CN103786270B - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- CN103786270B CN103786270B CN201310495079.5A CN201310495079A CN103786270B CN 103786270 B CN103786270 B CN 103786270B CN 201310495079 A CN201310495079 A CN 201310495079A CN 103786270 B CN103786270 B CN 103786270B
- Authority
- CN
- China
- Prior art keywords
- mentioned
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- holding member
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 abstract description 12
- 238000000576 coating method Methods 0.000 abstract description 12
- 238000005520 cutting process Methods 0.000 description 48
- 239000004065 semiconductor Substances 0.000 description 26
- 235000012431 wafers Nutrition 0.000 description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 238000003754 machining Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000003384 imaging method Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000002173 cutting fluid Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012239837A JP6078297B2 (ja) | 2012-10-31 | 2012-10-31 | 加工装置 |
| JP2012-239837 | 2012-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103786270A CN103786270A (zh) | 2014-05-14 |
| CN103786270B true CN103786270B (zh) | 2017-08-11 |
Family
ID=50662543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310495079.5A Active CN103786270B (zh) | 2012-10-31 | 2013-10-21 | 加工装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6078297B2 (ko) |
| KR (1) | KR102034318B1 (ko) |
| CN (1) | CN103786270B (ko) |
| TW (1) | TWI599434B (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018022847A (ja) * | 2016-08-05 | 2018-02-08 | 株式会社ディスコ | チャックテーブル |
| JP6968501B2 (ja) * | 2018-01-26 | 2021-11-17 | 株式会社ディスコ | 切削装置のセットアップ方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2597198Y (zh) * | 2003-01-14 | 2004-01-07 | 深圳市特种证件研究制作中心 | 自动层压切割制卡设备 |
| CN200960613Y (zh) * | 2006-10-13 | 2007-10-17 | 哈尔滨市华威电气有限公司 | 多绕组圆环式多极电磁吸盘 |
| CN102335972A (zh) * | 2011-10-24 | 2012-02-01 | 无锡绿波新能源设备有限公司 | 真空吸盘 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2979194B2 (ja) * | 1990-05-31 | 1999-11-15 | 京セラ株式会社 | 真空吸着装置 |
| JPH0751221Y2 (ja) * | 1990-07-31 | 1995-11-22 | 京セラ株式会社 | 真空チャック |
| JPH055352U (ja) * | 1991-04-22 | 1993-01-26 | 住友金属工業株式会社 | セラミツクス製定盤への移動用金枠の固定構造 |
| JP3865872B2 (ja) * | 1997-06-26 | 2007-01-10 | 京セラ株式会社 | 真空吸着保持装置 |
| JPH11254259A (ja) * | 1998-03-13 | 1999-09-21 | Disco Abrasive Syst Ltd | チャックテーブル |
| JP2004153288A (ja) * | 1999-08-23 | 2004-05-27 | Ibiden Co Ltd | ウエハプローバ装置 |
| JP4544706B2 (ja) * | 2000-06-29 | 2010-09-15 | 京セラ株式会社 | 基板ホルダー |
| JP4549654B2 (ja) | 2003-11-04 | 2010-09-22 | 株式会社ディスコ | 切削ブレードのセットアップ方法 |
| KR100753302B1 (ko) * | 2004-03-25 | 2007-08-29 | 이비덴 가부시키가이샤 | 진공 척, 흡착판, 연마 장치 및 반도체 웨이퍼의 제조 방법 |
| JP4681255B2 (ja) * | 2004-05-26 | 2011-05-11 | 株式会社タンケンシールセーコウ | ポーラスカーボン |
| JP2008062476A (ja) * | 2006-09-06 | 2008-03-21 | Disco Abrasive Syst Ltd | 加工装置およびチャックテーブル |
| JP2008114336A (ja) * | 2006-11-06 | 2008-05-22 | Disco Abrasive Syst Ltd | チャックテーブルのセルフグラインディング方法 |
| JP2008254132A (ja) * | 2007-04-05 | 2008-10-23 | Tokyo Seimitsu Co Ltd | チャックテーブル |
| JP2010278052A (ja) * | 2009-05-26 | 2010-12-09 | Disco Abrasive Syst Ltd | 切削装置のチャックテーブル |
| JP2011009423A (ja) * | 2009-06-25 | 2011-01-13 | Disco Abrasive Syst Ltd | 保持テーブルアセンブリ及び保持テーブルの製造方法 |
| WO2011049938A2 (en) * | 2009-10-20 | 2011-04-28 | Saint-Gobain Ceramics & Plastics, Inc. | Microelectronic processing component having a corrosion-resistant layer, microelectronic workpiece processing apparatus incorporating same, and method of forming an article having the corrosion-resistant layer |
-
2012
- 2012-10-31 JP JP2012239837A patent/JP6078297B2/ja active Active
-
2013
- 2013-09-03 TW TW102131651A patent/TWI599434B/zh active
- 2013-09-30 KR KR1020130116275A patent/KR102034318B1/ko active IP Right Grant
- 2013-10-21 CN CN201310495079.5A patent/CN103786270B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2597198Y (zh) * | 2003-01-14 | 2004-01-07 | 深圳市特种证件研究制作中心 | 自动层压切割制卡设备 |
| CN200960613Y (zh) * | 2006-10-13 | 2007-10-17 | 哈尔滨市华威电气有限公司 | 多绕组圆环式多极电磁吸盘 |
| CN102335972A (zh) * | 2011-10-24 | 2012-02-01 | 无锡绿波新能源设备有限公司 | 真空吸盘 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6078297B2 (ja) | 2017-02-08 |
| TWI599434B (zh) | 2017-09-21 |
| TW201416161A (zh) | 2014-05-01 |
| CN103786270A (zh) | 2014-05-14 |
| KR20140055984A (ko) | 2014-05-09 |
| KR102034318B1 (ko) | 2019-10-18 |
| JP2014090105A (ja) | 2014-05-15 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |