CN103617990A - Double-row plastic package lead frame - Google Patents
Double-row plastic package lead frame Download PDFInfo
- Publication number
- CN103617990A CN103617990A CN201310588678.1A CN201310588678A CN103617990A CN 103617990 A CN103617990 A CN 103617990A CN 201310588678 A CN201310588678 A CN 201310588678A CN 103617990 A CN103617990 A CN 103617990A
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- CN
- China
- Prior art keywords
- lead frame
- double
- head portions
- plastic package
- frame unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a double-row plastic package lead frame. The double-row plastic package lead frame is characterized by being formed by two rows of identical lead frame bodies in a butt joint mode, wherein each lead frame body comprises lead frame units, the head portions of the opposite lead frame units are connected every other four lead frame units, and each lead frame unit comprises a substrate and lead pins and is provided with a positioning hole. The lead frame is produced in a double-row mode in the whole manufacturing process, the head portions are oppositely arranged in the middle, the situation that the head portions are collided in the transmission procedure when the head portions are distributed outside is avoided, the set of the head portions of every five lead frame units are connected, and the difficulty in separating the two rows of the lead frame bodies at last is reduced.
Description
Technical field
The present invention relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it has played the function served as bridge being connected with outer lead, in the semiconductor integrated block of the overwhelming majority, all needing to use lead frame, is basic material important in electronics and information industry.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of double plastic packaging lead frame.
In order to solve the problems of the technologies described above, the invention provides a kind of double plastic packaging lead frame, the lead frame docking identical by two rows forms, and described lead frame is comprised of lead frame unit, wherein, every four lead frame unit, relative lead frame unit header is connected to each other.
As a further improvement on the present invention, described lead frame unit comprises matrix and terminal pin.
As a further improvement on the present invention, described lead frame unit is provided with location hole.
The double plastic packaging lead frame of the present invention meets package requirements, in whole manufacturing process, adopt double mode to produce, in the middle of head comes relatively, avoid head to come outside and transmitted the situation that in rules, head is damaged, every five lead frame unit, wherein one group of head is connected, the difficulty while having reduced final double separating.
Accompanying drawing explanation
Fig. 1 is the structural representation of the double plastic packaging lead frame of the present invention.
In figure: 1-lead frame, 2-lead frame unit, 3-matrix, 4-terminal pin, 5-location hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described in detail.
As shown in Figure 1, a kind of double plastic packaging lead frame, it is characterized in that: lead frame 1 docking identical by two rows forms, described lead frame 1 is comprised of lead frame unit 2, wherein every four lead frame unit 2, relative lead frame unit 2 heads are connected to each other, and described lead frame unit 2 comprises matrix 3 and terminal pin 4, and described lead frame unit 2 is provided with location hole 5.
The double plastic packaging lead frame of the present invention meets package requirements, in whole manufacturing process, adopt double mode to produce, in the middle of head comes relatively, avoid head to come outside and transmitted the situation that in rules, head is damaged, every five lead frame unit, wherein one group of head is connected, the difficulty while having reduced final double separating.
Within the similar designed lead frame of technical characterictic of any employing and the present invention will fall into protection scope of the present invention.
Claims (3)
1. a double plastic packaging lead frame, it is characterized in that: by the identical lead frame of two rows (1) docking, formed, described lead frame (1) is comprised of lead frame unit (2), and wherein every four lead frame unit (2), relative lead frame unit (2) head is connected to each other.
2. a kind of double plastic packaging lead frame according to claim 1, is characterized in that: described lead frame unit (2) comprises matrix (3) and terminal pin (4).
3. a kind of double plastic packaging lead frame according to claim 1, is characterized in that: described lead frame unit (2) is provided with location hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310588678.1A CN103617990A (en) | 2013-11-21 | 2013-11-21 | Double-row plastic package lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310588678.1A CN103617990A (en) | 2013-11-21 | 2013-11-21 | Double-row plastic package lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617990A true CN103617990A (en) | 2014-03-05 |
Family
ID=50168694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310588678.1A Pending CN103617990A (en) | 2013-11-21 | 2013-11-21 | Double-row plastic package lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617990A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101030542A (en) * | 2007-03-21 | 2007-09-05 | 宁波康强电子股份有限公司 | Production of triode lead wire frame |
| KR20080076063A (en) * | 2007-02-14 | 2008-08-20 | 한미반도체 주식회사 | Lead frame for semiconductor package |
| CN102593092A (en) * | 2012-03-22 | 2012-07-18 | 天水华天微电子股份有限公司 | Lead frame |
| CN203589013U (en) * | 2013-11-21 | 2014-05-07 | 沈健 | Double-row lead frame |
-
2013
- 2013-11-21 CN CN201310588678.1A patent/CN103617990A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080076063A (en) * | 2007-02-14 | 2008-08-20 | 한미반도체 주식회사 | Lead frame for semiconductor package |
| CN101030542A (en) * | 2007-03-21 | 2007-09-05 | 宁波康强电子股份有限公司 | Production of triode lead wire frame |
| CN102593092A (en) * | 2012-03-22 | 2012-07-18 | 天水华天微电子股份有限公司 | Lead frame |
| CN203589013U (en) * | 2013-11-21 | 2014-05-07 | 沈健 | Double-row lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |