスの製造方法および電子デバイス製造装置 |
US9010190B2 (en) * | 2012-04-20 | 2015-04-21 | Rosemount Aerospace Inc. | Stress isolated MEMS structures and methods of manufacture |
US8951373B2 (en) * | 2012-05-07 | 2015-02-10 | Sony Corporation | Replaceable protective layer on flat screen display |
JP6110734B2 (ja) * | 2013-06-06 | 2017-04-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2016086049A (ja) * | 2014-10-24 | 2016-05-19 | セイコーエプソン株式会社 | パッケージ、パッケージの製造方法、電子デバイス、電子機器及び移動体 |
-
2013
- 2013-05-14 JP JP2013102485A patent/JP6150249B2/ja active Active
- 2013-09-16 KR KR1020130111126A patent/KR20140106364A/ko not_active Application Discontinuation
- 2013-09-25 TW TW102134677A patent/TWI595604B/zh not_active IP Right Cessation
- 2013-09-30 CN CN201310462656.0A patent/CN104009726B/zh not_active Expired - Fee Related
- 2013-11-06 US US14/072,860 patent/US9686879B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102293056A (zh) * | 2009-01-27 | 2011-12-21 | 住友化学株式会社 | 显示面板的制造方法及显示装置用基板 |
US20110303347A1 (en) * | 2010-06-15 | 2011-12-15 | Nihon Dempa Kogyo Co., Ltd. | Method for manufacturing surface mounting crystal resonator |
JP2012004325A (ja) * | 2010-06-16 | 2012-01-05 | Kyocera Corp | 電子部品収納用容器および電子装置 |
JP2012212845A (ja) * | 2011-03-23 | 2012-11-01 | Kyocera Corp | 電子装置 |
Also Published As
Publication number | Publication date |
---|---|
US20140240905A1 (en) | 2014-08-28 |
TW201434115A (zh) | 2014-09-01 |
KR20140106364A (ko) | 2014-09-03 |
JP6150249B2 (ja) | 2017-06-21 |
CN104009726B (zh) | 2018-08-14 |
TWI595604B (zh) | 2017-08-11 |
US9686879B2 (en) | 2017-06-20 |
JP2014187341A (ja) | 2014-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: East Japan Applicant after: KYOCERA Crystal Device Corp. Address before: Yamagata Prefecture, Japan Applicant before: KYOCERA Crystal Device Corp. |
|
CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170810 Address after: Kyoto City Applicant after: KYOCERA Corp. Address before: East Japan Applicant before: KYOCERA Crystal Device Corp. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180814 Termination date: 20210930 |
|
CF01 | Termination of patent right due to non-payment of annual fee |