CN103648670A - 轧制铜箔及其制造方法以及层叠板 - Google Patents
轧制铜箔及其制造方法以及层叠板 Download PDFInfo
- Publication number
- CN103648670A CN103648670A CN201380001905.4A CN201380001905A CN103648670A CN 103648670 A CN103648670 A CN 103648670A CN 201380001905 A CN201380001905 A CN 201380001905A CN 103648670 A CN103648670 A CN 103648670A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- rolled copper
- formula
- rolling
- take
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 87
- 239000011889 copper foil Substances 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000005096 rolling process Methods 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims description 24
- 238000005097 cold rolling Methods 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000011120 plywood Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000002788 crimping Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 abstract description 8
- 239000003921 oil Substances 0.000 description 26
- 238000007747 plating Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 12
- 238000007788 roughening Methods 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 8
- 238000000151 deposition Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 238000004070 electrodeposition Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000006978 adaptation Effects 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000010731 rolling oil Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 206010017553 Furuncle Diseases 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- VDGMIGHRDCJLMN-UHFFFAOYSA-N [Cu].[Co].[Ni] Chemical compound [Cu].[Co].[Ni] VDGMIGHRDCJLMN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/406—Bright, glossy, shiny surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metal Rolling (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-147493 | 2012-06-29 | ||
JP2012147493A JP5298225B1 (ja) | 2012-06-29 | 2012-06-29 | 圧延銅箔及びその製造方法、並びに、積層板 |
PCT/JP2013/067414 WO2014003020A1 (ja) | 2012-06-29 | 2013-06-25 | 圧延銅箔及びその製造方法、並びに、積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103648670A true CN103648670A (zh) | 2014-03-19 |
CN103648670B CN103648670B (zh) | 2015-07-22 |
Family
ID=49396819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380001905.4A Active CN103648670B (zh) | 2012-06-29 | 2013-06-25 | 轧制铜箔及其制造方法以及层叠板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5298225B1 (zh) |
KR (1) | KR101671130B1 (zh) |
CN (1) | CN103648670B (zh) |
TW (1) | TWI601583B (zh) |
WO (1) | WO2014003020A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110392485A (zh) * | 2019-06-18 | 2019-10-29 | 昆山维嘉益材料科技有限公司 | 一种lp316l sta高阶摄像头模组fpc基板加工方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5822669B2 (ja) * | 2011-02-18 | 2015-11-24 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔及びそれを用いたグラフェンの製造方法 |
JP5850720B2 (ja) | 2011-06-02 | 2016-02-03 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
US9255007B2 (en) | 2011-06-02 | 2016-02-09 | Jx Nippon Mining & Metals Corporation | Copper foil for producing graphene and method of producing graphene using the same |
JP5721609B2 (ja) | 2011-11-15 | 2015-05-20 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
JP6078024B2 (ja) | 2014-06-13 | 2017-02-08 | Jx金属株式会社 | 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法 |
JP6611751B2 (ja) * | 2017-03-31 | 2019-11-27 | Jx金属株式会社 | リチウムイオン電池集電体用圧延銅箔及びリチウムイオン電池 |
Citations (7)
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---|---|---|---|---|
JP2000190005A (ja) * | 1998-12-24 | 2000-07-11 | Kawasaki Steel Corp | 光沢の優れた金属板の冷間圧延方法 |
CN1261560A (zh) * | 1999-01-21 | 2000-08-02 | 阿姆科公司 | 表面粗糙度得到改进的冷轧金属带的制造方法 |
CN1262335A (zh) * | 1999-01-18 | 2000-08-09 | 日矿金属株式会社 | 软性印刷电路基板用轧制铜箔及其制造方法 |
US20070098910A1 (en) * | 2005-10-14 | 2007-05-03 | Mitsui Mining & Smelting Co., Ltd. | Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape |
CN101146933A (zh) * | 2005-03-31 | 2008-03-19 | 三井金属矿业株式会社 | 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板 |
CN101466875A (zh) * | 2006-06-12 | 2009-06-24 | 日矿金属株式会社 | 具有粗化处理面的轧制铜或铜合金箔以及该轧制铜或铜合金箔的粗化方法 |
JP2011240625A (ja) * | 2010-05-19 | 2011-12-01 | Jx Nippon Mining & Metals Corp | 銅張積層板 |
Family Cites Families (5)
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---|---|---|---|---|
JP4522972B2 (ja) * | 2005-04-28 | 2010-08-11 | 日鉱金属株式会社 | 銅張積層基板用高光沢圧延銅箔 |
JP4538375B2 (ja) * | 2005-05-31 | 2010-09-08 | 日鉱金属株式会社 | プリント配線基板用金属材料 |
CN101842518B (zh) * | 2007-10-31 | 2012-07-18 | 杰富意钢铁株式会社 | 表面处理钢板及其制造方法、以及树脂被覆钢板 |
JP5094834B2 (ja) * | 2009-12-28 | 2012-12-12 | Jx日鉱日石金属株式会社 | 銅箔の製造方法、銅箔及び銅張積層板 |
KR101387301B1 (ko) * | 2010-09-28 | 2014-04-18 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 압연 동박 |
-
2012
- 2012-06-29 JP JP2012147493A patent/JP5298225B1/ja active Active
-
2013
- 2013-06-21 TW TW102122065A patent/TWI601583B/zh active
- 2013-06-25 CN CN201380001905.4A patent/CN103648670B/zh active Active
- 2013-06-25 WO PCT/JP2013/067414 patent/WO2014003020A1/ja active Application Filing
- 2013-06-25 KR KR1020157002392A patent/KR101671130B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000190005A (ja) * | 1998-12-24 | 2000-07-11 | Kawasaki Steel Corp | 光沢の優れた金属板の冷間圧延方法 |
CN1262335A (zh) * | 1999-01-18 | 2000-08-09 | 日矿金属株式会社 | 软性印刷电路基板用轧制铜箔及其制造方法 |
CN1261560A (zh) * | 1999-01-21 | 2000-08-02 | 阿姆科公司 | 表面粗糙度得到改进的冷轧金属带的制造方法 |
CN101146933A (zh) * | 2005-03-31 | 2008-03-19 | 三井金属矿业株式会社 | 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板 |
US20070098910A1 (en) * | 2005-10-14 | 2007-05-03 | Mitsui Mining & Smelting Co., Ltd. | Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape |
CN101466875A (zh) * | 2006-06-12 | 2009-06-24 | 日矿金属株式会社 | 具有粗化处理面的轧制铜或铜合金箔以及该轧制铜或铜合金箔的粗化方法 |
JP2011240625A (ja) * | 2010-05-19 | 2011-12-01 | Jx Nippon Mining & Metals Corp | 銅張積層板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110392485A (zh) * | 2019-06-18 | 2019-10-29 | 昆山维嘉益材料科技有限公司 | 一种lp316l sta高阶摄像头模组fpc基板加工方法 |
CN110392485B (zh) * | 2019-06-18 | 2022-04-12 | 淮安维嘉益集成科技有限公司 | 一种lp316l sta高阶摄像头模组fpc基板加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20150033707A (ko) | 2015-04-01 |
WO2014003020A1 (ja) | 2014-01-03 |
KR101671130B1 (ko) | 2016-10-31 |
JP5298225B1 (ja) | 2013-09-25 |
JP2014008525A (ja) | 2014-01-20 |
TW201404491A (zh) | 2014-02-01 |
TWI601583B (zh) | 2017-10-11 |
CN103648670B (zh) | 2015-07-22 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
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CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
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CP02 | Change in the address of a patent holder |