CN103635005B - 软硬结合电路基板、软硬结合电路板及制作方法 - Google Patents
软硬结合电路基板、软硬结合电路板及制作方法 Download PDFInfo
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- CN103635005B CN103635005B CN201210301581.3A CN201210301581A CN103635005B CN 103635005 B CN103635005 B CN 103635005B CN 201210301581 A CN201210301581 A CN 201210301581A CN 103635005 B CN103635005 B CN 103635005B
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
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Claims (25)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210301581.3A CN103635005B (zh) | 2012-08-23 | 2012-08-23 | 软硬结合电路基板、软硬结合电路板及制作方法 |
TW101131604A TWI472277B (zh) | 2012-08-23 | 2012-08-30 | 軟硬結合電路基板、軟硬結合電路板及製作方法 |
JP2012253947A JP2014041988A (ja) | 2012-08-23 | 2012-11-20 | リジッドフレキシブル回路基板及びその製作方法とリジッドフレキシブル回路板及びその製作方法 |
Applications Claiming Priority (1)
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CN201210301581.3A CN103635005B (zh) | 2012-08-23 | 2012-08-23 | 软硬结合电路基板、软硬结合电路板及制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN103635005A CN103635005A (zh) | 2014-03-12 |
CN103635005B true CN103635005B (zh) | 2017-02-15 |
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CN201210301581.3A Active CN103635005B (zh) | 2012-08-23 | 2012-08-23 | 软硬结合电路基板、软硬结合电路板及制作方法 |
Country Status (3)
Country | Link |
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JP (1) | JP2014041988A (zh) |
CN (1) | CN103635005B (zh) |
TW (1) | TWI472277B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105307423A (zh) * | 2015-10-28 | 2016-02-03 | 安捷利电子科技(苏州)有限公司 | 一种hdi刚挠结合板层间盲孔全铜填充的制备方法 |
CN106061107B (zh) * | 2016-08-08 | 2019-10-25 | 广州杰赛科技股份有限公司 | 具电磁屏蔽膜的刚挠结合线路板及其制备方法 |
CN108271324B (zh) * | 2017-12-20 | 2024-04-26 | 广东长盈精密技术有限公司 | 壳体以及移动终端 |
CN110708892A (zh) * | 2019-09-26 | 2020-01-17 | 九江明阳电路科技有限公司 | 抗干扰的刚挠结合板制作方法及装置 |
CN113597086B (zh) * | 2020-04-30 | 2023-01-17 | 鹏鼎控股(深圳)股份有限公司 | 传输线路板及其制作方法 |
CN114080099B (zh) * | 2020-08-19 | 2024-04-02 | 鹏鼎控股(深圳)股份有限公司 | 一种板对板连接结构及其制备方法 |
CN114126197A (zh) * | 2021-11-26 | 2022-03-01 | 京东方科技集团股份有限公司 | 一种柔性线路板及其制备方法和绑定方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101106861A (zh) * | 2006-07-13 | 2008-01-16 | 三星电机株式会社 | 刚性-柔性印刷电路板及其制造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8071883B2 (en) * | 2006-10-23 | 2011-12-06 | Ibiden Co., Ltd. | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
TW201130405A (en) * | 2010-02-23 | 2011-09-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
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2012
- 2012-08-23 CN CN201210301581.3A patent/CN103635005B/zh active Active
- 2012-08-30 TW TW101131604A patent/TWI472277B/zh active
- 2012-11-20 JP JP2012253947A patent/JP2014041988A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101106861A (zh) * | 2006-07-13 | 2008-01-16 | 三星电机株式会社 | 刚性-柔性印刷电路板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2014041988A (ja) | 2014-03-06 |
TWI472277B (zh) | 2015-02-01 |
CN103635005A (zh) | 2014-03-12 |
TW201410093A (zh) | 2014-03-01 |
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Effective date of registration: 20170306 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Effective date of registration: 20170516 Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Zhending Technology Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: 518105 Guangdong province Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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