CN103824847B - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN103824847B
CN103824847B CN201310572217.5A CN201310572217A CN103824847B CN 103824847 B CN103824847 B CN 103824847B CN 201310572217 A CN201310572217 A CN 201310572217A CN 103824847 B CN103824847 B CN 103824847B
Authority
CN
China
Prior art keywords
light
groove portion
substrate
slot part
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310572217.5A
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English (en)
Chinese (zh)
Other versions
CN103824847A (zh
Inventor
丸谷幸利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Publication of CN103824847A publication Critical patent/CN103824847A/zh
Application granted granted Critical
Publication of CN103824847B publication Critical patent/CN103824847B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
CN201310572217.5A 2012-11-16 2013-11-15 发光装置 Active CN103824847B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012252211A JP6079159B2 (ja) 2012-11-16 2012-11-16 発光装置
JP2012-252211 2012-11-16

Publications (2)

Publication Number Publication Date
CN103824847A CN103824847A (zh) 2014-05-28
CN103824847B true CN103824847B (zh) 2019-03-05

Family

ID=49619819

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310572217.5A Active CN103824847B (zh) 2012-11-16 2013-11-15 发光装置

Country Status (5)

Country Link
US (1) US9279571B2 (https=)
EP (1) EP2733751B1 (https=)
JP (1) JP6079159B2 (https=)
CN (1) CN103824847B (https=)
CA (1) CA2833466C (https=)

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* Cited by examiner, † Cited by third party
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DE102014110781A1 (de) * 2014-07-30 2016-02-04 Osram Opto Semiconductors Gmbh Herstellung einer Vorrichtung und Vorrichtung
JP6458493B2 (ja) * 2014-12-25 2019-01-30 大日本印刷株式会社 Ｌｅｄ素子用基板、及びそれを用いたｌｅｄ実装モジュールの製造方法
JP6458492B2 (ja) * 2014-12-25 2019-01-30 大日本印刷株式会社 Ｌｅｄ素子用基板、及びそれを用いたｌｅｄ実装モジュールの製造方法
JP2016167034A (ja) * 2015-03-10 2016-09-15 株式会社東芝 表示装置、発光装置及びライトユニット
JP2017034218A (ja) * 2015-08-03 2017-02-09 株式会社東芝 半導体発光装置
JP7014948B2 (ja) * 2017-06-13 2022-02-02 日亜化学工業株式会社 発光装置の製造方法および発光装置
DE102017130008A1 (de) * 2017-12-14 2019-06-19 Siteco Beleuchtungstechnik Gmbh Led-bauteil mit kachelartigem muster von kontaktflächen
CN209431157U (zh) * 2019-02-10 2019-09-24 中山市蓝德电子有限公司 一种柔性led倒装软灯条
JP7001937B2 (ja) * 2019-03-28 2022-02-04 日亜化学工業株式会社 発光装置
US11227985B2 (en) 2019-03-28 2022-01-18 Nichia Corporation Light-emitting device
KR102751425B1 (ko) * 2019-09-04 2025-01-13 삼성디스플레이 주식회사 표시 장치
KR102794235B1 (ko) * 2019-12-27 2025-04-15 삼성디스플레이 주식회사 표시 장치
CN114690523B (zh) * 2020-12-25 2023-05-02 精工爱普生株式会社 波长转换元件、光源装置和投影仪
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10025563B4 (de) * 2000-05-24 2005-12-01 Osram Opto Semiconductors Gmbh Modul für die Anordnung von elektrischen lichtemittierenden Elementen,integrierbar in ein Leuchtengehäuse,und Verfahren zur Herstellung eines derartigen Moduls
CN101360947A (zh) * 2006-09-12 2009-02-04 罗仲炜 整体成型的单片发光二极管线状灯
CN201638816U (zh) * 2010-04-21 2010-11-17 广州南科集成电子有限公司 Led集成光源板及专用模具

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JPH0770363B2 (ja) * 1987-02-28 1995-07-31 イビデン株式会社 印刷抵抗体付プリント配線板
JPH0525749U (ja) * 1991-09-10 1993-04-02 株式会社小糸製作所 チツプ型発光ダイオードの取付構造
JPH0545812U (ja) 1991-11-22 1993-06-18 株式会社小糸製作所 車輌用灯具
JP2000188001A (ja) 1998-12-21 2000-07-04 Hiyoshi Denshi Kk Ｌｅｄ報知灯
JP4724965B2 (ja) * 2001-07-10 2011-07-13 ソニー株式会社 フレキシブル配線基板
JP2004103993A (ja) 2002-09-12 2004-04-02 Ichikoh Ind Ltd Ｌｅｄ設置用フレキシブル基板及びそのｌｅｄ設置用フレキシブル基板を用いた車両用灯具
JP2004356144A (ja) 2003-05-27 2004-12-16 Fujikura Ltd 部品実装フレキシブル回路基板
US20050247944A1 (en) 2004-05-05 2005-11-10 Haque Ashim S Semiconductor light emitting device with flexible substrate
EP1856733A4 (en) 2004-09-28 2009-09-23 Agilight Inc METHOD FOR MICROPACKING LEDS AND MICROPACKING
KR101249230B1 (ko) 2005-03-30 2013-04-01 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 플렉시블 ｌｅｄ 어레이
US8567992B2 (en) * 2006-09-12 2013-10-29 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
RU2419740C1 (ru) 2007-02-16 2011-05-27 Шарп Кабусики Кайся Устройство подсветки и устройство плоского дисплея, использующее его
KR101476423B1 (ko) * 2008-05-23 2014-12-26 서울반도체 주식회사 Ｌｅｄ 패키지
AU2011213705B2 (en) 2009-01-16 2011-10-27 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
JP5659519B2 (ja) 2009-11-19 2015-01-28 豊田合成株式会社 発光装置、発光装置の製造方法、発光装置の実装方法及び光源装置
JP5533183B2 (ja) 2010-04-20 2014-06-25 日亜化学工業株式会社 Ｌｅｄ光源装置及びその製造方法
JP5885922B2 (ja) 2010-12-28 2016-03-16 日亜化学工業株式会社 発光装置
CN103460813B (zh) 2011-03-22 2017-07-11 飞利浦照明控股有限公司 用于安装多个发光元件的基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10025563B4 (de) * 2000-05-24 2005-12-01 Osram Opto Semiconductors Gmbh Modul für die Anordnung von elektrischen lichtemittierenden Elementen,integrierbar in ein Leuchtengehäuse,und Verfahren zur Herstellung eines derartigen Moduls
CN101360947A (zh) * 2006-09-12 2009-02-04 罗仲炜 整体成型的单片发光二极管线状灯
CN201638816U (zh) * 2010-04-21 2010-11-17 广州南科集成电子有限公司 Led集成光源板及专用模具

Also Published As

Publication number Publication date
CA2833466A1 (en) 2014-05-16
CN103824847A (zh) 2014-05-28
EP2733751A1 (en) 2014-05-21
US20140140079A1 (en) 2014-05-22
JP2014103148A (ja) 2014-06-05
EP2733751B1 (en) 2017-12-20
US9279571B2 (en) 2016-03-08
CA2833466C (en) 2020-03-24
JP6079159B2 (ja) 2017-02-15

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