CN103985645A - 一种半导体封装件及制造方法 - Google Patents
一种半导体封装件及制造方法 Download PDFInfo
- Publication number
- CN103985645A CN103985645A CN201410228272.7A CN201410228272A CN103985645A CN 103985645 A CN103985645 A CN 103985645A CN 201410228272 A CN201410228272 A CN 201410228272A CN 103985645 A CN103985645 A CN 103985645A
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- open area
- groove
- packaged
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 83
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 238000005538 encapsulation Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 27
- 239000000084 colloidal system Substances 0.000 claims description 18
- 238000012856 packing Methods 0.000 claims description 18
- 238000003384 imaging method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000010923 batch production Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 20
- 230000009931 harmful effect Effects 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410228272.7A CN103985645B (zh) | 2014-05-27 | 2014-05-27 | 一种半导体封装件及制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410228272.7A CN103985645B (zh) | 2014-05-27 | 2014-05-27 | 一种半导体封装件及制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103985645A true CN103985645A (zh) | 2014-08-13 |
CN103985645B CN103985645B (zh) | 2017-02-15 |
Family
ID=51277563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410228272.7A Active CN103985645B (zh) | 2014-05-27 | 2014-05-27 | 一种半导体封装件及制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103985645B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106711319A (zh) * | 2016-12-23 | 2017-05-24 | 无锡市好达电子有限公司 | Csp封装的声表面波滤波器芯片隔离槽 |
WO2018126336A1 (zh) * | 2017-01-03 | 2018-07-12 | 深圳市汇顶科技股份有限公司 | 一种封装芯片的基板结构 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5909057A (en) * | 1997-09-23 | 1999-06-01 | Lsi Logic Corporation | Integrated heat spreader/stiffener with apertures for semiconductor package |
CN1221982A (zh) * | 1997-11-21 | 1999-07-07 | 罗姆股份有限公司 | 半导体装置及其制造方法 |
US6724080B1 (en) * | 2002-12-20 | 2004-04-20 | Altera Corporation | Heat sink with elevated heat spreader lid |
US20040164390A1 (en) * | 2003-02-26 | 2004-08-26 | Sung-Fei Wang | [semiconductor package with a heat spreader] |
US20040217485A1 (en) * | 2003-05-02 | 2004-11-04 | Advanced Semiconductor Engineering Inc. | Stacked flip chip package |
CN102362347A (zh) * | 2009-01-20 | 2012-02-22 | 阿尔特拉公司 | 具有布置在插入层上的电容器的集成电路封装件 |
-
2014
- 2014-05-27 CN CN201410228272.7A patent/CN103985645B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5909057A (en) * | 1997-09-23 | 1999-06-01 | Lsi Logic Corporation | Integrated heat spreader/stiffener with apertures for semiconductor package |
CN1221982A (zh) * | 1997-11-21 | 1999-07-07 | 罗姆股份有限公司 | 半导体装置及其制造方法 |
US6724080B1 (en) * | 2002-12-20 | 2004-04-20 | Altera Corporation | Heat sink with elevated heat spreader lid |
US20040164390A1 (en) * | 2003-02-26 | 2004-08-26 | Sung-Fei Wang | [semiconductor package with a heat spreader] |
US20040217485A1 (en) * | 2003-05-02 | 2004-11-04 | Advanced Semiconductor Engineering Inc. | Stacked flip chip package |
CN102362347A (zh) * | 2009-01-20 | 2012-02-22 | 阿尔特拉公司 | 具有布置在插入层上的电容器的集成电路封装件 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106711319A (zh) * | 2016-12-23 | 2017-05-24 | 无锡市好达电子有限公司 | Csp封装的声表面波滤波器芯片隔离槽 |
WO2018126336A1 (zh) * | 2017-01-03 | 2018-07-12 | 深圳市汇顶科技股份有限公司 | 一种封装芯片的基板结构 |
Also Published As
Publication number | Publication date |
---|---|
CN103985645B (zh) | 2017-02-15 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 214024 floor, building B, No. 789 South Lake Avenue, Wuxi, Jiangsu, China Patentee after: WUXI BEETECH SENSOR Inc. Patentee after: BEIJING WILL CREATE TECHNOLOGY Co.,Ltd. Address before: 214024 floor, building B, No. 789 South Lake Avenue, Wuxi, Jiangsu, China Patentee before: WUXI BEETECH SENSOR Inc. Patentee before: BEIJING BEETECH TECHNOLOGY CO.,LTD. |
|
CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230626 Address after: 233010 6 # factory building in the intelligent display industrial park at the west side of H-2 Road, the south side of Xinghua Road, Changqing Township, Yuhui District, Bengbu Free Trade Pilot Zone, Bengbu City, Anhui Province Patentee after: Anhui Jingxin Sensor Technology Co.,Ltd. Address before: 214024 5 building, No. 789 nanhu road, Nanchang District, Wuxi, Jiangsu Province, B Patentee before: WUXI BEETECH SENSOR Inc. Patentee before: BEIJING WILL CREATE TECHNOLOGY Co.,Ltd. |